DE102011079508B4 - Kühlstruktur für ein Halbleiterelement - Google Patents

Kühlstruktur für ein Halbleiterelement Download PDF

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Publication number
DE102011079508B4
DE102011079508B4 DE102011079508A DE102011079508A DE102011079508B4 DE 102011079508 B4 DE102011079508 B4 DE 102011079508B4 DE 102011079508 A DE102011079508 A DE 102011079508A DE 102011079508 A DE102011079508 A DE 102011079508A DE 102011079508 B4 DE102011079508 B4 DE 102011079508B4
Authority
DE
Germany
Prior art keywords
base plate
heat radiation
semiconductor element
cooling
pressure receiving
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn - After Issue
Application number
DE102011079508A
Other languages
German (de)
English (en)
Other versions
DE102011079508A1 (de
Inventor
Mitsuharu Tabata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of DE102011079508A1 publication Critical patent/DE102011079508A1/de
Application granted granted Critical
Publication of DE102011079508B4 publication Critical patent/DE102011079508B4/de
Withdrawn - After Issue legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/072—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
DE102011079508A 2010-09-10 2011-07-20 Kühlstruktur für ein Halbleiterelement Withdrawn - After Issue DE102011079508B4 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010203091A JP2012060002A (ja) 2010-09-10 2010-09-10 半導体素子の冷却構造
JP2010-203091 2010-09-10

Publications (2)

Publication Number Publication Date
DE102011079508A1 DE102011079508A1 (de) 2012-03-15
DE102011079508B4 true DE102011079508B4 (de) 2013-12-24

Family

ID=45756248

Family Applications (1)

Application Number Title Priority Date Filing Date
DE102011079508A Withdrawn - After Issue DE102011079508B4 (de) 2010-09-10 2011-07-20 Kühlstruktur für ein Halbleiterelement

Country Status (3)

Country Link
JP (1) JP2012060002A (zh)
CN (1) CN102403288A (zh)
DE (1) DE102011079508B4 (zh)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015079643A1 (ja) 2013-11-28 2015-06-04 富士電機株式会社 半導体モジュール用冷却器の製造方法、半導体モジュール用冷却器、半導体モジュール及び電気駆動車両
JP6634839B2 (ja) * 2016-01-14 2020-01-22 富士通株式会社 半導体モジュール及び電子機器
WO2018146816A1 (ja) * 2017-02-13 2018-08-16 新電元工業株式会社 電子機器
DE102017207361A1 (de) * 2017-05-02 2018-05-09 Conti Temic Microelectronic Gmbh Kühler zur Kühlung von elektrischen Anordnungen
EP4253897A1 (en) * 2022-04-01 2023-10-04 Hamilton Sundstrand Corporation Varying topology heat sinks
US12007180B2 (en) 2022-04-01 2024-06-11 Hamilton Sundstrand Corporation Varying topology heat sinks

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4953634A (en) * 1989-04-20 1990-09-04 Microelectronics And Computer Technology Corporation Low pressure high heat transfer fluid heat exchanger
JP2003324173A (ja) * 2002-05-02 2003-11-14 Nissan Motor Co Ltd 半導体素子の冷却装置
DE20315170U1 (de) * 2003-09-24 2004-02-12 Giga-Byte Technology Co., Ltd., Hsin-Tien Wärmeabführrippen-Modul
DE69821779T2 (de) * 1997-09-17 2004-12-09 Advanced Energy's Voorhees Operations Kühlmodul für elektronische bauelemente
JP2007073816A (ja) * 2005-09-08 2007-03-22 Nissan Motor Co Ltd ダクト型冷却構造

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63110093U (zh) * 1987-01-08 1988-07-15
JPH02291154A (ja) * 1989-04-28 1990-11-30 Nec Corp ヒートシンク付セラミックパッケージ
JP2577063Y2 (ja) * 1992-02-28 1998-07-23 京セラ株式会社 半導体パッケージ
JP2002329821A (ja) * 2001-04-27 2002-11-15 Toshiyuki Arai ヒートシンク
JP2004128439A (ja) * 2002-08-07 2004-04-22 Fuji Electric Fa Components & Systems Co Ltd 発熱体冷却装置
JP4715529B2 (ja) * 2006-01-26 2011-07-06 トヨタ自動車株式会社 パワー半導体素子の冷却構造
JP2009131005A (ja) * 2007-11-21 2009-06-11 Denso Corp 負荷駆動素子冷却装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4953634A (en) * 1989-04-20 1990-09-04 Microelectronics And Computer Technology Corporation Low pressure high heat transfer fluid heat exchanger
DE69821779T2 (de) * 1997-09-17 2004-12-09 Advanced Energy's Voorhees Operations Kühlmodul für elektronische bauelemente
JP2003324173A (ja) * 2002-05-02 2003-11-14 Nissan Motor Co Ltd 半導体素子の冷却装置
DE20315170U1 (de) * 2003-09-24 2004-02-12 Giga-Byte Technology Co., Ltd., Hsin-Tien Wärmeabführrippen-Modul
JP2007073816A (ja) * 2005-09-08 2007-03-22 Nissan Motor Co Ltd ダクト型冷却構造

Also Published As

Publication number Publication date
DE102011079508A1 (de) 2012-03-15
CN102403288A (zh) 2012-04-04
JP2012060002A (ja) 2012-03-22

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Date Code Title Description
R012 Request for examination validly filed
R016 Response to examination communication
R018 Grant decision by examination section/examining division
R120 Application withdrawn or ip right abandoned

Effective date: 20131206