DE102011053434A1 - Bauteil zur Verwendung als doppelseitiges Sensorgehäuse - Google Patents

Bauteil zur Verwendung als doppelseitiges Sensorgehäuse Download PDF

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Publication number
DE102011053434A1
DE102011053434A1 DE102011053434A DE102011053434A DE102011053434A1 DE 102011053434 A1 DE102011053434 A1 DE 102011053434A1 DE 102011053434 A DE102011053434 A DE 102011053434A DE 102011053434 A DE102011053434 A DE 102011053434A DE 102011053434 A1 DE102011053434 A1 DE 102011053434A1
Authority
DE
Germany
Prior art keywords
component
sensor housing
pad
sensor
conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE102011053434A
Other languages
German (de)
English (en)
Inventor
Woojin Kim
John Dancaster
Aniela Bryzek
Dong-Suk Kim
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
General Electric Co
Original Assignee
General Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by General Electric Co filed Critical General Electric Co
Publication of DE102011053434A1 publication Critical patent/DE102011053434A1/de
Withdrawn legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60C—VEHICLE TYRES; TYRE INFLATION; TYRE CHANGING; CONNECTING VALVES TO INFLATABLE ELASTIC BODIES IN GENERAL; DEVICES OR ARRANGEMENTS RELATED TO TYRES
    • B60C23/00—Devices for measuring, signalling, controlling, or distributing tyre pressure or temperature, specially adapted for mounting on vehicles; Arrangement of tyre inflating devices on vehicles, e.g. of pumps or of tanks; Tyre cooling arrangements
    • B60C23/02—Signalling devices actuated by tyre pressure
    • B60C23/04—Signalling devices actuated by tyre pressure mounted on the wheel or tyre
    • B60C23/0408—Signalling devices actuated by tyre pressure mounted on the wheel or tyre transmitting the signals by non-mechanical means from the wheel or tyre to a vehicle body mounted receiver
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D11/00—Component parts of measuring arrangements not specially adapted for a specific variable
    • G01D11/24—Housings ; Casings for instruments
    • G01D11/245—Housings for sensors
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/0061—Electrical connection means
    • G01L19/0084—Electrical connection means to the outside of the housing
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings
    • G01L19/141—Monolithic housings, e.g. molded or one-piece housings
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings
    • G01L19/147—Details about the mounting of the sensor to support or covering means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Measuring Fluid Pressure (AREA)
  • Pressure Sensors (AREA)
  • Testing Or Calibration Of Command Recording Devices (AREA)
DE102011053434A 2010-09-10 2011-09-09 Bauteil zur Verwendung als doppelseitiges Sensorgehäuse Withdrawn DE102011053434A1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/879,143 2010-09-10
US12/879,143 US8264074B2 (en) 2010-09-10 2010-09-10 Device for use as dual-sided sensor package

Publications (1)

Publication Number Publication Date
DE102011053434A1 true DE102011053434A1 (de) 2012-03-15

Family

ID=45756231

Family Applications (1)

Application Number Title Priority Date Filing Date
DE102011053434A Withdrawn DE102011053434A1 (de) 2010-09-10 2011-09-09 Bauteil zur Verwendung als doppelseitiges Sensorgehäuse

Country Status (5)

Country Link
US (1) US8264074B2 (https=)
JP (1) JP5351943B2 (https=)
CN (1) CN102435226A (https=)
DE (1) DE102011053434A1 (https=)
SG (1) SG179365A1 (https=)

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ITTO20120515A1 (it) * 2012-06-14 2013-12-15 St Microelectronics Nv Assemblaggio di un dispositivo integrato a semiconduttori e relativo procedimento di fabbricazione
US9579511B2 (en) 2014-12-15 2017-02-28 Medtronic, Inc. Medical device with surface mounted lead connector
US10527523B2 (en) * 2015-12-18 2020-01-07 Ge Global Sourcing Llc Vehicle sensor assembly having an RF sensor disposed in the sensor assembly to wirelessly communicate data to outside the sensor assembly
EP3410481A1 (en) * 2017-06-01 2018-12-05 HS Elektronik Systeme GmbH Power semiconductor chip module
FR3079610B1 (fr) * 2018-03-30 2020-03-20 Mgi Coutier Dispositif de mesure d'un parametre physique d'un fluide d'un circuit de vehicule automobile
TWI667755B (zh) * 2018-06-25 2019-08-01 朋程科技股份有限公司 功率元件封裝結構
US10836222B2 (en) * 2018-10-26 2020-11-17 Sensata Technologies, Inc. Tire mounted sensors with controlled orientation and removal detection
CN209326840U (zh) 2018-12-27 2019-08-30 热敏碟公司 压力传感器及压力变送器
CN113701816B (zh) * 2021-08-26 2024-08-16 朱强 一种用于双传感器连接的组合固定装置

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Publication number Priority date Publication date Assignee Title
US5366933A (en) 1993-10-13 1994-11-22 Intel Corporation Method for constructing a dual sided, wire bonded integrated circuit chip package
US5527740A (en) 1994-06-28 1996-06-18 Intel Corporation Manufacturing dual sided wire bonded integrated circuit chip packages using offset wire bonds and support block cavities
KR0179921B1 (ko) * 1996-05-17 1999-03-20 문정환 적측형 반도체 패키지
JPH10104101A (ja) * 1996-10-02 1998-04-24 Mitsubishi Electric Corp 半導体圧力センサ
JP4118353B2 (ja) * 1996-10-11 2008-07-16 株式会社デンソー 樹脂封止型半導体装置の製造方法およびモールド金型
US5994166A (en) * 1997-03-10 1999-11-30 Micron Technology, Inc. Method of constructing stacked packages
US5899705A (en) * 1997-11-20 1999-05-04 Akram; Salman Stacked leads-over chip multi-chip module
TW410452B (en) * 1999-04-28 2000-11-01 Siliconware Precision Industries Co Ltd Semiconductor package having dual chips attachment on the backs and the manufacturing method thereof
JP2000329632A (ja) * 1999-05-17 2000-11-30 Toshiba Chem Corp 圧力センサーモジュール及び圧力センサーモジュールの製造方法
DE19929028A1 (de) * 1999-06-25 2000-12-28 Bosch Gmbh Robert Verfahren zur Herstellung eines Drucksensors
JP2001127246A (ja) * 1999-10-29 2001-05-11 Fujitsu Ltd 半導体装置
JP2003084008A (ja) * 2001-09-10 2003-03-19 Mitsubishi Electric Corp 半導体デバイス
TW499743B (en) * 2001-09-13 2002-08-21 Siliconware Precision Industries Co Ltd Multi-chip semiconductor package having a die carrier with leads extended downwardly
TW554501B (en) * 2002-08-14 2003-09-21 Siliconware Precision Industries Co Ltd Substrate for semiconductor package
US7309923B2 (en) * 2003-06-16 2007-12-18 Sandisk Corporation Integrated circuit package having stacked integrated circuits and method therefor
WO2005019790A1 (ja) * 2003-08-26 2005-03-03 Matsushita Electric Works, Ltd. センサ装置
US7375420B2 (en) * 2004-12-03 2008-05-20 General Electric Company Large area transducer array
US7408254B1 (en) * 2005-08-26 2008-08-05 Amkor Technology Inc Stack land grid array package and method for manufacturing the same
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JP5212159B2 (ja) * 2009-02-16 2013-06-19 株式会社デンソー センサ装置
US8178961B2 (en) * 2010-04-27 2012-05-15 Advanced Semiconductor Engineering, Inc. Semiconductor package structure and package process

Also Published As

Publication number Publication date
SG179365A1 (en) 2012-04-27
US8264074B2 (en) 2012-09-11
US20120061775A1 (en) 2012-03-15
JP5351943B2 (ja) 2013-11-27
JP2012058243A (ja) 2012-03-22
CN102435226A (zh) 2012-05-02

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Legal Events

Date Code Title Description
R119 Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee