DE102010025506A1 - Halbleitervorrichtung - Google Patents
Halbleitervorrichtung Download PDFInfo
- Publication number
- DE102010025506A1 DE102010025506A1 DE102010025506A DE102010025506A DE102010025506A1 DE 102010025506 A1 DE102010025506 A1 DE 102010025506A1 DE 102010025506 A DE102010025506 A DE 102010025506A DE 102010025506 A DE102010025506 A DE 102010025506A DE 102010025506 A1 DE102010025506 A1 DE 102010025506A1
- Authority
- DE
- Germany
- Prior art keywords
- inductor
- layer
- semiconductor device
- line
- esd element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W42/00—Arrangements for protection of devices
- H10W42/60—Arrangements for protection of devices protecting against electrostatic charges or discharges, e.g. Faraday shields
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D89/00—Aspects of integrated devices not covered by groups H10D84/00 - H10D88/00
- H10D89/60—Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W44/00—Electrical arrangements for controlling or matching impedance
- H10W44/501—Inductive arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
Landscapes
- Semiconductor Integrated Circuits (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009-157656 | 2009-07-02 | ||
| JP2009157656A JP2011014719A (ja) | 2009-07-02 | 2009-07-02 | 半導体装置 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE102010025506A1 true DE102010025506A1 (de) | 2011-02-24 |
Family
ID=43412539
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE102010025506A Withdrawn DE102010025506A1 (de) | 2009-07-02 | 2010-06-29 | Halbleitervorrichtung |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US8355229B2 (https=) |
| JP (1) | JP2011014719A (https=) |
| DE (1) | DE102010025506A1 (https=) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011014719A (ja) * | 2009-07-02 | 2011-01-20 | Renesas Electronics Corp | 半導体装置 |
| CN103400820B (zh) | 2013-01-30 | 2016-08-10 | 威盛电子股份有限公司 | 半导体装置 |
| JP6249960B2 (ja) * | 2014-01-29 | 2017-12-20 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
| JP2016171163A (ja) * | 2015-03-12 | 2016-09-23 | ルネサスエレクトロニクス株式会社 | 半導体集積回路、通信モジュール、及びスマートメータ |
| US10742026B2 (en) * | 2018-02-07 | 2020-08-11 | International Business Machines Corporation | Electrostatic protection device |
| US11912564B2 (en) * | 2020-07-31 | 2024-02-27 | Knowles Electronics, Llc | Sensor package including a substrate with an inductor layer |
| CN115394770A (zh) * | 2021-05-25 | 2022-11-25 | 意法半导体有限公司 | 无源静电放电传感器和用于检测静电放电的方法 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007103477A (ja) | 2005-09-30 | 2007-04-19 | Tdk Corp | インダクタ素子 |
| JP2009157656A (ja) | 2007-12-26 | 2009-07-16 | Samsung Electronics Co Ltd | 画像処理装置、画像処理方法、プログラム、および表示装置 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7400485B2 (en) * | 2005-09-28 | 2008-07-15 | Tdk Corporation | Surge absorber |
| US7750408B2 (en) * | 2007-03-29 | 2010-07-06 | International Business Machines Corporation | Integrated circuit structure incorporating an inductor, a conductive sheet and a protection circuit |
| JP2009064923A (ja) * | 2007-09-05 | 2009-03-26 | Toshiba Corp | 半導体装置 |
| JP2011014719A (ja) * | 2009-07-02 | 2011-01-20 | Renesas Electronics Corp | 半導体装置 |
-
2009
- 2009-07-02 JP JP2009157656A patent/JP2011014719A/ja active Pending
-
2010
- 2010-06-29 US US12/826,080 patent/US8355229B2/en not_active Expired - Fee Related
- 2010-06-29 DE DE102010025506A patent/DE102010025506A1/de not_active Withdrawn
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007103477A (ja) | 2005-09-30 | 2007-04-19 | Tdk Corp | インダクタ素子 |
| JP2009157656A (ja) | 2007-12-26 | 2009-07-16 | Samsung Electronics Co Ltd | 画像処理装置、画像処理方法、プログラム、および表示装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| US20110002076A1 (en) | 2011-01-06 |
| JP2011014719A (ja) | 2011-01-20 |
| US8355229B2 (en) | 2013-01-15 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| DE60000863T2 (de) | Filterstrukturen für schnittstellen zwischen integrierten schaltungen | |
| DE10392971B4 (de) | Filterschaltung | |
| DE10214068B4 (de) | ESD-Schutzschaltung für Radiofrequenz-Ausgangsanschlüsse in einer integrierten Schaltung | |
| DE102010025506A1 (de) | Halbleitervorrichtung | |
| DE102008010939B4 (de) | Abschlussschaltung, in ein Fahrzeug eingebaute Steuervorrichtung und in ein Fahrzeug eingebautes Kommunikationssystem | |
| DE102017213154B4 (de) | Halbleitervorrichtung | |
| DE102008014930A1 (de) | Ausgangsschaltung und Leistungsbauteil | |
| DE102008026467A1 (de) | Steckverbindersystem | |
| DE102004011719A1 (de) | Halbleitervorrichtung mit symmetrischer Schaltung zur Verwendung in einem Hochfrequenzband | |
| DE3234668A1 (de) | Ic-bauteil mit eigendaempfung fuer eine vielzahl von zuleitungen | |
| DE69429979T2 (de) | Halbleiterintegriertes Schaltungsbauelement | |
| DE112016007021T5 (de) | Störschutzfilterschaltung | |
| DE102005036834A1 (de) | Schaltungsplatine und Verfahren zum Herstellen einer Schaltungsplatine | |
| DE102014219579A1 (de) | Richtkoppler | |
| DE102011109982A1 (de) | Leistungskoppler, Leistungsverstärkermodul mit einem Leistungskoppler und Signalübertragungsmodul | |
| DE112022001649B4 (de) | Einheit zum schutz gegen elektrostatische aufladung | |
| DE102007054621A1 (de) | Hochfrequenzfilter mit elektromagnetisch gekoppelten Verzweigungsleitungen | |
| DE112019000181B4 (de) | Elektrostatische schutzvorrichtung | |
| DE102007029125A1 (de) | Breitbandiger Richtkoppler mit einstellbarer Richtschärfe | |
| DE112017007145T5 (de) | Zwischenplattenverbindungsstruktur | |
| DE102006003379B4 (de) | Elektrisches Filter | |
| DE112018000569T5 (de) | Verbinder | |
| EP2215900A2 (de) | Elektrische schaltungsanordnung und filter mit konzentrierten elementen umfassend diese elektrische schaltungsanordnung in mehrlagensubstraten | |
| DE102004037826B4 (de) | Halbleitervorrichtung mit miteinander verbundenen Halbleiterbauelementen | |
| DE112017006666T5 (de) | Rauschfilter |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| OP8 | Request for examination as to paragraph 44 patent law | ||
| R016 | Response to examination communication | ||
| R081 | Change of applicant/patentee |
Owner name: RENESAS ELECTRONICS CORPORATION, JP Free format text: FORMER OWNER: RENESAS ELECTRONICS CORP., KAWASAKI-SHI, KANAGAWA, JP |
|
| R082 | Change of representative |
Representative=s name: GLAWE DELFS MOLL PARTNERSCHAFT MBB VON PATENT-, DE |
|
| R120 | Application withdrawn or ip right abandoned |