DE102009018977A1 - Vorrichtung zur Ausrichtung und Vorfixierung eines Wafers - Google Patents

Vorrichtung zur Ausrichtung und Vorfixierung eines Wafers Download PDF

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Publication number
DE102009018977A1
DE102009018977A1 DE102009018977A DE102009018977A DE102009018977A1 DE 102009018977 A1 DE102009018977 A1 DE 102009018977A1 DE 102009018977 A DE102009018977 A DE 102009018977A DE 102009018977 A DE102009018977 A DE 102009018977A DE 102009018977 A1 DE102009018977 A1 DE 102009018977A1
Authority
DE
Germany
Prior art keywords
substrate
carrier
outer contour
carrier substrate
actuators
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
DE102009018977A
Other languages
German (de)
English (en)
Inventor
Jürgen Burggraf
Stefan Pargfrieder
Daniel Burgstaller
Paul Lindner
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EV Group GmbH
Original Assignee
EV Group GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by EV Group GmbH filed Critical EV Group GmbH
Priority to DE102009018977A priority Critical patent/DE102009018977A1/de
Priority to CN201080019365.9A priority patent/CN102439711B/zh
Priority to PCT/EP2010/002053 priority patent/WO2010121702A1/de
Priority to KR1020117025193A priority patent/KR101642536B1/ko
Priority to US13/138,906 priority patent/US8918989B2/en
Priority to EP10712900.9A priority patent/EP2422364B1/de
Priority to JP2012506360A priority patent/JP2012524985A/ja
Priority to TW099112891A priority patent/TWI588930B/zh
Publication of DE102009018977A1 publication Critical patent/DE102009018977A1/de
Priority to US14/537,066 priority patent/US9449863B2/en
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49131—Assembling to base an electrical component, e.g., capacitor, etc. by utilizing optical sighting device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49133—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49826—Assembling or joining
    • Y10T29/49895—Associating parts by use of aligning means [e.g., use of a drift pin or a "fixture"]
    • Y10T29/49902—Associating parts by use of aligning means [e.g., use of a drift pin or a "fixture"] by manipulating aligning means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/53087—Means to assemble or disassemble with signal, scale, illuminator, or optical viewer
    • Y10T29/53091—Means to assemble or disassemble with signal, scale, illuminator, or optical viewer for work-holder for assembly or disassembly
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/53978—Means to assemble or disassemble including means to relatively position plural work parts

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
DE102009018977A 2009-04-25 2009-04-25 Vorrichtung zur Ausrichtung und Vorfixierung eines Wafers Ceased DE102009018977A1 (de)

Priority Applications (9)

Application Number Priority Date Filing Date Title
DE102009018977A DE102009018977A1 (de) 2009-04-25 2009-04-25 Vorrichtung zur Ausrichtung und Vorfixierung eines Wafers
CN201080019365.9A CN102439711B (zh) 2009-04-25 2010-03-31 用于晶片的调准和预固定的装置
PCT/EP2010/002053 WO2010121702A1 (de) 2009-04-25 2010-03-31 Vorrichtung zur ausrichtung und vorfixierung eines wafers
KR1020117025193A KR101642536B1 (ko) 2009-04-25 2010-03-31 기판을 캐리어 기판 위에 정렬하고 프리픽싱 하기 위한 장치 및 방법
US13/138,906 US8918989B2 (en) 2009-04-25 2010-03-31 Device for aligning and pre-fixing a wafer
EP10712900.9A EP2422364B1 (de) 2009-04-25 2010-03-31 Vorrichtung zur ausrichtung und vorfixierung eines wafers
JP2012506360A JP2012524985A (ja) 2009-04-25 2010-03-31 ウェハを位置調整し予備付着するためのデバイス
TW099112891A TWI588930B (zh) 2009-04-25 2010-04-23 用於對準及預置晶圓之裝置
US14/537,066 US9449863B2 (en) 2009-04-25 2014-11-10 Device for aligning and pre-fixing a wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102009018977A DE102009018977A1 (de) 2009-04-25 2009-04-25 Vorrichtung zur Ausrichtung und Vorfixierung eines Wafers

Publications (1)

Publication Number Publication Date
DE102009018977A1 true DE102009018977A1 (de) 2010-11-04

Family

ID=42169431

Family Applications (1)

Application Number Title Priority Date Filing Date
DE102009018977A Ceased DE102009018977A1 (de) 2009-04-25 2009-04-25 Vorrichtung zur Ausrichtung und Vorfixierung eines Wafers

Country Status (8)

Country Link
US (2) US8918989B2 (enExample)
EP (1) EP2422364B1 (enExample)
JP (1) JP2012524985A (enExample)
KR (1) KR101642536B1 (enExample)
CN (1) CN102439711B (enExample)
DE (1) DE102009018977A1 (enExample)
TW (1) TWI588930B (enExample)
WO (1) WO2010121702A1 (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102009018977A1 (de) * 2009-04-25 2010-11-04 Ev Group Gmbh Vorrichtung zur Ausrichtung und Vorfixierung eines Wafers
DE102012010310B4 (de) 2012-05-24 2019-12-12 Muetec Automatisierte Mikroskopie Und Messtechnik Gmbh Wafer-Aufnahme
DE102012111246A1 (de) * 2012-11-21 2014-05-22 Ev Group E. Thallner Gmbh Vorrichtung und Verfahren zum Bonden
CN105247670B (zh) * 2013-12-06 2018-06-12 Ev 集团 E·索尔纳有限责任公司 用于对齐衬底的装置和方法
CN109332331A (zh) * 2018-09-28 2019-02-15 芜湖华宇彩晶科技有限公司 一种显示屏清洗用支撑定位装置
JP2021171874A (ja) * 2020-04-24 2021-11-01 セイコーエプソン株式会社 ワーク処理方法
CN120077472A (zh) 2022-11-18 2025-05-30 Ev 集团 E·索尔纳有限责任公司 用于基板接合的方法和设备
CN117096071B (zh) * 2023-10-20 2024-01-23 上海谙邦半导体设备有限公司 一种晶圆真空锁系统

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002313688A (ja) * 2001-04-16 2002-10-25 Toshiba Corp ウェーハ接着装置
US20050173781A1 (en) * 2003-03-31 2005-08-11 Peter Tolchinsky Complete device layer transfer without edge exclusion via direct wafer bonding and constrained bond-strengthening process
DE102007035788A1 (de) * 2007-07-31 2009-02-05 Robert Bosch Gmbh Waferfügeverfahren, Waferverbund sowie Chip
KR100886957B1 (ko) * 2008-04-24 2009-03-09 주식회사 엘트린 기판 본딩 모듈 및 이를 이용한 기판 본딩 방법

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4915565A (en) * 1984-03-22 1990-04-10 Sgs-Thomson Microelectronics, Inc. Manipulation and handling of integrated circuit dice
JPH03227702A (ja) 1990-01-31 1991-10-08 Bridgestone Corp 二輪車用空気入りタイヤ
US5194743A (en) * 1990-04-06 1993-03-16 Nikon Corporation Device for positioning circular semiconductor wafers
JP3227702B2 (ja) * 1990-10-12 2001-11-12 株式会社村田製作所 グリーンシート基板のブロック化装置
JPH098103A (ja) * 1995-06-19 1997-01-10 Nikon Corp 投影露光装置及び投影露光方法
US5870488A (en) * 1996-05-07 1999-02-09 Fortrend Engineering Corporation Method and apparatus for prealigning wafers in a wafer sorting system
WO2000058188A1 (en) * 1999-03-25 2000-10-05 N & K Technology, Inc. Wafer handling robot having x-y stage for wafer handling and positioning
JP2004207436A (ja) * 2002-12-25 2004-07-22 Ayumi Kogyo Kk ウエハのプリアライメント方法とその装置ならびにウエハの貼り合わせ方法とその装置
JP4615877B2 (ja) * 2003-02-20 2011-01-19 アプライド マテリアルズ インコーポレイテッド 支持ステージに対して基板を位置決めする装置及びコンピュータプログラム
TWI270952B (en) * 2003-02-20 2007-01-11 Applied Materials Inc Methods and apparatus for determining a position of a substrate relative to a support stage
JP4421833B2 (ja) 2003-03-27 2010-02-24 芝浦メカトロニクス株式会社 基板貼り合わせ装置
JP4330393B2 (ja) 2003-07-14 2009-09-16 日東電工株式会社 基板貼合せ方法およびその装置
US20050160992A1 (en) * 2004-01-28 2005-07-28 Applied Materials, Inc. Substrate gripping apparatus
JP4750724B2 (ja) * 2007-01-25 2011-08-17 東京応化工業株式会社 重ね合わせユニット及び貼り合わせ装置
DE102009018977A1 (de) * 2009-04-25 2010-11-04 Ev Group Gmbh Vorrichtung zur Ausrichtung und Vorfixierung eines Wafers

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002313688A (ja) * 2001-04-16 2002-10-25 Toshiba Corp ウェーハ接着装置
US20050173781A1 (en) * 2003-03-31 2005-08-11 Peter Tolchinsky Complete device layer transfer without edge exclusion via direct wafer bonding and constrained bond-strengthening process
DE102007035788A1 (de) * 2007-07-31 2009-02-05 Robert Bosch Gmbh Waferfügeverfahren, Waferverbund sowie Chip
KR100886957B1 (ko) * 2008-04-24 2009-03-09 주식회사 엘트린 기판 본딩 모듈 및 이를 이용한 기판 본딩 방법

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
KR 1000886957 B1 (Abstract)
KR 100886957 B1 (Abstract) *

Also Published As

Publication number Publication date
US8918989B2 (en) 2014-12-30
JP2012524985A (ja) 2012-10-18
US20120110825A1 (en) 2012-05-10
US20150089783A1 (en) 2015-04-02
KR101642536B1 (ko) 2016-07-25
EP2422364B1 (de) 2016-03-23
US9449863B2 (en) 2016-09-20
EP2422364A1 (de) 2012-02-29
CN102439711A (zh) 2012-05-02
WO2010121702A1 (de) 2010-10-28
TW201101411A (en) 2011-01-01
TWI588930B (zh) 2017-06-21
CN102439711B (zh) 2017-02-08
KR20120014557A (ko) 2012-02-17

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