DE102007046901A1 - Verfahren und Paste zur Kontaktierung von Metallflächen - Google Patents

Verfahren und Paste zur Kontaktierung von Metallflächen Download PDF

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Publication number
DE102007046901A1
DE102007046901A1 DE102007046901A DE102007046901A DE102007046901A1 DE 102007046901 A1 DE102007046901 A1 DE 102007046901A1 DE 102007046901 A DE102007046901 A DE 102007046901A DE 102007046901 A DE102007046901 A DE 102007046901A DE 102007046901 A1 DE102007046901 A1 DE 102007046901A1
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DE
Germany
Prior art keywords
silver
contacting
paste
contact
compound
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
DE102007046901A
Other languages
German (de)
English (en)
Inventor
Wolfgang Schmitt
Tanja Dickel
Katja Stenger
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Heraeus Deutschland GmbH and Co KG
Original Assignee
WC Heraus GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by WC Heraus GmbH and Co KG filed Critical WC Heraus GmbH and Co KG
Priority to DE102007046901A priority Critical patent/DE102007046901A1/de
Priority to DK08016620.0T priority patent/DK2042260T3/en
Priority to EP08016620.0A priority patent/EP2042260B1/de
Priority to KR1020080094083A priority patent/KR101102214B1/ko
Priority to US12/237,660 priority patent/US20090134206A1/en
Priority to CN2008101688371A priority patent/CN101431038B/zh
Priority to CN201110312205.XA priority patent/CN102430875B/zh
Priority to JP2008250495A priority patent/JP5156566B2/ja
Publication of DE102007046901A1 publication Critical patent/DE102007046901A1/de
Priority to US12/615,516 priority patent/US20100055828A1/en
Priority to KR1020110060009A priority patent/KR20110088477A/ko
Priority to HRP20140178AT priority patent/HRP20140178T1/hr
Ceased legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/34—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material comprising compounds which yield metals when heated
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
    • B23K35/3006—Ag as the principal constituent
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    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/4867—Applying pastes or inks, e.g. screen printing
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
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    • H01L2924/15331—Connection portion the connection portion being formed on the die mounting surface of the substrate the connection portion being formed both on the die mounting surface of the substrate and outside the die mounting surface of the substrate being a ball array, e.g. BGA
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    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
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    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H05K3/305—Affixing by adhesive

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
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  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Powder Metallurgy (AREA)
  • Conductive Materials (AREA)
  • Manufacture Of Metal Powder And Suspensions Thereof (AREA)
DE102007046901A 2007-09-28 2007-09-28 Verfahren und Paste zur Kontaktierung von Metallflächen Ceased DE102007046901A1 (de)

Priority Applications (11)

Application Number Priority Date Filing Date Title
DE102007046901A DE102007046901A1 (de) 2007-09-28 2007-09-28 Verfahren und Paste zur Kontaktierung von Metallflächen
DK08016620.0T DK2042260T3 (en) 2007-09-28 2008-09-22 METHOD AND FIT FOR ESTABLISHING CONTACT BETWEEN METAL SURFACES
EP08016620.0A EP2042260B1 (de) 2007-09-28 2008-09-22 Verfahren und Paste zur Kontaktierung von Metallflächen
KR1020080094083A KR101102214B1 (ko) 2007-09-28 2008-09-25 금속 표면의 접촉을 위한 방법 및 페이스트
US12/237,660 US20090134206A1 (en) 2007-09-28 2008-09-25 Process and Paste for Contacting Metal Surfaces
CN2008101688371A CN101431038B (zh) 2007-09-28 2008-09-28 用于多个金属面触点接通的方法和膏体
CN201110312205.XA CN102430875B (zh) 2007-09-28 2008-09-28 用于多个金属面触点接通的方法和膏体
JP2008250495A JP5156566B2 (ja) 2007-09-28 2008-09-29 金属面の接続方法及びそのためのペースト
US12/615,516 US20100055828A1 (en) 2007-09-28 2009-11-10 Process and paste for contacting metal surfaces
KR1020110060009A KR20110088477A (ko) 2007-09-28 2011-06-21 금속 표면의 접촉을 위한 방법 및 페이스트
HRP20140178AT HRP20140178T1 (hr) 2007-09-28 2014-02-27 Metoda i pasta za stvaranje kontakata metalnih površina

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DE102008031893A1 (de) * 2008-07-08 2010-01-14 W.C. Heraeus Gmbh Verfahren zur Fügung von Metallflächen
EP2158997A2 (de) 2008-08-27 2010-03-03 W.C. Heraeus GmbH Steuerung der Porosität von Metallpasten für den druckfreien Niedertemperatursinterprozess
WO2011026624A1 (de) 2009-09-04 2011-03-10 W. C. Heraeus Gmbh & Co. Kg Metallpaste mit co-vorläufern
DE102009040076A1 (de) 2009-09-04 2011-03-10 W.C. Heraeus Gmbh Metallpaste mit Oxidationsmittel
DE102010044329A1 (de) 2010-09-03 2012-03-08 Heraeus Materials Technology Gmbh & Co. Kg Kontaktierungsmittel und Verfahren zur Kontaktierung elektrischer Bauteile
DE102010044326A1 (de) 2010-09-03 2012-03-08 Heraeus Materials Technology Gmbh & Co. Kg Verwendung von aliphatischen Kohlenwasserstoffen und Paraffinen als Lösemittel in Silbersinterpasten
WO2012052252A2 (de) 2010-10-20 2012-04-26 Robert Bosch Gmbh Ausgangswerkstoff einer sinterverbindung und verfahren zur herstellung der sinterverbindung
WO2012052251A2 (de) 2010-10-20 2012-04-26 Robert Bosch Gmbh Ausgangswerkstoff einer sinterverbindung und verfahren zur herstellung der sinterverbindung
DE102011079660A1 (de) 2011-07-22 2013-01-24 Robert Bosch Gmbh Schichtverbund aus einer Schichtanordnung und einer elektrischen oder elektronischen Komponente
WO2013011127A2 (de) 2011-07-20 2013-01-24 Behr Gmbh & Co. Kg Thermoelektrisches modul, verfahren zur herstellung eines thermoelektrischen moduls und verwendung eines metallischen glases oder eines gesinterten werkstoffes
DE102011109226A1 (de) * 2011-08-02 2013-02-07 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung einer Verbindungsschicht mit einem Sintermaterial, Verwendung einer Mischung zur Herstellung einer Verbindungsschicht, Verbindungsschicht mit einem Sintermaterial und Bauelement mit einer Verbindungsschicht
EP2572814A1 (de) 2011-09-20 2013-03-27 Heraeus Materials Technology GmbH & Co. KG Paste und Verfahren zum Verbinden von elektronischem Bauelement mit Substrat
DE102011083893A1 (de) 2011-09-30 2013-04-04 Robert Bosch Gmbh Ausgangswerkstoff einer Sinterverbindung und Verfahren zur Herstellung der Sinterverbindung
DE102012200034A1 (de) 2012-01-03 2013-07-04 Robert Bosch Gmbh Verfahren zur Herstellung eines Verbundkörpers mit gesinterter Fügeschicht und Sintervorrichtung zur Herstellung eines derartigen Verbundkörpers
WO2013156570A1 (de) 2012-04-20 2013-10-24 Technische Universität Berlin Lotmaterial, verfahren zu dessen herstellung und seine verwendung zum drucklosen fügen metallischer substrate
WO2014086519A1 (de) 2012-12-06 2014-06-12 Robert Bosch Gmbh Verfahren zum verbinden von wenigstens zwei komponenten unter verwendung eines sinterprozesses
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DE102008031893A1 (de) * 2008-07-08 2010-01-14 W.C. Heraeus Gmbh Verfahren zur Fügung von Metallflächen
EP2158997A2 (de) 2008-08-27 2010-03-03 W.C. Heraeus GmbH Steuerung der Porosität von Metallpasten für den druckfreien Niedertemperatursinterprozess
DE102008039828A1 (de) 2008-08-27 2010-03-04 W.C. Heraeus Gmbh Steuerung der Porosität von Metallpasten für den druckfreien Niedertemperatursinterprozess
EP2158997A3 (de) * 2008-08-27 2011-08-24 W.C. Heraeus GmbH Steuerung der Porosität von Metallpasten für den druckfreien Niedertemperatursinterprozess
WO2011026624A1 (de) 2009-09-04 2011-03-10 W. C. Heraeus Gmbh & Co. Kg Metallpaste mit co-vorläufern
DE102009040076A1 (de) 2009-09-04 2011-03-10 W.C. Heraeus Gmbh Metallpaste mit Oxidationsmittel
DE102009040078A1 (de) 2009-09-04 2011-03-10 W.C. Heraeus Gmbh Metallpaste mit CO-Vorläufern
WO2011026623A1 (de) 2009-09-04 2011-03-10 W. C. Heraeus Gmbh Metallpaste mit oxidationsmitteln
US8950653B2 (en) 2009-09-04 2015-02-10 Heraeus Materials Technology Gmbh & Co. Kg Metal paste with co-precursors
US8950652B2 (en) 2009-09-04 2015-02-10 Heraeus Materials Technology Gmbh & Co. Kg Metal paste with oxidizing agents
EP2428293A2 (de) * 2010-09-03 2012-03-14 Heraeus Materials Technology GmbH & Co. KG Kontaktierungsmittel und Verfahren zur Kontaktierung elektrischer Bauteile
US8925789B2 (en) 2010-09-03 2015-01-06 Heraeus Materials Technology Gmbh & Co. Kg Contacting means and method for contacting electrical components
EP2428293A3 (de) * 2010-09-03 2016-08-10 Heraeus Deutschland GmbH & Co. KG Kontaktierungsmittel und Verfahren zur Kontaktierung elektrischer Bauteile
DE102010044326A1 (de) 2010-09-03 2012-03-08 Heraeus Materials Technology Gmbh & Co. Kg Verwendung von aliphatischen Kohlenwasserstoffen und Paraffinen als Lösemittel in Silbersinterpasten
DE102010044329A1 (de) 2010-09-03 2012-03-08 Heraeus Materials Technology Gmbh & Co. Kg Kontaktierungsmittel und Verfahren zur Kontaktierung elektrischer Bauteile
WO2012052252A2 (de) 2010-10-20 2012-04-26 Robert Bosch Gmbh Ausgangswerkstoff einer sinterverbindung und verfahren zur herstellung der sinterverbindung
WO2012052251A2 (de) 2010-10-20 2012-04-26 Robert Bosch Gmbh Ausgangswerkstoff einer sinterverbindung und verfahren zur herstellung der sinterverbindung
DE102010042721A1 (de) 2010-10-20 2012-04-26 Robert Bosch Gmbh Ausgangswerkstoff einer Sinterverbindung und Verfahren zur Herstellung der Sinterverbindung
DE102010042702A1 (de) 2010-10-20 2012-04-26 Robert Bosch Gmbh Ausgangswerkstoff einer Sinterverbindung und Verfahren zur Herstellung der Sinterverbindung
EP3695921A1 (de) 2010-10-20 2020-08-19 Robert Bosch GmbH Ausgangswerkstoff einer sinterverbindung und verfahren zur herstellung der sinterverbindung
WO2013011127A2 (de) 2011-07-20 2013-01-24 Behr Gmbh & Co. Kg Thermoelektrisches modul, verfahren zur herstellung eines thermoelektrischen moduls und verwendung eines metallischen glases oder eines gesinterten werkstoffes
DE102011079467A1 (de) 2011-07-20 2013-01-24 Behr Gmbh & Co. Kg Thermoelektrisches Modul, Verfahren zur Herstellung eines thermoelektrischen Moduls und Verwendung eines metallischen Glases oder eines gesinterten Werkstoffes
US9837594B2 (en) 2011-07-20 2017-12-05 Mahle International Gmbh Thermoelectric module, method for producing a thermoelectric module and use of a metallic glass or a sintered material
WO2013013956A2 (de) 2011-07-22 2013-01-31 Robert Bosch Gmbh Schichtverbund aus einer schichtanordnung und einer elektrischen oder elektronischen komponente
DE102011079660B4 (de) 2011-07-22 2023-06-07 Robert Bosch Gmbh Schichtverbund aus einer Schichtanordnung und einer elektrischen oder elektronischen Komponente, eine Schaltungsanordnung diesen Schichtverbund enthaltend und Verfahren zu dessen Ausbildung
DE102011079660A1 (de) 2011-07-22 2013-01-24 Robert Bosch Gmbh Schichtverbund aus einer Schichtanordnung und einer elektrischen oder elektronischen Komponente
DE102011109226A1 (de) * 2011-08-02 2013-02-07 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung einer Verbindungsschicht mit einem Sintermaterial, Verwendung einer Mischung zur Herstellung einer Verbindungsschicht, Verbindungsschicht mit einem Sintermaterial und Bauelement mit einer Verbindungsschicht
EP2572814A1 (de) 2011-09-20 2013-03-27 Heraeus Materials Technology GmbH & Co. KG Paste und Verfahren zum Verbinden von elektronischem Bauelement mit Substrat
WO2013045360A1 (de) 2011-09-30 2013-04-04 Robert Bosch Gmbh Ausgangswerkstoff einer sinterverbindung und verfahren zur herstellung der sinterverbindung
DE102011083893A1 (de) 2011-09-30 2013-04-04 Robert Bosch Gmbh Ausgangswerkstoff einer Sinterverbindung und Verfahren zur Herstellung der Sinterverbindung
DE102012200034A1 (de) 2012-01-03 2013-07-04 Robert Bosch Gmbh Verfahren zur Herstellung eines Verbundkörpers mit gesinterter Fügeschicht und Sintervorrichtung zur Herstellung eines derartigen Verbundkörpers
WO2013102534A1 (de) 2012-01-03 2013-07-11 Robert Bosch Gmbh Verfahren zur herstellung eines verbundkörpers mit gesinterter fügeschicht und sintervorrichtung zur herstellung eines derartigen verbundkörpers
US10065273B1 (en) 2012-04-20 2018-09-04 Nano-Join Gmbh Solder material, method for the production thereof and use thereof to join metal substrates without pressure
DE102012206587A1 (de) 2012-04-20 2013-11-07 Technische Universität Berlin Lotmaterial, Verfahren zu dessen Herstellung und seine Verwendung zum drucklosen Fügen metallischer Substrate
WO2013156570A1 (de) 2012-04-20 2013-10-24 Technische Universität Berlin Lotmaterial, verfahren zu dessen herstellung und seine verwendung zum drucklosen fügen metallischer substrate
DE102012222416A1 (de) 2012-12-06 2014-06-12 Robert Bosch Gmbh Verfahren zum Verbinden von wenigstens zwei Komponenten unter Verwendung eines Sinterprozesses
WO2014086519A1 (de) 2012-12-06 2014-06-12 Robert Bosch Gmbh Verfahren zum verbinden von wenigstens zwei komponenten unter verwendung eines sinterprozesses
WO2023067191A1 (en) 2021-10-21 2023-04-27 Nano-Join Gmbh Composition for sintering comprising an organic silver precursor and particles of agglomerated silver nanoparticles
EP4249148A1 (en) 2022-03-21 2023-09-27 Nano-Join GmbH Composition for sintering comprising an organic silver precursor and particles of agglomerated silver nanoparticles

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