DE102007009351A1 - Leuchtmittel - Google Patents

Leuchtmittel Download PDF

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Publication number
DE102007009351A1
DE102007009351A1 DE102007009351A DE102007009351A DE102007009351A1 DE 102007009351 A1 DE102007009351 A1 DE 102007009351A1 DE 102007009351 A DE102007009351 A DE 102007009351A DE 102007009351 A DE102007009351 A DE 102007009351A DE 102007009351 A1 DE102007009351 A1 DE 102007009351A1
Authority
DE
Germany
Prior art keywords
light
illuminant according
semiconductor structures
chip arrangement
emitting semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE102007009351A
Other languages
German (de)
English (en)
Inventor
Georg Diamantidis
Frederic Tonhofer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NOCTRON SOPARFI S.A., BRIDEL, LU
Original Assignee
Noctron Holding SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Noctron Holding SA filed Critical Noctron Holding SA
Priority to DE102007009351A priority Critical patent/DE102007009351A1/de
Priority to CN200780052512A priority patent/CN101647116A/zh
Priority to US12/528,432 priority patent/US20110024772A1/en
Priority to PCT/EP2007/007921 priority patent/WO2008101524A1/de
Priority to TW096135717A priority patent/TW200836324A/zh
Priority to US12/528,431 priority patent/US20110049714A1/en
Priority to CN200780052513A priority patent/CN101681908A/zh
Priority to PCT/EP2007/008833 priority patent/WO2008101525A1/de
Priority to EP07818904A priority patent/EP2156469A1/de
Publication of DE102007009351A1 publication Critical patent/DE102007009351A1/de
Withdrawn legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00—Globes; Bowls; Cover glasses
    • F21V3/04—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
    • H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/36—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
    • H01L33/38—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/647—Heat extraction or cooling elements the elements conducting electric current to or from the semiconductor body
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • General Engineering & Computer Science (AREA)
  • Led Devices (AREA)
  • Led Device Packages (AREA)
DE102007009351A 2007-02-23 2007-02-23 Leuchtmittel Withdrawn DE102007009351A1 (de)

Priority Applications (9)

Application Number Priority Date Filing Date Title
DE102007009351A DE102007009351A1 (de) 2007-02-23 2007-02-23 Leuchtmittel
CN200780052512A CN101647116A (zh) 2007-02-23 2007-09-12 用于半导体结构的电连接结构、其制造方法及其在发光单元中的应用
US12/528,432 US20110024772A1 (en) 2007-02-23 2007-09-12 Electrical connection for semiconductor structures, method for the production thereof, and use of such a connection in a luminous element
PCT/EP2007/007921 WO2008101524A1 (de) 2007-02-23 2007-09-12 Elektrische verbindung für halbleiterstrukturen, verfahren zu ihrer herstellung sowie verwendung einer solchen in einem leuchtelement
TW096135717A TW200836324A (en) 2007-02-23 2007-09-26 Electrical connection for semiconductor structures, method for the production thereof, and use of such a connection in a luminous element
US12/528,431 US20110049714A1 (en) 2007-02-23 2007-10-11 Illuminant
CN200780052513A CN101681908A (zh) 2007-02-23 2007-10-11 发光装置
PCT/EP2007/008833 WO2008101525A1 (de) 2007-02-23 2007-10-11 Leuchtmittel
EP07818904A EP2156469A1 (de) 2007-02-23 2007-10-11 Leuchtmittel

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102007009351A DE102007009351A1 (de) 2007-02-23 2007-02-23 Leuchtmittel

Publications (1)

Publication Number Publication Date
DE102007009351A1 true DE102007009351A1 (de) 2008-08-28

Family

ID=38754774

Family Applications (1)

Application Number Title Priority Date Filing Date
DE102007009351A Withdrawn DE102007009351A1 (de) 2007-02-23 2007-02-23 Leuchtmittel

Country Status (6)

Country Link
US (2) US20110024772A1 (zh)
EP (1) EP2156469A1 (zh)
CN (2) CN101647116A (zh)
DE (1) DE102007009351A1 (zh)
TW (1) TW200836324A (zh)
WO (2) WO2008101524A1 (zh)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102008005935A1 (de) * 2007-11-29 2009-06-04 Osram Opto Semiconductors Gmbh Halbleiteranordnung sowie Verfahren zur Herstellung einer Halbleiteranordnung
EP2482347A3 (en) * 2011-01-31 2016-01-06 Yung Pun Cheng Method for packaging an LED emitting light omnidirectionally and an LED package
DE102015114849A1 (de) * 2015-09-04 2017-03-09 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung von Leuchtdiodenfilamenten und Leuchtdiodenfilament
DE102015120085A1 (de) * 2015-11-19 2017-05-24 Osram Opto Semiconductors Gmbh LED-Filamente, Verfahren zur Herstellung von LED-Filamenten und Retrofitlampe mit LED-Filament

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102008049188A1 (de) * 2008-09-26 2010-04-01 Osram Opto Semiconductors Gmbh Optoelektronisches Modul mit einem Trägersubstrat und einer Mehrzahl von strahlungsemittierenden Halbleiterbauelementen und Verfahren zu dessen Herstellung
DE102010023342A1 (de) * 2010-06-10 2011-12-15 Osram Opto Semiconductors Gmbh Leuchtdiodenanordnung und Leuchtmittel insbesondere mit solch einer Leuchtdiodenanordnung
TWI446578B (zh) * 2010-09-23 2014-07-21 Epistar Corp 發光元件及其製法
DE102012209325B4 (de) * 2012-06-01 2021-09-30 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronisches Modul
JP2015525005A (ja) * 2012-08-15 2015-08-27 ダウ グローバル テクノロジーズ エルエルシー 二部材電気コネクタ
CN104091867B (zh) * 2014-07-25 2017-07-14 厦门市三安光电科技有限公司 高压发光二极管芯片及其制作方法
DE102016106734A1 (de) * 2015-12-14 2017-06-14 Osram Opto Semiconductors Gmbh Träger für ein optoelektronisches Bauelement, Verfahren zum Herstellen eines Trägers für ein optoelektronisches Bauelement, Wafer und Lötverfahren
KR102162739B1 (ko) * 2018-04-19 2020-10-07 엘지전자 주식회사 반도체 발광소자의 자가조립 장치 및 방법

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JPH0662911B2 (ja) * 1987-03-11 1994-08-17 積水化学工業株式会社 導電ペ−スト
US5404282A (en) * 1993-09-17 1995-04-04 Hewlett-Packard Company Multiple light emitting diode module
DE69524429T2 (de) * 1994-09-08 2002-05-23 Idemitsu Kosan Co Verfahren zur abdichtung eines organischen elektrolumineszenten elements und organisches elektrolumineszentes element
JP3195720B2 (ja) * 1994-12-20 2001-08-06 シャープ株式会社 多色ｌｅｄ素子およびその多色ｌｅｄ素子を用いたｌｅｄ表示装置、並びに多色ｌｅｄ素子の製造方法
JPH0982133A (ja) * 1995-09-12 1997-03-28 Hitachi Chem Co Ltd 導電粉体の製造法
US5583350A (en) * 1995-11-02 1996-12-10 Motorola Full color light emitting diode display assembly
JP3337405B2 (ja) * 1996-12-27 2002-10-21 シャープ株式会社 発光表示素子およびその電気配線基板への接続方法ならびに製造方法
DE69936375T2 (de) * 1998-09-17 2008-02-28 Koninklijke Philips Electronics N.V. Led-leuchte
JP2001068742A (ja) * 1999-08-25 2001-03-16 Sanyo Electric Co Ltd 混成集積回路装置
GB2366610A (en) * 2000-09-06 2002-03-13 Mark Shaffer Electroluminscent lamp
JP2002334604A (ja) * 2001-03-06 2002-11-22 Yoshimitsu Suda ヘッドライト等のバルブ
US6480389B1 (en) * 2002-01-04 2002-11-12 Opto Tech Corporation Heat dissipation structure for solid-state light emitting device package
US6936856B2 (en) * 2002-01-15 2005-08-30 Osram Opto Semiconductors Gmbh Multi substrate organic light emitting devices
AU2003221442A1 (en) * 2002-03-22 2003-10-08 Nichia Corporation Nitride phosphor and method for preparation thereof, and light emitting device
TWI249148B (en) * 2004-04-13 2006-02-11 Epistar Corp Light-emitting device array having binding layer
CN100472823C (zh) * 2003-10-15 2009-03-25 日亚化学工业株式会社 发光装置
EP1544923A3 (de) * 2003-12-19 2007-03-14 Osram Opto Semiconductors GmbH Strahlungemittierendes Halbleiterbauelement und Verfahren zum Befestigen eines Halbleiterchips auf einem Leiterrahmen
JP2007517378A (ja) * 2003-12-24 2007-06-28 松下電器産業株式会社 半導体発光装置、照明モジュール、照明装置、表示素子、および半導体発光装置の製造方法
US7195944B2 (en) * 2005-01-11 2007-03-27 Semileds Corporation Systems and methods for producing white-light emitting diodes
US7045375B1 (en) * 2005-01-14 2006-05-16 Au Optronics Corporation White light emitting device and method of making same
WO2006095949A1 (en) * 2005-03-11 2006-09-14 Seoul Semiconductor Co., Ltd. Led package having an array of light emitting cells coupled in series

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102008005935A1 (de) * 2007-11-29 2009-06-04 Osram Opto Semiconductors Gmbh Halbleiteranordnung sowie Verfahren zur Herstellung einer Halbleiteranordnung
EP2482347A3 (en) * 2011-01-31 2016-01-06 Yung Pun Cheng Method for packaging an LED emitting light omnidirectionally and an LED package
DE102015114849A1 (de) * 2015-09-04 2017-03-09 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung von Leuchtdiodenfilamenten und Leuchtdiodenfilament
DE102015114849B4 (de) 2015-09-04 2022-01-13 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Verfahren zur Herstellung von Leuchtdiodenfilamenten und Leuchtdiodenfilament
DE102015120085A1 (de) * 2015-11-19 2017-05-24 Osram Opto Semiconductors Gmbh LED-Filamente, Verfahren zur Herstellung von LED-Filamenten und Retrofitlampe mit LED-Filament

Also Published As

Publication number Publication date
WO2008101524A1 (de) 2008-08-28
CN101681908A (zh) 2010-03-24
US20110024772A1 (en) 2011-02-03
CN101647116A (zh) 2010-02-10
US20110049714A1 (en) 2011-03-03
WO2008101525A1 (de) 2008-08-28
TW200836324A (en) 2008-09-01
EP2156469A1 (de) 2010-02-24

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Legal Events

Date Code Title Description
8127 New person/name/address of the applicant

Owner name: NOCTRON SOPARFI S.A., BRIDEL, LU

R005 Application deemed withdrawn due to failure to request examination

Effective date: 20140225