DE102006016312B4 - Radial ausgerichtetes Polierkissen und Verfahren zum Polieren - Google Patents

Radial ausgerichtetes Polierkissen und Verfahren zum Polieren Download PDF

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Publication number
DE102006016312B4
DE102006016312B4 DE102006016312.5A DE102006016312A DE102006016312B4 DE 102006016312 B4 DE102006016312 B4 DE 102006016312B4 DE 102006016312 A DE102006016312 A DE 102006016312A DE 102006016312 B4 DE102006016312 B4 DE 102006016312B4
Authority
DE
Germany
Prior art keywords
polishing
radial
microchannels
grooves
straight radial
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE102006016312.5A
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German (de)
English (en)
Other versions
DE102006016312A1 (de
Inventor
Gregory P. Muldowney
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DuPont Electronic Materials Holding Inc
Original Assignee
Rohm and Haas Electronic Materials CMP Holdings Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm and Haas Electronic Materials CMP Holdings Inc filed Critical Rohm and Haas Electronic Materials CMP Holdings Inc
Publication of DE102006016312A1 publication Critical patent/DE102006016312A1/de
Application granted granted Critical
Publication of DE102006016312B4 publication Critical patent/DE102006016312B4/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • D—TEXTILES; PAPER
    • D21—PAPER-MAKING; PRODUCTION OF CELLULOSE
    • D21H—PULP COMPOSITIONS; PREPARATION THEREOF NOT COVERED BY SUBCLASSES D21C OR D21D; IMPREGNATING OR COATING OF PAPER; TREATMENT OF FINISHED PAPER NOT COVERED BY CLASS B31 OR SUBCLASS D21G; PAPER NOT OTHERWISE PROVIDED FOR
    • D21H27/00—Special paper not otherwise provided for, e.g. made by multi-step processes
    • D21H27/18—Paper- or board-based structures for surface covering
    • D21H27/20—Flexible structures being applied by the user, e.g. wallpaper
    • D—TEXTILES; PAPER
    • D21—PAPER-MAKING; PRODUCTION OF CELLULOSE
    • D21H—PULP COMPOSITIONS; PREPARATION THEREOF NOT COVERED BY SUBCLASSES D21C OR D21D; IMPREGNATING OR COATING OF PAPER; TREATMENT OF FINISHED PAPER NOT COVERED BY CLASS B31 OR SUBCLASS D21G; PAPER NOT OTHERWISE PROVIDED FOR
    • D21H27/00—Special paper not otherwise provided for, e.g. made by multi-step processes
    • D21H27/001—Release paper
    • D—TEXTILES; PAPER
    • D21—PAPER-MAKING; PRODUCTION OF CELLULOSE
    • D21H—PULP COMPOSITIONS; PREPARATION THEREOF NOT COVERED BY SUBCLASSES D21C OR D21D; IMPREGNATING OR COATING OF PAPER; TREATMENT OF FINISHED PAPER NOT COVERED BY CLASS B31 OR SUBCLASS D21G; PAPER NOT OTHERWISE PROVIDED FOR
    • D21H27/00—Special paper not otherwise provided for, e.g. made by multi-step processes
    • D21H27/30—Multi-ply
    • D21H27/32—Multi-ply with materials applied between the sheets
    • D21H27/34—Continuous materials, e.g. filaments, sheets, nets
    • D21H27/36—Films made from synthetic macromolecular compounds

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
DE102006016312.5A 2005-04-12 2006-04-06 Radial ausgerichtetes Polierkissen und Verfahren zum Polieren Expired - Fee Related DE102006016312B4 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US67046605P 2005-04-12 2005-04-12
US60/670,466 2005-04-12

Publications (2)

Publication Number Publication Date
DE102006016312A1 DE102006016312A1 (de) 2006-10-19
DE102006016312B4 true DE102006016312B4 (de) 2018-10-31

Family

ID=37054983

Family Applications (1)

Application Number Title Priority Date Filing Date
DE102006016312.5A Expired - Fee Related DE102006016312B4 (de) 2005-04-12 2006-04-06 Radial ausgerichtetes Polierkissen und Verfahren zum Polieren

Country Status (7)

Country Link
US (1) US7255633B2 (https=)
JP (1) JP5089073B2 (https=)
KR (1) KR101279819B1 (https=)
CN (1) CN100515685C (https=)
DE (1) DE102006016312B4 (https=)
FR (1) FR2884164B1 (https=)
TW (1) TWI372093B (https=)

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TWI455795B (zh) * 2007-10-18 2014-10-11 Iv Technologies Co Ltd 研磨墊及研磨方法
US7927092B2 (en) 2007-12-31 2011-04-19 Corning Incorporated Apparatus for forming a slurry polishing pad
US9180570B2 (en) 2008-03-14 2015-11-10 Nexplanar Corporation Grooved CMP pad
US9117870B2 (en) * 2008-03-27 2015-08-25 Lam Research Corporation High throughput cleaner chamber
JP5585081B2 (ja) * 2008-05-16 2014-09-10 東レ株式会社 研磨パッド
TWI449597B (zh) * 2008-07-09 2014-08-21 Iv Technologies Co Ltd 研磨墊及其製造方法
TWI535527B (zh) * 2009-07-20 2016-06-01 智勝科技股份有限公司 研磨方法、研磨墊與研磨系統
JP5544124B2 (ja) * 2009-08-18 2014-07-09 富士紡ホールディングス株式会社 研磨パッド
US8562272B2 (en) * 2010-02-16 2013-10-22 Lam Research Corporation Substrate load and unload mechanisms for high throughput
US8282698B2 (en) * 2010-03-24 2012-10-09 Lam Research Corporation Reduction of particle contamination produced by moving mechanisms in a process tool
US8893642B2 (en) 2010-03-24 2014-11-25 Lam Research Corporation Airflow management for low particulate count in a process tool
JP5839163B2 (ja) * 2010-07-12 2016-01-06 Jsr株式会社 化学機械研磨パッドおよび化学機械研磨方法
US20140054266A1 (en) * 2012-08-24 2014-02-27 Wiechang Jin Compositions and methods for selective polishing of platinum and ruthenium materials
US9522454B2 (en) * 2012-12-17 2016-12-20 Seagate Technology Llc Method of patterning a lapping plate, and patterned lapping plates
KR20170096025A (ko) * 2014-12-22 2017-08-23 쓰리엠 이노베이티브 프로퍼티즈 컴파니 제거 가능한 연마 부재를 갖는 연마 용품 및 이들의 분리 및 교체 방법
US10875146B2 (en) * 2016-03-24 2020-12-29 Rohm And Haas Electronic Materials Cmp Holdings Debris-removal groove for CMP polishing pad
US10589399B2 (en) * 2016-03-24 2020-03-17 Applied Materials, Inc. Textured small pad for chemical mechanical polishing
US10625393B2 (en) 2017-06-08 2020-04-21 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pads having offset circumferential grooves for improved removal rate and polishing uniformity
US10857647B2 (en) 2017-06-14 2020-12-08 Rohm And Haas Electronic Materials Cmp Holdings High-rate CMP polishing method
US10857648B2 (en) 2017-06-14 2020-12-08 Rohm And Haas Electronic Materials Cmp Holdings Trapezoidal CMP groove pattern
US10586708B2 (en) 2017-06-14 2020-03-10 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Uniform CMP polishing method
US10777418B2 (en) 2017-06-14 2020-09-15 Rohm And Haas Electronic Materials Cmp Holdings, I Biased pulse CMP groove pattern
US10861702B2 (en) 2017-06-14 2020-12-08 Rohm And Haas Electronic Materials Cmp Holdings Controlled residence CMP polishing method
US10654146B2 (en) 2018-01-23 2020-05-19 Seagate Technology Llc One or more charging members used in the manufacture of a lapping plate, and related apparatuses and methods of making
CN110039380B (zh) * 2019-04-11 2020-12-01 上海理工大学 一种用于周期性微沟槽结构抛光的磁性复合流体抛光装置
CN112720282B (zh) * 2020-12-31 2022-04-08 湖北鼎汇微电子材料有限公司 一种抛光垫
EP4382250A4 (en) * 2021-08-04 2025-06-11 Kuraray Co., Ltd. POLISHING CUSHION
CN114770371B (zh) * 2022-03-10 2023-08-25 宁波赢伟泰科新材料有限公司 一种高抛光液使用效率的抛光垫
CN114918824B (zh) * 2022-06-29 2024-08-20 万华化学集团电子材料有限公司 一种具有径向微沟槽的抛光垫
US20240139906A1 (en) * 2022-10-27 2024-05-02 Applied Materials, Inc. Control of carrier head sweep and platen shape
KR20260017377A (ko) * 2023-06-12 2026-02-05 주식회사 쿠라레 연마 패드, 연마 방법 및 반도체의 제조 방법
CN117325088A (zh) * 2023-09-20 2024-01-02 咸宁南玻光电玻璃有限公司 抛光海绵、抛光设备及玻璃抛光方法

Citations (3)

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Publication number Priority date Publication date Assignee Title
US5216843A (en) 1992-09-24 1993-06-08 Intel Corporation Polishing pad conditioning apparatus for wafer planarization process
US5456627A (en) 1993-12-20 1995-10-10 Westech Systems, Inc. Conditioner for a polishing pad and method therefor
US5885147A (en) 1997-05-12 1999-03-23 Integrated Process Equipment Corp. Apparatus for conditioning polishing pads

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US5081051A (en) 1990-09-12 1992-01-14 Intel Corporation Method for conditioning the surface of a polishing pad
US5785585A (en) 1995-09-18 1998-07-28 International Business Machines Corporation Polish pad conditioner with radial compensation
US5611943A (en) 1995-09-29 1997-03-18 Intel Corporation Method and apparatus for conditioning of chemical-mechanical polishing pads
JP3042593B2 (ja) * 1995-10-25 2000-05-15 日本電気株式会社 研磨パッド
US5938507A (en) 1995-10-27 1999-08-17 Applied Materials, Inc. Linear conditioner apparatus for a chemical mechanical polishing system
US5645469A (en) 1996-09-06 1997-07-08 Advanced Micro Devices, Inc. Polishing pad with radially extending tapered channels
US5916010A (en) 1997-10-30 1999-06-29 International Business Machines Corporation CMP pad maintenance apparatus and method
US6027659A (en) 1997-12-03 2000-02-22 Intel Corporation Polishing pad conditioning surface having integral conditioning points
JP2001001253A (ja) * 1999-06-21 2001-01-09 Toray Ind Inc 研磨布
US6306008B1 (en) 1999-08-31 2001-10-23 Micron Technology, Inc. Apparatus and method for conditioning and monitoring media used for chemical-mechanical planarization
US6626743B1 (en) 2000-03-31 2003-09-30 Lam Research Corporation Method and apparatus for conditioning a polishing pad
JP2003535462A (ja) 2000-05-31 2003-11-25 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ 半導体及び集積回路を製造するための研磨方法及び装置
JP2002100592A (ja) * 2000-09-20 2002-04-05 Rodel Nitta Co 研磨パッド
US6767427B2 (en) 2001-06-07 2004-07-27 Lam Research Corporation Apparatus and method for conditioning polishing pad in a chemical mechanical planarization process
JP2003145413A (ja) * 2001-10-31 2003-05-20 Applied Materials Inc 研磨パッド
JP2003303793A (ja) * 2002-04-12 2003-10-24 Hitachi Ltd 研磨装置および半導体装置の製造方法
JP2004167605A (ja) * 2002-11-15 2004-06-17 Rodel Nitta Co 研磨パッドおよび研磨装置
US6976907B2 (en) 2003-01-10 2005-12-20 Intel Corporation Polishing pad conditioning
JPWO2005023487A1 (ja) * 2003-08-29 2007-10-04 東邦エンジニアリング株式会社 研磨パッドおよびその製造方法と製造装置
CN1852786B (zh) * 2003-09-26 2011-01-12 信越半导体股份有限公司 研磨布及其加工方法及使用该研磨布的基板的制造方法
US6843711B1 (en) * 2003-12-11 2005-01-18 Rohm And Haas Electronic Materials Cmp Holdings, Inc Chemical mechanical polishing pad having a process-dependent groove configuration

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5216843A (en) 1992-09-24 1993-06-08 Intel Corporation Polishing pad conditioning apparatus for wafer planarization process
US5456627A (en) 1993-12-20 1995-10-10 Westech Systems, Inc. Conditioner for a polishing pad and method therefor
US5885147A (en) 1997-05-12 1999-03-23 Integrated Process Equipment Corp. Apparatus for conditioning polishing pads

Also Published As

Publication number Publication date
JP5089073B2 (ja) 2012-12-05
DE102006016312A1 (de) 2006-10-19
FR2884164B1 (fr) 2014-04-11
FR2884164A1 (fr) 2006-10-13
US20060229002A1 (en) 2006-10-12
JP2006289605A (ja) 2006-10-26
TW200642797A (en) 2006-12-16
US7255633B2 (en) 2007-08-14
KR101279819B1 (ko) 2013-06-28
KR20060108211A (ko) 2006-10-17
CN100515685C (zh) 2009-07-22
TWI372093B (en) 2012-09-11
CN1846940A (zh) 2006-10-18

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R079 Amendment of ipc main class

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R016 Response to examination communication
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R020 Patent grant now final
R119 Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee