DE102005024096A1 - Vorrichtung und Verfahren zur Montage elektrischer Bauteile - Google Patents

Vorrichtung und Verfahren zur Montage elektrischer Bauteile Download PDF

Info

Publication number
DE102005024096A1
DE102005024096A1 DE102005024096A DE102005024096A DE102005024096A1 DE 102005024096 A1 DE102005024096 A1 DE 102005024096A1 DE 102005024096 A DE102005024096 A DE 102005024096A DE 102005024096 A DE102005024096 A DE 102005024096A DE 102005024096 A1 DE102005024096 A1 DE 102005024096A1
Authority
DE
Germany
Prior art keywords
component
cooling device
binder
electronic component
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
DE102005024096A
Other languages
German (de)
English (en)
Inventor
Volker SCHÜREN
Alexander Seufert
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Bosch Rexroth AG
Original Assignee
Bosch Rexroth AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bosch Rexroth AG filed Critical Bosch Rexroth AG
Priority to DE102005024096A priority Critical patent/DE102005024096A1/de
Priority to PCT/EP2006/004151 priority patent/WO2006125512A2/fr
Publication of DE102005024096A1 publication Critical patent/DE102005024096A1/de
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/021—Components thermally connected to metal substrates or heat-sinks by insert mounting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10166—Transistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/0485—Tacky flux, e.g. for adhering components during mounting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
DE102005024096A 2005-05-25 2005-05-25 Vorrichtung und Verfahren zur Montage elektrischer Bauteile Ceased DE102005024096A1 (de)

Priority Applications (2)

Application Number Priority Date Filing Date Title
DE102005024096A DE102005024096A1 (de) 2005-05-25 2005-05-25 Vorrichtung und Verfahren zur Montage elektrischer Bauteile
PCT/EP2006/004151 WO2006125512A2 (fr) 2005-05-25 2006-05-04 Dispositif et procede pour monter des composants electriques

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102005024096A DE102005024096A1 (de) 2005-05-25 2005-05-25 Vorrichtung und Verfahren zur Montage elektrischer Bauteile

Publications (1)

Publication Number Publication Date
DE102005024096A1 true DE102005024096A1 (de) 2006-11-30

Family

ID=36648656

Family Applications (1)

Application Number Title Priority Date Filing Date
DE102005024096A Ceased DE102005024096A1 (de) 2005-05-25 2005-05-25 Vorrichtung und Verfahren zur Montage elektrischer Bauteile

Country Status (2)

Country Link
DE (1) DE102005024096A1 (fr)
WO (1) WO2006125512A2 (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102008002969A1 (de) * 2008-07-25 2010-02-04 Kumatec Sondermaschinenbau & Kunststoffverarbeitung Gmbh Kontaktstift für Durchkontaktierungen
DE102011004171A1 (de) * 2011-02-15 2012-08-16 Brose Fahrzeugteile GmbH & Co. Kommanditgesellschaft, Würzburg Temperierelement und Verfahren zur Befestigung eines Elektrobauteils an dem Temperierelement
DE102021129642A1 (de) 2021-11-15 2023-05-17 Bayerische Motoren Werke Aktiengesellschaft Elektronische Vorrichtung und System mit verbessertem Kühlkonzept

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003060137A (ja) * 2001-08-08 2003-02-28 Ibiden Co Ltd モジュール用基板
DE20301773U1 (de) * 2003-02-05 2003-04-17 Kostal Leopold Gmbh & Co Kg Elektrische Einrichtung
DE19949429C2 (de) * 1999-10-13 2003-10-09 Conti Temic Microelectronic Verfahren zur Bearbeitung einer durchkontaktierten Leiterplatte
DE10229953A1 (de) * 2002-07-03 2004-01-29 Hartmann Codier Gmbh & Co.Kg Bauelement zur Leiterplattenmontage
DE10344745A1 (de) * 2003-09-25 2005-04-14 Endress + Hauser Gmbh + Co. Kg Bauteil zur maschinellen Bestückung einer Leiterplatten

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04233258A (ja) * 1990-07-23 1992-08-21 Internatl Business Mach Corp <Ibm> 超小型電子回路パッケージ
CA2072817A1 (fr) * 1991-07-02 1993-01-03 Miksa Desorgo Carte de circuits multicouche

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19949429C2 (de) * 1999-10-13 2003-10-09 Conti Temic Microelectronic Verfahren zur Bearbeitung einer durchkontaktierten Leiterplatte
JP2003060137A (ja) * 2001-08-08 2003-02-28 Ibiden Co Ltd モジュール用基板
DE10229953A1 (de) * 2002-07-03 2004-01-29 Hartmann Codier Gmbh & Co.Kg Bauelement zur Leiterplattenmontage
DE20301773U1 (de) * 2003-02-05 2003-04-17 Kostal Leopold Gmbh & Co Kg Elektrische Einrichtung
DE10344745A1 (de) * 2003-09-25 2005-04-14 Endress + Hauser Gmbh + Co. Kg Bauteil zur maschinellen Bestückung einer Leiterplatten

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102008002969A1 (de) * 2008-07-25 2010-02-04 Kumatec Sondermaschinenbau & Kunststoffverarbeitung Gmbh Kontaktstift für Durchkontaktierungen
DE102008002969B4 (de) * 2008-07-25 2010-08-12 Kumatec Sondermaschinenbau & Kunststoffverarbeitung Gmbh Kontaktstift für Durchkontaktierungen
DE102011004171A1 (de) * 2011-02-15 2012-08-16 Brose Fahrzeugteile GmbH & Co. Kommanditgesellschaft, Würzburg Temperierelement und Verfahren zur Befestigung eines Elektrobauteils an dem Temperierelement
DE102021129642A1 (de) 2021-11-15 2023-05-17 Bayerische Motoren Werke Aktiengesellschaft Elektronische Vorrichtung und System mit verbessertem Kühlkonzept

Also Published As

Publication number Publication date
WO2006125512A2 (fr) 2006-11-30
WO2006125512A3 (fr) 2007-07-05

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OP8 Request for examination as to paragraph 44 patent law
8131 Rejection