WO2006125512A2 - Dispositif et procede pour monter des composants electriques - Google Patents

Dispositif et procede pour monter des composants electriques Download PDF

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Publication number
WO2006125512A2
WO2006125512A2 PCT/EP2006/004151 EP2006004151W WO2006125512A2 WO 2006125512 A2 WO2006125512 A2 WO 2006125512A2 EP 2006004151 W EP2006004151 W EP 2006004151W WO 2006125512 A2 WO2006125512 A2 WO 2006125512A2
Authority
WO
WIPO (PCT)
Prior art keywords
component
binder
cooling device
electronic component
substrate
Prior art date
Application number
PCT/EP2006/004151
Other languages
German (de)
English (en)
Other versions
WO2006125512A3 (fr
Inventor
Alexander Seufert
Volker SCHÜREN
Original Assignee
Bosch Rexroth Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bosch Rexroth Ag filed Critical Bosch Rexroth Ag
Publication of WO2006125512A2 publication Critical patent/WO2006125512A2/fr
Publication of WO2006125512A3 publication Critical patent/WO2006125512A3/fr

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/021—Components thermally connected to metal substrates or heat-sinks by insert mounting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10166—Transistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/0485—Tacky flux, e.g. for adhering components during mounting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder

Definitions

  • the invention relates to a device and a method for assembling electrical components according to the preamble of the independent claims.
  • the object of the invention is to realize a high-quality thermal coupling of an electrical component to be cooled to a heat sink with the least possible outlay.
  • This object is achieved by the method mentioned at the beginning and the preferred use of electrical components according to the device claim.
  • the method is used to establish a connection between a generally cooled electronic component and a substrate, wherein on the substrate electrical conductor tracks are arranged and the component is placed in a first step on a substrate surface and / or on a cooling device and in a second step in one operation, an electrical connection between the component and interconnects and a mechanical connection between the component and the cooling device, preferably by means of a soldering process or a low-temperature sintering process, is realized.
  • the following processes are understood to mean a soldering process: reflow soldering with / without protective gas, hot air soldering, infrared soldering or vapor-phase soldering with / without protective atmosphere, vacuum soldering.
  • the substrate can be realized by means of a multilayer construction or a printed circuit board provided with conductor tracks only on one or two sides. An extension to other soldering processes is conceivable.
  • As a cooling device preferably large-area, for example ribbed, heat sink are suitable.
  • the invention saves working steps by performing all the necessary contacts for the electrical component within a single operation.
  • thermal paste and associated additional operations can be dispensed with. It is an automated process with standard systems feasible. The thermal connection is greatly improved and it is saved by dispensing with screws or similar fasteners volume.
  • a metallic binder such as solder
  • solder is introduced between the component and the cooling device before the mechanical connection is established in order to use the binder locally in a targeted manner.
  • the method is used in conjunction with THT devices (Through Hole Technology), wherein the pin-in-paste soldering process is additionally used to make the electrical connection.
  • THT devices Three Hole Technology
  • the pin-in-paste soldering process is additionally used to make the electrical connection.
  • first solder paste is applied, then the electrical connections of the component used and finally a connection between terminals and Conductors is realized by means of reflow soldering.
  • the advantage of this is that a soldering can be done together with SMD components.
  • the surface of the cooling device facing the cooled electronic component is at least partially provided with a coating whose melting point must be above the melting point of the binder (for example solder).
  • a silver-containing coating is applied. This measure improves the stability of the overall structure.
  • the surface of the cooling device facing the cooled electronic component is coated in sections with a binder-repellent (for example, solder-repellent) material, in particular with a lacquer or a film. This avoids uncontrolled bleeding of the binder and ensures the desired material thickness of the binder.
  • a binder-repellent for example, solder-repellent
  • the cooling device is realized by means of an aluminum heat sink or an aluminum cooling plate, this provides a very good heat dissipation characteristic and a lightweight construction.
  • the alternative use of copper as a basis is also recommended.
  • the use of an electronic component advantageously contributes, which includes a binding agent depot directly on the component.
  • a power semiconductor could already be provided with a soldering pad during production, so that the attachment of solder during loading is eliminated.
  • the binding agent depot comprises solder for producing a soldered connection or low-temperature sintering material for producing a connection by means of a low-temperature sintering process and is plate-shaped in accordance with the dimensions of the component.
  • the material thickness of the platelet is preferably up to 400 microns. The plate can thus be easily transported together with the component.
  • the plate comprises a flux when using solder as a binder.
  • the flux serves as a soldering agent that keeps the surfaces to be wetted with solder free of oxides.
  • the flux reduces (deoxidizes) the surface during soldering and prevents re-oxide formation and improves flow and wetting properties during the soldering process, as well as reducing the inclusion of foreign matter. Another effect is to reduce the surface tension of the liquid solder.
  • the device is a power semiconductor or a digital circuit, this improves the heat dissipation of these often highly loaded and very adverse conditions exposed components.
  • FIG. 1 The following figures show schematically a component with binding agent depot (FIG. 1) and the component in the assembled state (FIG. 2).
  • FIG. 1 shows the cross section of a component 1 according to the invention.
  • the component 1 with a solderable underside and the binder depot 9 and the electrical connection legs 2 are shown.
  • the binder depot 9 is in this case mounted on the solderable back side of the component 1 in the form of a small plate 9 and Corresponds to the dimensions of the rechteckf ⁇ rmigen rear side of the housing.
  • the material thickness of the plate is theoretically arbitrary, depending on how much solder is required for attachment to the heat sink. Preferably, the material thickness is up to 400 microns.
  • a flux is preferably embedded, which is released during the soldering process. The flux is located either on the surface of Lotplättchens 9 or within the Lotplättchens 9.
  • solder platelets should preferably with about 0.5 wt. % wetted on its surface with flux.
  • a solder plate 9 with flux in its interior could be realized, for example, by rolling out solder wire with a flux core.
  • the material used is preferably solder SN / PB or SN / PB / Ag2.
  • the solder plate 9 can be attached by means of a gluing process on the component 1.
  • a suitable flux is used as the adhesive.
  • a carrier material for the electronic circuits or assemblies for example, a one-sided or two-sided at least partially laminated with copper ceramic carrier could be used.
  • the circuits can be connected by means of bonding wires with the copper coating.
  • the entire assembly is then usually potted by means of a suitable material, such as molding compound or epoxy resin.
  • the component 1 in this example is a power semiconductor of the control electronics for controlling a servomotor.
  • the control electronics are mounted in this case on the motor housing, particularly important here is the effective dissipation of heat and the saving of construction volume.
  • a coupling between the heat sink and the motor housing or a use of the motor housing itself as a heat sink would also be conceivable.
  • Figure 2 shows the cross section of a mounted inventive component 1 on a printed circuit board 6. To see is the component 1 with solderable bottom, the electrical connections 2, solder 4 on the circuit board 6, the cooling device 5 and the binder 3, a solder-repellent insulating film 7 and some components 8.
  • the construction has been made in part by means of the method according to the invention.
  • the electronic component 1 was placed in a first step on the Porterplattenoberfizze 6 and on the surface of the cooling device 5 by the connection pins 4 were inserted into existing holes on the circuit board. Previously, the holes were prepared so that a solder paste was applied.
  • a second step and in a single operation an electrical connection between component 1 and printed conductors on the printed circuit board 6 and a mechanical connection between component 1 and cooling device 5 was realized by means of reflow soldering (pin-in-paste).
  • reflow soldering pin-in-paste
  • a solder-repellent insulating film 7 serves on the one hand for insulation between the printed circuit board 6 and the heat sink 5 and additionally for limiting that area on the heat sink 5, which serves to produce the connection 3 between the component 1 and the heat sink 5.
  • the film 7 could also be replaced by a paint having similar properties. An uncontrolled distribution of the solder between the heat sink 5 and circuit board 6 is avoided with this measure.
  • the cooled electronic component 1 facing surface of the heat sink 5 is at least partially provided with a solderable coating whose melting point is above the melting point of the solder 3. Preferably, it is a silver coating.
  • the heat sink 5 is made of a good thermal conductivity material, such as aluminum.
  • SMD components 8 There are still other components 8 are shown, which were fixed during reflow soldering on the surface of the printed circuit board 6 during the same work.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

L'invention concerne un procédé pour établir une liaison entre un composant électronique refroidi (1) et un substrat (6), ce substrat (6) comportant des tracés électroconducteurs. Le procédé selon l'invention consiste : à placer le composant (1) sur une surface de substrat et/ou sur un dispositif de refroidissement (5), et ; à créer, au cours d'une même opération, une liaison électrique entre le composant (1) et les tracés conducteurs du substrat, ainsi qu'une liaison mécanique entre le composant (1) et le dispositif de refroidissement (5). Cette invention concerne également un composant électronique (1), conçu en particulier pour l'unité électronique de puissance d'un servomoteur. Selon l'invention, ledit composant est au moins partiellement configuré de manière à pouvoir être relié au moyen d'un liant métallique, et un dépôt de liant est disposé sur le boîtier du composant (1), de préférence à l'aide d'un adhésif. De manière avantageuse, il est possible d'accélérer la dissipation de chaleur, et de simplifier le processus de liaison.
PCT/EP2006/004151 2005-05-25 2006-05-04 Dispositif et procede pour monter des composants electriques WO2006125512A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102005024096.8 2005-05-25
DE102005024096A DE102005024096A1 (de) 2005-05-25 2005-05-25 Vorrichtung und Verfahren zur Montage elektrischer Bauteile

Publications (2)

Publication Number Publication Date
WO2006125512A2 true WO2006125512A2 (fr) 2006-11-30
WO2006125512A3 WO2006125512A3 (fr) 2007-07-05

Family

ID=36648656

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2006/004151 WO2006125512A2 (fr) 2005-05-25 2006-05-04 Dispositif et procede pour monter des composants electriques

Country Status (2)

Country Link
DE (1) DE102005024096A1 (fr)
WO (1) WO2006125512A2 (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102008002969B4 (de) * 2008-07-25 2010-08-12 Kumatec Sondermaschinenbau & Kunststoffverarbeitung Gmbh Kontaktstift für Durchkontaktierungen
DE102011004171A1 (de) * 2011-02-15 2012-08-16 Brose Fahrzeugteile GmbH & Co. Kommanditgesellschaft, Würzburg Temperierelement und Verfahren zur Befestigung eines Elektrobauteils an dem Temperierelement
DE102021129642A1 (de) 2021-11-15 2023-05-17 Bayerische Motoren Werke Aktiengesellschaft Elektronische Vorrichtung und System mit verbessertem Kühlkonzept

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0471938A1 (fr) * 1990-07-23 1992-02-26 International Business Machines Corporation Substrat thermique pour circuit à haute densité
EP0521720A1 (fr) * 1991-07-02 1993-01-07 Chomerics, Inc. Circuit imprimé multicouche dissipant la chaleur
DE19949429A1 (de) * 1999-10-13 2001-05-23 Daimler Chrysler Ag Durchkontaktierte Leiterplatte mit Leiterplattenbohrung
WO2004006636A1 (fr) * 2002-07-03 2004-01-15 Hartmann Codier Gmbh & Co. Kg Composant de montage de cartes de circuits imprimes
EP1445799A2 (fr) * 2003-02-05 2004-08-11 Leopold Kostal GmbH & Co. KG Dispositif à dissipation de chaleur pour un semi-conducteur sur un circuit imprimé
DE10344745A1 (de) * 2003-09-25 2005-04-14 Endress + Hauser Gmbh + Co. Kg Bauteil zur maschinellen Bestückung einer Leiterplatten

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003060137A (ja) * 2001-08-08 2003-02-28 Ibiden Co Ltd モジュール用基板

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0471938A1 (fr) * 1990-07-23 1992-02-26 International Business Machines Corporation Substrat thermique pour circuit à haute densité
EP0521720A1 (fr) * 1991-07-02 1993-01-07 Chomerics, Inc. Circuit imprimé multicouche dissipant la chaleur
DE19949429A1 (de) * 1999-10-13 2001-05-23 Daimler Chrysler Ag Durchkontaktierte Leiterplatte mit Leiterplattenbohrung
WO2004006636A1 (fr) * 2002-07-03 2004-01-15 Hartmann Codier Gmbh & Co. Kg Composant de montage de cartes de circuits imprimes
EP1445799A2 (fr) * 2003-02-05 2004-08-11 Leopold Kostal GmbH & Co. KG Dispositif à dissipation de chaleur pour un semi-conducteur sur un circuit imprimé
DE10344745A1 (de) * 2003-09-25 2005-04-14 Endress + Hauser Gmbh + Co. Kg Bauteil zur maschinellen Bestückung einer Leiterplatten

Also Published As

Publication number Publication date
DE102005024096A1 (de) 2006-11-30
WO2006125512A3 (fr) 2007-07-05

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