DD279980B5 - Vorrichtung zur Ultraschall-Drahtkontaktierung - Google Patents

Vorrichtung zur Ultraschall-Drahtkontaktierung Download PDF

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Publication number
DD279980B5
DD279980B5 DD30014987A DD30014987A DD279980B5 DD 279980 B5 DD279980 B5 DD 279980B5 DD 30014987 A DD30014987 A DD 30014987A DD 30014987 A DD30014987 A DD 30014987A DD 279980 B5 DD279980 B5 DD 279980B5
Authority
DD
German Democratic Republic
Prior art keywords
bonding
wire
pin
sonotrode
guide tube
Prior art date
Application number
DD30014987A
Other languages
German (de)
English (en)
Inventor
Manfred Dipl-Ing Bansemir
Original Assignee
Css Semiconductor Equipment
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Css Semiconductor Equipment filed Critical Css Semiconductor Equipment
Priority to DD30014987A priority Critical patent/DD279980B5/de
Priority to DE19873739955 priority patent/DE3739955A1/de
Priority to HU875427A priority patent/HU201178B/hu
Priority to US07/130,052 priority patent/US4789093A/en
Priority to FR878717895A priority patent/FR2611156B3/fr
Priority to CH608/88A priority patent/CH675035A5/de
Publication of DD279980B5 publication Critical patent/DD279980B5/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • B23K20/005—Capillary welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
    • B23K20/106—Features related to sonotrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78313—Wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/852—Applying energy for connecting
    • H01L2224/85201—Compression bonding
    • H01L2224/85205—Ultrasonic bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/0101—Neon [Ne]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01032—Germanium [Ge]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01039—Yttrium [Y]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01052—Tellurium [Te]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01057—Lanthanum [La]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01058—Cerium [Ce]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01068—Erbium [Er]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01075—Rhenium [Re]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19042—Component type being an inductor

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
DD30014987A 1987-02-25 1987-02-25 Vorrichtung zur Ultraschall-Drahtkontaktierung DD279980B5 (de)

Priority Applications (6)

Application Number Priority Date Filing Date Title
DD30014987A DD279980B5 (de) 1987-02-25 1987-02-25 Vorrichtung zur Ultraschall-Drahtkontaktierung
DE19873739955 DE3739955A1 (de) 1987-02-25 1987-11-25 Vorrichtung zur ultraschall-drahtkontaktierung
HU875427A HU201178B (en) 1987-02-25 1987-12-02 Device for bonding by means of ultrasonic sound
US07/130,052 US4789093A (en) 1987-02-25 1987-12-08 Apparatus for ultrasonic wire bonding
FR878717895A FR2611156B3 (fr) 1987-02-25 1987-12-22 Dispositif de soudage aux ultrasons pour des composants electroniques, notamment a l'aide de fil des bobines classiques
CH608/88A CH675035A5 (nl) 1987-02-25 1988-02-18

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DD30014987A DD279980B5 (de) 1987-02-25 1987-02-25 Vorrichtung zur Ultraschall-Drahtkontaktierung

Publications (1)

Publication Number Publication Date
DD279980B5 true DD279980B5 (de) 1994-08-04

Family

ID=5587007

Family Applications (1)

Application Number Title Priority Date Filing Date
DD30014987A DD279980B5 (de) 1987-02-25 1987-02-25 Vorrichtung zur Ultraschall-Drahtkontaktierung

Country Status (6)

Country Link
US (1) US4789093A (nl)
CH (1) CH675035A5 (nl)
DD (1) DD279980B5 (nl)
DE (1) DE3739955A1 (nl)
FR (1) FR2611156B3 (nl)
HU (1) HU201178B (nl)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5014900A (en) * 1990-03-08 1991-05-14 Texas Instruments Incorporated Deep access bond head
JP3007195B2 (ja) * 1991-09-18 2000-02-07 株式会社日立製作所 ボンディング装置およびボンディング部検査装置
DE4326478C2 (de) * 1993-07-13 2000-02-17 F&K Delvotec Bondtechnik Gmbh Bondkopf für Ultraschall-Bonden
US5452838A (en) * 1993-07-13 1995-09-26 F & K Delvotec Bondtechnik Gmbh Bonding head for an ultrasonic bonding machine
US5897048A (en) * 1996-11-08 1999-04-27 Asm Assembly Automation Ltd. Radial wire bonder and selectable side view inspection system
US6439448B1 (en) * 1999-11-05 2002-08-27 Orthodyne Electronics Corporation Large wire bonder head
DE10133885A1 (de) * 2000-07-21 2002-03-21 Esec Trading Sa Vorrichtung zur Herstellung von Drahtverbindungen
US6471116B2 (en) * 2001-01-19 2002-10-29 Orthodyne Electronics Corporation Wire bonding spool system
JP4343985B2 (ja) * 2008-01-24 2009-10-14 株式会社新川 ボンディング装置及びボンディング装置のボンディングステージ高さ調整方法
US8129220B2 (en) * 2009-08-24 2012-03-06 Hong Kong Polytechnic University Method and system for bonding electrical devices using an electrically conductive adhesive
JP5164230B1 (ja) * 2011-09-28 2013-03-21 株式会社カイジョー ボンディング装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2466936A1 (fr) * 1979-09-28 1981-04-10 Cii Honeywell Bull Appareil de cablage a la surface d'un substrat d'interconnexion
US4475681A (en) * 1982-05-24 1984-10-09 The Micromanipulator Co., Inc. Bonder apparatus
US4550871A (en) * 1982-08-24 1985-11-05 Asm Assembly Automation Ltd. Four-motion wire bonder
US4619395A (en) * 1985-10-04 1986-10-28 Kulicke And Soffa Industries, Inc. Low inertia movable workstation

Also Published As

Publication number Publication date
CH675035A5 (nl) 1990-08-15
HU201178B (en) 1990-09-28
US4789093A (en) 1988-12-06
HUT49752A (en) 1989-10-30
FR2611156A1 (fr) 1988-08-26
DE3739955A1 (de) 1988-09-08
FR2611156B3 (fr) 1989-06-30

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Legal Events

Date Code Title Description
EPAE Change in the person, name or address of the patentee
UW Conversion of economic patent into exclusive patent
EP Request for examination under paragraph 12(1) filed
RPI Change in the person, name or address of the patentee (searches according to art. 11 and 12 extension act)
RPV Change in the person, the name or the address of the representative (searches according to art. 11 and 12 extension act)
B5 Patent specification, 2nd publ. accord. to extension act
RPV Change in the person, the name or the address of the representative (searches according to art. 11 and 12 extension act)
RPV Change in the person, the name or the address of the representative (searches according to art. 11 and 12 extension act)
RPV Change in the person, the name or the address of the representative (searches according to art. 11 and 12 extension act)
RPV Change in the person, the name or the address of the representative (searches according to art. 11 and 12 extension act)
ENJ Ceased due to non-payment of renewal fee