CN2847174Y - Heat radiation structure of semiconductor refrigerating device - Google Patents
Heat radiation structure of semiconductor refrigerating device Download PDFInfo
- Publication number
- CN2847174Y CN2847174Y CN 200520059063 CN200520059063U CN2847174Y CN 2847174 Y CN2847174 Y CN 2847174Y CN 200520059063 CN200520059063 CN 200520059063 CN 200520059063 U CN200520059063 U CN 200520059063U CN 2847174 Y CN2847174 Y CN 2847174Y
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- radiator structure
- heat radiation
- air
- radiation structure
- utility
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Abstract
The utility model discloses a heat radiation structure of a semiconductor refrigerating device and the utility model can be assembled on the cold surface of the semiconductor refrigerating device. The heat radiation structure is of a curved wave shape, namely that all bent plates of the heat radiation structure have wave shape, and the wind resistance is relatively large; the speed of the air coming from the side is slow when passing through the heat radiation structure, and the air volume of air of an output terminal is small, so cold air of lower temperature can be obtained. That is to say, the utility model can conduct heat exchange sufficiently because the air stays in the curved wave-shaped heat radiation structure for a long time under the condition that the power of other devices is not changed, so the cooling effect is greatly enhanced.
Description
Technical field
The utility model relates to a kind of radiator structure, refers to a kind of radiator structure of semiconductor cooling device especially.
Background technology
Usually, semiconductor cooling device has a hot side and a huyashi-chuuka (cold chinese-style noodles), in order to make the semiconductor cooling device operate as normal when energising work, generally all need be at the equipped radiator structure of its hot side and a small-sized DC fan, go so that heat is dispersed in the environment.Radiator structure and fan are big more, and the heat that is dispersed in the environment is many more, and the effect of refrigeration is also just good more.When semiconductor cooling device is used to cool off air, also need be used for carrying out heat exchange with the cooling air at the equipped radiator structure of its huyashi-chuuka (cold chinese-style noodles) and a small-sized DC fan with air.Requiring in the light as far as possible semiconductor refrigerating application apparatus in the as far as possible little and weight of dimensional requirement, generally all is the shared fan of hot side and huyashi-chuuka (cold chinese-style noodles), can not ratio on demand distribute through the air quantity of superheating surface and huyashi-chuuka (cold chinese-style noodles); And when needs change cryogenic temperature, must change the power of each components and parts, even will change whole refrigeration device.
The utility model content
The purpose of this utility model is to provide a kind of radiator structure of semiconductor cooling device, and it can improve heat dissipation capacity under the prerequisite that does not change each device power, increases refrigeration.
For achieving the above object, technical solution of the present utility model is: a kind of radiator structure of semiconductor cooling device, described radiator structure are bent waveshape, and promptly each tabs of radiator structure is a waveform.
Described semiconductor cooling device comprises a hot side and a huyashi-chuuka (cold chinese-style noodles), and described bent waveform radiator structure is assemblied on the huyashi-chuuka (cold chinese-style noodles).
Be equipped with another first radiator structure on the hot side of described semiconductor cooling device, this first radiator structure is straight waveshape.
After adopting such scheme, because radiator structure described in the utility model is bent waveshape, each tabs that is radiator structure is a waveform, when this radiator structure is assemblied in the huyashi-chuuka (cold chinese-style noodles) of semiconductor cooling device, its wavy shaped configuration windage is bigger, speed when the air of coming in from the side passes through this radiator structure is slower, and the air quantity of output air is less like this, thereby can obtain the more cold air of low temperature.That is to say, under the situation that the power of other each device remains unchanged,, can fully carry out heat exchange in the radiator structure of bent waveform, therefore improved cooling effect greatly because the time that air is detained is longer.
Description of drawings
Fig. 1 is the three-dimensional exploded view of the utility model refrigeration application device;
Fig. 2 is the three-dimensional combination figure of the utility model refrigeration application device;
Fig. 3 is the stereo appearance figure (placing in the housing) of the utility model refrigeration application device;
Fig. 4 is the free state schematic diagram of the straight wave dispersion heat structure of the utility model hot side;
Fig. 5 is the confined state schematic diagram of the straight wave dispersion heat structure of the utility model hot side;
Fig. 6 is the free state schematic diagram of the bent wave dispersion heat structure of the utility model huyashi-chuuka (cold chinese-style noodles);
Fig. 7 is the confined state schematic diagram of the bent wave dispersion heat structure of the utility model huyashi-chuuka (cold chinese-style noodles).
The specific embodiment
As shown in Figure 1, 2, 3, radiator structure described in the utility model is applied in a kind of semiconductor cooling device application apparatus, this semiconductor cooling device 1 comprises a hot side 11 and a huyashi-chuuka (cold chinese-style noodles) 12, on hot side 11, be equipped with one first radiator structure 2, this first radiator structure 2 is used for heat is dispersed in the environment and goes, and also is equipped with a radiator structure 3 on the huyashi-chuuka (cold chinese-style noodles) 12, and this radiator structure 3 is used for and air carries out heat exchange, need the air of cooling with cooling, thereby be used for refrigeration.And the radiator structure 3 on first radiator structure 2 on the described hot side 11 and the huyashi-chuuka (cold chinese-style noodles) 12 can be with red copper or aluminum strip.In addition, between cold and hot two ceramic wafers and first radiator structure 2 and radiator structure 3 of semiconductor cooling device 1, be coated with an amount of heat-conducting silicone grease 4, be used for heat conduction.In addition,, be provided with a fan (not shown), thereby make the shared fan in cold and hot two sides in the side of semiconductor cooling device 1.
Said structure is identical with located by prior art, different is the utility model: first radiator structure 2 that is assembled on described semiconductor cooling device 1 hot side 11 is traditional straight waveshape (shown in Fig. 4,5), be that its each tabs is a linear, its windage is very little, the air of coming in from the side can pass through this first radiator structure 2 fast, and like this, the air quantity that is assigned to hot side 11 is bigger, more heats will be taken away, radiating effect can be improved; And the radiator structure 3 that is assembled on described semiconductor cooling device 1 huyashi-chuuka (cold chinese-style noodles) 12 is bent waveshape (shown in Fig. 6,7), each tabs that is radiator structure is a waveform, its windage is bigger, speed when the air of coming in from the side passes through this radiator structure 3 is slower, the air quantity of output air is less like this, thereby can obtain the more cold air of low temperature.
Suitable adjusting by to described huyashi-chuuka (cold chinese-style noodles) 12 radiator structures 3 bent ripple curvature can reach the air quantity of output air and the best configuration between the temperature.Just because of the bent waveshape of this radiator structure 3, the time that air is detained within it is longer, can fully carry out heat exchange, has therefore improved cooling effect greatly, like this, even do not change the power of each device, also can improve refrigeration.
Claims (3)
1, a kind of radiator structure of semiconductor cooling device is characterized in that: described radiator structure is bent waveshape, and promptly each tabs of radiator structure is a waveform.
2, the radiator structure of semiconductor cooling device according to claim 1, it is characterized in that: described semiconductor cooling device comprises a hot side and a huyashi-chuuka (cold chinese-style noodles), described bent waveform radiator structure is assemblied on the huyashi-chuuka (cold chinese-style noodles).
3, as the radiator structure of semiconductor cooling device as described in the claim 2, it is characterized in that: be equipped with another first radiator structure on the hot side of described semiconductor cooling device, this first radiator structure is straight waveshape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200520059063 CN2847174Y (en) | 2005-05-25 | 2005-05-25 | Heat radiation structure of semiconductor refrigerating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200520059063 CN2847174Y (en) | 2005-05-25 | 2005-05-25 | Heat radiation structure of semiconductor refrigerating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2847174Y true CN2847174Y (en) | 2006-12-13 |
Family
ID=37512597
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200520059063 Expired - Fee Related CN2847174Y (en) | 2005-05-25 | 2005-05-25 | Heat radiation structure of semiconductor refrigerating device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2847174Y (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102237422A (en) * | 2010-05-04 | 2011-11-09 | 杜邦太阳能有限公司 | Photovoltaic panel assembly |
| CN108082014A (en) * | 2016-11-22 | 2018-05-29 | 现代自动车株式会社 | For the ventilation module of aeration seat |
| CN111371287A (en) * | 2018-12-24 | 2020-07-03 | 合肥迅达电器有限公司 | IGBT variable frequency power supply for intermediate frequency smelting furnace |
-
2005
- 2005-05-25 CN CN 200520059063 patent/CN2847174Y/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102237422A (en) * | 2010-05-04 | 2011-11-09 | 杜邦太阳能有限公司 | Photovoltaic panel assembly |
| CN108082014A (en) * | 2016-11-22 | 2018-05-29 | 现代自动车株式会社 | For the ventilation module of aeration seat |
| CN108082014B (en) * | 2016-11-22 | 2022-02-15 | 现代自动车株式会社 | Ventilation module for a ventilated seat |
| CN111371287A (en) * | 2018-12-24 | 2020-07-03 | 合肥迅达电器有限公司 | IGBT variable frequency power supply for intermediate frequency smelting furnace |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C19 | Lapse of patent right due to non-payment of the annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |