CN2833897Y - 高效热传导大功率发光二极管 - Google Patents

高效热传导大功率发光二极管 Download PDF

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CN2833897Y
CN2833897Y CNU2005201270502U CN200520127050U CN2833897Y CN 2833897 Y CN2833897 Y CN 2833897Y CN U2005201270502 U CNU2005201270502 U CN U2005201270502U CN 200520127050 U CN200520127050 U CN 200520127050U CN 2833897 Y CN2833897 Y CN 2833897Y
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heat
circuit board
printed circuit
radiating substrate
light
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刘召忠
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JIANGXI LITKCONN TECHNOLOGY Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909—Post-treatment of the connector or wire bonding area
    • H01L2224/8592—Applying permanent coating, e.g. protective coating

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Abstract

本实用新型提供一种高效热传导大功率发光二极管，包括：透镜1、环氧树脂2、印制电路板3、导热胶4、散热基板5、传热铜柱6、焊接点7、金线8及芯片p－n结9，所述的透镜1的腿部直接插入散热基板5并与其紧密配合，印制电路板3与散热基板5之间由导热胶4粘合，传热铜柱6穿透印制电路板3和散热基板5并与散热基板5紧密配合，从芯片p－n结9引出的金线8直接焊接在印制电路板3上。本实用新型实现了热能高效率和更大面积的传导，并提高了产品的合格率。该发光二极管在所有的照明领域均可应用。

Description

高效热传导大功率发光二极管
技术领域
本发明涉及一种发光二极管，特别涉及一种高效热传导大功率发光二极管。
技术背景
大功率发光二极管是半导体芯片光源，它具有节电、寿命长、抗震防爆、体积小、低压安全等诸多优点，是环保节能的新一代照明光源。但是，由于大功率发光二极管的芯片在工作时会产生大量的热量，使芯片的温度迅速上升，另外，由于芯片发出的光热能传导不良，高温导致芯片的光效与寿命受很大影响，因此，研究和生产高效热传导大功率发光二级管是光源领域的重大项目。
发明内容
本实用新型的目的是提供一种传热铜柱直接插入散热基板、增大传热面积的高效热传导大功率发光二极管。
本实用新型的目的是这样实现的：一种高效热传导大功率发光二极管，包括：透镜1、环氧树脂2、印制电路板3、导热胶4、散热基板5、传热铜柱6、焊接点7、金线8及芯片p-n结9，所述的透镜1的腿部直接插入散热基板5并与散热基板5紧密配合，印制电路板3与散热基板5之间由导热胶4粘合，传热铜柱6穿透印制电路板3和散热基板5并与散热基板5紧密配合，从芯片p-n结引出的金线8直接焊接在印制电路板3上。所述的散热基板5是由金属材料制成的，所述的散热基板5也可以是由陶瓷材料制成的，所述的透镜1的形状是球形的，所述的透镜1的形状是蝙蝠翼状的。
本实用新型的优点是：1.增加了散热面积，大大提高了热传导效率；2.透镜直接固定在散热基板上，省去了塑胶支架，利于芯片散热，降低了生产成本；3.从芯片引出的金线直接焊接在印制电路板上，提高了产品的合格率。
附图说明
图1是本实用新型的结构示意图；
图2是本实用新型的另一个实施例的结构示意图。
具体实施方式
下面结合附图及实施对本实用新型作进一步说明。
图1为本实用新型一个实施例的结构示意图，该高效热传导大功率发光二极管包括：透镜1、环氧树脂2、印制电路板3、导热胶4、散热基板5、传热铜柱6、焊接点7、金线8及芯片p-n结9。其中，透镜1是球形，它的腿部直接插入散热基板5中并与其紧密配合，省去了塑胶支架，增加芯片p-n结9的散热空间，使透镜不变形而保障发光角的稳定，印制电路板3与散热基板5之间由导热胶4粘合，传热铜柱6穿透印制电路板3和散热基板5，并与散热基板5紧密配合，传热铜柱6下部加工成螺丝状，可以直接拧在灯具散热器金属体的螺母内。从芯片p-n结9引出的金线8直接焊接在印制电路板3上，不仅节省了材料，而且省去了二道焊接工艺，提高了产品的合格率。环氧树脂2涂复在芯片p-n结9上，以保护芯片p-n结9。所述的散热基板5是由金属材料制成的，也可以由陶瓷材料制成。图2为本实用新型另一个实施例的结构示意图，其中，透镜1的形状是蝙蝠翼状的，使该发光二极管的反射效果更佳；在环氧树脂2上复盖一层荧光粉作为发光材料，其余的结构特征与图1的实施例类同。
本实用新型实现了热能高效率和更大面积的传导，例如，使目前常规使用的直径20mm，厚度2.0mm以内的1瓦产品温度从60摄氏度以上降到了60摄氏度以下，使该产品的光效提高30％以上，并且使光衰从每半小时的9％以上降低到5％以内，该发光二极管在所有的照明领域均可应用，如城市亮化工程的城市楼宇轮廓灯、射灯、花园灯、路灯、庭院灯、室内照明、手电筒、矿工灯、警用灯、指示灯、航标灯、医疗专用灯等等。

Claims (5)

1.一种高效热传导大功率发光二极管，包括：透镜(1)、环氧树脂(2)、印制电路板(3)、导热胶(4)、散热基板(5)、传热铜柱(6)、焊接点(7)、金线(8)及芯片p-n结(9)，其特征在于，所述的透镜(1)的腿部直接插入散热基板(5)并与散热基板(5)紧密配合，印制电路板(3)与散热基板(5)之间由导热胶(4)粘合，传热铜柱(6)穿透印制电路板(3)和散热基板(5)并与散热基板(5)紧密配合，从芯片p-n结引出的金线(8)直接焊接在印制电路板(3)上。
2.根据权利要求1所述的发光二极管，其特征在于，所述的散热基板(5)是由金属材料制成的。
3.根据权利要求1所述的发光二极管，其特征在于，所述的散热基板(5)是由陶瓷材料制成的。
4.根据权利要求1所述的发光二极管，其特征在于，所述的透镜(1)的形状是球形的。
5.根据权利要求1所述的发光二极管，其特征在于，所述的透镜(1)的形状是蝙蝠翼状的。
CNU2005201270502U 2005-09-29 2005-09-29 高效热传导大功率发光二极管 Expired - Lifetime CN2833897Y (zh)

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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101447534B (zh) * 2007-11-27 2010-04-21 林志泽 发光二极管及其制作方法
CN101319772B (zh) * 2007-06-05 2011-07-27 亿光电子工业股份有限公司 双向散热发光二极管装置
CN101761795B (zh) * 2008-12-23 2011-12-28 富准精密工业(深圳)有限公司 发光二极管照明装置及其封装方法
CN102449788A (zh) * 2009-06-15 2012-05-09 夏普株式会社 发光模块、照明装置、显示装置以及电视接收机
CN104393162A (zh) * 2014-11-05 2015-03-04 共青城超群科技股份有限公司 一种铜柱型基板封装的led
CN106151891A (zh) * 2016-07-07 2016-11-23 浙江昊玥电子科技有限公司 一种一次光学配光的全防水光源封装结构

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101319772B (zh) * 2007-06-05 2011-07-27 亿光电子工业股份有限公司 双向散热发光二极管装置
CN101447534B (zh) * 2007-11-27 2010-04-21 林志泽 发光二极管及其制作方法
CN101761795B (zh) * 2008-12-23 2011-12-28 富准精密工业(深圳)有限公司 发光二极管照明装置及其封装方法
CN102449788A (zh) * 2009-06-15 2012-05-09 夏普株式会社 发光模块、照明装置、显示装置以及电视接收机
CN104393162A (zh) * 2014-11-05 2015-03-04 共青城超群科技股份有限公司 一种铜柱型基板封装的led
CN106151891A (zh) * 2016-07-07 2016-11-23 浙江昊玥电子科技有限公司 一种一次光学配光的全防水光源封装结构

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