CN2829099Y - Led - Google Patents
Led Download PDFInfo
- Publication number
- CN2829099Y CN2829099Y CNU2005200599457U CN200520059945U CN2829099Y CN 2829099 Y CN2829099 Y CN 2829099Y CN U2005200599457 U CNU2005200599457 U CN U2005200599457U CN 200520059945 U CN200520059945 U CN 200520059945U CN 2829099 Y CN2829099 Y CN 2829099Y
- Authority
- CN
- China
- Prior art keywords
- led
- supporting frame
- encapsulating
- epoxy resin
- light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- Led Device Packages (AREA)
Abstract
The utility model provides an LED, which comprises an encapsulating epoxy resin adhesive for encapsulating a light-emitting wafer, a cathode supporting frame, an anode supporting frame, and a gold thread, wherein the encapsulating epoxy resin adhesive is used for encapsulating a light-emitting wafer; the cathode supporting frame is provided with a light reflecting cup; the anode supporting frame is corresponding to the cathode supporting frame; the gold thread is used for connecting a needed chip with the cathode supporting frame and the anode supporting frame; the epoxy resin adhesive is in a polyhedral structure. The technical scheme which is adopted can cause the LED to be applied to more small-sized electronic products so that a lamp type (Lamp) LED is provided with the volume to be encapsulated with a paster type (SMD) LED, and simultaneously, the problem of heat radiation of the paster type (SMD) LED is also avoided. In the way, the service life of a product is prolonged, the LED can also be applied to more fields and industries, the use range of the LED is enlarged and the utility model is favorable to the popularization of the LED which has the effect of energy saving.
Description
Technical field
The utility model relates to the electronic devices and components light-emitting diode, the concrete a kind of encapsulating structure that is meant light-emitting diode.
Background technology
Light-emitting diode (LED) generally is divided into lamp type (Lamp) and SMD (SMD) as electronic devices and components.The anti-seismic performance of LED is good, be widely used in traffic indication, instrument and meter, general lighting, information demonstration and light of stage etc., its appearance progressively replaces incandescent source, compare with incandescent source, LED has many good qualities: LED uses low-tension supply, consumed energy is low with the incandescent lamp of light efficiency, luminous good stability, long service life.As shown in Figure 1; wherein; the LED basic structure of known lamp type (Lamp) be one can be luminous chip; place on the leaded framework, use epoxy sealing all around then, play protection inside chip and support bracket fastened effect; and that the epoxy resin sealing is generally is cylindrical; and be spherical epoxy resin sealing of binding, highly high, volume is bigger.In some small-sized electronic products, can need LED to the Lamp type, and owing to the reason of this structure self, the LED of Lamp type is difficult to put into electronic product inside, and SMD (SMD) is though all the LED than lamp type is little for LED size and volume, but its radiating effect is not very desirable, can have influence on the useful life of product.Nature will hinder to the use field of LED like this, and is unfavorable for having the popularization of the LED of energy-saving effect.
The utility model content
In order to solve the deficiency of above-mentioned technology, this practical encapsulating structure that aims to provide a kind of improved LED can be applied among the small-sized electronic product, has also avoided the heat dissipation problem of SMD (SMD) LED.
In order to arrive above-mentioned purpose, the utility model adopts following technical scheme, it is a kind of light-emitting diode, the encapsulating epoxy resin glue that comprises the encapsulating light emitting wafer, the cathode anchor that has reflector with the corresponding anode carrier of this cathode anchor, connects the gold thread of required chip and yin, yang the two poles of the earth support, it is characterized in that described epoxy resin sealing is a polyhedral structure.
Adopt above-mentioned technical scheme, among the small-sized electronic product that LED is applied to more arrive, make lamp type (Lamp) LED have encapsulation volume with SMD (SMD) LED, also avoided simultaneously the heat dissipation problem of SMD (SMD) LED, prolonged the useful life of product like this, LED is applied among more field and the industry, has enlarged the scope of application of LED.And be beneficial to the popularization of the LED with energy-saving effect, have good economic effect and result of use.
Description of drawings
Fig. 1 is the encapsulating structure schematic diagram of known lamp type (Lmap) LED;
Fig. 2 is an encapsulating structure schematic diagram of the present utility model;
Fig. 3 is a vertical view of the present utility model.
Embodiment
With reference to the accompanying drawings, and in conjunction with the embodiments the utility model is done detailed description and interpretation.Embodiment is the explanation to utility model, is not the qualification to utility model.
With reference to accompanying drawing, embodiment of the present utility model provides the encapsulating structure of a kind of improved LED.As Fig. 2, shown in Figure 3, a kind of light-emitting diode, the encapsulating epoxy resin glue 1 that comprises the encapsulating light emitting wafer, the cathode anchor 2 that has reflector, with the corresponding anode carrier 3 of this cathode anchor, the gold thread 4 that connects required chip and yin, yang the two poles of the earth support, and this encapsulating epoxy resin glue 1 is a truncated rectangular pyramids shape encapsulating epoxy resin glue.Dwindled volume and the profile of LED, LED has been installed in some narrow spaces, and needs under the situation of multi-plane structure.
The encapsulating structure that the utility model adopts, and kept the production procedure and the technology of known light-emitting diode, reduced the encapsulating structure of LED, LED is applied among the special environment, enlarged the scope that LED uses, help the popularization of LED.Have good economic benefits and social benefit.
Claims (2)
1. light-emitting diode, the encapsulating epoxy resin glue that comprises the encapsulating light emitting wafer, the cathode anchor that has reflector, with the corresponding anode carrier of this cathode anchor, the gold thread that connects required chip and yin, yang the two poles of the earth support, it is characterized in that described epoxy resin sealing is a polyhedral structure.
2. a kind of light-emitting diode according to claim 1 is characterized in that, polyhedral epoxy resin sealing is a terrace with edge shape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2005200599457U CN2829099Y (en) | 2005-06-20 | 2005-06-20 | Led |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2005200599457U CN2829099Y (en) | 2005-06-20 | 2005-06-20 | Led |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2829099Y true CN2829099Y (en) | 2006-10-18 |
Family
ID=37080649
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2005200599457U Expired - Fee Related CN2829099Y (en) | 2005-06-20 | 2005-06-20 | Led |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2829099Y (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101936513A (en) * | 2010-09-16 | 2011-01-05 | 魏展生 | Radiation device for LED lamp |
-
2005
- 2005-06-20 CN CNU2005200599457U patent/CN2829099Y/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101936513A (en) * | 2010-09-16 | 2011-01-05 | 魏展生 | Radiation device for LED lamp |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Shenzhen Top Century Optoelectronics Technology Co., Ltd. Assignor: Wang Wenfeng Contract fulfillment period: 2009.7.1 to 2014.6.30 Contract record no.: 2009440000563 Denomination of utility model: Semiconductor LED and its preparing process Granted publication date: 20061018 License type: Exclusive license Record date: 20090710 |
|
| LIC | Patent licence contract for exploitation submitted for record |
Free format text: EXCLUSIVE LICENSE; TIME LIMIT OF IMPLEMENTING CONTACT: 2009.7.1 TO 2014.6.30; CHANGE OF CONTRACT Name of requester: SHENZHEN CITY SHI FENG SCIENCE CO., LTD. Effective date: 20090710 |
|
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20061018 Termination date: 20100620 |