CN2812028Y - MEMS acceleration earthquake sensor - Google Patents
MEMS acceleration earthquake sensor Download PDFInfo
- Publication number
- CN2812028Y CN2812028Y CN 200520085090 CN200520085090U CN2812028Y CN 2812028 Y CN2812028 Y CN 2812028Y CN 200520085090 CN200520085090 CN 200520085090 CN 200520085090 U CN200520085090 U CN 200520085090U CN 2812028 Y CN2812028 Y CN 2812028Y
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Abstract
The utility model relates to an MEMS acceleration earthquake sensor which comprises an upper electrode, a lower electrode and a movable middle electrode, wherein the upper and the lower electrodes are tank-shaped electrodes which are formed by means of micro mechanical processing technologies, and the middle electrode comprises a frame, a mass block and cantilever beams. The mass block of the utility model is in the orthohexagonal structure. Since three cantilever beams are supported in tanks which are formed from the frame, the upper electrode and the lower electrode, the horizontal movement of the middle electrode is guaranteed. The utility model has the advantages of good effect of transversely isolating performance, good line shape, shock resistance, small temperature drift, simple structure, small size, convenient installation and high operational reliability, and is particularly for manufacturing a three-component sensor.
Description
Technical field
The utility model relates to a kind of earthquake sensing device, specifically a kind of acceleration earthquake sensor.
Background technology
We know, oil, when coal industry carries out geologic prospecting, and seismic sensor is indispensable instrument.Existing seismic sensor mainly adopts magnetoelectric velocity transducer, its structure mainly is made up of shell, loam cake, lower cover, coil, shell fragment, magnet, yoke, electrode etc., yoke is positioned at the magnet upper/lower terminal, and the location of magnet and yoke is to realize by the shrinkage pool on the yoke, and they form the magnetic loop device, coil is around magnet, yoke outside, supported by shell fragment, when the external world is shaken, coil is done in magnetic loop up and down reciprocatingly and is vibrated, cutting magnetic line, the output vibration signal.The quality of magneto-electric seismic sensor performance depends primarily on the performance of magnet, and volume is generally all bigger, causes that the magnetic loop device volume is big, cost is high, makes that the sensor finished-product volume that installs is also big, cost is high, causes constructional difficulties.Simultaneously, shunting of said apparatus magnetic circuit and temperature compensation function are also poor, and functional reliability is not high.Also has capacitance acceleration transducer in addition, it is to become the spacing differential capacitance sensor, its chip by two fixing lateral electrodes and movably target constitute, top electrode, bottom electrode are the grooved electrodes that forms with micromachining technology, target comprises frame, mass, semi-girder etc., by the central movable electrode and up and down fixed electorde constitute a sandwich structure.The mass of target is supported by semi-girder, and after being shaken, target is subjected to displacement and causes the power-on and power-off volume change.The target conventional design is the square or rectangular structure, and therefore connected semi-girder is both arms and four arms.Adopt the both arms girder construction, realize that target translation difficulty is big, and shock resistance, lateral isolation poor performance; Four arm girder constructions can realize parallel moving, and the shock resistance of lateral isolation performance all is better than the both arms girder construction, and its shortcoming is that volume is big, and corresponding sensitivity is low.In addition, glutinousness gas is arranged between capacitance electrode, as air, these gases can produce resistance when the mass vibration of target, and damping is big, can reduce the sensor quality factor.
Summary of the invention
Technical problem to be solved in the utility model is to overcome above-mentioned the deficiencies in the prior art, provides a kind of structure compact, and volume is little, and is highly sensitive, shock resistance, good linearity, reliability height, the MEMS acceleration earthquake sensor of good manufacturability.
The technical scheme in the invention for solving the above technical problem is: a kind of MEMS acceleration earthquake sensor, comprise top electrode, bottom electrode and target movably, top electrode, bottom electrode are the grooved electrodes that forms with micromachining technology, target comprises frame, mass, semi-girder, it is characterized in that: mass is the regular hexagon structure, and three semi-girders by uniform setting on it are supported in the groove that frame and top electrode, bottom electrode form.
The utility model target guarantees the translation of target owing to adopt above-mentioned three arm beams and orthohexagonal mass, and linear good, impact resistance is strong, and isolation performance is strong in length and breadth, and temperature drift is little, and volume is little, the reliability height.Against existing technologies, the utility model is simple in structure, and volume is little, and is easy for installation, the functional reliability height.
Description of drawings
Below in conjunction with accompanying drawing the utility model is further specified.
Fig. 1 is a structural representation of the present utility model.
1. top electrodes among the figure, 2. mass, 3. semi-girder, 4. intermediate exhaust hole, 5. exhaust passage, 6. bottom electrode, 7. frame.
Embodiment
As can be seen from Figure 1, a kind of MEMS acceleration earthquake sensor comprises top electrode 1, bottom electrode 6 and target movably, constitutes one and becomes the spacing differential capacitance sensor.Top electrode 1, bottom electrode 6, groove electrode or plane electrode that available silicon or high silica glass are manufactured with micromachined.Top electrode 1, bottom electrode 6 play overload protective function simultaneously.Target is between top electrode 1, bottom electrode 6, and it is that the monocrystalline silicon with [100] or [110] crystal orientation is matrix, forms an integrative-structure that comprises frame 7, mass 2, three semi-girders 3 with micromachining technology.Mass 2 is supported by semi-girder 3, frame 7, is arranged in the groove that top electrode 1, bottom electrode 6 and frame 7 form.
The utility model mass 2 is the regular hexagon structure, and three semi-girders 3 by uniform setting on the tool link to each other with frame 7.Be supported in the groove of frame 7 and top electrode 1, bottom electrode 6 formation.Frame 7 outsides are positive square, and inner edge is the regular hexagon structure.When being shaken, evenly three semi-girders 3 that are provided with produce stress under regular hexagon mass 2 drives, and are subjected to displacement.Because semi-girder 3 five equilibriums are fixed on the hexagon mass, the piece translation between upper and lower electrode of therefore ensuring the quality of products, good linearity, overload capacity is strong.
The utility model is for reducing damping, and mass 2 central authorities of target are provided with intermediate exhaust hole 4, and vent port 4 can be a square hole, also can be circular hole.The a plurality of exhaust passages 5 of processing on the frame 7 of target.The utility model exhaust passage 5 can be located on frame 7 and the upper and lower side that top electrode 1, bottom electrode 6 contact.Like this, when mass 2 was done upper and lower displacement, the air in the chamber can be discharged by intermediate exhaust hole 4 and exhaust passage 5, strengthens flowing of air, reducing damping, and played the effect that reduces noise.
The utility model is to be a sandwich style change spacing differential capacitance sensor of means formation with micromachined and integrated circuit technology.When sensor is fixed on the testee, when testee produced vibrations, mass was subjected to displacement, and then produced displacement difference with upper/lower electrode and was respectively Δ d
1With-Δ d
2Because mass itself is again the target of sensor, so relatively-stationary upper/lower electrode produces the variation of capacitance difference, one of them electrode C
1Increase a Δ C
1, and another electrode C
2Reduce by a Δ C
2, as displacement d
1=-d
2. capacitor C
1=C
2=C
0, capacitor C then
1, C
2The equation of variable quantity is:
C
1＝C
0〔1+Δd/d+(Δd/d)
2+(Δd/d)
3+…〕
C
2＝C
0〔1-Δd/d+(Δd/d)
2-(Δd/d)
3+…〕
The relative variation of electric capacity:
ΔC/C
0＝C
1-C
2/C
0＝2〔Δd/d+(Δd/d)
3+…〕
Ignore high-order term
ΔC/C
0＝2(Δd/d)
The output of the utility model sensor is electric capacity, for the purpose of using conveniently, has corresponding C-V translation circuit etc.Act on sensor through oscillatory circuit, again through C-V translation circuit, amplifying circuit, A/D conversion etc., last single-chip microcomputer output.Can obtain analog quantity output, also can realize digital quantity output.Concrete application circuit belongs to prior art, is not describing in detail here.
The utility model is owing to be three arm beam stably translational structures, remolding sensitivity four arm deck-moldings, and good linearity, temperature drift is little, does not need temperature and linear compensation.
Claims (3)
1. MEMS acceleration earthquake sensor, comprise top electrode, bottom electrode and target movably, top electrode, bottom electrode are the grooved electrodes that forms with micromachining technology, target comprises frame, mass, semi-girder, it is characterized in that: mass is the regular hexagon structure, and three semi-girders by uniform setting on it are supported in the groove that frame and top electrode, bottom electrode form.
2. MEMS acceleration earthquake sensor according to claim 1 is characterized in that: the frame outside is positive square, and inner edge is the regular hexagon structure.
3. MEMS acceleration earthquake sensor according to claim 1 is characterized in that: mass central authorities are provided with the intermediate exhaust hole, and frame is provided with a plurality of exhaust passages.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200520085090 CN2812028Y (en) | 2005-07-05 | 2005-07-05 | MEMS acceleration earthquake sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200520085090 CN2812028Y (en) | 2005-07-05 | 2005-07-05 | MEMS acceleration earthquake sensor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2812028Y true CN2812028Y (en) | 2006-08-30 |
Family
ID=36938418
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200520085090 Expired - Fee Related CN2812028Y (en) | 2005-07-05 | 2005-07-05 | MEMS acceleration earthquake sensor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2812028Y (en) |
-
2005
- 2005-07-05 CN CN 200520085090 patent/CN2812028Y/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C19 | Lapse of patent right due to non-payment of the annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |