CN2785142Y

CN2785142Y - Image sensing equipment packaging structure

Info

Publication number: CN2785142Y
Application number: CNU2005200000455U
Authority: CN
Inventors: 辛宗宪; 王东传; 蔡尚节; 谢尚锋; 张建伟; 阎俊杰
Original assignee: Kingpak Technology Inc
Current assignee: Kingpak Technology Inc
Priority date: 2005-01-06
Filing date: 2005-01-06
Publication date: 2006-05-31
Anticipated expiration: 2015-01-06

Abstract

The utility model relates to an encapsulation structure of an image sensor, which comprises a base plate which forms a square shape, four convex blocks, an image sensing chip, a plurality of conducting wires, an adhesive layer and a euphotic layer, wherein the base plate is provided with an upper surface and a lower surface, a plurality of first electrodes are formed on the upper surface and a plurality of second electrodes are formed on the lower surface and are electrically connected to the first electrodes. The four convex blocks are respectively arranged on four corner positions of the upper surface of the base plate, the image sensing chip is arranged on the upper surface position of the base plate and the image sensing chip is electrically connected to the corresponding first electrodes by using the conducting wires. The adhesive layer is coated on the upper surface of the base plate along the peripheries of the four convex blocks, the image sensing chip is surrounded by the adhesive layer and partial conducting wires which are positioned on the periphery of the base plate are covered. The euphotic layer is covered above the four convex blocks and is used for covering the image sensor.

Description

The image sensor packaging structure

Technical field

The utility model is a kind of image sensor packaging structure, refers in particular to a kind of compact packaging structure that has, and can effectively improve its reliability.

Background technology

See also Fig. 1, be the cutaway view of existing a kind of image sensor packaging structure, it includes a substrate 10, and it is provided with a first surface 12 and a second surface 14, and first surface 12 is formed with first contact 15, and second surface 14 is formed with second and connects 16; One flange layer 18 is provided with a upper surface 20 and a lower surface 22, and lower surface 22 adhesions are fixed on the first surface 12 of substrate 10, and form an accommodation chamber 24 with substrate 10; One image sensing chip 26 is located in substrate 10 and the flange layer 18 formed accommodation chambers 24, and is fixed on the first surface 12 of substrate 10; Many leads 28, it has one first end points 30 and one second end points, 32, the first end points 30 are electrically connected to the signal input part 15 that image sensing chip 26, the second end points 32 are electrically connected to substrate 10; An and the photic zone 34 sticking upper surfaces 20 of being located at flange layer 18.

Above-mentioned image sensor packaging structure because the periphery of substrate 10 is provided with flange layer 18, therefore, its can't be on the substrate 10 of fixed dimension ccontaining bigger image sensing chip 26, encapsulation volume is dwindled.And it is when routing, often because of the distance limit of 26 of flange layer 18 and image sensing chips, makes its routing operation be difficult for carrying out, and the production yield of reduction product.

Novel content

Main purpose of the present utility model is to provide a kind of image sensor packaging structure, and it has the effect that reduces product size, to reach compact purpose.

Another purpose of the present utility model is to provide a kind of image sensor packaging structure, and it has the effect of being convenient to routing, to reach in the manufacturing purpose more easily.

In order to achieve the above object, of the present utility modelly be characterised in that including a substrate is a square shape, be provided with a upper surface and a lower surface, this upper surface is formed with a plurality of first electrodes, and this lower surface is formed with a plurality of second electrodes and is electrically connected to this first electrode.Four projections are located at the position, four angles of the upper surface of this substrate respectively.One image sensing chip is arranged at the upper surface position of this substrate.Many leads are in order to be electrically connected this image sensing chip to this corresponding first electrode; One glue-line is prolonging the upper surface that this substrate is coated in these four projection peripheries, and this image sensing chip is centered on, and covers the lead that partly is positioned at this substrate periphery.One photic zone, it is covered on this four projection tops, in order to this image sensor is covered.

In this way, it can have compact and make purpose easily.

Description of drawings

Fig. 1 is the view of existing image sensor packaging structure.

Fig. 2 is the cutaway view of the utility model image sensor packaging structure.

Fig. 3 is the first signal top view of the utility model image sensor packaging structure.

Fig. 4 is the second signal top view of the utility model image sensor packaging structure.

The figure number explanation

Known figure number

Substrate 10 first surfaces 12 second surfaces 14

First contact, 15 second surfaces 14 second connect 16

Flange layer 18 upper surfaces 20 lower surfaces 22

Accommodation chamber 24 image sensing chips 26 leads 28

First end points, 30 second end points, 32 photic zones 34

The utility model figure number

Substrate 40 projections 42 image sensing chips 44

Many lead 46 glue-lines 48 photic zones 50

Upper surface 52 lower surfaces 54 first electrodes 56

Second electrode, 58 electric conducting materials, 60 weld pads 62

Embodiment

See also Fig. 2, be the cutaway view of image sensor packaging structure of the present utility model, it includes a substrate 40, four projections 42, an image sensing chip 44, many leads 46, glue-line 48 and photic zones 50;

Please cooperate and consult Fig. 3 and Fig. 4, wherein substrate 40 is provided with a upper surface 52 and a lower surface 54, upper surface 52 is formed with a plurality of first electrodes 56, lower surface 54 is formed with a plurality of second electrodes 58, and substrate 40 peripheries are formed with electric conducting material 60, in order to be electrically connected corresponding first electrode 56 and second electrode 58.

Four projections 42 are located at the position, four angles of the upper surface 52 of substrate 40 respectively.

Image sensing chip 44 is arranged at upper surface 52 positions of substrate 40, and its periphery is formed with a plurality of weld pads 62.

Many leads 46 in order to the weld pad 62 that is electrically connected image sensing chip 44 to corresponding first electrode 56.

One glue-line 48 is prolonging the upper surface 52 that substrate 40 is coated in four projection 42 peripheries, and image sensing chip 44 is centered on, and covers the lead 46 that partly is positioned at substrate 40 peripheries.And

One photic zone 50 is a transparent glass, and it is glued by glue-line 48 is located at four projection 42 tops, in order to this image sensing chip 44 is covered.

In this way, the utlity model has following advantage:

1. therefore the utility model, can make the utilization rate of substrate 40 acquisitions than large space owing to only in four corners of substrate projection 42 is set, therefore, in the image sensing chip encapsulation of fixed dimension, can use less substrate, not only can effectively reduce production costs, and can have less envelope volume.

2. owing to glue-line 48 row coating again behind routing, therefore, can be convenient to the operation of routing, and can effectively improve the routing yield.

The specific embodiment that is proposed in the detailed description of preferred embodiment is only in order to be easy to illustrate the technology contents of this creation, be not with the utility model narrow sense be limited to embodiment, all many variations that situation is done enforcement according to spirit of the present utility model and following claim all belongs to scope of the present utility model.

Claims

1. an image sensor packaging structure is characterized in that, includes:

One substrate, it is a square shape, is provided with a upper surface and a lower surface, and this upper surface is formed with a plurality of first electrodes, and this lower surface is formed with a plurality of second electrodes and is electrically connected to this first electrode;

Four projections are located at the position, four angles of the upper surface of this substrate respectively;

One image sensing chip, it is arranged at the upper surface position of this substrate;

Many leads, it is in order to be electrically connected this image sensing chip to this corresponding first electrode;

One glue-line, it is prolonging the upper surface that this substrate is coated in these four projection peripheries, and this image sensing chip is centered on, and covers the lead that partly is positioned at this substrate periphery; And

One photic zone, it is covered on this four projection tops, in order to this image sensing chip is covered.

2. image sensor packaging structure as claimed in claim 1 is characterized in that, is formed with electric conducting material around this substrate, with the conducting so that corresponding this first electrode is connected with this second electrode.

3. image sensor packaging structure as claimed in claim 1 is characterized in that, this photic zone is a transparent glass.

4. image sensor packaging structure as claimed in claim 1 is characterized in that, this photic zone is adhered to this four projection tops by this glue-line.