CN2894140Y

CN2894140Y - Image sensor module with passive component

Info

Publication number: CN2894140Y
Application number: CNU2006200045573U
Authority: CN
Inventors: 辛宗宪
Original assignee: Kingpak Technology Inc
Current assignee: Kingpak Technology Inc
Priority date: 2006-03-08
Filing date: 2006-03-08
Publication date: 2007-04-25
Anticipated expiration: 2016-03-08

Abstract

An image sensor module with passive elements comprises a soft circuit board, on which an electric circuit is arranged, more than one passive element arranged on the soft circuit board and electrically connected with the electric circuit, a substrate provided with a first surface, a second surface and a hollowed-out hole, and the two surfaces arranged on the upper surface of the soft circuit board to make the passive elements correctly arranged in the hollowed-out hole of the substrate, a chip on the first surface of the substrate and above the hollowed-out hole, a plurality of conductors which electrically connect the chip with the substrate, a spectacle base with internal thread on it, arranged on the first surface of the substrate to surround the chip, and a drawtube, which is provided with external thread to screw the drawtube to the internal thread of the spectacle base. The drawtube is provided with the transparent area, the aspheric spectacles and the infrared filtering lens successively from top to bottom.

Description

Image sensor module with passive device

Technical field

The utility model is a kind of image sensor module with passive device, is meant a kind of image sensor module that can effectively reduce product size and improve the product yield especially.

Prior art

See also Fig. 1, be a kind of image sensor module structure, it includes; One substrate 10, it is provided with a first surface 12 and a second surface 14, be formed with first electrode 15 around the first surface 12, be formed with second electrode, 16, the first electrodes 15 and second electrode 16 around the second surface 14 by lead 17 mutual conduction of prolonging substrate 10 sides; One flange layer 18 is provided with a upper surface 20 and a lower surface 22, and lower surface 22 is that adhesion is fixed on the first surface 12 of substrate 10, and forms an accommodation chamber 24 with substrate 10; One image sensing chip 26 is provided with most weld pads 27 and is positioned at around it, is to be located in substrate 10 and the flange layer 18 formed accommodation chambers 24, and is fixed on the first surface 12 of substrate 10; Plurality of wires 28, it has one first end points 30 and one second end points, 32, the first end points 30 is that to be electrically connected to image sensing chip 26, the second end points 32 are first electrodes 15 that are electrically connected to substrate 10; One photic zone 34 is sticking upper surfaces 20 of being located at flange layer 18; One microscope base 35, it is provided with a upper surface 36, a lower surface 40 and one and connects to the lower surface 40 accommodation chamber 42 by upper surface 36, and the accommodation chamber 42 of microscope base 34 is formed with internal thread 44; One lens barrel 46, it is provided with an external screw thread 48, is that the upper surface 36 by microscope base 35 is placed in the accommodation chamber 42, and with internal thread 44 screw locks of microscope base 34, and from top to bottom be provided with a transparent area 47, aspherical lens 481 and infrared ray filter glass 49 in the lens barrel 46.

See also Fig. 2, above-mentioned module in use, second electrode 16 of substrate 10 must be electrically connected on the flexible circuit board 55, be connected so that do with electronic installation, passive device 57 then is to be arranged on the flexible circuit board 55, in this way, when flexible circuit board 55 bendings, often cause passive device 57 to come off, and the circuit of passive device 57 received signals is longer, it is electrically relatively poor.

In view of this, this creator be this in the spirit of keeping on improving, innovate breakthrough, be devoted to the research and development of image sensor module, and create the image sensor encapsulation of the utility model reduced form, can effectively reduce product size and improve the product yield.

Novel content

Main purpose of the present utility model is to provide a kind of image sensor module with passive device, and it has the effect that can improve its yield, to reach more practical purpose.

Another purpose of the present utility model is to provide a kind of image sensor module with passive device, and it has the effect that reduces package dimension, to reach more practical purpose.

In order to achieve the above object, a kind of image sensor module with passive device of the present utility model is characterized in that it includes:

One flexible circuit board, it is provided with a upper surface and a lower surface, and this upper surface cloth is implanted with electronic circuit;

More than one passive device, it is to be arranged on this flexible circuit board, and electrically connects with this electronic circuit;

One substrate, it is provided with a first surface, a second surface and a hollow hole, and this first surface is formed with first electrode, and this second surface is formed with second electrode, the second surface of this substrate is arranged on the upper surface of this flexible circuit board, and this passive device just is positioned at the hollow hole of this substrate;

One chip, it is to be arranged on the first surface of this substrate, and is positioned at this hollow hole top, is formed with most weld pads on it;

A most lead, it is to be electrically connected the weld pad of this chip to first electrode of this substrate;

One microscope base, it is to be fixedly arranged on the first surface of this substrate, and this chip around living, is formed with internal thread on it; And

One lens barrel, it is provided with external screw thread, and screw lock is on the internal thread of this microscope base, and it from top to bottom is provided with transparent area, aspherical lens and infrared ray filter glass in regular turn.

Wherein second electrode of this substrate is electrically connected on the electronic circuit of this flexible circuit board.

The beneficial effects of the utility model are: it has the effect that can improve its yield, and can reduce the effect of package dimension.

Description of drawings

Above-mentioned and other purpose, advantage and characteristic of the present utility model are by the detailed description of following preferred embodiment and can more be understood in depth with reference to the accompanying drawings, wherein:

Fig. 1 is the cutaway view of known image sensor module.

Fig. 2 is the enforcement figure of known image sensor module.

Fig. 3 is the first enforcement figure of the image sensor module of the utility model tool passive device.

Fig. 4 is the second enforcement figure of the image sensor module of the utility model tool passive device.

Execution mode

See also Fig. 3, be the cutaway view of the image sensor module that the utlity model has passive device, it includes a flexible circuit board 50, passive device 51, substrate 52, a chip 54, plurality of wires 56, a microscope base 58 and lens barrel 60: wherein

Flexible circuit board 50 is provided with a upper surface 62 and a lower surface 64, and upper surface cloth is implanted with electronic circuit 66.

Passive device 51 is to be arranged on the upper surface 62 of flexible circuit board 50, and electrically connects with electronic circuit 66.

Substrate 52 is provided with a first surface 68, a second surface 70 and a hollow hole 72, first surface 68 is formed with first electrode 74, second surface 70 is formed with second electrode 76, the second surface 70 of substrate 52 is to be arranged on the upper surface 62 of flexible circuit board 50, makes passive device 51 just be positioned at the hollow hole 72 of substrate 52.

Chip 54 is to be arranged on the first surface 68 of substrate 52, and is positioned at hollow hole 72 tops, is formed with most weld pads 78 on it.

A most lead 56 are to be electrically connected the weld pad 78 of chip 54 to first electrode 74 of substrate 52.

Microscope base 58 is to be fixedly arranged on the first surface 68 of substrate 52, in order to chip 54 around living, be formed with internal thread 80 on it.

Lens barrel 60 is provided with external screw thread 82, and on the internal thread 80 of microscope base 58, it from top to bottom is provided with transparent area 84, aspherical lens 86 and infrared ray filter glass 88 in regular turn in order to screw lock.

See also Fig. 4, be the cutaway view of another embodiment of the image sensor module that the utlity model has passive device, it includes a flexible circuit board 50, passive device 51, substrate 52, a flange layer 53, a chip 54, plurality of wires 56, a photic zone 61, a microscope base 58 and lens barrel 60: wherein

Flange layer 53 is to be arranged on the first surface 68 of substrate 52, and forms a groove 59 with substrate 52.

Chip 54 is to be arranged on the first surface 68 of substrate 52, and is positioned at hollow hole 72 tops and is positioned at groove 59, is formed with most weld pads 78 on it.

Photic zone 61 is to be covered on the flange layer 53, in order to chip 54 is covered.

Microscope base 58 is to be fixedly arranged on the flange layer 53, is formed with internal thread 80 on it.

In this way, passive device 61 is arranged in the hollow hole 72 of substrate 52, can shortens the distance that signal transmits, can improve its electrical ability.Moreover, passive device is hidden in the hollow hole 72, can effectively avoid it to come off, and improve its fine ratio of product.

The specific embodiment that is proposed in the detailed description of preferred embodiment is only in order to be easy to illustrate technology contents of the present utility model, be not with the utility model narrow sense be limited to embodiment, every many variations that situation is done enforcement according to spirit of the present utility model and following claim all belongs to scope of the present utility model.

Claims

1. image sensor module with passive device is characterized in that it includes:

2. as claim 1 a described image sensor module, it is characterized in that wherein second electrode of this substrate is electrically connected on the electronic circuit of this flexible circuit board with passive device.