CN213093201U - Infrared receiving device - Google Patents
Infrared receiving device Download PDFInfo
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- CN213093201U CN213093201U CN202022366289.2U CN202022366289U CN213093201U CN 213093201 U CN213093201 U CN 213093201U CN 202022366289 U CN202022366289 U CN 202022366289U CN 213093201 U CN213093201 U CN 213093201U
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Abstract
The utility model provides an infrared receiving device, include: the infrared receiving chip, the infrared decoding chip and the ambient light sensing chip are all arranged on the surface of the support and are electrically connected with the support, and the packaging layer is coated on the infrared receiving chip, the infrared decoding chip, the ambient light sensing chip and the outer side of the support. The infrared receiving chip and the ambient light sensing chip are mounted at the corresponding positions of the bracket in an integrated packaging mode, the structure is simple, the manufacturing is convenient, the development period is shortened, and the reliability of the product is improved.
Description
Technical Field
The utility model relates to an electronic components technical field especially relates to an infrared receiving device.
Background
The infrared remote control technology is widely applied in real life, and the infrared remote control technology is adopted from various toys to various household appliances and further to various industrial production and tests. As the electromagnetic environment becomes more and more complex, when the infrared remote control technology is used, higher and higher requirements are put forward on the characteristics of relevant devices, such as anti-interference capability, electromagnetic compatibility capability, sensitivity, reliability and the like.
The infrared receiving device is one of the key components in the infrared remote control system, and the performance of the infrared receiving device determines the performance of the infrared remote control system. Currently, the internal structure of the infrared receiving device is improved. A window is arranged in the middle of the shielding cover, a shielding net is arranged in the window, and the shielding cover is assembled on the bottom plate. The structure has the defects that the bottom plate and the shielding cover are connected in a riveting mode, the processing and the repair are inconvenient, and the size of the bracket is large; most of the front end of the LED chip is not provided with an encapsulating structure, light leakage is serious, and the influence on the anti-interference performance of the LED chip is serious.
The existing infrared receiving head and the ambient light sensor are independently packaged, and need to be separately installed during use, the placement positions are extremely difficult to control and are easy to interfere with each other, the product design and development difficulty is increased, and the product development period is long.
SUMMERY OF THE UTILITY MODEL
In view of the above, the present invention has been made to provide an infrared receiving device that overcomes or at least partially solves the above problems.
In order to solve the above problem, the utility model discloses an infrared receiving device, include: the infrared receiving chip, the infrared decoding chip and the ambient light sensing chip are all arranged on the surface of the support and are electrically connected with the support, and the packaging layer is coated on the infrared receiving chip, the infrared decoding chip, the ambient light sensing chip and the outer side of the support.
Further, the packaging layer is a resin layer.
Further, the number of the infrared receiving chips is two.
Further, the infrared receiving chip, the infrared decoding chip and the ambient light sensing chip are alternately arranged on the surface of the bracket.
Furthermore, the infrared receiving chip further comprises a shielding cover, and the shielding cover covers the outer side of the infrared receiving chip.
Furthermore, the device also comprises a color filter, wherein the color filter is arranged on the surface of the ambient light sensing chip.
Further, the packaging layer is a transparent resin layer.
Further, the packaging layer further comprises a brown resin layer, the transparent resin layer covers the surface of the ambient light sensing chip, and the brown resin layer covers the surface of the infrared receiving chip.
Further, the infrared receiving chip, the infrared decoding chip and the ambient light sensing chip are electrically connected with the bracket through metal wires.
Further, the infrared receiving chip, the infrared decoding chip, the ambient light sensing chip, the bracket and the packaging layer are integrally packaged and formed.
The utility model discloses a following advantage: the infrared receiving chip and the ambient light sensing chip are mounted at the corresponding positions of the bracket in an integrated packaging mode, the structure is simple, the manufacturing is convenient, the development period is shortened, and the reliability of the product is improved.
Drawings
Fig. 1 is a schematic structural diagram of an infrared receiving device of the present invention.
The device comprises an infrared receiving chip 1, an infrared decoding chip 2, an ambient light sensing chip 3, a metal wire 4, a shielding case 5, a bracket 6 and a packaging layer 7.
Detailed Description
In order to make the above objects, features and advantages of the present invention more comprehensible, the present invention is described in detail with reference to the accompanying drawings and the detailed description.
One of the core ideas of the utility model lies in that an infrared receiving device is provided, include: at least one infrared receiving chip 1, infrared decoding chip 2, ambient light sensing chip 3, support 6 and packaging layer 7, infrared receiving chip 1 infrared decoding chip 2 with ambient light sensing chip 3 all locates support 6 surface, and all with support 6 electricity is connected, packaging layer 7 cladding in infrared receiving chip 1 infrared decoding chip 2 ambient light sensing chip 3 with the support 6 outside. The infrared receiving chip 1 and the ambient light sensing chip 3 are installed at the corresponding positions of the bracket 6 in an integrated packaging mode, the structure is simple, the manufacturing is convenient, the development period is shortened, and the reliability of the product is improved.
Referring to fig. 1, a schematic structural diagram of an infrared receiving apparatus of the present invention is shown, which may specifically include: at least one infrared receiving chip 1, infrared decoding chip 2, ambient light sensing chip 3, support 6 and packaging layer 7, infrared receiving chip 1 infrared decoding chip 2 with ambient light sensing chip 3 all locates support 6 surface, and all with support 6 electricity is connected, packaging layer 7 cladding in infrared receiving chip 1 infrared decoding chip 2 ambient light sensing chip 3 with the support 6 outside. The infrared receiving chip 1 in the present embodiment is used for receiving an infrared light signal; the infrared decoding chip 2 is used for decoding the infrared light signal; the ambient light sensing chip 3 is used for collecting ambient light signals, in this embodiment, the infrared receiving chip 1, the infrared decoding chip 2 and the ambient light sensing chip 3 are mounted on a bracket 6, and the chips are electrically connected to the bracket 6, the bracket 6 is a conductive bracket 6, the conductive bracket 6 in a specific embodiment is a metal bracket 6, and the metal bracket 6 has excellent conductivity and low cost; the infrared receiving chip 1, the infrared decoding chip 2, the ambient light sensing chip 3 and the support 6 are coated integrally by the packaging layer 7, so that the reliability of a product can be improved, the packaging structure is simple, the product development period can be effectively shortened, and the production cost is reduced.
In the present embodiment, the encapsulating layer 7 is a resin layer. The resin layer is adopted as the packaging layer 7, so that the packaging stability can be improved, and the quality of a packaged product is ensured.
In the present embodiment, the infrared receiving chips 1 are provided in two. In a specific embodiment, the number of the infrared receiving chips 1 may be set according to specific product performance requirements, the number of the infrared receiving chips 1 may be set to be single or two, and in other embodiments, the number of the infrared receiving chips 1 may be set to be multiple.
In this embodiment, the infrared receiving chip 1, the infrared decoding chip 2 and the ambient light sensing chip 3 are alternately disposed on the surface of the bracket 6. The infrared receiving chip 1, the infrared decoding chip 2 and the ambient light sensing chip 3 are alternately arranged on the surface of the bracket 6, so that the working performance of the infrared receiving device can be improved, and the product quality can be ensured.
In this embodiment, the infrared receiving device further includes a shielding case 5, and the shielding case 5 covers the outside of the infrared receiving chip 1. The shielding case 5 is used for reducing interference of the electrical signal and ensuring working stability of the product, and specifically, whether the shielding case 5 is additionally arranged on the periphery of the infrared receiving chip 1 can be determined according to performance requirements of the product.
In this embodiment, the device further includes a color filter, and the color filter is disposed on the surface of the ambient light sensing chip 3. The color filter is used to block infrared rays while allowing ambient light to pass. Specifically, the color filter can be added on the ambient light sensing chip 3 according to the requirements of product performance.
In this embodiment, the encapsulating layer 7 is a transparent resin layer. The transparent resin layer can transmit ambient light, and the scattering performance of the ambient light is improved.
In this embodiment, the encapsulation layer 7 further includes a brown resin layer, the transparent resin layer covers the surface of the ambient light sensing chip 3, and the brown resin layer covers the surface of the infrared receiving chip 1. Above-mentioned brown resin layer can filter partial ambient light, through encapsulating the brown resin layer in the infrared receiving chip 1 outside, can filter partial ambient light, reduces the ambient light to infrared receiving chip 1's interference, improves the stability of product.
In this embodiment, the infrared receiving chip 1, the infrared decoding chip 2 and the ambient light sensing chip 3 are electrically connected to the bracket 6 through a metal wire 4. Adopt metal wire 4 to connect, can improve the quality of product, guarantee the stability that the product is connected.
In this embodiment, the infrared receiving chip 1, the infrared decoding chip 2, the ambient light sensing chip 3, the bracket 6 and the encapsulating layer 7 are integrally encapsulated. The infrared receiving chip 1 and the ambient light sensing chip 3 are installed at the corresponding positions of the bracket 6 in an integrated packaging mode, the structure is simple, the manufacturing is convenient, the development period is shortened, and the reliability of the product is improved.
Finally, it should also be noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or terminal that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or terminal. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a process, method, article, or terminal that comprises the element.
The infrared receiving device provided by the present invention is introduced in detail, and the principle and the implementation of the present invention are explained by applying specific examples, and the descriptions of the above examples are only used to help understanding the method and the core idea of the present invention; meanwhile, for the general technical personnel in the field, according to the idea of the present invention, there are changes in the specific implementation and application scope, to sum up, the content of the present specification should not be understood as the limitation of the present invention.
Claims (10)
1. An infrared receiving apparatus, comprising: the infrared receiving chip, the infrared decoding chip and the ambient light sensing chip are all arranged on the surface of the support and are electrically connected with the support, and the packaging layer is coated on the infrared receiving chip, the infrared decoding chip, the ambient light sensing chip and the outer side of the support.
2. The infrared receiving device as set forth in claim 1, wherein the encapsulating layer is a resin layer.
3. The infrared receiving device as set forth in claim 1, wherein the infrared receiving chips are provided in two.
4. The infrared receiving device as claimed in claim 1 or 3, wherein the infrared receiving chip, the infrared decoding chip and the ambient light sensing chip are alternately disposed on the surface of the bracket.
5. The infrared receiving device as claimed in claim 1, further comprising a shielding case, wherein the shielding case covers the outside of the infrared receiving chip.
6. The ir receiving device of claim 1, further comprising a color filter disposed on a surface of the ambient light sensing die.
7. The infrared receiving device as set forth in claim 1, wherein the encapsulating layer is a transparent resin layer.
8. The infrared receiving device as claimed in claim 7, wherein the encapsulating layer further comprises a tawny resin layer, the transparent resin layer covers the ambient light sensing chip surface, and the tawny resin layer covers the infrared receiving chip surface.
9. The infrared receiving device of claim 1, wherein the infrared receiving chip, the infrared decoding chip and the ambient light sensing chip are electrically connected to the bracket through metal wires.
10. The infrared receiving device of claim 1, wherein the infrared receiving chip, the infrared decoding chip, the ambient light sensing chip, the bracket and the encapsulating layer are integrally formed by encapsulation.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022366289.2U CN213093201U (en) | 2020-10-21 | 2020-10-21 | Infrared receiving device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022366289.2U CN213093201U (en) | 2020-10-21 | 2020-10-21 | Infrared receiving device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213093201U true CN213093201U (en) | 2021-04-30 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022366289.2U Active CN213093201U (en) | 2020-10-21 | 2020-10-21 | Infrared receiving device |
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| CN (1) | CN213093201U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112185947A (en) * | 2020-10-21 | 2021-01-05 | 深圳市锦创宏光电科技有限公司 | Infrared receiving device and method |
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2020
- 2020-10-21 CN CN202022366289.2U patent/CN213093201U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112185947A (en) * | 2020-10-21 | 2021-01-05 | 深圳市锦创宏光电科技有限公司 | Infrared receiving device and method |
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