CN2599757Y - Stacking structure of image sensor - Google Patents
Stacking structure of image sensor Download PDFInfo
- Publication number
- CN2599757Y CN2599757Y CNU022941711U CN02294171U CN2599757Y CN 2599757 Y CN2599757 Y CN 2599757Y CN U022941711 U CNU022941711 U CN U022941711U CN 02294171 U CN02294171 U CN 02294171U CN 2599757 Y CN2599757 Y CN 2599757Y
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- plate
- image sensor
- substrate
- integrated circuit
- electrically connected
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Abstract
The utility model relates to an image sensor superimposed structure, including: a base plate, the base plate comprises a plurality of symmetrical metal sheets and plates in mutual arrangement and the metal sheets form a first plate and a second plate of different heights so as to form a groove at the bottom of the base plate; an integrated circuit, arranged in the groove of the base plate and electrically connected with the base plate; a flange layer, used to coat the base plate and the integrated circuit and make the first and the second plates of the metal sheets of the base plate respectively exposed from the flange layer; an image sensor chip, arranged on the middle plate of the base plate and electrically connected with the first plate of the metal sheets through a plurality of wires; and a transparent layer, arranged on the flange layer and covering the image sensor chip. The utility model can reduce packaging components so as to lower packaging cost and simplify manufacturing process so as to make manufacturing more convenient.
Description
Technical field
The utility model relates to a kind of image sensor stacking construction, refer in particular to and a kind ofly be packaged on the packaging body, can reduce the use of base plate for packaging and the image sensor stacking construction that the integrated circuit and the image sensing wafer of variant function can be integrated encapsulation in order to the integrated circuit and the image sensing wafer that will have difference in functionality.
Background technology
General sensor is used for sensing one signal, and this signal can be light signal or sound signal, and the sensor of this case is used for receiving an image signal (light signal), and this image signal is converted to electric signal is passed on the printed circuit board (PCB).
General image sensor is in order to receiving an image signal, and image signal is converted to electric signal is passed on the printed circuit board (PCB), is electrically connected with the integrated circuit that other encapsulation are finished again, makes it have different functional requirements.Such as, it is electrically connected with digital signals processor (Digital signal Processor), in order to the processing signal that image sensor produced, or can be electrically connected, and produce different functional requirements with microcontroller (Micro Controller) or central processing unit (CPU) etc.
Yet, known image sensor encapsulates all separately and makes, and therefore, also must be encapsulated separately with the various integrated circuit of its collocation, image sensor that encapsulation is finished and various signal processing unit are electrically connected on the printed circuit board (PCB) again, by lead it are electrically connected to integrate again and use.So, when encapsulating separately, each signal processing unit and image sensor must respectively use a substrate and an encapsulation procedure, cause production cost to reduce effectively, and when being arranged at each signal processing unit on the printed circuit board (PCB), the area of required printed circuit board (PCB) must be bigger, and can't reach light, thin, short and small demand.
In view of this, the inventor invents out image sensor stacking construction of the present invention, and it can solve the shortcoming that above-mentioned image sensor is used effectively.
Summary of the invention
Main purpose of the present invention is to provide a kind of image sensor stacking construction, and it has the effect that reduces packing component, and packaging cost is reduced.
Another object of the present invention is to provide a kind of image sensor stacking construction, it has the simplification procedure for producing, and it is more convenient that it is made.
Another purpose of the present invention is to provide a kind of image sensor stacking construction, can reduce the area size of product.
A further object of the present invention is to provide a kind of image sensor stacking construction, and it can reduce product encapsulation, the testing cost of image sensor.
In order to achieve the above object, image sensor stacking construction of the present utility model, it includes a substrate, it arranges symmetrical sheet metal by a plurality of spaces and the intermediate plate that is positioned between this left and right sides sheet metal is formed, these symmetrical these sheet metals are formed with first plate and second plate of differing heights, and make this base plate bottom form a groove; One integrated circuit, it is arranged in the groove of this substrate, and is electrically connected this substrate; One flange layer, it is in order to enveloping this substrate and this integrated circuit, and first plate and second plate of the sheet metal of this substrate are exposed by flange layer respectively; One image sensing wafer, it is arranged on the intermediate plate of this substrate; Plural wires, first plate of its these sheet metals that are electrically connected is to this image sensing wafer; And a photic zone, it is arranged on this flange layer, and this image sensing wafer is covered.
In the utility model, first plate of described sheet metal can further be connected by the 3rd plate with second plate.
Photic zone in the utility model can be transparent glass.
But symmetrical sheet metal and this intermediate plate integrated punching moulding are arranged in a plurality of space of the present utility model.
Wherein, described integrated circuit can be a signal processor.
In the utility model, the level height of described intermediate plate and this first plate can be identical.
Described integrated circuit can be covered first plate that crystal type is electrically connected to this substrate.
In this way, image sensor and other integrated circuit can be integrated encapsulation, to reach above-mentioned purpose.
Effect of the present utility model is significant, and one is because the utility model is integrated encapsulation with image sensing wafer and integrated circuit, and the material of substrate capable of reducing using effectively reduces the manufacturing cost of image sensor product.
Its two because the utility model integrated encapsulation with image sensing wafer and integrated circuit, can reduce the area size of image sensing product.
Its three because the utility model integrated encapsulation with image sensing wafer and integrated circuit, because of a packaging body is only arranged, so test with tool and only must one overlap, can reduce testing cost.
Its four because the utility model integrated encapsulation with image sensing wafer and integrated circuit, make only one encapsulation procedure of need of two wafers, can effectively reduce packaging cost.
Its five because integrated circuit of the present utility model is arranged in the groove of substrate, can reduce the volume of stacked package effectively, reach compact purpose.
Description of drawings
Fig. 1 is the cutaway view of the utility model image sensor stacking construction;
Fig. 2 is first schematic diagram of the processing procedure of the utility model image sensor stacking construction;
Fig. 3 is second schematic diagram of the processing procedure of the utility model image sensor stacking construction;
Fig. 4 is the 3rd schematic diagram of the processing procedure of the utility model image sensor stacking construction.The figure number explanation
The other end 38 of one end, 36 leads of lead
Embodiment
See also Fig. 1, be the cutaway view of the utility model image sensor stacking construction, it comprises: a substrate 10, a flange layer 12, an integrated circuit 14, an image sensing wafer 16, plural wires 18 and a photic zone 20.
The intermediate plate 24 that substrate 10 is arranged symmetrical sheet metal 22 by a plurality of spaces and is positioned at 22 of left and right sides sheet metals is formed, symmetrical each sheet metal 22 is formed with first plate 26 and second plate 28 of differing heights, and 28 of first plate 26 and second plates interconnect by the 3rd plate 30, and intermediate plate 24 is identical level height with first plate 26, and second plate 28 is passed to this printed circuit board (PCB) 11 in order to be electrically connected to a printed circuit board (PCB) 11 with signal.
One end 36 of plural wires 18 is electrically connected to the weld pad 35 of image sensing wafer 16, the other end 38 is electrically connected to first plate 26 of sheet metal 22, make that the signal of image sensing wafer 16 is passed on the substrate 10, and be passed to printed circuit board (PCB) 11 by second plate 28 of substrate 10.
See also Fig. 2, be first schematic diagram of processing procedure of the present utility model, at first integrated circuit 14 is arranged in the groove 34 of substrate 10 bottoms in advance, and to cover first plate, 26 bottom surfaces that crystalline substance (Flip-Chip) mode is electrically connected to substrate 10.
See also Fig. 3, second schematic diagram for processing procedure of the present utility model, then with the thermoplastic plastic via jetting mold directly with the flange layer 12 of a plurality of sheet metal 22 now moulding one U word shapes, it has a shaped as frame structure and is formed at substrate 10 peripheries, and integrated circuit 14 enveloped, and first plate 26 and second plate 28 of the sheet metal 22 of substrate 10 are exposed by flange layer 12 respectively, with so that second plate 28 can be electrically connected on the printed circuit board (PCB).
See also Fig. 4, the 3rd schematic diagram for processing procedure of the present utility model, with image sensing wafer 16 by on the adhesive intermediate plate 24 that is fixed in substrate 10 of viscose 40, be electrically connected to the weld pad 35 of image sense wafer 16 with an end 36 of plural wires 18, the other end 38 is electrically connected on first plate 26 of substrate 10, and Hou is placed in photic zone 20 in the depression 37 of flange layer 12, in order to image sensing wafer 16 is covered, makes image sensing wafer 16 see through photic zone 20 and receives the light signal.
Mat tectonic association as above the utlity model has following advantage:
1, image sensing wafer 16 and integrated circuit 14 are integrated encapsulation, the material of substrate 10 capable of reducing using can effectively reduce the manufacturing cost of image sensor product.
2, image sensing wafer 16 and integrated circuit 14 are integrated encapsulation, can be reduced the area size of image sensing product.
3, image sensing wafer 16 and integrated circuit 14 are integrated encapsulation, because of a packaging body is only arranged, so test with tool and only must one overlap, can be reduced testing cost.
4., image sensing wafer 16 integrated encapsulation with integrated circuit 14, makes only one encapsulation procedure of need of two wafers, can effectively reduce packaging cost.
5, because integrated circuit 14 is arranged in the groove 34 of substrate 10, and can reduce the volume of stacked package effectively, to reach compact purpose.
The specific embodiment that is proposed in the detailed description of preferred embodiment is only in order to be easy to illustrate technology contents of the present utility model, be not with the utility model narrow sense be limited to embodiment, all many variations that situation is done enforcement according to spirit of the present utility model and following claim all belongs to scope of the present utility model.
Claims (8)
1, a kind of image sensor stacking construction, is characterized in that it includes in order to be arranged on the printed circuit board (PCB):
One substrate, it arranges symmetrical sheet metal by a plurality of spaces and the intermediate plate that is positioned between this left and right sides sheet metal is formed, and these a plurality of symmetrical sheet metals are formed with first plate and second plate of differing heights, and this base plate bottom forms a groove;
One integrated circuit, it is arranged in the groove of this substrate, and is electrically connected on this substrate;
One flange layer, it is in order to enveloping this substrate and this integrated circuit, and first plate and second plate of the sheet metal of this substrate are exposed by flange layer respectively, and second plate is in order to be electrically connected to this printed circuit board (PCB);
One image sensing wafer, it is arranged on the intermediate plate of this substrate;
Plural wires, first plate of its these sheet metals that are electrically connected is to this image sensing wafer; And
One photic zone, it is arranged on this flange layer, covers this image sensing wafer.
2, image sensor stacking construction as claimed in claim 1, it is characterized in that: this flange layer is thermoplastic plastic's ejection formation.
3, image sensor stacking construction as claimed in claim 1 is characterized in that: first plate of this sheet metal is connected by the 3rd plate with second plate.
4, image sensor stacking construction as claimed in claim 1 is characterized in that: this photic zone is a transparent glass.
5, image sensor stacking construction as claimed in claim 1 is characterized in that: symmetrical sheet metal and this intermediate plate integrated punching moulding are arranged in these a plurality of spaces.
6, image sensor stacking construction as claimed in claim 1 is characterized in that: this integrated circuit is a signal processor.
7, image sensor stacking construction as claimed in claim 1 is characterized in that: this intermediate plate is identical with the level height of this first plate.
8, image sensor stacking construction as claimed in claim 1 is characterized in that: this integrated circuit is to cover first plate that crystal type is electrically connected to this substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU022941711U CN2599757Y (en) | 2002-12-27 | 2002-12-27 | Stacking structure of image sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU022941711U CN2599757Y (en) | 2002-12-27 | 2002-12-27 | Stacking structure of image sensor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2599757Y true CN2599757Y (en) | 2004-01-14 |
Family
ID=34151918
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU022941711U Expired - Fee Related CN2599757Y (en) | 2002-12-27 | 2002-12-27 | Stacking structure of image sensor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2599757Y (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108538870A (en) * | 2018-03-12 | 2018-09-14 | 信利光电股份有限公司 | A kind of plastic package method of image sensor chip, plastic packaging component and camera |
| CN112857248A (en) * | 2019-11-12 | 2021-05-28 | 宁波舜宇光电信息有限公司 | Depth information camera module, projection module and preparation method thereof |
| CN112995453A (en) * | 2019-12-18 | 2021-06-18 | 宁波舜宇光电信息有限公司 | Depth information camera module and assembling method thereof |
-
2002
- 2002-12-27 CN CNU022941711U patent/CN2599757Y/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108538870A (en) * | 2018-03-12 | 2018-09-14 | 信利光电股份有限公司 | A kind of plastic package method of image sensor chip, plastic packaging component and camera |
| CN112857248A (en) * | 2019-11-12 | 2021-05-28 | 宁波舜宇光电信息有限公司 | Depth information camera module, projection module and preparation method thereof |
| CN112995453A (en) * | 2019-12-18 | 2021-06-18 | 宁波舜宇光电信息有限公司 | Depth information camera module and assembling method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C19 | Lapse of patent right due to non-payment of the annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |