CN2598149Y

CN2598149Y - Improved structure of light sensor package

Info

Publication number: CN2598149Y
Application number: CNU022950273U
Authority: CN
Inventors: 谢志鸿; 吴志成; 陈炳光; 陈榕庭
Original assignee: Kingpak Technology Inc
Current assignee: Kingpak Technology Inc
Priority date: 2002-12-30
Filing date: 2002-12-30
Publication date: 2004-01-07
Anticipated expiration: 2012-12-30

Abstract

The utility model provides an improved light sensor encapsulating structure, which comprises: a substrate with an upper surface on which a plurality of signal input ends are arranged, and a lower surface on which a plurality of signal output ends are arranged; a flange layer with an upper head surface and a lower head face. The lower head face is arranged on the upper surface of the substrate, forming a holding chamber together with the substrate. A concave groove is arranged on the upper surface of the substrate inside the holding chamber; a plurality of conductors for electrically connecting the welding pad of the image sensing chip with the signal input ends of the substrate; a sticking gum layer is coated on the upper surface of the flange layer inside the concave; and an euphotic layer fixedly is arranged on the upper surface of the flange layer by the sticking gum layer; due to such a structure, the euphotic layer can be stuck onto the flange layer more firmly, and the utility model can be more easily manufactured, and the rate of qualified product can be efficiently improved.

Description

Optical sensor encapsulation improvement structure

Technical field

The utility model relates to a kind of structure of optical sensor.

Technical background

See also Fig. 1, be the schematic diagram of known optical sensor packaging structure, it includes: a substrate 10, and it is provided with a first surface 12 and a second surface 14, and first surface 12 is formed with signal input end 15, and second surface 14 is formed with signal output end 16; One flange layer 18 is provided with a upper surface 20 and a lower surface 22, and lower surface 22 is to stick together on the first surface 12 that is fixed in substrate 10, and forms an accommodation chamber 24 with substrate 10; One image sensing chip 26 is to be located in substrate 10 and the flange layer 18 formed accommodation chambers 24, and is fixed on the first surface 12 of substrate 10; Plural wires 28, it has one first end points 30 and one second end points, 32, the first end points 30 is that to be electrically connected to these image sensing chip 26, the second end points 32 be the signal input end 15 that is electrically connected to substrate 10; And a photic zone 34 is the glutinous upper surface 20 of being located at flange layer 18.

When photic zone 34 glutinous when being located on the flange layer 18, because accommodation chamber 24 is an enclosure space, the past photic zone 34 direction reactions of air of accommodation chamber 24 inside will be made, cause the adhesion of photic zone 34 to reduce, make photic zone 34 be easy to peel off, or, cause extraneous air or impurity to enter in the accommodation chamber 24 in conjunction with not close, and have influence on the quality of image sensor.

In view of this, the inventor be this in the spirit of keeping on improving, innovate breakthrough, put forth effort on the research and development of optical sensor encapsulation, and create the utility model optical sensor encapsulation improvement structure, can be convenient to make and improve and produce yield.

Summary of the invention

Main purpose of the present utility model is to provide a kind of optical sensor encapsulation improvement structure, and it has the effect of being convenient to make, to reach the purpose that reduces production costs.

Another purpose of the present utility model is to provide a kind of optical sensor encapsulation improvement structure, its make photic zone more firm, be attached on the flange layer hermetically, to reach the purpose that improves the production yield.

In order to achieve the above object, the technical solution adopted in the utility model is:

A kind of optical sensor encapsulation improvement structure is provided, it is characterized in that including:

One substrate, it is provided with a upper surface and a lower surface, and this upper surface is provided with the plurality of signals input, and this lower surface is provided with the plurality of signals output;

One flange layer, it is provided with a upper surface and a lower surface, and this lower surface system is arranged at the upper surface of this substrate, and is formed with an accommodation chamber with this substrate, and this upper surface is provided with a groove;

One optical sensing chip which is provided with a photosensitive area and is formed with a plurality of weld pads in this photosensitive area periphery, and it is to be arranged on the upper surface of this substrate, and is positioned at this accommodation chamber;

Plural wires, it is provided with one first end points and one second end points, and this first end points system is electrically connected on the weld pad of this optical sensing chip, and this second end points then is electrically connected on the signal input end of this substrate;

One mucigel, it is the upper surface of coating this flange layer, and is positioned at this groove; And

One photic zone, it is to be located on the upper surface of this flange layer, combines fixing with this flange layer by this mucigel.

And following characteristics:

This photic zone is a transparent glass.

This flange layer and this substrate are the one ejection formations.

This substrate is provided with a plurality of sheet metals, and this flange layer forms with injection molding method.

This this a plurality of sheet metals are exposed by the upper surface of this substrate, form this signal input end, and these a plurality of sheet metals expose by the lower surface of this substrate, form this signal output end.

This substrate and flange layer are plastic material.

Advantage of the present utility model and good effect are: by above structure, when coating this mucigel in the upper surface of flange layer and the groove, can strengthen the composition surface of this photic zone and this flange layer, make it in conjunction with more firm, it is more easy to make.

Description of drawings

The schematic diagram of the known optical sensor packaging structure of Fig. 1;

Fig. 2 first embodiment sectional exploded view of the present utility model;

Fig. 3 first embodiment assembled sectional view of the present utility model;

Fig. 4 second embodiment assembled sectional view of the present utility model.The piece number explanation

Substrate 40 flange layers 42

Optical sensing chip 44 plural wires 46

Mucigel 48 photic zones 50

Upper surface 52 lower surfaces 54

Signal input end 56 signal output ends 58

Printed circuit board (PCB) 60 sheet metals 61

62 lower surfaces 64, upper surface

Accommodation chamber 66 grooves 68

Photosensitive area 70 a plurality of weld pads 72

First end points, 74 second end points 76

Embodiment

Above-mentioned and other purpose, advantage and practical function of the present utility model are by the detailed description of following preferred embodiment and can more be understood in depth with reference to the accompanying drawings.

Please cooperate and consult Fig. 2 and Fig. 3, be sectional exploded view of the present utility model and assembled sectional view, it includes: a substrate 40, a flange layer 42, an optical sensing chip 44, plural wires 46, mucigel 48 and a photic zone 50.

Substrate 40 is provided with a upper surface 52 and a lower surface 54, and upper surface 52 is provided with plurality of signals input 56, and lower surface 54 is provided with plurality of signals output 58, puts on the printed circuit board (PCB) 60 in order to electrical connection, and signal is passed to printed circuit board (PCB).

Flange layer 42 is provided with a upper surface 62 and a lower surface 64, and lower surface 64 is the upper surface 52 that is arranged at substrate 40, and itself and substrate 40 are formed with an accommodation chamber 66, and upper surface 62 is provided with a groove 68.

Optical sensing chip 44 is provided with a photosensitive area 70 and is formed with a plurality of weld pads 72 in photosensitive area 70 peripheries, and it is to be arranged on the upper surface 52 of substrate 40, and is positioned at accommodation chamber 66.

Plural wires 46 is provided with one first end points 74 and one second end points 76, first end points 74 is the weld pad 72 that is electrically connected on optical sensing chip 44,76 of second end points are electrically connected on the signal input end 56 of substrate 40, make the signal of optical sensing chip 44 be passed to substrate 40 by plural wires 46.

Mucigel 48 is to coat on the upper surface 62 of flange layer 42, and is positioned at groove 68.And

Photic zone 50 is a transparent glass, and it is to be located on the upper surface 62 of flange layer 42, combines fixing with flange layer 42 by mucigel 48.

Be with, because mucigel 48 is not only coated the upper surface 62 of flange layer 42, and be positioned at flange layer 42 formed grooves 68, make when photic zone 50 and flange layer 42 stick together, can improve adhesion effectively, photic zone 50 is more firmly combined with flange layer 42, and can make accommodation chamber 66 more airtight, can improve the fine ratio of product and the reliability of product.

See also Fig. 4, substrate 40 includes a plurality of sheet metals 61 in the present embodiment, and these a plurality of sheet metals 61 are by the plastic material injection molding method it to be enveloped, and so promptly form substrate 40 and flange layer 42, in this way, the groove 68 of flange layer 42 will take shape in upper surface 62 naturally, in addition, these sheet metals are exposed by the upper surface of substrate 40, to form signal input end 56, these sheet metals are exposed by the lower surface of substrate 40, to form signal output end 58.

48 of mucigels are coated in the upper surface 62 and groove 68 of flange layer 42.

Photic zone 50 is to stick together by mucigel 48 to be fixed on the flange layer 42, makes optical sensing chip 44 can see through photic zone 50 and receives the light signal.

By above explanation, the utlity model has following advantage:

One, forms the groove 68 of a ccontaining mucigel 48 in the upper surface of flange layer 42,, make its adhesion more firm to increase the faying face of photic zone 50 and flange layer 42.

Two, the utility model can form flange layer 42 and groove 68 by injection molding method, and it is more easy to make.

The specific embodiment that this case is proposed in the detailed description of preferred embodiment is only in order to be easy to illustrate technology contents of the present utility model, be not with the utility model narrow sense be limited to embodiment, all many variations that situation is done enforcement according to intention spirit of the present utility model and claim thereof all belongs to scope of the present utility model.

Claims

1, a kind of optical sensor encapsulation improvement structure is characterized in that including:

2, optical sensor encapsulation improvement is constructed according to claim 1, it is characterized in that this photic zone is a transparent glass.

3, optical sensor encapsulation improvement is constructed according to claim 1, it is characterized in that this flange layer and this substrate are the one ejection formations.

4, as optical sensor encapsulation improvement structure as described in the claim 3, it is characterized in that this substrate is provided with a plurality of sheet metals, this flange layer forms with injection molding method.

5, as optical sensor encapsulation improvement structure as described in the claim 4, it is characterized in that this this a plurality of sheet metals are exposed by the upper surface of this substrate, form this signal input end, and these a plurality of sheet metals expose by the lower surface of this substrate, form this signal output end.

6, optical sensor encapsulation improvement is constructed according to claim 1, it is characterized in that this substrate and flange layer are plastic material.