CN100350620C - Image sensor and sealing method thereof - Google Patents
Image sensor and sealing method thereof Download PDFInfo
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- CN100350620C CN100350620C CNB03136375XA CN03136375A CN100350620C CN 100350620 C CN100350620 C CN 100350620C CN B03136375X A CNB03136375X A CN B03136375XA CN 03136375 A CN03136375 A CN 03136375A CN 100350620 C CN100350620 C CN 100350620C
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- upper strata
- intermediate plate
- sheet metal
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- sheet
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- Solid State Image Pick-Up Elements (AREA)
Abstract
The present invention relates to an image sensor and a package method, which is proposed in order to provide a sensor with high package reliability, good radiation effect, high fixed stability, convenient lead-wire bonding, and high good rate for products, and a package method thereof. The image sensor comprises a lower and an upper layers of metal sheet groups, a glue packing body covering the lower and the upper layers of metal sheet groups, an image sensing wafer, a plurality of conducting wires, and a euphotic layer, and the lower and the upper layers of metal sheet groups respectively comprise a plurality of lower layers of metal which is mutually arranged at intervals and has the upper and the lower surfaces, an upper layer of sheet metals correspondingly overlapped on a lower layer of metal sheets, a lower layer of intermediate boards, and an upper layer of intermediate boards which are overlapped on the lower layer of intermediate boards and can contain an image sensing wafer. The package method comprises the following steps that the lower and the upper layers of metal sheet groups respectively comprising a plurality of lower and the upper layers of metal sheets which are mutually arranged at intervals and the lower and the upper layers of metal sheet groups of the lower and the upper layers of intermediate boards are provided; the glue packing body is formed; the image sensing wafer is arranged on the upper layer of intermediate boards; the conducting wires are provided for the lead-wire bonding, and the euphotic layer is arranged.
Description
Technical field
The invention belongs to sensor and method for packing thereof, particularly a kind of image sensor and method for packing thereof.
Background technology
As shown in Figure 1, known image sensor comprises substrate 10, flange layer 18, image sensing wafer 22, several wires 24 and photic zone 26.
The sheet metal 12 that substrate 10 is arranged by several spaces is formed, and several sheet metals 12 form first plate 14 and second plate 16 of differing heights.
Though known image sensor really can reach its creation purpose and effect, precisely because still there is following defective:
When 1, making, owing to sheet metal 12 must be bent into first plate 14 and second plate 16 of differing heights, will cause first plate 14 smooth inadequately, make when going between the bonding processing procedure, lead 24 can't successfully be followed on sheet metal 12, so that influence its yield.
Can't stamp out the bigger sheet metal of thickness 12 during 2, because of manufacturing, make second plate, 16 thin thickness of sheet metal 12, so in soldering (SMT) process, scolding tin can't be in the side climbing of sheet metal 12 second plates 16, so that have influence on the stability that packaging body is fixed in printed circuit board (PCB).
3, the bottom surface of image sensing wafer 22 is all sealed by flange layer 18, so failed better heat radiating effect.
Summary of the invention
The purpose of this invention is to provide a kind of image sensor and method for packing thereof that improves encapsulation reliability, good heat dissipation effect, raising fixing-stable degree, the bonding of being convenient to go between, improves the product yield.
Image sensor of the present invention comprises lower metal sheet group, upper strata sheet metal group, adhesive body, image sensing wafer, several wires and photic zone; Lower metal sheet group comprises that the lower metal sheet that arranges several spaces and contour correspondence be located at the lower floor's intermediate plate between several lower metal sheets; Each lower metal sheet is provided with upper surface and lower surface; Lower floor's intermediate plate is provided with upper surface and lower surface; Upper strata sheet metal group comprises that the upper strata sheet metal that arranges several spaces and contour correspondence be located at the upper strata intermediate plate between several upper strata sheet metals; Each upper strata sheet metal is provided with the lower surface on upper surface and the corresponding upper surface that is stacked at the lower metal sheet; The upper strata intermediate plate is provided with the lower surface on upper surface and the corresponding upper surface that is stacked at lower floor's intermediate plate; Adhesive body envelopes several lower metal sheets, lower floor's intermediate plate, several upper strata sheet metals and upper strata intermediate plate, and the upper surface of each upper strata sheet metal is exposed by adhesive body, the lower surface of each lower metal sheet is exposed by adhesive body, and the upper surface of the lower surface of lower floor's intermediate plate and upper strata intermediate plate is exposed by adhesive body; Adhesive body forms flange layer in the upper surface periphery of several upper strata sheet metals, so that itself and several upper strata sheet metal constitutes accommodation chamber; Image sensing wafer is arranged on the upper surface of upper strata intermediate plate and is positioned at accommodation chamber; Several wires is electrically connected the upper surface of image sensing wafer and upper strata sheet metal; Photic zone is covered on the adhesive body flange layer to cover image sensing wafer.
Image sensor package method of the present invention comprises the steps:
Step 1
Upper and lower layer sheet metal group is provided; Lower metal sheet group comprises that the lower metal sheet that arranges several spaces and contour correspondence be located at the lower floor's intermediate plate between several lower metal sheets; Each lower metal sheet is provided with upper surface and lower surface, and lower floor's intermediate plate is provided with upper surface and lower surface; Upper strata sheet metal group comprises that the upper strata sheet metal that arranges several spaces and contour correspondence be located at the upper strata intermediate plate between several upper strata sheet metals, each upper strata sheet metal is provided with upper surface and lower surface, upper strata sheet metal lower surface is corresponding to be stacked on the upper surface of lower metal sheet, the upper strata intermediate plate is provided with upper surface and lower surface, the corresponding upper surface that is stacked at lower floor's intermediate plate of the lower surface of upper strata intermediate plate.
Step 2
Form adhesive body and stick together several lower metal sheets, lower floor's intermediate plate, several upper strata sheet metals and upper strata intermediate plate with coating, and the upper surface of each upper strata sheet metal is exposed by adhesive body, the lower surface of each lower metal sheet is exposed by adhesive body, and the upper surface of the lower surface of lower floor's intermediate plate and upper strata intermediate plate is exposed by adhesive body; Adhesive body forms flange layer in the upper surface periphery of several upper strata sheet metals, and makes itself and several upper strata sheet metal constitute accommodation chamber.
Image sensing wafer is provided and is arranged on the upper surface of upper strata intermediate plate and is positioned at accommodation chamber;
Several wires is provided, and each lead is electrically connected the upper surface of image sensing wafer and upper strata sheet metal.
Step 5
Photic zone is provided and is covered on the flange layer of adhesive body, so that image sensing wafer is enveloped.
Wherein:
Adhesive body is industrial plastic material; Flange layer and adhesive body are one-body molded.
Photic zone is a transparent glass.
Adhesive body is industrial plastic material in the step 2; Flange layer and adhesive body are one-body molded.
Because image sensor of the present invention comprises upper and lower layer sheet metal group, form adhesive body, the image sensing wafer that is positioned at accommodation chamber, the several wires that constitutes the accommodation chamber flange layer and be covered on photic zone on the flange layer; Upper and lower layer sheet metal group comprises upper and lower layer sheet metal and the upper and lower layer intermediate plate that arrange several spaces respectively; Each upper and lower layer sheet metal, upper and lower layer intermediate plate are respectively equipped with upper and lower surface; Each upper strata sheet metal and upper strata intermediate plate are with the corresponding upper surface that is stacked at lower metal sheet and lower floor's intermediate plate of its lower surface; Adhesive body envelopes several upper and lower layer sheet metals and upper and lower layer intermediate plate, and the upper and lower surface of each upper and lower layer sheet metal and the upper and lower surface of upper and lower layer intermediate plate are exposed by adhesive body; Image sensing wafer is arranged at the upper surface of upper strata intermediate plate; Several wires is electrically connected the upper surface of image sensing wafer and upper strata sheet metal; Method for packing comprises provides upper and lower layer sheet metal group; Upper and lower layer sheet metal group comprises upper and lower layer sheet metal and the upper and lower layer intermediate plate that arrange several spaces respectively; Upper strata sheet metal and upper strata intermediate plate lower surface be corresponding to be stacked on the upper surface of lower metal sheet and lower floor's intermediate plate; Form and coat the adhesive body that sticks together several upper and lower layer sheet metals and upper and lower layer intermediate plate, and the upper surface of each upper strata sheet metal, upper strata intermediate plate and lower metal sheet, upper strata intermediate plate is exposed by adhesive body; Image sensing wafer is provided and is arranged on the upper surface of upper strata intermediate plate and is positioned at accommodation chamber; Several wires is provided, and each lead is electrically connected the upper surface of image sensing wafer and upper strata sheet metal; Photic zone is provided and is covered on the flange layer of adhesive body.Several upper and lower layer sheet metals that constitute upper and lower layer sheet metal group are by two dull and stereotyped formation, and have evenness preferably, therefore, and the carrying out of its bonding operation of can being convenient to go between and can improve the encapsulation yield of product; The folded upper and lower layer sheet metal of establishing formed higher thickness, and therefore, when the image sensor soldering was on printed circuit board (PCB), scolding tin can be climbed on the sheet metal of upper strata by the lower metal sheet, made image sensor more firmly be fixed on the printed circuit board (PCB); Image sensing wafer is located on the upper surface of upper strata intermediate plate, and the lower surface of upper strata intermediate plate is stacked at the upper surface of lower floor's intermediate plate, the lower surface of lower floor's intermediate plate is exposed by adhesive body, so the heat that image sensing wafer is produced can be spread with heat radiation by the lower surface of lower floor's intermediate plate, thereby can reach better heat radiating effect.Not only improve encapsulation reliability, good heat dissipation effect, raising fixing-stable degree, and the bonding of being convenient to go between, improve the product yield, thereby reach purpose of the present invention.
Description of drawings
Fig. 1, be known image sensor structure schematic sectional view.
Fig. 2, for image sensor structure schematic sectional view of the present invention.
Fig. 3, be image sensor package method step 1 of the present invention, two schematic diagrames.
Fig. 4, be image sensor package method step 3 of the present invention, four schematic diagrames.
Embodiment
As shown in Figure 2, image sensor of the present invention comprises lower metal sheet group 3, upper strata sheet metal group 4, adhesive body 34, image sensing wafer 36, several wires 38 and photic zone 40.
Lower metal sheet group 3 comprises that the lower metal sheet 30 that arranges several spaces and contour correspondence be located at the lower floor's intermediate plate 50 between several lower metal sheets; Each lower metal sheet 30 is for being provided with the flat board of upper surface 42 and lower surface 44, and the lower surface 44 of lower metal sheet 30 welds in soldering (SMT) mode by scolding tin 60 and is located on the printed circuit board (PCB) 58; Lower floor's intermediate plate 50 is provided with upper surface 51 and lower surface 52.
Upper strata sheet metal group 4 comprises that the upper strata sheet metal 32 that arranges several spaces and contour correspondence be located at the upper strata intermediate plate 62 between several upper strata sheet metals; Each upper strata sheet metal 32 is for being provided with the flat board of upper surface 46 and lower surface 48, and the lower surface of upper strata sheet metal 32 48 is corresponding to be stacked on the upper surface 42 of lower metal sheet 30; Upper strata intermediate plate 62 is provided with upper surface 63 and lower surface 64, and the lower surface of upper strata intermediate plate 62 64 is corresponding to be stacked on the upper surface 51 of lower floor's intermediate plate 50.
Image sensor package method of the present invention comprises the steps:
Step 1
Upper and lower layer sheet metal group 3,4 is provided
As shown in Figure 3, lower metal sheet group 3 comprises that the lower metal sheet 30 that arranges several spaces and contour correspondence be located at the lower floor's intermediate plate 50 between several lower metal sheets 30; Each lower metal sheet 30 is provided with upper surface 42 and lower surface 44, and lower floor's intermediate plate 50 is provided with upper surface 51 and lower surface 52.
Upper strata sheet metal group 4 comprises that the upper strata sheet metal 32 that arranges several spaces and contour correspondence be located at the upper strata intermediate plate 62 between several upper strata sheet metals 32; Each upper strata sheet metal 32 is provided with upper surface 46 and lower surface 48, sheet metal 32 lower surfaces 48 in upper strata are corresponding to be stacked on the upper surface 42 of lower metal sheet 30, upper strata intermediate plate 62 is provided with upper surface 63 and lower surface 64, the lower surface 64 corresponding upper surfaces 51 that are stacked at lower floor's intermediate plate 50 of upper strata intermediate plate 62.
Step 2
Form adhesive body 34
As shown in Figure 3, with industrial plastic cement is that material forms the adhesive body 34 that several lower metal sheets 30, lower floor's intermediate plate 50, several upper strata sheet metals 32 and upper strata intermediate plate 62 are sticked together in coating by injection molding method, and the upper surface 46 of each upper strata sheet metal 32 is exposed by adhesive body 34, the lower surface 44 of each lower metal sheet 30 is exposed by adhesive body 34, and the lower surface 52 of lower floor's intermediate plate 50 and the upper surface 63 of upper strata intermediate plate 62 are exposed by adhesive body 34; Adhesive body 34 forms flange layer 54 in upper surface 46 peripheries of several upper strata sheet metals 32, and makes itself and several upper strata sheet metal 32 constitute accommodation chamber 56.
As shown in Figure 4, image sensing wafer 36 is provided and it is arranged on the upper surface 63 of upper strata intermediate plate 62, and be positioned at accommodation chamber 56.
The lead-in wire bonding
Step 5
The photic zone 40 that can be transparent glass is provided, and it is covered on the flange layer 54 of adhesive body 34, use covering image sensing wafer 36, receive the light signal so that image sensing wafer 36 can see through photic zone 40.
As mentioned above, the present invention has following advantage:
1, several upper and lower layer sheet metals 32,30 that constitute upper and lower layer sheet metal group 3,4 have upper and lower surperficial 42,44,46,48 flat board by two and form, and has evenness preferably, therefore, the carrying out of its bonding operation of can being convenient to go between and can improve the encapsulation yield of product.
2, the folded upper and lower layer sheet metal of establishing 32,30 formed higher thickness, therefore, when the image sensor soldering was on printed circuit board (PCB) 58, scolding tin 60 can be climbed on upper strata sheet metal 32 by lower metal sheet 30, and image sensor more firmly is fixed on the printed circuit board (PCB) 58.
3, image sensing wafer 36 is located on the upper surface 63 of upper strata intermediate plate 62, and the lower surface 64 of upper strata intermediate plate 62 is stacked at the upper surface 51 of lower floor's intermediate plate 50, the lower surface 52 of lower floor's intermediate plate 50 is exposed by adhesive body 34, so can make heat that image sensing wafer 36 produces by lower surface 52 diffusions of lower floor's intermediate plate 50 with heat radiation, thereby can reach better heat radiating effect.
Claims (5)
1, a kind of image sensor, it comprises the sheet metal group, coat and to stick together the sheet metal group and form the several wires of the adhesive body that constitutes the accommodation chamber flange, the image sensing wafer that is positioned at accommodation chamber, electrical connection image sensing wafer and sheet metal group upper surface and be covered on the adhesive body flange layer to cover the photic zone of image sensing wafer; It is characterized in that described sheet metal group comprises lower metal sheet group and upper strata sheet metal group; Lower metal sheet group comprises that the lower metal sheet that arranges several spaces and contour correspondence be located at the lower floor's intermediate plate between several lower metal sheets; Each lower metal sheet is provided with upper surface and lower surface; Lower floor's intermediate plate is provided with upper surface and lower surface; Upper strata sheet metal group comprises that the upper strata sheet metal that arranges several spaces and contour correspondence be located at the upper strata intermediate plate between several upper strata sheet metals; Each upper strata sheet metal is provided with the lower surface on upper surface and the corresponding upper surface that is stacked at the lower metal sheet; The upper strata intermediate plate is provided with the lower surface on upper surface and the corresponding upper surface that is stacked at lower floor's intermediate plate; Adhesive body envelopes several lower metal sheets, lower floor's intermediate plate, several upper strata sheet metals and upper strata intermediate plate, and the upper surface of each upper strata sheet metal is exposed by adhesive body, the lower surface of each lower metal sheet is exposed by adhesive body, and the upper surface of the lower surface of lower floor's intermediate plate and upper strata intermediate plate is exposed by adhesive body; Adhesive body forms flange layer in the upper surface periphery of several upper strata sheet metals, so that itself and several upper strata sheet metal constitutes accommodation chamber; The image sensing wafer that is positioned at accommodation chamber is arranged on the upper surface of upper strata intermediate plate; Several wires is electrically connected the upper surface of image sensing wafer and upper strata sheet metal.
2, image sensor according to claim 1 is characterized in that described adhesive body is industrial plastic material; Flange layer and adhesive body are one-body molded.
3, image sensor according to claim 1 is characterized in that described photic zone is a transparent glass.
4, a kind of image sensor package method, it comprises the steps:
Step 1
The sheet metal group is provided;
Step 2
Form and cover the sheet metal group and form the adhesive body that constitutes the accommodation chamber flange layer;
Step 3
Image sensing wafer is provided and is positioned at accommodation chamber;
Step 4
Several wires is provided, and each lead is electrically connected image sensing wafer and sheet metal group;
Step 5
Photic zone is provided and is covered on the flange layer of adhesive body, so that image sensing wafer is enveloped;
It is characterized in that described step 1 provides upper and lower layer sheet metal group; Lower metal sheet group comprises that the lower metal sheet that arranges several spaces and contour correspondence be located at the lower floor's intermediate plate between several lower metal sheets; Each lower metal sheet is provided with upper surface and lower surface, and lower floor's intermediate plate is provided with upper surface and lower surface; Upper strata sheet metal group comprises that the upper strata sheet metal that arranges several spaces and contour correspondence be located at the upper strata intermediate plate between several upper strata sheet metals, each upper strata sheet metal is provided with upper surface and lower surface, upper strata sheet metal lower surface is corresponding to be stacked on the upper surface of lower metal sheet, the upper strata intermediate plate is provided with upper surface and lower surface, the corresponding upper surface that is stacked at lower floor's intermediate plate of the lower surface of upper strata intermediate plate; The adhesive body that forms in the step 2 coats and sticks together several lower metal sheets, lower floor's intermediate plate, several upper strata sheet metals and upper strata intermediate plate, and the upper surface of each upper strata sheet metal is exposed by adhesive body, the lower surface of each lower metal sheet is exposed by adhesive body, and the upper surface of the lower surface of lower floor's intermediate plate and upper strata intermediate plate is exposed by adhesive body; Adhesive body forms flange layer in the upper surface periphery of several upper strata sheet metals, and makes itself and several upper strata sheet metal constitute accommodation chamber; The image sensing wafer that is positioned at accommodation chamber in the step 3 is arranged on the upper surface of upper strata intermediate plate; Several wires is electrically connected the upper surface of image sensing wafer and upper strata sheet metal in the step 4.
5, image sensor package method according to claim 4 is characterized in that adhesive body is industrial plastic material in the described step 2; Flange layer and adhesive body are one-body molded.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB03136375XA CN100350620C (en) | 2003-06-03 | 2003-06-03 | Image sensor and sealing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB03136375XA CN100350620C (en) | 2003-06-03 | 2003-06-03 | Image sensor and sealing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1553510A CN1553510A (en) | 2004-12-08 |
| CN100350620C true CN100350620C (en) | 2007-11-21 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB03136375XA Expired - Fee Related CN100350620C (en) | 2003-06-03 | 2003-06-03 | Image sensor and sealing method thereof |
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| Country | Link |
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| CN (1) | CN100350620C (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1359153A (en) * | 2000-12-11 | 2002-07-17 | 胜开科技股份有限公司 | packaged video image sensitive chip and peackaging method |
| JP2002368950A (en) * | 2001-05-23 | 2002-12-20 | Kingpak Technology Inc | Stacked package structure for image sensor |
| CN2631044Y (en) * | 2003-06-03 | 2004-08-04 | 胜开科技股份有限公司 | Image sensor |
-
2003
- 2003-06-03 CN CNB03136375XA patent/CN100350620C/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1359153A (en) * | 2000-12-11 | 2002-07-17 | 胜开科技股份有限公司 | packaged video image sensitive chip and peackaging method |
| JP2002368950A (en) * | 2001-05-23 | 2002-12-20 | Kingpak Technology Inc | Stacked package structure for image sensor |
| CN2631044Y (en) * | 2003-06-03 | 2004-08-04 | 胜开科技股份有限公司 | Image sensor |
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| Publication number | Publication date |
|---|---|
| CN1553510A (en) | 2004-12-08 |
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Granted publication date: 20071121 |