CN1359153A - packaged video image sensitive chip and peackaging method - Google Patents
packaged video image sensitive chip and peackaging method Download PDFInfo
- Publication number
- CN1359153A CN1359153A CN 00134542 CN00134542A CN1359153A CN 1359153 A CN1359153 A CN 1359153A CN 00134542 CN00134542 CN 00134542 CN 00134542 A CN00134542 A CN 00134542A CN 1359153 A CN1359153 A CN 1359153A
- Authority
- CN
- China
- Prior art keywords
- wafer
- sheet metal
- image sensing
- bearing part
- sensing wafer
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Abstract
The packaged image sensing wafer includes wafer, metal slices electrically connected with wafer and arranged at a certain gap space and transparent colloidal matter for covering all the metal slices, wafer and filling gap, and its packaging method includes the following step: on the adhesive tape the spacing-arranged metal slices, first surface for electrically-connecting wafer and metals slices and transparent colloidal matter for covering metal slices and wafer and filling the gaps between the metal slices are stuck. Said invented packaged image sensing wafer can shorten wafer signal transfer distance and raise signal transfer quality.
Description
The invention belongs to packaging semiconductor and method for packing thereof, particularly a kind of encapsulation image sensing wafer and method for packing thereof.
General image sensing wafer is in order to reach the demand of heat radiation and high leakproofness, system is with the base material of ceramic material as bearing wafer, the base material periphery is formed with horizontal Jiong (Contraband) the shape pin of mutual conduction, wafer is placed on the base material, be electrically connected the pin of wafer and base material again with lead, the glass with printing opacity is placed on the wafer then, to finish the encapsulation of encapsulation image sensing wafer, so, the encapsulation image sensing wafer that encapsulation can be finished is electrically connected with circuit board formation with the pin of base material lower surface.
This kind during its machine-shaping, must be noted that the selection of ceramic material composition and the control of processing temperature with the base material of ceramic material as the encapsulation image sensing wafer, if its selection or control improperly will cause base material distortion or be full of cracks.Moreover,, can't produce in a large number, so that its production cost is quite high so that when encapsulation must single encapsulation because the ceramic base material structure can't be cut.
Moreover because the pin of base material lower surface system is in order to be electrically connected with circuit board, therefore, pin must have more smooth contact-making surface, just unlikelyly influences being electrically connected of base material and circuit board.Yet horizontal Jiong (Contraband) shape that known pin system forms with impact style is with the pin as the upper and lower surface of base material, so it influences the transmission of image sensing wafer signal because of being difficult to obtain comparatively smooth pin.
In addition, it is longer that the formed electric signal of this horizontal Jiong (Contraband) shape pin transmits distance, also influences the signal transmission of wafer to base material.
Moreover this encapsulation image sensing wafer must be covered on the wafer with transparent glass when encapsulation, and the light signal of wafer is appeared by transparent glass, comparatively inconvenience in its encapsulation.
The purpose of this invention is to provide a kind ofly produce in batches, cost is low, shorten the wafer signal transmits distance, improves encapsulation image sensing wafer and method for packing thereof that signal transmits quality.
The present invention encapsulates the transparent colloid that image sensing wafer comprises wafer, most sheet metal and printing opacity; Sheet metal has as the first surface of signal input end and as the second surface of signal output end; The gap that isolates to form is arranged in most sheet metals space; Wafer forms with the first surface of each sheet metal and is electrically connected; Transparent colloid covers each sheet metal first surface and wafer, and clogs in the gap between each sheet metal.
The present invention encapsulates the image sensing wafer method for packing and comprises the steps:
Step 1
Row are established sheet metal
Have first and second surperficial sheet metal space with most and arrange on the adhesive tape that is attached to the ccontaining wafer holding area of formation, form the gap that isolates between each sheet metal; The hollow out mould is arranged on the adhesive tape, and makes most sheet metals be positioned at the hollow out mould.
Step 2
Connecting wafer and sheet metal
The wafer that is provided with a plurality of weld pads is placed the holding area of adhesive tape, and be electrically connected with the sheet metal first surface with weld pad;
Step 3
Cover transparent colloid
The perspex material is poured in the mould, form to coat most sheet metals, wafer and to clog transparent colloid in the gap between each sheet metal;
Step 4
Take out the present invention and encapsulate image sensing wafer
Remove adhesive tape, will in mould, take out the present invention and encapsulate image sensing wafer.
Wherein:
Sheet metal is smooth sheet metal.
Wafer is electrically connected with the sheet metal first surface with the lead that the routing mode forms.
Wafer is located on the bearing part; Form the gap that isolates between bearing part and the sheet metal; The transparent colloid that covers each sheet metal, lead and wafer is clogged in the gap between each sheet metal and bearing part, uses each sheet metal and bearing part is fixed and form electrical isolation.
Bearing part is a metal material, and it is and each sheet metal one die cast.
The weld pad of the lead connecting wafer that forms in the routing mode in the step 2 and sheet metal first surface.
Adhesive tape is provided with the holding area of putting bearing part.
Bearing part is one-body molded with most sheet metals.
Because the present invention encapsulates image sensing wafer and comprises that wafer, majority have the transparent colloid of first and second surperficial sheet metal and printing opacity; Each sheet metal is arranged with clearance gap; Wafer forms with the first surface of each sheet metal and is electrically connected; Transparent colloid covers each sheet metal first surface and wafer, and clogs in the gap between each sheet metal; Its method for packing is included in to stick together at interval on the adhesive tape and is listed as the transparent colloid of establishing sheet metal, be electrically connected wafer and sheet metal first surface and cover coating most sheet metals, wafer and clog in the gap between each sheet metal.During use, the signal that makes wafer by foil transmits media, when the signal with wafer is passed to circuit board, can obtain short transmission distance, having preferable signal transmission effect, and make the second surface of sheet metal form preferable electro-contact effect with circuit board; During encapsulation, can irritate a plurality of base materials of mould simultaneously, be cut into single encapsulation image sensing wafer again, simplify processing procedure; Not only can produce in batches, cost is low, and shorten the wafer signal and transmit distance, improve signal and transmit quality, thereby reach purpose of the present invention.
Fig. 1, encapsulate image sensing wafer structural representation cutaway view for the present invention.
Fig. 2, encapsulate image sensing wafer method for packing step 1 schematic sectional view for the present invention.
Fig. 3, encapsulate image sensing wafer method for packing step 2 schematic sectional view for the present invention.
Fig. 4, encapsulate image sensing wafer method for packing step 3 schematic sectional view for the present invention.
Below in conjunction with accompanying drawing the present invention is further elaborated.
As shown in Figure 1, the present invention encapsulates image sensing wafer and comprises most sheet metals 10, bearing part 20, is located at the wafer 18 on the bearing part 20 and the transparent colloid 26 of printing opacity.
Bearing part 20 is a metal material, and it is and each sheet metal 10 one die cast that most sheet metals 10 are arranged with bearing part 20 spaces and are provided with, and form the gap 24 that isolates between each sheet metal 10 and between each sheet metal 10 and the bearing part 20.
Wafer 18 is provided with plural weld pad 16.
During use, the present invention is encapsulated image sensing wafer place on the circuit board, and be electrically connected with circuit board formation with each sheet metal 10 second surface 14.During operation, can make light be passed to wafer 18 by transparent colloid 26, make wafer 18 be received the light signal, and signal is passed to the first surface 12 of sheet metal 10 as input through its weld pad 16 and lead 22, and through second surface 14 outputs of sheet metal 10 as output.
The present invention encapsulates the image sensing wafer method for packing and comprises the steps:
Step 1
Row are established sheet metal
As shown in Figure 2, at first most the sheet metal 10 spaces arrangements with first surface 12, second surface 14 are attached on the adhesive tape (tape) 28, with holding bearing part 20 glutinous the placing in the holding area 30 of adhesive tape 28 of establishing wafer 18, form the gap 24 that isolates between each sheet metal 10 and between each sheet metal 10 and the bearing part 20; Hollow out mould 32 is arranged on the adhesive tape (tape) 28, and makes most sheet metals 10 and bearing part 20 be positioned at hollow out mould 32.
Step 2
Connecting wafer and sheet metal
As shown in Figure 3, the wafer 18 that will be provided with a plurality of weld pads (bonding pad) 16 places on the bearing part (carrier) 20 that is arranged at adhesive tape 28 holding areas 30, form the lead 22 that is electrically connected wafer 18 weld pads 16 and sheet metal 10 first surfaces 12 in the routing mode then, the signal of using wafer 18 is passed to the first surface 12 of sheet metal 10 as input, so that as the second surface 14 of output signal is passed to circuit board through sheet metal 10.
Step 3
Cover transparent colloid
As shown in Figure 4, the perspex material is poured in the mould 32, with form to coat most sheet metals 12, lead 22, wafer 18 and clog between each sheet metal 10 and each sheet metal 10 and bearing part 20 between gap 24 in transparent colloid 26.
Step 4
Take out the present invention and encapsulate image sensing wafer
Remove adhesive tape 28, in mould 32, take out the present invention and encapsulate image sensing wafer
As mentioned above, the present invention encapsulates image sensing wafer and method for packing has following advantage:
1, makes the signal transmission media of wafer 18 by foil 10, when the signal with wafer 18 is passed to circuit board, can obtains short transmission distance, thereby have preferable signal transmission effect.
2, sheet metal 10 has smooth second surface 14, can form preferable electro-contact effect with circuit board.
3, can irritate a plurality of base materials of mould simultaneously, be cut into single encapsulation image sensing wafer again, therefore, its package speed is fast, can reduce production costs.
4, the transparent colloid 26 that is shaped with the perfusion of perspex material, its cost of material is low than ceramic material, and packaging cost is greatly reduced.
5, replace transparent glass with transparent colloid 26, can simplify the processing procedure that covers transparent glass, and form base material the transparent colloid that constitutes of perfusion perspex material 26 time, packaging cost is greatly reduced.
Claims (9)
1, a kind of encapsulation image sensing wafer, it comprises wafer; It is characterized in that it also comprises the transparent colloid of most sheet metals and printing opacity; Sheet metal has as the first surface of signal input end and as the second surface of signal output end; The gap that isolates to form is arranged in most sheet metals space; Wafer forms with the first surface of each sheet metal and is electrically connected; Transparent colloid covers each sheet metal first surface and wafer, and clogs in the gap between each sheet metal.
2, encapsulation image sensing wafer according to claim 1 is characterized in that described sheet metal is smooth sheet metal.
3, encapsulation image sensing wafer according to claim 1 is characterized in that described wafer is electrically connected with the sheet metal first surface with the lead that the routing mode forms.
4, encapsulation image sensing wafer according to claim 1 is characterized in that described wafer is located on the bearing part; Form the gap that isolates between bearing part and the sheet metal; The transparent colloid that covers each sheet metal, lead and wafer is clogged in the gap between each sheet metal and bearing part, uses each sheet metal and bearing part is fixed and form electrical isolation.
5, encapsulation image sensing wafer according to claim 4 is characterized in that described bearing part is a metal material, and it is and each sheet metal one die cast.
6, a kind of encapsulation image sensing wafer method for packing is characterized in that it comprises the steps:
Step 1
Row are established sheet metal
Have first and second surperficial sheet metal space with most and arrange on the adhesive tape that is attached to the ccontaining wafer holding area of formation, form the gap that isolates between each sheet metal; The hollow out mould is arranged on the adhesive tape, and makes most sheet metals be positioned at the hollow out mould.
Step 2
Connecting wafer and sheet metal
The wafer that is provided with a plurality of weld pads is placed the holding area of adhesive tape, and be electrically connected with the sheet metal first surface with weld pad;
Step 3
Cover transparent colloid
The perspex material is poured in the mould, form to coat most sheet metals, wafer and to clog transparent colloid in the gap between each sheet metal;
Step 4
Take out the present invention and encapsulate image sensing wafer
Remove adhesive tape, will in mould, take out the present invention and encapsulate image sensing wafer.
7, encapsulation image sensing wafer method for packing according to claim 6 is characterized in that the weld pad and the sheet metal first surface of the lead connecting wafer that forms in the routing mode in the described step 2.
8, encapsulation image sensing wafer method for packing according to claim 6 is characterized in that described adhesive tape is provided with the holding area of putting bearing part.
9, encapsulation image sensing wafer method for packing according to claim 8 is characterized in that described bearing part is for one-body molded with most sheet metals.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB001345427A CN1152429C (en) | 2000-12-11 | 2000-12-11 | packaged video image sensitive chip and peackaging method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB001345427A CN1152429C (en) | 2000-12-11 | 2000-12-11 | packaged video image sensitive chip and peackaging method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1359153A true CN1359153A (en) | 2002-07-17 |
| CN1152429C CN1152429C (en) | 2004-06-02 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB001345427A Expired - Fee Related CN1152429C (en) | 2000-12-11 | 2000-12-11 | packaged video image sensitive chip and peackaging method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1152429C (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1306575C (en) * | 2003-01-17 | 2007-03-21 | 胜开科技股份有限公司 | Method for packaging image sensor by injection moulding |
| CN100350621C (en) * | 2003-06-03 | 2007-11-21 | 胜开科技股份有限公司 | Image sensor mould set and producing method thereof |
| CN100350620C (en) * | 2003-06-03 | 2007-11-21 | 胜开科技股份有限公司 | Image sensor and sealing method thereof |
| CN100355079C (en) * | 2003-06-03 | 2007-12-12 | 胜开科技股份有限公司 | Image sensor and sealing method thereof |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101562175B (en) * | 2008-04-18 | 2011-11-09 | 鸿富锦精密工业（深圳）有限公司 | Image sensor encapsulating structure and imaging device applied thereof |
-
2000
- 2000-12-11 CN CNB001345427A patent/CN1152429C/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1306575C (en) * | 2003-01-17 | 2007-03-21 | 胜开科技股份有限公司 | Method for packaging image sensor by injection moulding |
| CN100350621C (en) * | 2003-06-03 | 2007-11-21 | 胜开科技股份有限公司 | Image sensor mould set and producing method thereof |
| CN100350620C (en) * | 2003-06-03 | 2007-11-21 | 胜开科技股份有限公司 | Image sensor and sealing method thereof |
| CN100355079C (en) * | 2003-06-03 | 2007-12-12 | 胜开科技股份有限公司 | Image sensor and sealing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1152429C (en) | 2004-06-02 |
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