CN1835211A - Circuit board of electronic device and mfg method thereof - Google Patents

Circuit board of electronic device and mfg method thereof Download PDF

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Publication number
CN1835211A
CN1835211A CNA2005101327789A CN200510132778A CN1835211A CN 1835211 A CN1835211 A CN 1835211A CN A2005101327789 A CNA2005101327789 A CN A2005101327789A CN 200510132778 A CN200510132778 A CN 200510132778A CN 1835211 A CN1835211 A CN 1835211A
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conductor
insulator
circuit board
assembly
conductive layer
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CNA2005101327789A
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王忠诚
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Individual
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L24/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H01L2224/48228—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item the bond pad being disposed in a recess of the surface of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/49105—Connecting at different heights
    • H01L2224/49109—Connecting at different heights outside the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1517—Multilayer substrate
    • H01L2924/15172—Fan-out arrangement of the internal vias
    • H01L2924/15174—Fan-out arrangement of the internal vias in different layers of the multilayer substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress

Abstract

Structure of the disclosed circuit board includes an insulator and a first conductor. The insulator possesses a first up surface, a first low surface and a broadside. The first conductor possesses a first up surface, a first low surface and a broadside. The insulator clothes the first conductor so that at least part of first broadside of the first conductor is built in the insulator; at least part of first up surface of the first conductor is protruded and exposed out of the first up surface of the insulator; and at least part of first low surface of the first conductor is exposed out of the first low surface of the insulator. The first conductor is not prepared from conductive paste, using characteristic of solid conductor, the invention prevents rimose phenomena happened in conductive path on general circuit board. The invention increases reliability and saves materials.

Description

The circuit board of electronic installation and manufacture method
Technical field
The present invention relates to a kind of circuit board and use the electronic installation that this circuit board is made, be meant a kind of circuit board and manufacture method that improves the product quality reliability and save the electronic installation of material especially.
Background technology
As shown in figure 18, for practising formula electronic installation 9, it comprises: a circuit board 1, has an insulator 30, one first conductor 7, second conductor 8 and a conductive path 5, wherein, insulator 30 has first upper surface 31, first lower surface 32 and accommodation space 14, accommodation space 14 is positioned at insulator 30 first upper surfaces 31, first conductor 7 is located on accommodation space 14 peripheries, 8 of second conductors are arranged at circuit board 1 first lower surface 32, by conductive path 5 with first, two conductors 7,8 electrical communication make electrically and can be transferred to first lower surface 32 from insulator 30 first upper surfaces 31.Conductive path 5 has the through hole 6 of a hollow form, one filler 43 is filled in the through hole 6, to increase the intensity of conductive path 5, wherein, first conductor 7 and second conductor 8 can be considered the extension of conductive path 5, so, conductive path 5 just can by first and second conductor 7,8 respectively insulator 30 first upper and lower surperficial 31,32 on extend, and filler 43 can be insulating cement or conductive paste materials such as (Conductivepaste), wherein, conductive paste can be by being the paste conductive materials made of main material with tin (Tin) or being made by other paste conductive materials.One chip 20 is arranged at circuit board 1 accommodation space 14, one electric-conductors 60 and is embodied as conductor wire, engages with chip 20, first conductor 7 respectively, makes chip 20 and first conductor, 7 electrical communication.One packaging body 40 is sealed circuit board 1, chip 20, electric-conductor 60 and first conductor, 7, one tin balls (solderball) 50 and is engaged in second conductor 8, for externally electrically connecting.
Above-mentioned commonly using in the electronic installation 9, because it must use tin ball 50 just to be easy to electrically connect with extraneous, so just, increased product cost, and owing to tin ball 50 needs engage with second conductor 8 by tin ball bond pad 53, make tin ball 50 be subject to external force collision, manufacture process is polluted or the influence of thermal stress and peeling off from second conductor 8, cause electronic installation 9 to produce phenomenon of the failure, simultaneously, conductive path 5 is because of being hollow form rather than solid structure, the generation be full of cracks E phenomenon as shown in figure 18 so be subject to the thermal stress influence when in the big environment of variations in temperature, moving, make electrically can't transmit and cause product function to lose efficacy, also make electronic installation 9 produce phenomenon of the failure.In electronic installation 9, electric-conductor 60 is by a routing processing procedure (Wirebonding process) electric-conductor 60 to be engaged in respectively on the chip 20 and first conductor 7, and chip 20 can be electrically connected with first conductor 7.And in the process that electric-conductor 60 engages, circuit board 1 need be heated to 140～300 ℃ usually, in order to the joint operation of implementing electric-conductor 60, wherein, though conductive paste (filler 43) is filled in conductive path 5 through holes 6 to increase the intensity of conductive path 5, but because of molten some temperature of conductive paste only is 183 ℃, during heating conductive paste will deliquescing to cause circuit board 1, electric-conductor 60 can't be engaged on the conductive path 5 and must be engaged on first conductor 7, so, circuit board 1 just must be provided with first conductor 7, thereby has increased cost and limited the practicality of circuit board 1.
Summary of the invention
At the problems referred to above, main purpose of the present invention is to provide a kind of circuit board and manufacture method of electronic installation, and it can reduce manufacturing cost, and can make conductor be difficult for producing crack performance because of the thermal stress influence.
For achieving the above object, the circuit board of a kind of electronic installation provided by the present invention, it includes: the insulator and first conductor; It is characterized in that: described insulator has first upper surface, first lower surface and side; Described first conductor, have first upper surface, first lower surface and first side, described first conductor is coated by described insulator, make the first side of described first conductor have at least some to be embedded in the described insulator, first upper surface of described first conductor has a part of protrusion at least and exposes in the described insulator first upper surface outside, and first lower surface of described first conductor has at least some to expose in the described insulator first lower surface outside; Wherein, described first conductor is not to be made by conductive paste.
Adopt technique scheme, the present invention has following advantage: 1, be embodied as the conductor of a solid solid-state shape because of first conductor, it does not have the hollow form space, makes first conductor be difficult for taking place crack performance.2, protrude from first lower surface of insulator because of first lower surface of first conductor, make circuit board be easy to must not use the tin ball, so the manufacturing cost of circuit board is minimized with extraneous the electric connection.3, when electric-conductor is embodied as conductor wire, because the molten point of copper is about 1083 ℃, therefore, circuit board had been heated between 140～300 ℃, first conductor still can deliquescing, conductor wire can directly be engaged on first conductor, first upper surface, so, circuit board just can not need be provided with first conductor, and the application limitations of circuit board is reduced, and the saving cost, the while also can be improved the reliability of circuit board.4, not only engage with insulator owing to first conductor by the first side, simultaneously, its extension also engages with insulator, and the bonding area of first conductor and insulator is increased, thus, first conductor can engage with insulator the problem peeled off of more firm and difficult generation.5,, therefore can improve the practicality of circuit board because of extension can freely stretch setting at insulator first upper surface by demand.
Description of drawings
Figure 1A～1J is the cutaway view of first kind circuit board of the present invention;
Fig. 1 K～1P is the cutaway view of the present invention's second class circuit board;
Fig. 1 Q～1R is the cutaway view of the present invention's the 3rd class circuit board;
The cutaway view of the electronic installation embodiment of first kind circuit board of the present invention is used in Fig. 2～10th;
Figure 11 is a cutaway view of using the electronic installation embodiment of the present invention's second class circuit board;
Figure 12 is a cutaway view of using the electronic installation embodiment of the present invention's the 3rd class circuit board;
Figure 13 A～13E is first kind of manufacture method cutaway view of invention first kind circuit board;
Figure 14 A～14F is second kind of manufacture method cutaway view of first kind circuit board of the present invention;
Figure 15 A～15C is first kind of manufacture method cutaway view of the present invention's second class circuit board;
Figure 16 A～16E is second kind of manufacture method cutaway view of the present invention's second class circuit board;
Figure 17 A～17D is the third manufacture method cutaway view of the present invention's second class circuit board;
Figure 18 is the cutaway view of habit formula electronic device construction.
Embodiment
First kind circuit board of the present invention is a basic structure of the present invention, and wherein, conductor is embodied as solid solid-state shape (solidstate), now according to following each accompanying drawing in detail its structure and function is described in detail:
Shown in Figure 1A, be a circuit board 10 provided by the present invention, it comprises: an insulator 30 has first upper surface 31, first lower surface 32 and side 37.2 first conductors 70, each first conductor 70 has first upper surface 71, first lower surface 72 and first side 73, first side 73 insulated bodys 30 coat, and make first conductor, 70 first upper surfaces 71, first lower surface 72 be exposed to insulator 30 first upper surfaces 31, first lower surface, 32 power supply property connections usefulness respectively, wherein first conductor, 70 first lower surfaces 72 protrude from insulator 30 first lower surfaces 32 1 height H, and first conductor, 70 first lower surfaces 72 are positioned on the different level with insulator 30 first lower surfaces 32.One assembly 80 is embodied as heat sink, it has first upper surface 81, first lower surface 82, first side 83, recess 86 and extension 85, wherein, first side 83 insulated bodys 30 coat, assembly 80 first on, lower surface 81,82 expose to respectively on the insulator 30 first, lower surface 31,32, and assembly 80 first lower surfaces 82 also protrude from insulator 30 first lower surfaces 32 1 height H, the recess 86 of assembly 80 is non-penetration state, be embodied as the accommodation space of circuit board 10, can be for holding object (chip for example, stick together part, packaging body etc.) use, the extension 85 of assembly 80 is to be provided with and to be attached on insulator 30 first lower surfaces 32, therefore, extension 85 removes the heat dispersion that the bond strength that can increase assembly 80 and insulator 30 also can promote circuit board 10.In the present embodiment, first conductor 70 and assembly 80 are embodied as the metal of identical material, and it can be made by copper, copper alloy or other proper metal, and can summarize following advantage (effect):
1, be embodied as the conductor of a solid solid-state shape because of first conductor 70, it does not have the hollow form space, makes first conductor 70 be difficult for taking place crack performance.
2, because of first conductor, 70 first lower surfaces 72 protrude from insulator first lower surface 32, make circuit board 10 be easy to must not use the tin ball with extraneous the electric connection, the manufacturing cost of circuit board 10 is minimized.
3, when electric-conductor is embodied as conductor wire, because the molten point of copper is about 1083 ℃, therefore, circuit board 10 had been heated between 140～300 ℃, first conductor 70 still can deliquescing, conductor wire can directly be engaged on first conductor, 70 first upper surfaces 71, so, circuit board 10 just can not need be provided with first conductor 7 (consulting Figure 18), and the application limitations of circuit board 10 is reduced, and the saving cost, the while also can be improved the reliability of circuit board 10.
Shown in Figure 1B, be a circuit board 10 provided by the invention, it comprises: an insulator 30, have first upper and lower surperficial 31,32 and side 37, wherein, insulator 30 forms with filling mode, makes insulator 30 first lower surfaces 32 be one non-planar.One accommodation space 14 is arranged on insulator 30 first upper surfaces 31, uses for holding object (for example chip, electric-conductor, packaging body etc.).2 first conductors 70, each first conductor 70 has on first, lower surface 71,72, first side 73 and extension 75, wherein, the extension 75 and first conductor 70 are whole single structure, just extension 75 is the some of first conductor 70, and extension 75 is that first upper surface 31 along insulator 30 extends setting and is engaged on insulator 30 first upper surfaces 31 from first conductor 70, simultaneously, first side 73 insulated bodys 30 of first conductor 70 coat, first conductor 70 is embedded in the insulator 30, and makes on first conductor 70 first, lower surface 71,72 is exposed respectively and protrude from the insulator 30 first, lower surface 31,32 externally fed connections are used.Present embodiment so, then can be summarized following advantage because first conductor 70 of circuit board 10 has extension 75:
1, owing to first conductor 70 not only engages with insulator 30 by first side 73, simultaneously, its extension 75 also engages with insulator 30, first conductor 70 and the bonding area of insulator 30 are increased, thus, first conductor 70 can engage with insulator 30 the problem peeled off of more firm and difficult generation.
2, because of extension 75 can freely stretch setting at insulator 30 first upper surfaces 31 by demand, so can promote the practicality of circuit board 10.
Shown in Fig. 1 C, be a circuit board 10 provided by the present invention, it comprises: an insulator 30 has first upper and lower surperficial 31,32.One penetration state accommodation space 15 is used for (holding) object (for example chip, conductor wire, packaging body etc.) is set.A plurality of conductors, be embodied as first conductor 70 respectively, the second conductor 70a, each is first years old, the first side 73 of two conductors, 73a insulated body 30 coats, make each first, two conductors 70,70a all is embedded in the insulator 30, and make each first, first upper surface 71 of two conductors, the 71a and first lower surface 72,72a exposes to respectively on the insulator 30 first, lower surface 31,32 power supply property connections are used, wherein, each first conductor 70 has protuberance 77, protuberance 77 has a upper surface, and protuberance 77 upper surfaces are embodied as first upper surface 71 of first conductor 70, the first upper surface 71a that makes first conductor, 70 first upper surfaces 71 be standing shape and do not protrude from insulator 30 first upper surfaces 31, the second conductor 70a then is lower than insulator 30 first upper surfaces 31.In the present embodiment, because of first conductor, 70 first upper surfaces 71 are convex shape, thus, can increase the bonding area of packaging body (not shown) and circuit board 10, make circuit board 10 engage with packaging body the problem peeled off of more firm and difficult generation packaging body and circuit board 10.
Shown in Fig. 1 D, be a circuit board 10 provided by the present invention, it comprises: an insulator 30, form by the first insulator 30A and the second insulator 30b.2 first conductors 70, respectively have first upper surface 71, first lower surface 72, extension 75 and first side 73, wherein, each first side 73 is skewed, and each extension 75 and first side 73 equal insulated bodys 30 coat, and make first upper and lower surperficial 71,72 of first conductor 70 be exposed to insulator 30 first upper and lower surperficial 31,32 and use for electrically connecting.One assembly 80, its material is identical with first conductor 70, and insulated body 30 coats, and makes first upper surface 81 be exposed to insulator 30 first upper surfaces 31.One accommodation space 14 is arranged on assembly 80 first upper surfaces 81 and uses for object is set.In the present embodiment, but the extension 75 of first conductor 70 not only insulated body 30 coat and more firm, simultaneously, still have the advantage of freely extending.
Shown in Fig. 1 E, be a circuit board 10 provided by the present invention, it comprises: an insulator 30 has first upper and lower surperficial 31,32.The equal insulated bodys 30 of 2 first conductors 70 coat, and make first conductor, 70 first upper surfaces 71, first lower surface 72 can power supply property connection usefulness, and wherein, first upper surface 71 protrudes from insulator 30 first upper surfaces 31.One assembly 80, it has hole 88, first side 83, the second side 84 of a penetration state, its material is identical with first conductor 70, first side 83 insulated bodys 30 coat, and second side 84 exposes to hole 88, hole 88 is embodied as the accommodation space 15 of circuit board 10, and for (holding) object (for example chip, conductor wire, packaging body etc.) usefulness is set, its first upper surface 81 protrudes from insulator 30 first upper surfaces 31.Present embodiment makes assembly 80 have hole 88 and holds object by changing the shape of assembly 80, thus, can make the thickness attenuation of electronic installation and saves material.
Shown in Fig. 1 F, be a circuit board 10 provided by the present invention, it comprises: an insulator 30 has first upper and lower surperficial 31,32.The equal insulated body 30 of one first conductor 70 and the second conductor 70a coats, wherein, the protuberance 77a of the protuberance 77 of first conductor 70 and the second conductor 70a makes the surface of first conductor 70 and the second conductor 70a be convex shape, and the protuberance 77a of the protuberance 77 of first conductor 70 and the second conductor 70a protrudes respectively and exposes to insulator 30 first upper surfaces 31, another protuberance 77b of the second conductor 70a does not then protrude, but exposes to insulator 30 first lower surfaces 32.One assembly 80, its material is identical with first conductor 70, each first side 83 equal insulated body 30 coats, and first upper surface 81 exposes and protrude from insulator 30 first upper surfaces 31, assembly 80 first upper surfaces 81 are embodied as the accommodation space 14 of circuit board 10, use for (holding) object (chip, electric-conductor, packaging body etc.) is set.Present embodiment is by the shape of change assembly, in the time of can making the chip (not shown) be arranged at assembly 80 first upper surfaces 81, with assembly 80 more efficient conduct the heat to circuit board 10 outsides of heat (Heat) by being embedded in insulator 30 of chip generation.
Shown in Fig. 1 G, be a circuit board 10 provided by the present invention, it comprises: an insulator 30 has first upper surface 31, first lower surface 32 and side 37.One penetration state accommodation space 15 is used for (holding) object (chip, conductor wire, packaging body etc.) is set.2 first conductors 70, be located on penetration state accommodation space 15 peripheries, have first upper surface 71, first lower surface 72, first side 73 and second side 74, and make first upper and lower surperficial 71,72 to be exposed to insulator 30 first upper and lower surperficial 31,32 power supply property connections usefulness.Wherein, each first side 73 equal insulated body 30 coats, and makes second side 74 be exposed to penetration state accommodation space 15 outsides, can shorten first conductor 70 and the distance that is contained in the chip (not shown) in the accommodation space 15 thus, shortens the length of conductor wire.
2 second conductor 70a, it has the first upper surface 71a, the first lower surface 72a, first side 73a and second side 74a, wherein, first side 73a has at least a part of insulated body 30 to coat and be embedded in the insulator 30, and make second side 74a at least a portion be exposed to insulator 30 sides 37 outsides, and the first upper surface 71a and the first lower surface 72a are exposed to insulator 30 first upper surfaces 31 and first lower surface 32 respectively.Thus, just can dwindle the area of circuit board 10 because of the second conductor 70a second side 74a naked body 30 (not insulated body 30 coatings of second side 74a just), and, then can increase the area that the second conductor 70a externally electrically connects and promote the quality of electrical communication because of the second conductor 70a second side 74a is exposed to insulator 30 sides 37.In the present embodiment, the accommodation space of circuit board 10 also can be asked as required and be embodied as non-penetration state, in order to the utilization of industry.
Shown in Fig. 1 H, be a circuit board 10 provided by the present invention, it comprises: an insulator 30 has first upper surface 31, first lower surface 32.The accommodation space 14 of one recess is used for object (chip, stick together part, packaging body etc.) is set.2 first conductors 70, all insulated body 30 coats, and makes respectively and first upper and lower surperficial 71,72 is exposed to insulator 30 first upper and lower surperficial 31,32 power supply property connections usefulness.One assembly 80, its material is different with first conductor 70, as be embodied as aluminum metal, be arranged on insulator 30 first lower surfaces 32, first upper surface 81 of assembly 80 is engaged with insulator 30 first lower surfaces 32, and have two holes 88, make still outer insulator first lower surface 32 outsides that are exposed at of first lower surface 72 of first conductor 70.Therefore present embodiment can promote the radiating effect of circuit board 10 because assembly 80 is engaged in insulator 30 first lower surfaces 32, and the area that assembly 80 is exposed in the external world increases.
Shown in Fig. 1 I, be a circuit board 10 provided by the present invention, it comprises: an insulator 30 has first upper surface 31, first lower surface 32, a recess 36 and one second lower surface 34.One assembly 80 is arranged in insulator 30 recesses 36, and first upper surface 81, first side 83 are engaged with insulator 30 respectively, and wherein, second side 84 does not engage with insulator 30.Present embodiment is engaged in assembly 80 in insulator 30 recesses 36, except that the radiating effect that can promote circuit board 10, also can make the thinner thickness of circuit board 10.
Shown in Fig. 1 J, be a circuit board 10 provided by the present invention, it comprises: an insulator 30 has first upper surface 31, first lower surface 32 and hole 38; One accommodation space 14; 2 first conductors 70 have first upper surface 71, first lower surface 72, first side 73 and extension 75, make first upper surface 71, first lower surface 72 all expose to insulator 30 power supply property connections and use.Wherein, extension 75 is arranged at insulator 30 first upper surfaces 31, and first side 73 is arranged in the insulator hole 38, does not directly engage with insulator 30.In the present embodiment, though first conductor, 70 first sides 73 directly do not engage with insulator 30, but in the process of making electronic installation, can in the hole 38 of insulator 30, fill a conductive paste (Conductivepaste) 62, the first side 73 of first conductor 70 is engaged with insulator 30 by conductive paste 62.Thus, what first conductor 70 can be stabilized fixes, and first conductor 70 can increase the quality that promotes electronic installation with extraneous bonding area by first side 73 simultaneously.Wherein, conductive paste 62 can be embodied as tin cream (Solder paste) or be made by the conductive materials of other paste, and some can protrude and expose to insulator 30 first lower surfaces 32 by demand to make conductive paste 62.
The present invention's second class circuit board is in conjunction with first kind circuit board of the present invention, conductive path or other conductor is set again first and second conductor electrical communication is formed, and now according to following each accompanying drawing in detail its structure and function is described in detail:
Shown in Fig. 1 K, be a circuit board 11 provided by the present invention, it comprises: an insulator 30, tool first upper surface 31 and first lower surface 32.One assembly 80 is arranged at insulator 30 first upper surfaces 31, tool first upper surface 81, first lower surface 82 and extension 85, and wherein, first lower surface 82 yet insulated body 30 coatings is not exposed to insulator 30 surfaces.One accommodation space 14; 2 first conductors 70, have first upper surface 71, first lower surface 72, first side 73 and extension 75 respectively, first conductor, 70 insulated bodys 30 coat, and make first upper surface 71, first lower surface 72 be exposed to insulator 30 first upper surfaces 31, first lower surface, 32 power supply property connections usefulness.Wherein, first lower surface 72 protrudes from insulator 30 first lower surfaces 32.2 second conductor 70a, each second conductor 70a engages with insulator 30 first upper surfaces 31 respectively, and respectively has a hole 78a.3 the 3rd conductor 70b engage with the second conductor 70a, the first upper surface 71a, assembly 80 first upper surfaces 81 respectively, wherein, the 3rd conductor 70b that engages with the second conductor 70a, its some be arranged in the hole 78a of the second conductor 70a, and engage with first conductor, 70 first upper surfaces 71.The present embodiment second conductor 70a engages and electrical communication with first conductor 70 by the 3rd conductor 70b, makes circuit board 11 can be embodied as the circuit board with two conductive layers and has more practicality.
Shown in Fig. 1 L, be a circuit board 11 provided by the present invention, it comprises: an insulator 30, form its tool first upper surface 31 and first lower surface 32 and a hole 38 by the first insulator 30a and the second insulator 30b.One assembly 80, be arranged at insulator 30 first lower surfaces 32, have first upper surface 81 and first lower surface 82, wherein, first lower surface 82 is exposed to insulator 30 first lower surfaces 32, and first upper surface 81 is not exposed to insulator 30 surfaces by second insulator 30b coating.One accommodation space 14 is arranged at insulator 30 first upper surfaces 31, uses for object is set.2 first conductors 70, have first upper surface 71, first lower surface 72, extension 75 and first side 73 respectively, wherein, first lower surface 72 is exposed to insulator first lower surface 32, and first upper surface 71 and extension 75 are not exposed to insulator 30 surfaces by second insulator 30b coating.One second conductor 70a is arranged at insulator 30 first upper surfaces 31, and wherein, the some of the second conductor 70a is arranged in the hole 38 of insulator 30, and engages with first conductor, 70 first upper surfaces 71.One conductive path 69, it is the conductive path of habit formula, respectively with first conductor 70 and the 3rd conductor 70b electrical communication.Present embodiment not only can make first conductor 70 directly engage and electrical communication with the second conductor 70a, and also can make circuit board 11 can be embodied as the circuit board of three conductive layers with conductive path 69 with first conductor 70 and the 3rd conductor 70b electrical communication.
Shown in Fig. 1 M, be a circuit board 11 provided by the present invention, it comprises: an insulator 30, tool first upper surface 31, one first lower surface 32,2 second lower surfaces 34 and four recesses 36.2 first conductors 70, each tool first upper surface 71, first lower surface 72, first side 73 and extension 75, first conductor, 70 insulated bodys 30 coat, make first upper surface, 71 protrusions and expose to insulator 30 first upper surfaces 31 power supply property connection usefulness, and make its first lower surface 72 be exposed to insulator 30 first lower surfaces 32 power supply property connections usefulness.2 second conductor 70a, be arranged in insulator 30 recesses 36, each tool first upper surface 71a, the first lower surface 72a, first side 73a and second side 74a, its first upper surface 71a and first side 73a engage with insulator 30 respectively, wherein, the first lower surface 72a and second side 74a not insulated body 30 coat and exposed power supply property connection is outside used.2 the 3rd conductor 70b, be arranged on insulator 30 first lower surfaces 32, each the tool first upper surface 71b and first lower surface 72b, wherein, the first upper surface 71b engages with insulator 30 first lower surfaces 32, first conductor, 70 first lower surfaces 72 and the second conductor 70a, the first lower surface 72a respectively, makes first conductor 70 and second conductor 70a energy electrical communication.One accommodation space 14 is used for object is set.Present embodiment makes first conductor 70 and second conductor 70a energy electrical communication by the 3rd conductor 70b, make circuit board 11 can be embodied as the circuit board of two conductive layers, and because of insulator 30 tool recesses 36, make circuit board 11 have the lower surface of convex shape, make circuit board 11 be more conducive to engage with other circuit board, simultaneously, the 3rd conductor 70b can form with electroplating (Plating) or sputter (Sputtering) or other mode.
Shown in Fig. 1 N, be a circuit board 11 provided by the present invention, it comprises: an insulator 30 has first upper surface 31, first lower surface 32 and hole 38.One accommodation space 14,2 first conductors 70, have first upper surface 71, first lower surface 72, first side 73 and extension 75 respectively, making first upper surface 71, first lower surface 72 all expose to insulator 30 power supply property connections uses, wherein, extension 75 is arranged at insulator 30 first upper surfaces 31, and first side 73 is arranged in the hole 38 of insulator 30, does not engage with insulator 30.2 second conductor 70a, respectively have the first upper surface 71a, the first lower surface 72a, first side 73a and second side 74a, wherein the equal insulated body of the first upper surface 71a and first side 73a 30 coats and is not exposed to insulator 30 surfaces, wherein, second side 74a not insulated body 30 coat and be exposed to the hole 38 of insulator 30.Present embodiment is owing to be provided with the second conductor 70a, make circuit board 11 can be embodied as the circuit board of two conductive layers, simultaneously, though the second conductor 70a second side 74a does not directly engage with insulator 30, but in the process of making electronic installation, can in insulator 30 holes 38, fill a conductive paste 62, the first side 73 of first conductor 70 is engaged with insulator 30 by conductive paste 62.Thus, what first conductor 70 can be stabilized fixes, and first conductor 70 can promote the electronic installation quality with the extraneous area that engages by first side 73 increases simultaneously, and wherein conductive paste 62 is also with first conductor 70 and the second conductor 70a electrical communication.
Shown in Fig. 1 O, be a circuit board 11 provided by the present invention, it comprises: an insulator 30, one is the accommodation space 14 of recess, for being set, object (chip, stick together part, electric-conductor, packaging body etc.) uses, the two first stepped conductors 70, form by first upper surface 71, first lower surface 72 and first side 73, and insulated body 30 coats, making first upper surface 71 expose to insulator 30 power supply property connections uses, wherein, each first conductor 70 extends in the accommodation space 14 from insulator 30 first upper surfaces 31.2 second conductor 70a, also insulated body 30 coats, and makes the first upper surface 71a insulated body 30 coat and be embedded in the insulator 30, simultaneously, makes the first lower surface 72a protrude from the 32 power supply property connections of insulator 30 first lower surfaces and uses.Two conductive paths 69 engage and electrical communication with first conductor 70 and the second conductor 70a respectively, so, just can improve the practicality of circuit board 11.Wherein, the first upper surface 71a of the second conductor 70a also can be bonded on insulator 30 first lower surfaces 32 and power supply property connection usefulness by demand.
Shown in Fig. 1 P, be a circuit board 11 provided by the present invention, it comprises: 4 first conductors 70 respectively have first upper surface 71, first lower surface 72 and first side 73.4 first conductive layers 55 respectively have upper surface 56, lower surface 57 and side 58, are separately positioned on first conductor, 70 first upper surfaces 71, and engage with first conductor 70.4 second conductive layer 55a respectively have upper surface 56a, lower surface 57a and side 58a, are separately positioned on first conductive layer, 55 upper surfaces 56, and engage with first conductive layer 55.One insulator 30 has first upper surface 31, first lower surface 32 and side 37, and first conductor 70, first conductive layer 55 and the second conductive layer 55a are coated, and first conductor 70, first conductive layer 55 and the second conductive layer 55a are embedded in the insulator 30.Wherein, the second conductive layer body 55a upper surface 56a not insulated body 30 coats and is exposed to insulator 30 first upper surfaces 31, and the connection of power supply property is used.By the structure of circuit board 11 as can be known, because each conductor and conductive layer all are embedded in the insulator, the thickness of circuit board is dwindled, and conductive layer makes that circuit board is easy to electrically engage with extraneous, and can promote the circuit board electrical quality reliability of joint to external world.
The present invention's the 3rd class circuit board is in conjunction with the first kind of the present invention or the second class circuit board, and the multilayer circuit board that a conductive path or conductor form each conductor electrical communication is set again, and it can increase the suitable number of plies again by demand and use in order to industry.Now its structure and function are described in detail in detail according to following each accompanying drawing:
Shown in Fig. 1 Q, be a circuit board 12 provided by the present invention, it is made up of first and second class circuit board 10,11 of the present invention, wherein, circuit board 11 has one first insulator 30a, its tool first upper surface 31a, 2 first conductors 70 are arranged on the first insulator 30a, and make each first conductor, 70 first lower surface 72 and first upper surface 71 be exposed to the first insulator 30a, first upper surface 31a and circuit board 12 first lower surfaces 32 power supply property connections usefulness respectively.Wherein circuit board 10, has one second insulator 30b, be arranged on the first insulator 30a, the first upper surface 31a, one second conductor 70a, be arranged at the second insulator 30b, and make the first upper surface 71a be exposed to circuit board 12 first upper surfaces 31 power supply property connection usefulness, simultaneously, the first lower surface 72a engages and electrical communication with first conductor, 70 first lower surfaces 72 by conductive paste 62.Present embodiment utilization conductive paste 62 combine formation circuit board 12 with first kind circuit board 10 of the present invention with the second class circuit board 11, make circuit board 12 become a circuit board with three layers of conductive layer, and is like this, makes circuit board 12 have more practicality.
Shown in Fig. 1 R, be a circuit board 12 provided by the present invention, it is formed by the 10 storehouse settings of two first kind circuit boards, and wherein, circuit board 10 has an insulator 30, insulator 30 tools, first upper surface 31 and first lower surface 32.2 first conductors 70 have first upper surface 71 and first lower surface 72 respectively, and make first upper and lower surperficial 71,72 to be exposed to insulator 30 surface power supply property connections usefulness.Three conductive pastes 62 engage with corresponding first conductor 70 and assembly 80 respectively, make two circuit boards 10 by conductive paste 62 electrical communication, and can promote the radiating efficiency of circuit board 12.In the present embodiment, circuit board 12 has three layers of conductive layer.
More than first; two; the insulator of the circuit board of three classes can be by viscose; pottery; glass; resin or other appropriate insulation material are made; and each conductor and each assembly expose to the part on insulator 30 surfaces the above suitable conductive (nickel of one deck can be set at least again; gold; silver or palladium etc.) quality when promote electrically connecting; and each conductor; insulator can be made into different shape patterns (Patterns) with assembly; also can make the side of conductor expose to the side of insulator; and can change insulator on demand; the shape of conductor and assembly and quantity; in order to promote the effect of circuit board; and conductor and assembly can be by Copper Foils; copper alloy; nickel; metal alloy (metallic alloy) or other suitable material are made; simultaneously; one welding resisting layer (solder mask) also can be set on demand, expose to the conductor of insulator with protection; assembly or circuit board surface.
The effect of the electronic installation 90 that relevant utilization first kind circuit board 10 is made, now lift the following example and conjunction with figs. is described as follows:
As shown in Figure 2, be the electronic installation 90 that first embodiment of the invention provided, it comprises: a circuit board 10, have an insulator 30,2 first conductors 70 and an assembly 80, wherein, first conductor 70 tools, first upper surface 71 and one first lower surface 72, wherein first lower surface 72 protrudes and is exposed to insulator 30 first lower surfaces 32 assemblies 80 and is embodied as metal conductive materials, and it has first upper surface 81, first lower surface 82 and recess 86.Wherein, first lower surface 82 protrudes from insulator 30 first lower surfaces 32, and recess 86 is embodied as the accommodation space of circuit board 10, uses for placing objects.One chip 20 is arranged in assembly 80 recesses 86.Many electric-conductors 60 are embodied as conductor wire, and it engages with chip 20, first conductor 70 and assembly 80 respectively, make the chip 20 and first conductor 70 and assembly 80 electrical communication.One packaging body 40, its encapsulate chip 20, electric-conductor 60 and circuit board 10.By present embodiment as can be known, because having the conductor 70 of a convex shape, circuit board 10 electrically connects with extraneous, make electronic installation 90 needn't use the tin ball, can reduce manufacturing cost, and the electric-conductor 60 that is embodied as conductor wire directly electrically connects with first conductor 70, makes circuit board 10 can be provided with first conductor 7 shown in Figure 180, and the application limitations of circuit board 10 is reduced, and escapable cost, the while also can be improved the reliability of circuit board 10.In addition, because first conductor 70 has protuberance 77, it can increase the area that first conductor, 70 packed bodies 40 coat, make circuit board 10 engage more firmly and can avoid producing the problem of peeling off with packaging body 40, thereby can improve the reliability of electronic installation 90, simultaneously, because of circuit board 10 assemblies 80 expose to circuit board 10 for metal material and its second lower surface 82, thus, can improve the heat dissipation of electronic installation 90.
As shown in Figure 3, be the electronic installation 90 that second embodiment of the invention provided, it comprises: a circuit board 10, have an insulator 30,2 first conductors 70,2 second conductor 70a and an accommodation space 14, wherein, first conductor 70 is stepped, tool first upper surface 71, second upper surface 79, first side 73, second side 74 and extension 75, extension 75 is arranged at insulator 30 first upper surfaces 31, and extend to accommodation space 14 as far as possible, and the height of the second conductor 70a, the first upper surface 71a is lower than insulator 30 first upper surfaces 31.One chip 20 is arranged on the accommodation space 14.Many electric-conductors 60 are embodied as conductor wire, and it engages with chip 20, first conductor 70 and the second conductor 70a respectively, make the chip 20 and first conductor 70 and the second conductor 70a electrical communication.One packaging body 40, its encapsulate chip 20, electric-conductor 60 and circuit board 10.By present embodiment as can be known, because first conductor, 70 first upper surfaces 71 are arranged at different height with the second conductor 70a, the first upper surface 71a, the clearance G that therefore can widen 60 of electric-conductors prevents electrical short circuit phenomenon.Simultaneously, because of first conductor, 70 tool extensions 75 can more close accommodation space 14, thus, can shorten the distance D of 70 of the chip 20 and first conductors, reduce the consumption of electric-conductor 60, provide cost savings, and first conductor, 70 second sides 74 not insulated body 30 coat and be exposed to packaging body 40 outsides, can increase the area of electric connection.
As shown in Figure 4, be the electronic installation 90 that third embodiment of the invention provided, it comprises: a circuit board 10 has an insulator 30,2 first conductors 70, one second conductor 70a, an assembly 80.Wherein, the second conductor 70a has one and runs through accommodation space 79a, and the second conductor 70a's runs through the accommodation space 15 that accommodation space 79a is embodied as circuit board 10, can for chip be set, stick together part, object such as packaging body uses.First conductor 70 has extension 75 and is arranged at insulator 30 first upper surfaces 31, assembly 80 is located on the outer rim of circuit board 10, have extension 85, recess 86 and first and second side 83,84, wherein, second side 84 not insulated body 30 coats and is exposed to packaging body 40 outsides, in order to promote radiating efficiency.One chip 20 is arranged at and runs through in the accommodation space 15.One packaging body 40, encapsulate chip 20, electric-conductor 60 and circuit board 10.By present embodiment as can be known, because circuit board 10 has the accommodation space of running through 15 ccontaining chips 20, can make the integral thickness of electronic installation 90 thinner, simultaneously, the second conductor 70a can be embodied as cathode power supply contact (positive supply bus) or negative power supply contact (negative supply bus), makes electronic installation 90 have more practicality.
As shown in Figure 5, be the electronic installation 90 that fourth embodiment of the invention provided, it is made up of first electronic installation 91 and second electronic device 92.First and second electronic installation 91,92 comprises respectively: a circuit board 10, have an insulator 30 and first and second conductor 70,70a, wherein, first conductor, 70 first upper surfaces 71, first lower surface 72 all are exposed to insulator 30 first upper surfaces 31 and first lower surface, 32 power supply property connection usefulness, and the second conductor 70a is arranged at the 31 power supply property connections of insulator 30 first upper surfaces and uses.One penetration state accommodation space 15.Two chips 20,25 all are arranged in the accommodation space 15, and wherein, chip 25 is the storehouse shape and is arranged on the chip 20.Many electric-conductors 60 are embodied as conductor wire, engage with chip 20,25, first conductor 70 and the second conductor 70a respectively, make chip 20,25 and first and second conductor 70,70a electrical communication.One packaging body 40, its encapsulate chip 20, chip 25, electric-conductor 60 and circuit board 10.By present embodiment as can be known, electronic installation 90 has a plurality of circuit boards 10, and by the penetration state accommodation space 15 of each circuit board 10 formation a plurality of chips 20,25 can be set, and so, just can improve the effect of electronic installation 90.In addition, electronic installation 90 packaging body 40 seal finish after, also can along line of cut A-A electronic installation 90 be divided into separately independently first electronic installation 91 and second electronic device 92 by demand, wherein, chip 20,25 is positioned at the side 37 of circuit board 10.In view of the above, the accommodation space 15 of circuit board 10 can not confined stretching, extension, and can not be more conducive to electronic industry and use because of accommodation space 15 becomes the area that increase circuit board 10 greatly.
As shown in Figure 6, be the electronic installation 90 that fifth embodiment of the invention provided, it comprises: a circuit board 10, have an insulator 30, an accommodation space 14 and 4 first conductors 70, wherein, each first conductor 70 has a plurality of protuberances 77,77c respectively, makes first upper surface 71 of first conductor 70 and first lower surface 72 be exposed to insulator 30 first upper surfaces 31 and first lower surface, 32 power supply property connections usefulness respectively, wherein, first upper surface 71 protrudes from insulator 30 first upper surfaces 31.One chip 20, be embodied as crystal covered chip (Flip chip), be arranged on the accommodation space 14 of circuit board 10, its acting surface 21 has four electric-conductors 65, be embodied as the conduction protuberance, and each electric-conductor 65 engages with the protuberance 77 (first upper surface 71) of the chip 20 and first conductor 70 respectively, makes chip 20 and first conductor, 70 electrical communication.One packaging body 40, its encapsulate chip 20, electric-conductor 65 and circuit board 10.By present embodiment as can be known, because first conductor has protuberance 77, just increased the contact area of the electric-conductor 65 and first conductor 70, make electric-conductor 65 engage more firmly with first conductor 70, can avoid chip 20 from the problem that circuit board 10 separates and generation is peeled off, thereby improve the quality of electronic installation 90, simultaneously, also can make the non-acting surface 22 of packaging body 40 coating chips 20 by demand, make chip 20 more stable being fixed on the circuit board 10.
As shown in Figure 7, be the electronic installation 90 that sixth embodiment of the invention provided, it comprises: a circuit board 10, its tool one insulator 30,2 first conductors 70 and a penetration state accommodation space 15, wherein, insulator 30 forms with filling mode, makes insulator 30 first lower surfaces 32 be one non-planar.Each first conductor, 70 tools, one extension 75, first side 73 and second side 74, wherein, first conductor, 70 first sides 73 are exposed to runs through accommodation space 15.One chip 20 is arranged at and runs through in the accommodation space 15, and sticks together part 45 by one and engage with circuit board 10.Many electric-conductors 60 are embodied as conductor wire, engage with the chip 20 and first conductor 70 respectively, make chip 20 and first conductor, 70 electrical communication.One packaging body 40, sticks together part 45 and circuit board 10 at its encapsulate chip 20, electric-conductor 60.By present embodiment as can be known,, make first conductor 70 can more close chip 20, thus, can shorten the heat dissipation path of chip 20, promote the heat-sinking capability of electronic installation 90 because first conductor, 70 first sides 73 are exposed to the penetration state accommodation space 15 of circuit board 10.In addition, stick together part 45 and can ask the some that is embodied as packaging body 40 as required, and stick together part 45 and also can adopt identical material by demand and packaging body 40.
As shown in Figure 8, be the electronic installation 90 that seventh embodiment of the invention provided, it comprises: a circuit board 10, and it has an insulator 30,2 first conductors 70 and an accommodation space 14, and wherein, some is positioned at accommodation space 14 first conductor 70.One chip 20 is accommodated in the accommodation space 14, and is arranged on first conductor, 70 second upper surfaces 79.Many electric-conductors 60 are embodied as conductor wire, engage with the chip 20 and first conductor 70 respectively, make chip 20 and first conductor, 70 electrical communication.One packaging body 40, its encapsulate chip 20, electric-conductor 60 and circuit board 10.Three welding resisting layers 46 (Solder mask) are arranged on insulator 30 first lower surfaces 32 of circuit board 10, in order to protective circuit plate 10.By present embodiment as can be known and since first conductor 70 some be arranged in the accommodation space 14, the outward appearance of electronic installation 90 can be dwindled, and can improve the radiating efficiency of chip 20.
As shown in Figure 9, be the electronic installation 90 that eighth embodiment of the invention provided, it comprises: a circuit board 10, it has an insulator 30,2 first conductors 70 and an assembly 80, wherein, first conductor 70 has first upper surface 71, first lower surface 72 and extension 75, make first upper surface 71 and first lower surface 72 be exposed to insulator 30 first upper surfaces 31 and first lower surface, 32 power supply property connections usefulness, assembly 80 has consistent perforating hole hole 88, hole 88 is embodied as the penetration state accommodation space of circuit board 10, uses for holding object.One chip 20, the acting surface 21 of chip 20 and the surface engagement of circuit board 10, and be arranged on the penetration state accommodation space of circuit board 10.Many electric-conductors 60 are embodied as conductor wire, engage with chip 20, first conductor 70 and assembly 80 respectively, make the chip 20 and first conductor 70, assembly 80 electrical communication.Two packaging bodies 40 are separately positioned on insulator 30 first upper surfaces 31 and first lower surface 32, and by the demand extension 75 of encapsulate chip 20, electric-conductor 60, assembly 80, circuit board 10 and first conductor 70 respectively.Wherein, first conductor, 70 first upper surfaces 71 and first lower surface, 72 non-encapsulated bodies 40 coat, and can externally electrically connect.By present embodiment as can be known, because first conductor, 70 first upper surfaces 71 and first lower surface 72 all expose in the surface of circuit board 10, make electronic installation 90 can pass through tin ball 50 (among the figure shown in the dotted line) and electrically connect, and can help the industry utilization by a plurality of electronic installations 90 of demand storehouse with extraneous.
As shown in figure 10, be the electronic installation 90 that ninth embodiment of the invention provided, it comprises: a circuit board 10, tool one insulator 30, two conductors 70 and an accommodation space 14, wherein, insulator 30 first upper surfaces 31 have the bossy body P of preset shape, thus, bossy body P promptly with accommodation space 14 adjacent settings.One chip 20 is arranged in the accommodation space 14.Many electric-conductors 60 engage with the chip 20 and first conductor 70 respectively, make chip 20 and first conductor, 70 electrical communication.One lid C, be arranged on the bossy body P of insulator 30, thus, just be formed with the accommodation space 17 of a depression on the circuit board 10, and chip 20, electric-conductor 60 just are encapsulated in the accommodation space 17, wherein, chip 20 can be asked as required and be embodied as optical chip (image sensor) etc., and lid C then can ask as required and be embodied as transparency carrier (transparent substrate).Present embodiment can be inserted packaging body encapsulate chip 20, electric-conductor 60 and circuit board 10 by demand in accommodation space 17, lid C then can ask as required and be embodied as heat sink or other object etc.
As shown in figure 11, be the electronic installation 90 that tenth embodiment of the invention provided, it comprises: a circuit board 11, the structural similarity shown in Fig. 1 M in its structure and the present invention's second class circuit board has an insulator 30,2 first conductors 70,2 second conductor 70a and 2 the 3rd conductor 70b.Wherein, insulator 30 has first upper surface 31, second upper surface 33, first lower surface 32 and two protuberances 39, insulator 30 protrudes from second upper surface 33 because of protuberance 39 makes first upper surface 31, and first conductor, 70 insulated bodys 30 coat, and make first upper surface 71 and first lower surface 72 be exposed to insulator 30 first upper surfaces 31 and first lower surface, 32 power supply property connections usefulness respectively, the second conductor 70a be arranged on insulator 30 second upper surfaces 33 and with the protuberance 39 adjacent settings of insulator 30, the 3rd conductor 70b is arranged on insulator 30 first upper surfaces 31, and engage with first conductor 70 and the second conductor 70a respectively, make first conductor 70 and second conductor 70a energy electrical communication.One accommodation space 14 is used for object is set.One chip 20 is arranged on the accommodation space 14.Many electric-conductors 60 are embodied as conductor wire, engage with chip 20 and the 3rd conductor 70b respectively, make chip 20 and first conductor, 70 electrical communication.One packaging body 40, its encapsulate chip 20, electric-conductor 60 and circuit board 10.Present embodiment shows that the second class circuit board 11 also can apply in the electronic installation 90.
As shown in figure 12, be the modular electronic installation 90 that eleventh embodiment of the invention provided, it has a circuit board 12, a chip 20, a packaging body 40 and an electric capacity (capacitor) 89, wherein, circuit board 12 comprises: an insulator 30, it forms tool first upper surface 31 and first lower surface 32 by the first insulator 30a, the second insulator 30b, the 3rd insulator 30c storehouse setting.3 second conductor 70a are separately positioned on the surface of the second insulator 30b, and are coated by the first insulator 30a and the 3rd insulator 30c respectively, and respectively have a hole 78a.3 first conductors 70, engage with the first insulator 30a and the 3rd insulator 30c respectively, and making first upper surface 71 expose to insulator 30 first upper surfaces 31 and first lower surface, 32 supply lines connection usefulness by demand respectively, each first lower surface 72 is arranged at respectively in the hole 78a of the second conductor 70a.Three conductive pastes 62 also respectively are arranged in the hole 78a of the second conductor 70a, and make first conductor 70 and the second conductor 70a by conductive paste 62 electrical communication.Two accommodation spaces 14 are used for object is set.One chip 20 is arranged on the accommodation space 14.One electric capacity 89 is arranged on another accommodation space 14, and electrically connects with 2 first conductors 70 respectively by conductive paste 62.Many electric-conductors 60 engage with the chip 20 and first conductor 70 respectively, but make chip 20 and first conductor, 70 electrical communication.First lower surface 72 of each first conductor 70 need not expose to insulator 30 first upper surfaces 31 or first lower surface 32 in the present embodiment, make circuit board 12 still can carry out the effect of external electric connection, simultaneously, use three-layer insulated body can make circuit board 12 have the circuit board of four layers of conductive layer, help the use of industry.
Can derive by the various embodiments described above, the conductor that the present invention will expose and protrude from insulator surface be arranged on circuit board lower surface and not insulated body coat, make electronic installation can be easy to electrically connect with the external world and the tin ball can be set, thereby can reduce manufacturing cost, or with circuit board upset use, make conductor exposed and that protrude from insulator surface be arranged on the upper surface of circuit board and insulated body coats, can promote the practicality of circuit board.
Shown in Figure 13 A～13E, first kind of manufacturing step method for first kind circuit board specifies as follows:
As shown in FIG. 13A, one first conductive plate 70p is provided earlier, is embodied as copper material, respectively on its first upper surface 71p, the first lower surface 72p film 49 being set, film 49 has hole 48, and the some of the first conductive plate 70p, the first lower surface 72p is exposed to outside the film 49.
Shown in Figure 13 B, the first conductive plate 70p forms the protuberance 77p of six preset shapes after chemical etching.
Shown in Figure 13 C, after 49 removals of the film on the first conductive plate 70p, adopt curing process to coat each protuberance 77p of the first conductive plate 70p one insulator 30, wherein, the first conductive plate 70p, the first lower surface 72p not insulated body 30 coats and is exposed to insulator 30 first lower surfaces 32.After finishing this making step, can at insulator 30 first lower surfaces 32 the second conductive plate 70s be set, with the circuit board (consulting the explanation of Figure 15 A～15C) of making different structure by demand.
Shown in Figure 13 D, on the first conductive plate 70p, the first upper surface 71p, the first lower surface 72p and insulator 30 first lower surfaces 32, film 49 is set respectively, film 49 has hole 48, and the some of the first conductive plate 70p, the first upper surface 71p and the first lower surface 72p is exposed to outside the film 49.
Shown in Figure 13 E, through an etch process, after the part that the first conductive plate 70p is exposed to film 49 etches away by demand, form a circuit board 10, it comprises: an insulator 30, it has one first upper surface 31, first lower surface 32 and two holes 38.One first conductor 70, it has first upper surface 71, first lower surface 72, first side 73 and extension 75, wherein, extension 75 is arranged on insulator 30 first upper surfaces 31, first side 73 is arranged in insulator 30 holes 38, first upper surface 71 and first lower surface 72 are exposed to outside the insulator 30, power supply property connection usefulness, and first upper surface 71 protrudes from insulator 30 first upper surfaces 31.One second conductor 70a, it has the first upper surface 71a, the first lower surface 72a, first side 73a, and wherein, first side 73a insulated body 30 coats, and the first upper surface 71a and the first lower surface 72a are exposed to outside the insulator 30, and the connection of power supply property is used.One the 3rd conductor 70b, it has the first upper surface 71b, the first lower surface 72b, first side 73b and extension 75b, wherein, the first upper surface 71b and extension 75b are arranged on insulator 30 first upper surfaces 31, first side 73b insulated body 30 coats, and the first upper surface 71b, the first lower surface 72b are exposed to outside insulator 30 surfaces, power supply property connection usefulness, and the first upper surface 71b protrudes from insulator 30 first upper surfaces 31.One the 4th conductor 70c, it has the first upper surface 71c, the first lower surface 72c and first side 73c, wherein, first side 73c insulated body 30 coats, and the first upper surface 71c, the first lower surface 72c are exposed to outside insulator 30 surfaces, power supply property connection usefulness, and the first upper surface 71c protrudes from insulator 30 first upper surfaces 31.One assembly 80, its material is identical with each conductor, has one first upper surface 81, first lower surface 82, first side 83 and hole 88, wherein, first side 83 insulated bodys 30 coat, and first upper surface 81 and first lower surface 82 are exposed to outside insulator 30 surfaces.In the said method, because the first upper surface 71c of the 4th conductor 70c of circuit board 10 is for protrusion and expose to insulator 30, make circuit board 10 be easy to must not use the tin ball with extraneous electric connection, and need not use in the manufacture process and contain the material that lead waits other hostile environment, therefore, can reduce the pollution of circuit board to environment.The upper and lower surface of circuit board 10 also can be provided with welding resisting layer (Soder mask) with protective circuit plate 10 by demand simultaneously.
Shown in Figure 14 A～14F, second kind of manufacturing step method for first kind circuit board specifies as follows:
Shown in Figure 14 A, one first conductive plate 70p is provided earlier, and on the first conductive plate 70p, the first upper surface 71p and the first lower surface 72p, one first conductive layer 55 is set respectively, and each first conductive layer 55 is engaged in respectively on the first conductive plate 70p, this first conductive layer 55 can be embodied as silver or palladium metal.
As shown in Figure 14B, provide film 49, film 49 is arranged at respectively on each first conductive layer, 55 upper surface 56, film 49 has a plurality of holes 48, and some is not coated by film 49 and is exposed among the atmosphere (atmosphere) to make first conductive layer 55.
Shown in Figure 14 C, adopt an etch process, a part that is exposed to first conductive layer 55 in the atmosphere and the first conductive plate 70p is removed, make the first conductive plate 70p have two protuberance 77p, and film 49 removed, and the first not etched conductive layer 55 still is engaged in the first conductive plate 70p respectively.
Shown in Figure 14 D, one insulator 30 is provided, and make insulator 30 coat the protuberance 77p and first conductive layer 55 of the first conductive plate 70p, behind the baking-curing processing procedure, make insulator 30 form a preset shape outward appearance, wherein, first conductive layer, 55 upper surfaces 56 not insulated body 30 coat and be exposed in the atmosphere.
Shown in Figure 14 E, film 49 is provided, film 49 is arranged at respectively below each first conductive layer, 55 upper surface 56 and the insulator 30 first on 32, and film 49 has a plurality of perforates 48, and some is not coated by film 49 and is exposed among the atmosphere to make first conductive layer 55.
Shown in Figure 14 F, again by an etch process, the part that first conductive layer 55 and the first conductive plate 70p are exposed in the atmosphere is removed, again film 49 is removed, form first kind circuit board 10 then.The structure of circuit board 10 comprises: 2 first conductors 70 have first upper surface 71, first lower surface 72 and first side 73 respectively.4 first conductive layers 55 have upper surface 56, lower surface 57 and side 58 respectively, are separately positioned on first conductor, 70 first upper surfaces 71 and first lower surface 72, and engage with first conductor 70 respectively.One insulator 30, have first upper surface 31, first lower surface 32 and side 37, insulator 30 only coats first conductor 70 and first conductive layer 55 that is engaged in first conductor, 70 first lower surfaces 72, make first conductor, 70 first upper surfaces 71 not insulated body 30 coat and exposed and protrude from insulator 30 first upper surfaces 31, and first conductor, 70 first lower surfaces 72 not insulated body 30 coat and be depressed in insulator 30 first lower surfaces 32.Wherein, first conductive layer 55 that is engaged in first conductor, 70 first upper surfaces 71 not insulated body 30 coats the connections of power supply property and uses, be engaged in then insulated body 30 coatings of first conductive layer 55 of first conductor, 70 first lower surfaces 72, and make its upper surface 56 be exposed to insulator 30 first lower surfaces 32 power supply property connections usefulness.In the structure of circuit board 10, because conductor and conductive layer can be embedded in the insulator, and the thickness of circuit board is dwindled, help the industry utilization, and first conductive layer 55 makes circuit board 10 be easy to electrically engage with extraneous, and can promote the quality reliability that circuit board 10 electrically engages to external world.
Shown in Figure 15 A～15C, be the first kind of manufacturing step and the method for the second class circuit board, specify as follows:
Shown in Figure 15 A, at first, provide one to have the first conductive plate 70p of six protuberance 77p and coat the first conductive plate 70p and each protuberance 77p with an insulator 30, the structure shown in Figure 15 A is identical with the structure shown in Figure 13 C.On insulator 30 first lower surfaces 32 and the first conductive plate 70p, the first lower surface 72p one second conductive plate 70s is set then, the second conductive plate 70s can form by demand electricity consumption plating (Plating) or sputter modes such as (Sputtering).
Shown in Figure 15 B, on the first lower surface 72s of the first upper surface 71p of the first conductive plate 70p and the second conductive plate 70s, film 49 is set, film 49 has hole 48, and the some a part of and the second conductive plate 70s, the first lower surface 72s of the first conductive plate 70p, the first upper surface 71p is exposed to outside the film 49.
Shown in Figure 15 C, by a chemical etching processing procedure, the first conductive plate 70p and the second conductive plate 70s are exposed to film 49 outer parts etch away, and film 49 is removed, so far, just form a conductive plate 11.Conductive plate 11 comprises: an insulator 30, it has first upper surface 31, first lower surface 32.6 first conductors 70, respectively have first upper surface 71, first lower surface 72 and first side 73, each first side 73 insulated body 30 coats, make each first upper surface 71 and first lower surface 72 be exposed to insulator 30 surfaces, power supply property connection usefulness, and each first upper surface 71 protrudes insulator 30 first upper surfaces 31.5 second conductor 70a have the first upper surface 71a, the first lower surface 72a and first side 73a respectively, and engage with first lower surface 72 of insulator 30 first lower surfaces 32 and first conductor 70 respectively.In the said method,, make circuit board form the circuit board 11 of pair of lamina conductive layer because the second conductor 70a of circuit board 11 is arranged on insulator 30 first lower surfaces 32.
Shown in Figure 16 A～16E, be the second kind of manufacturing step and the method for the second class circuit board, specify as follows:
Shown in Figure 16 A, one first conductive plate 70p is provided earlier, it has one first upper surface 71p, 4 first lower surface 72p and four protuberance 77p.One second conductive plate 70s, it has the first upper surface 71s, the first lower surface 72s and recess 76s.Two conductive pastes 62, it is filled in the two recess 76s, wherein, the level height difference of two conductive pastes 62.Two fillers 43 are filled in other the two recess 76s, and the level height of two fillers 43 is also different.
Shown in Figure 16 B, first and second conductive plate 70p, 70s are engaged, and each first lower surface 72p of the first conductive plate 70p is embedded in the four recess 76s of the second conductive plate 70s, and coated by conductive paste 62 and filler 43 respectively, again through a curing process, conductive paste 62 and filler 43 are solidified, so, the first conductive plate 70p and the second conductive plate 70s just link together, then, provide a filling process that insulator 30 is filled in the first conductive plate 70p and the second conductive plate 70s between the two again, and solidify insulator 30.
Shown in Figure 16 C, film 49 is provided, be arranged at respectively on the first conductive plate 70p, first upper surface 71p and the second conductive plate 70s, the first lower surface 72s, and offer hole 48 by demand, the some a part of and the second conductive plate 70s, the first lower surface 72s of the first conductive plate 70p, the first upper surface 71p is exposed to respectively outside the film 49.
Shown in Figure 16 D, one etch process is provided, the part that first and second conductive plate 70p, 70s is exposed to film 49 perforates 48 places is removed, and make the first conductive plate 70p form 2 first conductors 70,2 second conductor 70a, and the second conductive plate 70a forms 2 the 3rd conductor 70b and an assembly 80.
Shown in Figure 16 E, provide one to remove processing procedure, filler 43 is removed, make the second conductor 70a, the first lower surface 72a be exposed to insulator 30 outsides, so far, just circuit board 11 has formed.Circuit board 11 comprises: an insulator 30, it has first upper surface 31, first lower surface 32, second lower surface 34, the 3rd lower surface 35, recess 36 and protuberance 39.2 first conductors 70, insulated body 30 coats, have first upper surface 71, first lower surface 72, first side 73 and extension 75 respectively, and make first upper surface 71 and first lower surface 72 exposed and protrude from insulator 30 surface power supply property connections and use, wherein, extension 75 is arranged on insulator 30 first upper surfaces 31.2 second conductor 70a, insulated body 30 coats, have the first upper surface 71a, the first lower surface 72a and first side 73a respectively, and making the first upper surface 71a and the first lower surface 72a exposed respectively and protrude from insulator 30 first upper surfaces 31, second lower surface 34 or the 3rd lower surface 35, the connection of power supply property is used.2 the 3rd conductor 70b are arranged on insulator 30 the 3rd lower surface 35, have the first lower surface 72b respectively, expose respectively and protrude from the 35 power supply property connections of insulator 30 the 3rd lower surface and use.Two conductive pastes 62 are separately positioned between first conductor, 70 first lower surfaces 72 and the 3rd conductor 70b, make first conductor 70 and the 3rd conductor 70b energy electrical communication.One assembly 80 is arranged on insulator 30 first lower surfaces 32 and the 3rd lower surface 35, and makes first lower surface 82 exposed and protrude from insulator 30 the 3rd lower surface 35.In the said method, the 3rd conductor 70b can freely extend setting at insulator 30 the 3rd lower surface 35 by demand, makes circuit board 11 become a circuit board with double-deck conductive layer.
Shown in Figure 17 A～17D, be the third manufacturing step and the method for the second class circuit board, specify as follows:
Shown in Figure 17 A, one first conductive plate 70p is provided, it has one first upper surface 71p, 2 first lower surface 72p and two protuberance 77p.One second conductive plate 70s is provided, is arranged on the adhesive tape 47, have the first upper surface 71s, the first lower surface 72s and hole 78s, wherein, two fillers 43 are filled in the two hole 78s.
Shown in Figure 17 B, first and second conductive plate 70p, 70s are engaged, and each the first lower surface 72p that makes the first conductive plate 70p is embedded in the filler 43 in the second conductive plate 70s hole 78s respectively, and the first lower surface 72p is engaged with adhesive tape 47, through a heating processing filler 43 is solidified again, so, the first conductive plate 70p and the second conductive plate 70s just link together, then, provide again a filling process with insulator 30 be filled in the first conductive plate 70p and the second conductive plate 70s the two, and solidify insulator 30.
Shown in Figure 17 C, remove adhesive tape 47, film 49 is provided then, be arranged at respectively on the first conductive plate 70p, first upper surface 71p and the second conductive plate 70s, the first lower surface 72s, and offer hole 48 by demand, the some a part of and the second conductive plate 70s, the first lower surface 72p of the first conductive plate 70p, the first upper surface 71p is exposed to respectively outside the film 49.
Shown in Figure 17 D, one etch process is provided, the part that first and second conductive plate 70p, 70s is exposed to film 49 perforates 48 places is removed, provide one to remove processing procedure again with film 49 and filler 43 removals, make first conductor, 70 first upper surfaces 71 and first lower surface 72 all be exposed to insulator 30 outsides, so far, circuit board 11 just forms.Circuit board 11 comprises: an insulator 30, it has first upper surface 31, first lower surface 32, second lower surface 34 and recess 36.One accommodation space 14.2 first conductors 70, insulated body 30 coats, have one first upper surface 71, first lower surface 72 and extension 75, wherein, extension 75 is arranged on insulator 30 first upper surfaces 31, and first upper surface 71 and first lower surface 72 are all exposed and protrude from outside insulator 30 first upper surfaces 31 and second lower surface 34 power supply property connection usefulness.One second conductor 70a is arranged on insulator 30 first upper surfaces 31.One the 3rd conductor 70b is arranged at insulator 30 first lower surfaces 32, and its insulated body 30 coats, and makes the first lower surface 72b be exposed to insulator 30 first lower surfaces 32.In the said method, the 3rd conductor 70b can be provided with extension by demand, makes circuit board 11 become a circuit board with double-deck conductive layer, also can be by demand in making step, the second guide plate 70s is not set, makes circuit board 11 not have the 3rd conductor 70b and become first kind circuit board 10.
The above only is preferred embodiment of the present invention, conductor will be electrically to be transferred to the function of first lower surface from insulator first upper surface constant down, when not limiting practical range of the present invention with this, for example: shown in Figure 1A, wherein, assembly 80 also can have a hole by demand.Shown in Fig. 1 E, wherein, assembly 80 not only can be embodied as heat sink, and can be embodied as second conductor.Shown in Fig. 1 K, wherein, the 3rd conductor 70b and the second conductor 70a can exchange each other, and just the 3rd conductor 70b can be embodied as second conductor, and the second conductor 70a then can be embodied as the 3rd conductor.Shown in Fig. 1 N, wherein, conductive paste 62 can be replaced by another insulator by demand.Shown in Fig. 1 H, Fig. 1 I, assembly 80 can by demand be arranged on first upper surface 31 of insulator 30 or first lower surface 32 and not insulated body 30 coat, maybe can assembly 80 first sides 83 insulated bodys 30 be coated, so also can make circuit board have more practicality by demand.Shown in Fig. 1 M, Fig. 1 N, the second conductor 70a can by demand be arranged on first upper surface 31 of insulator 30 or first lower surface 32 and not insulated body 30 coat, maybe can the second conductor 70a second side 74a insulated body 30 be coated, so also can make circuit board have more practicality by demand.Shown in Fig. 1 P, wherein, be positioned at first conductor 70 of insulator 30 first upper surfaces 31 and be positioned at insulator first lower surface 31 first conductor 70 the two, can one the 3rd conductor be set by demand, it is each first conductor, 70 electrical communication, and this 3rd conductor can be embodied as tin or copper conductive path etc.Shown in Fig. 1 Q, circuit board 12 can not have the 3rd conductor 70b by demand, makes first conductor, 70 first lower surfaces 72 exposed and protrude from the first insulator 30a surface, so can reach the effect that the tin ball need not be set and save material yet.And for example shown in Figure 1A, Fig. 1 E or Fig. 1 F, assembly 80 also can be made different shapes by demand, and first upper surface 31, first lower surface 32 or the insulated body 30 that are arranged on insulator 30 coat, and so, can promote radiating efficiency and makes circuit board have more practicality.And as shown in Figure 4, if assembly 80 is with first and second conductor 70, when 70a all is embodied as conductive material, then assembly 80 can be changed function by demand with first and second conductor 70,70a, as assembly 80 being embodied as the second conductor 70a, or the second conductor 70a is embodied as assembly 80, so, can make the use of circuit board have more elasticity.As shown in Figure 6, wherein, also can one heat sink be set on the non-acting surface 22 of chip 20 by demand.Shown in the method for Figure 13, Figure 14, Figure 15, Figure 16 or Figure 17, can by demand one or more insulators, conductor or assembly be set again at circuit board surface, form the circuit board of multilayer conductive layer through processing procedures such as etching, removings, and pass through conductive paste, conductive path or electrodeposited coating with the conductor electrical communication between each conductive layer, wherein, the first conductive plate 70p as shown in FIG. 13A can be made by copper or metal alloy suitable materials such as (metallic alloy) by demand.Shown in Figure 14 A, wherein, on the first conductive plate 70p first, lower surface 71p, the number of plies of last each conductive layer of 72p can be by demand storehouse and have the number of plies that second conductive layer or the 3rd conductive layer etc. successively increase again layer by layer, and also can only first conductive layer 55 be set by demand at the first conductive plate 70p, the first lower surface 72p, make first conductor, 70 first upper surfaces 71 shown in Figure 14 F not have first conductive layer 55, and the material of each conductive layer also can change metal material by demand, for example, first conductive layer is embodied as nickel, second conductive layer is embodied as proper metal materials such as gold, simultaneously, first conductive layer 55 of preset shape also can be set on the first guide plate 70p by demand, be beneficial to the usability of etching operation and lifting circuit board 10.And shown in Fig. 1 P or Figure 16 B, wherein, the circuit board 11 of Fig. 1 P is between insulator 30 and first conductor 70 (containing first conductive layer, 55 sides 58 and the second conductive layer 55a side 58a), can one insulating barrier (insulating layer) be set by demand, in view of the above, make first conductor 70 (containing first conductive layer, 55 sides 58 and the second conductive layer 55a side 58a) but insulated body 30 coats more firmly, promote the zygosity of first conductor 70, first conductive layer 55, the second conductive layer 55a and insulator 30.Shown in Figure 16 B, wherein, the two also can be provided with an insulating barrier (insulating layer) by demand at the first conductive plate 70p and insulator 30, in view of the above, also insulated body 30 coatings are more firm but make the first conductive plate 70p, promote the zygosity of the first conductive plate 70p and insulator 30.When implementing etch process, the some of insulating barrier can be removed, and so, the some of insulator 30 first upper surfaces 31 (consulting Figure 16 D) just can be exposed in atmosphere (atmosphere), and simultaneously, this insulating barrier can be embodied as the some of insulator 30.Shown in Figure 16 E, wherein, second lower surface 34 of insulator 30 can exchange each other with first lower surface 32 of insulator 30, and just second lower surface 34 of insulator 30 can be embodied as first lower surface 32, and first lower surface 32 of insulator 30 then can be embodied as second lower surface 34.The second conductive plate 70s shown in Figure 17 A can not be provided with by demand yet, makes only to have filler 43 on the adhesive tape 47, and so, the circuit board 11 shown in Figure 17 D just can form first kind circuit board of the present invention.Simultaneously, the second conductive plate 70s shown in Figure 17 (A, B, C) can be replaced by a plurality of second conductor 70a by demand.So all, all should be included in the category that patent of the present invention contains for numerical value change or equivalent elements displacement or claims are done according to the present invention equalization change and modification.

Claims (26)

1, a kind of circuit board of electronic installation, it includes: the insulator and first conductor; It is characterized in that:
Described insulator has first upper surface, first lower surface and side;
Described first conductor, have first upper surface, first lower surface and first side, described first conductor is coated by described insulator, make the first side of described first conductor have at least some to be embedded in the described insulator, first upper surface of described first conductor has a part of protrusion at least and exposes in the described insulator first upper surface outside, and first lower surface of described first conductor has at least some to expose in the described insulator first lower surface outside; Wherein, described first conductor is not to be made by conductive paste.
2, a kind of circuit board of electronic installation, it includes: the insulator and first conductor; It is characterized in that:
Described insulator has first upper surface, first lower surface and side;
Described first conductor, have first upper surface, first lower surface and first side, described first conductor is coated by described insulator, make the first side of described first conductor have at least some to be embedded in the described insulator, first upper surface of described first conductor has a part of protrusion at least and exposes in the described insulator first upper surface outside, and first lower surface of described first conductor has at least some to protrude and expose in the described insulator first lower surface outside; Wherein, described first conductor is not to be made by conductive paste.
3, a kind of circuit board of electronic installation, it includes: the insulator and first conductor; It is characterized in that:
Described insulator has first upper surface, first lower surface, side and penetration state accommodation space;
Described first conductor, be arranged on the periphery of described insulator penetration state accommodation space, have first upper surface, first lower surface, first side and second side, described first conductor is coated by described insulator, wherein, described first side is coated and is not exposed to described insulator by described insulator, described second side is not coated and is exposed to the penetration state accommodation space of described insulator by described insulator, and makes described first upper surface and first lower surface be exposed to described insulator first upper surface and first lower surface respectively; Wherein, described first conductor is not to be made by conductive paste.
4, a kind of circuit board of electronic installation, it includes: insulator, first conductor and assembly; It is characterized in that:
Described insulator has first upper surface, first lower surface and side;
Described first conductor, have first upper surface, first lower surface and first side, described first conductor is coated by described insulator, make the first side of described first conductor have at least some to be embedded in the described insulator, first upper surface of described first conductor and first lower surface have at least some to expose respectively in described insulator first upper surface and the first lower surface outside; Wherein, described first conductor is not to be made by conductive paste;
Described assembly, it is arranged on first upper surface of described insulator, have first upper surface, first lower surface and first side, described assembly is coated by described insulator, make described assembly first side have at least one part to be embedded in the described insulator, first upper surface of described assembly exposes in the described insulator first upper surface outside, and described assembly first lower surface is coated by described insulator and is not exposed to described insulator.
5, a kind of circuit board of electronic installation, it includes: insulator, first conductor and assembly; It is characterized in that:
Described insulator, it has first upper surface, first lower surface and side;
Described first conductor, it has first upper surface, first lower surface and first side, described first conductor is coated by described insulator, make the described first conductor first side have at least one part to be embedded in the described insulator, first upper surface of described first conductor and first lower surface have at least some to expose respectively in described insulator first upper surface and the first lower surface outside; Wherein, described first conductor is not to be made by conductive paste;
Described assembly, it is arranged on first upper surface of described insulator, have first upper surface, first lower surface and first side, described assembly first lower surface is engaged with described insulator, and first upper surface of described assembly and first side are not all coated and expose in the described insulator first upper surface outside by described insulator.
6, a kind of circuit board of electronic installation, it includes: the insulator and first conductor; It is characterized in that:
Described insulator, it has first upper surface, first lower surface, side and hole;
Described first conductor, it has first upper surface, first lower surface, first side and extension, the first side of described first conductor is arranged in the hole of described insulator and is not coated by described insulator, the extension of described first conductor is arranged on described insulator first upper surface, make the extension of described first conductor have some at least for protruding and exposing in the described insulator first upper surface outside, first lower surface of described first conductor has at least some to expose in the described insulator first lower surface outside.
7, a kind of circuit board of electronic installation, it includes: the insulator and first conductor; It is characterized in that:
Described insulator, it has first upper surface, first lower surface and side;
Described first conductor, it has protuberance, first lower surface and first side, wherein, described protuberance has a upper surface, described protuberance upper surface forms first upper surface of described first conductor, make described first conductor, first upper surface be standing shape, described first conductor is coated by described insulator, make the described first conductor first side have at least one part to be embedded in the described insulator, the protuberance of described first conductor has at least some to expose in the described insulator first upper surface outside, and first lower surface of described first conductor has at least some to expose in the described insulator first lower surface outside; Wherein, described first conductor is not to be made by conductive paste.
8, a kind of circuit board of electronic installation, it includes: insulator, first conductor and first conductive layer; It is characterized in that:
Described first conductor, it has first upper surface, first lower surface and first side;
Described first conductive layer, it has a upper surface, lower surface and side, and wherein, described first conductive layer is arranged on first upper surface of described first conductor and engages with described first conductor;
Described insulator, it has first upper surface, first lower surface and side, wherein, the side of the first side of described first conductor and first conductive layer is coated by described insulator and is embedded in the described insulator, and described first conductor, first upper surface is lower than described insulator first upper surface, and the upper surface of described first conductive layer exposes to described insulator first upper surface.
9, a kind of circuit board of electronic installation, it includes: the insulator and first conductor; It is characterized in that:
Described insulator, it has first upper surface, first lower surface and side;
Described first conductor, it has first upper surface, first lower surface, first side and second side, described first conductor is coated by described insulator, wherein, described first side has at least some to be coated and be embedded in the described insulator by described insulator, and make described second side have at least some not coated by described insulator and be exposed to described insulator side outside, and described first upper surface and first lower surface are exposed to described insulator first upper surface and first lower surface respectively; Wherein, described first conductor is not to be made by conductive paste.
10, as the circuit board of claim 1 or 2 or 3 or 4 or 5 or 7 or 8 or 9 described a kind of electronic installations, it is characterized in that: described first conductor has extension, and described extension is bonded on described insulator first upper surface or described insulator first lower surface.
11, as the circuit board of claim 1 or 2 or 4 or 5 or 6 or 7 or 8 or 9 described a kind of electronic installations, it is characterized in that: described circuit board has the hole of a penetration state, and described hole is the accommodation space of described circuit board.
12, as the circuit board of claim 1 or 2 or 3 or 4 or 6 or 7 or 8 or 9 described a kind of electronic installations, it is characterized in that: first upper surface or first lower surface at described insulator are provided with assembly, described assembly has first upper surface, first lower surface and first side, first lower surface of described assembly engages with described insulator, first upper surface of described assembly and first side are not coated by described insulator and be exposed to described insulator, and described assembly is described second conductor or described heat sink.
13, circuit board as claim 1 or 2 or 3 or 5 or 6 or 7 or 8 or 9 described a kind of electronic installations, it is characterized in that: first upper surface or first lower surface at described insulator are provided with assembly, described assembly has first upper surface, first lower surface and first side, first lower surface of described assembly is coated and is not exposed to described insulator exterior by described insulator, its first side has a part of described insulator exterior that coated and be not exposed to by described insulator at least, and its first upper surface is not coated by described insulator and be exposed to described insulator exterior, and described assembly is described second conductor or described heat sink.
14, as the circuit board of claim 1 or 2 or 3 or 4 or 5 or 6 or 7 or 8 or 9 described a kind of electronic installations, it is characterized in that: in described insulator, assembly is set, described assembly has first upper surface, first lower surface and first side, described assembly first side has a part of described insulator exterior that coated and be not exposed to by described insulator at least, and its first upper surface and first lower surface are not coated by described insulator and be exposed to described insulator exterior respectively, and described assembly is described second conductor or described heat sink.
15, as the circuit board of claim 13 or 14 described a kind of electronic installations, it is characterized in that: described assembly has extension, and described extension is bonded on the described insulator.
16, as the circuit board of claim 12 or 13 or 14 described a kind of electronic installations, it is characterized in that: described assembly has the hole of penetration state.
17, as the circuit board of claim 12 or 13 or 14 described a kind of electronic installations, it is characterized in that: described assembly has recess, makes described assembly have first upper surface and second upper surface, or has first lower surface and second lower surface.
18, circuit board as claim 1 or 2 or 3 or 4 or 5 or 6 or 7 or 8 or 9 described a kind of electronic installations, it is characterized in that: one second insulator is set on the described circuit board, described second insulator has first upper surface, first lower surface and side, and the 3rd conductor is set in described second insulator, make described the 3rd conductor respectively with the first conductor electrical communication of described circuit board, make described circuit board form a circuit board with multilayer conductive layer, pass through conductive path between described the 3rd conductor and described first conductor, a kind of formation electrical communication in the mode such as tin cream or plated metal.
19, the circuit board of a kind of electronic installation as claimed in claim 8, it is characterized in that: also include at least one second conductive layer, it has a upper surface, lower surface and side, described second conductive layer is arranged on the upper surface of described first conductive layer, upper surface at least a portion of described first conductive layer is coated by described second conductive layer, the described second conductive layer side is coated and is embedded in the described insulator by described insulator, and the upper surface of described second conductive layer then is exposed to described insulator first upper surface.
20, the circuit board of a kind of electronic installation as claimed in claim 8, it is characterized in that: also include another first conductor and another first conductive layer, described another first conductor has first upper surface, first lower surface and first side, described another first conductive layer has upper surface, lower surface and side, described another first conductive layer is arranged on first upper surface of described another first conductor, make described another first conductor combine and be coated and be embedded in the described insulator by described insulator with described another first conductive layer, first upper surface of described another first conductor is lower than first lower surface of described insulator, and the upper surface of described another first conductive layer exposes first lower surface at described insulator.
21, the circuit board of a kind of electronic installation as claimed in claim 20, it is characterized in that: also include at least one second conductive layer, it is arranged on the upper surface of described another first conductive layer, at least one part of upper surface of described another first conductive layer is coated by described second conductive layer, described second conductive layer is coated and is embedded in the described insulator by described insulator, and the upper surface of described second conductive layer is exposed to described insulator first lower surface.
22, the circuit board of a kind of electronic installation as claimed in claim 8 is characterized in that: first lower surface of described first conductor is exposed to described insulator first lower surface.
23, as the circuit board of claim 1 or 2 or 3 or 4 or 5 or 6 or 7 or 8 or 9 described a kind of electronic installations, it is characterized in that: after described circuit board was arranged at electronic installation, described electronic installation comprised having:
At least one circuit board, it has at least one accommodation space and at least one first conductor;
At least one chip, it is arranged on the accommodation space of described circuit board;
At least one electric-conductor, it engages with first conductor of described chip and described circuit board respectively, and first conductor of described chip and described circuit board is electrically connected, and wherein, described electric-conductor is conductor wire or conduction protuberance;
At least one packaging body, it seals described circuit board, chip and electric-conductor.
24, as the circuit board of claim 3 or 11 described a kind of electronic installations, it is characterized in that: after described circuit board was arranged at described electronic installation, described electronic installation comprised having:
At least one circuit board, it has at least one penetration state accommodation space and at least one first conductor;
At least one chip, it is arranged in the penetration state accommodation space of described circuit board;
At least one electric-conductor, it engages with first conductor of described chip and described circuit board respectively, and first conductor of described chip and described circuit board is electrically connected, and wherein, described electric-conductor is a conductor wire;
At least one packaging body, it seals described circuit board, chip and electric-conductor.
25, as the circuit board of claim 3 or 11 described a kind of electronic installations, it is characterized in that: after described circuit board was arranged at described electronic installation, described electronic installation comprised having:
At least one circuit board, it has at least one penetration state accommodation space and at least one first conductor;
At least one chip, the acting surface of described chip and the surface engagement of described circuit board, and be arranged on the penetration state accommodation space of described circuit board;
At least one electric-conductor, it engages with first conductor of described chip and described circuit board respectively, and first conductor of described chip and described circuit board is electrically connected, and wherein, described electric-conductor is conductor wire or conduction protuberance;
At least one packaging body, it seals described circuit board, chip and electric-conductor.
26, as the circuit board of claim 1 or 2 or 4 or 5 or 6 or 7 or 8 or 9 described a kind of electronic installations, it is characterized in that: after described circuit board was arranged at described electronic installation, described electronic installation comprised having:
At least one circuit board, it has at least one accommodation space and at least one first conductor;
At least one chip, it is arranged on the side of described circuit board;
At least one electric-conductor, it engages with first conductor of described chip and described circuit board respectively, and first conductor of described chip and described circuit board is electrically connected, and wherein, described electric-conductor is a conductor wire;
At least one packaging body, it seals described circuit board, chip and electric-conductor.
CNA2005101327789A 2005-03-15 2005-12-26 Circuit board of electronic device and mfg method thereof Pending CN1835211A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
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Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
CN200510053984 2005-03-15
CN200510053984.0 2005-03-15
CNA2005101327789A CN1835211A (en) 2005-03-15 2005-12-26 Circuit board of electronic device and mfg method thereof

Publications (1)

Publication Number Publication Date
CN1835211A true CN1835211A (en) 2006-09-20

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Family Applications (1)

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105428325A (en) * 2015-12-22 2016-03-23 苏州日月新半导体有限公司 Preparation process of single-layer ultrathin substrate packaging structure with metal shielding layer and product thereof
CN109560183A (en) * 2015-04-29 2019-04-02 光宝光电(常州)有限公司 Multi-layer circuit boards and light-emitting diode encapsulation structure
CN110677986A (en) * 2015-04-17 2020-01-10 王忠宝 Circuit board structure
CN111599279A (en) * 2020-06-03 2020-08-28 昆山国显光电有限公司 Display panel and display device

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110677986A (en) * 2015-04-17 2020-01-10 王忠宝 Circuit board structure
CN109560183A (en) * 2015-04-29 2019-04-02 光宝光电(常州)有限公司 Multi-layer circuit boards and light-emitting diode encapsulation structure
CN109560183B (en) * 2015-04-29 2020-04-17 光宝光电(常州)有限公司 Multi-layer circuit board and light emitting diode packaging structure
CN105428325A (en) * 2015-12-22 2016-03-23 苏州日月新半导体有限公司 Preparation process of single-layer ultrathin substrate packaging structure with metal shielding layer and product thereof
CN105428325B (en) * 2015-12-22 2017-03-22 苏州日月新半导体有限公司 Preparation process of single-layer ultrathin substrate packaging structure with metal shielding layer and product thereof
CN111599279A (en) * 2020-06-03 2020-08-28 昆山国显光电有限公司 Display panel and display device

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Application publication date: 20060920