CN2631045Y

CN2631045Y - Image sensor

Info

Publication number: CN2631045Y
Application number: CNU032618980U
Authority: CN
Inventors: 谢志鸿; 吴志成
Original assignee: Kingpak Technology Inc
Current assignee: Kingpak Technology Inc
Priority date: 2003-06-03
Filing date: 2003-06-03
Publication date: 2004-08-04
Anticipated expiration: 2013-06-03

Abstract

Provided is a vision sensor. Aiming at providing a sensor which can increase the reliability, provide a fine heat dissipation effect, increase the fixing stability, is convenient for lead bonding and increase the yield of the product, the utility model is proposed. The utility model comprises a plurality of lower and upper layers of metal tablets which are put in order with intervals, possess upper and lower surfaces and are stacked together, a seal adhesive body which formed the flange layer, a vision sensing wafer, a plurality of upper surface conductors which connect through electricity the vision sensing wafer to a plurality of upper layer metal tablets and an euphotic layer.

Description

Image sensor

Technical field

The utility model belongs to sensor, particularly a kind of image sensor.

Background technology

As shown in Figure 1, known image sensor comprises substrate 10, flange layer 18, image sensing wafer 22, several wires 24 and photic zone 26.

Substrate 10 is to be made up of the sheet metal 12 of several spaces arrangements, and several sheet metals 12 form first plate 14 and second plate 16 of differing heights.

Flange layer 18 is to be formed at substrate 10 peripheries and bottom surface, and itself and substrate 10 form disposal area 20, and top and the following of second plate 16 of several sheet metal 12 first plates 14 exposed by flange layer 18 respectively.

Image sensing wafer 22 is to be arranged in the disposal area 20 of flange layer 18 and substrate 10 formation.

Several wires 24 is the top and image sensing wafer 22 that is electrically connected several sheet metal 12 first plates 14 respectively.

Photic zone 26 is to be arranged on the flange layer 18, to cover image sensing wafer 22.

Though known image sensor really can reach its creation purpose and effect, precisely because still deposit following disappearance:

When 1, making, owing to sheet metal 12 must be bent into first plate 14 and second plate 16 of differing heights, will cause first plate 14 smooth inadequately, make when going between the bonding processing procedure, lead 24 can't successfully be followed on sheet metal 12, so that influence its yield.

Can't stamp out the bigger sheet metal of thickness 12 during 2, because of manufacturing, make second plate, 16 thin thickness of sheet metal 12, so in soldering (SMT) process, scolding tin can't be in the side climbing of sheet metal 12 second plates 16, so that have influence on the stability that packaging body is fixed in printed circuit board (PCB).

Summary of the invention

The purpose of this utility model provides and a kind ofly improves the encapsulation reliability, improves the fixing-stable degree, the bonding of being convenient to go between, improves the image sensor of product yield.

The utility model comprises the lower metal sheet of arranging several spaces, upper strata sheet metal, adhesive body, image sensing wafer, several wires and the photic zone that arrange several spaces; Each lower metal sheet is provided with upper surface and lower surface; Each upper strata sheet metal is provided with upper surface and is stacked and placed on lower surface on the corresponding lower metal sheet upper surface; Adhesive body coats and sticks together several upper and lower layer sheet metals, and the upper surface of each upper strata sheet metal is exposed by adhesive body, and the lower surface of each lower metal sheet is exposed by adhesive body; Adhesive body forms flange layer in the upper surface periphery of several upper strata sheet metals, so that itself and several upper strata sheet metal constitutes accommodation chamber; Image sensing wafer is arranged in the accommodation chamber; Several wires is electrically connected the upper surface of image sensing wafer and several upper strata sheet metals: photic zone is covered on the adhesive body flange layer to cover image sensing wafer.

Wherein:

Contour correspondence is provided with the intermediate plate that is provided with for image sensing wafer between several upper strata sheet metals.

Adhesive body is industrial plastic material; Flange layer and adhesive body are one-body molded.

Photic zone is a transparent glass.

Since the utility model comprise several spaces arrange and be respectively equipped with the upper and lower layer sheet metal on upper and lower surface, form flange layer adhesive body, image sensing wafer, electrical connection image sensing wafer and several upper strata sheet metals upper surface several wires and be covered on photic zone on the flange layer; Each upper strata sheet metal is stacked and placed on the corresponding lower metal sheet upper surface with its lower surface.Stacked upper and lower layer sheet metal has evenness and bigger thickness preferably, therefore, be convenient to go between the bonding operation carrying out and can improve the encapsulation yield of product, and with its soldering on printed circuit board (PCB) the time, scolding tin can be climbed on the sheet metal of upper strata by the lower metal sheet, and packaging body more firmly is fixed on the printed circuit board (PCB).Not only improve the encapsulation reliability, improve the fixing-stable degree, and the bonding of being convenient to go between, improve the product yield, thereby reach the purpose of this utility model.

Description of drawings

Fig. 1, be known image sensor structure schematic sectional view.

Fig. 2, be the utility model structural representation cutaway view.

Fig. 3, be the utility model encapsulation step one, two schematic diagrames.

Fig. 4, be the utility model encapsulation step three, four schematic diagrames.

Embodiment

As shown in Figure 2, the utility model includes the lower metal sheet of arranging several spaces 30, upper strata sheet metal 32, adhesive body 34, image sensing wafer 36, several wires 38 and the photic zone 40 that arrange several spaces.

The lower metal sheet 30 that arrange each space is provided with upper surface 42 and lower surface 44; Lower surface 44 is to weld in soldering (SMT) mode by scolding tin 60 to be located on the printed circuit board (PCB) 58.

The upper strata sheet metal 32 that arrange each space is provided with upper surface 46 and lower surface 48, the lower surface 48 of upper strata sheet metal 32 is on the corresponding upper surface 42 that is stacked at lower metal sheet 30, and is provided with intermediate plate 50 in 36 contour correspondences of several upper strata sheet metals.

Adhesive body 34 is to coat to stick together several lower metal sheets 30, several upper strata sheet metals 32 and intermediate plate 50, and the upper surface 46 of each upper strata sheet metal 32 and the upper surface of intermediate plate 50 are exposed by adhesive body 34, the lower surface 44 of each lower metal sheet 30 is exposed by adhesive body 34; Adhesive body 34 forms the flange layer 54 that constitutes accommodation chamber 56 with several upper strata sheet metals 32 in upper surface 46 peripheries of upper strata sheet metal 32.

Image sensing wafer 36 is to be arranged on the intermediate plate 50, and is positioned at accommodation chamber 56.

Several wires 38 is the upper surface 46 that is electrically connected image sensing wafer 36 and several upper strata sheet metals 32, so that the signal of image sensing wafer 36 can be passed to upper strata sheet metal 32.

Photic zone 40 is a transparent glass, and it is to be covered on the flange layer 54 of adhesive body 34 and to cover image sensing wafer 36, receives the light signals so that image sensing wafer 36 can see through photic zone 40.

Comprise the following steps: during the utility model encapsulation

Step 1

Several upper and lower

layer sheet metals

30,32 are provided

As shown in Figure 3, provide several spaces to arrange and be provided with the lower metal sheet 30 of upper surface 42 and lower surface 44;

Provide several spaces to arrange and be provided with the upper strata sheet metal 32 of upper surface 46 and lower surface 48, sheet metal 32 lower surfaces 48 in upper strata are on the corresponding upper surface 42 that is stacked at lower metal sheet 30, and are provided with intermediate plate 50 in 36 contour correspondences of several upper strata sheet metals.

Step 2

Form adhesive body 54

As shown in Figure 3, form adhesive body 34, it is to be that material forms by injection molding method with industrial plastic cement, adhesive body 34 coats and sticks together several lower metal sheets 30, several upper strata sheet metals 32 and intermediate plate 50, and the upper surface 46 of each upper strata sheet metal 32 and the upper surface of intermediate plate 50 are exposed by adhesive body 34, the lower surface 44 of each lower metal sheet 30 is exposed by adhesive body 34; Adhesive body 34 forms the flange layer 54 that constitutes accommodation chamber 56 with several upper strata sheet metals 32 in upper surface 46 peripheries of upper strata sheet metal 32.

Step 3

Image sensing wafer 36 is set

As shown in Figure 4, provide image sensing wafer 36 also will be arranged on the intermediate plate 50 of several upper strata sheet metals 32, and be positioned at accommodation chamber 56.

Step 4

The lead-in wire bonding

As shown in Figure 4, several wires 38 is provided and is electrically connected image sensing wafer 36 and the upper surface 46 of upper strata sheet metal 32, so that the signal of image sensing wafer 36 is passed to upper strata sheet metal 32.

Step 5

Photic zone 40 is set

As shown in Figure 2, provide the photic zone 40 that can be transparent glass, and it is covered on the flange layer 54 of adhesive body 34, use covering image sensing wafer 36, receive the light signal so that image sensing wafer 36 can see through photic zone 40.

As mentioned above, the utlity model has following advantage:

1, upper and lower

layer sheet metal

32,30 is by two dull and stereotyped formation, thus have evenness preferably, therefore, the encapsulation yield of be convenient to go between bonding operation and raising product.

2, upper and lower

layer sheet metal

32,30 formed higher thickness, and therefore, it is when soldering is on printed circuit board (PCB) 58, and scolding tin 60 can be climbed on upper strata sheet metal 32 by lower metal sheet 30, and the utility model more firmly is fixed on the printed circuit board (PCB) 58.

Claims

1, a kind of image sensor, it comprises the sheet metal several spaces arranged, coat stick together several sheet metals and in several sheet metal peripheries form flanges with several sheet metals constitute accommodation chambers adhesive body, be arranged at image sensing wafer in the accommodation chamber, be electrically connected the several wires of image sensing wafer and sheet metal upper surface and be covered on the adhesive body flange layer to cover the photic zone of image sensing wafer; It is characterized in that several upper and lower layer sheet metals that described several sheet metals are arranged by the space constitute; Each lower metal sheet is provided with upper surface and lower surface; Each upper strata sheet metal is provided with upper surface and is stacked and placed on lower surface on the corresponding lower metal sheet upper surface; Adhesive body coats and sticks together several upper and lower layer sheet metals, and the upper surface of each upper strata sheet metal is exposed by adhesive body, and the lower surface of each lower metal sheet is exposed by adhesive body; Adhesive body forms flange layer in the upper surface periphery of several upper strata sheet metals, so that itself and several upper strata sheet metal constitutes accommodation chamber; Several wires system is electrically connected image sensing wafer to the upper surface of several upper strata sheet metals.

2, image sensor according to claim 1 is characterized in that contour correspondence is provided with the intermediate plate that is provided with for image sensing wafer between described several upper strata sheet metals.

3, image sensor according to claim 1 is characterized in that described adhesive body is industrial plastic material; Flange layer and adhesive body are one-body molded.

4, image sensor according to claim 1 is characterized in that described photic zone is a transparent glass.