CN2543207Y

CN2543207Y - Image sensing device

Info

Publication number: CN2543207Y
Application number: CN 02231008
Authority: CN
Inventors: 庄俊华; 谢志鸿; 吴志成
Original assignee: Kingpak Technology Inc
Current assignee: Kingpak Technology Inc
Priority date: 2002-04-11
Filing date: 2002-04-11
Publication date: 2003-04-02
Anticipated expiration: 2012-04-11

Abstract

The utility model relates to an image sensor for simplifying package process, improving product yield, and lowering package production cost. The image sensor comprises a substrate, a flange layer arranged at the substrate periphery and bottom, an image sensing chip on the substrate, a plurality of leads electrically connected between the image sensing chip and the substrate, and a light permeable layer covered on the flange layer. The substrate comprises a plurality of metal pieces spaced from each other; each metal piece comprises a first plate with higher height and a second plate with lower height as electric connection point; the upper face of the first plate and the lower face of the second plate are respectively exposed via the flange layer; an accommodation zone for accommodating the image sensing chip is formed between the flange layer and the substrate; and the plurality of leads electrically connected between the image sensing chip and the substrate are connected on the upper face of the first plate of the metal piece.

Description

Image sensor

Technical field

The utility model belongs to sensor, particularly a kind of image sensor.

Background technology

As shown in Figure 1 and Figure 2, known to the image sensing wafer method for packing, be at first to provide cloth to be implanted with the substrate 10 that circuit 12 surrounds plurality of regions 17, use that a plurality of image sensing wafers 13 are disposed on the plurality of regions 17; The flange layer 14 that is formed with several and circuit 12 corresponding hollow out zones 16 is provided then, and flange layer 14 is attached on the substrate 10, so that a plurality of image sensing wafers 13 on the substrate 10 are exposed by hollow out zone 16 by viscose 15; Be electrically connected image sensing wafer 13 and substrate 10 with plural wires 18 again; At last substrate 10 is cut into single and stick together the packaging body that flange layer 14 is arranged; Then as shown in Figure 3, single packaging body is put in tool 22, orienting the zone of ccontaining transparent glass 20, and transparent glass 20 is covered on the flange layer 14, just finish the encapsulation of image sensing wafer 13.

There is following shortcoming in known image sensor, makes its packaging cost higher.

1, must make substrate 10, and cloth is planted circuit 12 on substrate 10 in advance; Row is made flange layer 14 again, and flange layer 14 is attached on the substrate 10; So, its fabrication schedule is quite complicated, and fee of material is also higher, makes its whole manufacturing cost height.

2, after the encapsulation of finishing image sensor, must cut into single packaging body; Because flange layer 14 is to be attached on the substrate 10 by viscose 15, so that when desiring to be cut to single encapsulation, often cause viscose 15 to overflow, thereby have influence on the signal transmission of substrate 10.

3, carry out after the program system of covering transparent glass 20 gives cutting substrate 10, cause cutting bits pollution image sensing wafer 13 this moment easily, thereby will have influence on the yield of image sensing wafer 13.

Summary of the invention

The purpose of this utility model provides a kind of image sensor of simplifying encapsulation procedure, raising product yield, reducing the encapsulation production cost.

The utility model comprises substrate, be arranged at the flange layer of substrate periphery and bottom surface, be arranged at image sensing wafer on the substrate, be electrically connected on the plural wires between image sensing wafer and the substrate and be covered in photic zone on the flange layer; The sheet metal that substrate system is arranged by a plurality of spaces; Low second plate of first plate that each sheet metal height is higher and height as electric connection point, and make top and the following of second plate of first plate of plural sheet metal expose by flange layer respectively; Form the disposal area of ccontaining image sensing wafer between flange layer and the substrate; Be electrically connected on plural wires system between image sensing wafer and the substrate be electrically connected on sheet metal first plate above.

Wherein:

Flange layer with thermoplastic plastic's ejection formation on substrate.

Between first plate of sheet metal and second plate is that the 3rd plate is connected.

Photic zone is a transparent glass.

Form the intermediate plate that image sensing wafer is set and separates in the middle of each sheet metal of substrate with each metallic plate.

Because the utility model comprises substrate, be arranged at substrate periphery and bottom surface flange layer, be arranged at image sensing wafer on the substrate, be electrically connected on the plural wires between image sensing wafer and the substrate and be covered in photic zone on the flange layer; The sheet metal that substrate system is arranged by a plurality of spaces; Low second plate of first plate that each sheet metal height is higher and height as electric connection point, and make top and the following of second plate of first plate of plural sheet metal expose by flange layer respectively; Form the disposal area of ccontaining image sensing wafer between flange layer and the substrate; Be electrically connected on plural wires system between image sensing wafer and the substrate be electrically connected on sheet metal first plate above.Be that the utility model is to be spaced with a plurality of sheet metals to form substrate, and be the output of signal with each sheet metal, can save the known expense that is produced in the substrate implant circuit, therefore, can effectively reduce production costs, simplify the known processing procedure that sticks together, and can avoid cutting into the situation that single packaging body produces the glue that overflows, can improve the product yield effectively.Not only simplify encapsulation procedure, and improve product yield, reduction encapsulation production cost, thereby reach the purpose of this utility model.

Description of drawings

Fig. 1, be known image sensor decomposition texture schematic isometric.

Fig. 2, for known image sensor structure schematic sectional view (cutting into single packaging body)

Fig. 3, be known image sensor structure schematic sectional view (capping transparent glass).

Fig. 4, be the utility model structural representation cutaway view.

Embodiment

As shown in Figure 4, the utility model comprises substrate 70, flange layer 72, image sensing wafer 74, plural wires 88 and photic zone 76.

Substrate 70 is made up of the sheet metal 78 and the intermediate plate 94 of the arrangement of a plurality of spaces, and first plate 80 and second plate, 82, the first plates 80 that each sheet metal 78 forms differing heights interconnect for height and by the 3rd plate 84 than second plate 82.During manufacturing, substrate 70 is directly to form the sheet metal of arranging the space 78 and be positioned at middle intermediate plate 94 with impact style, and is very easy in the manufacturing.

Flange layer 72 is directly to be formed at substrate 70 peripheries and bottom surface with thermoplastic plastic's mat jetting mold, uses plural sheet metal 78 and intermediate plate 94 in conjunction with substrate 70.Flange layer 72 forms disposal area 86 with substrate 70, and exposed top and the following of second plate 82 of first plate 80 of plural sheet metal 78 respectively by flange layer 72, that is following and second plate 82 of first plate 80 of plural sheet metal 78 above be all flange layer 72 and coat, and second plate 82 is following in order to be electrically connected to printed circuit board (PCB).

Image sensing wafer 74 is to be arranged on the intermediate plate 94 of substrate 70, and is positioned at disposal area 86.

Plural wires 88 be electrically connected the weld pad 90 of image sensing wafer 74 and substrate 70 each sheet metal 78 first plate 80 above, the signal of image sensing wafer 74 is passed on each sheet metal 78 by plural wires 88.

Photic zone 76 is a transparent glass, by adhesion layer 92 glutinous being located on the flange layer 72, thereby image sensing wafer 74 is enveloped, in order to receive the light signal.

As mentioned above, the utlity model has following advantage:

1, is spaced with a plurality of sheet metals 78 and forms substrate 70, and be the output of signal, can save the known expense that is produced in the substrate implant circuit, therefore, can effectively reduce production costs with each sheet metal 78.

2, directly form required flange layer 72 and, can simplify the known processing procedure that sticks together with shoot mode, and can avoid cutting into the situation that single packaging body produces the glue that overflows, can improve the product yield effectively a plurality of sheet metal 78 combinations.

Claims

1, a kind of image sensor, it comprises substrate, be arranged at the flange layer of substrate periphery and bottom surface, be arranged at image sensing wafer on the substrate, be electrically connected on the plural wires between image sensing wafer and the substrate and be covered in photic zone on the flange layer; Form the disposal area of ccontaining image sensing wafer between flange layer and the substrate; It is characterized in that described substrate is the sheet metal of being arranged by a plurality of spaces; Low second plate of first plate that each sheet metal height is higher and height as electric connection point, and make top and the following of second plate of first plate of plural sheet metal expose by flange layer respectively; Be electrically connected on plural wires system between image sensing wafer and the substrate be electrically connected on sheet metal first plate above.

2, image sensor according to claim 1, it is characterized in that described flange layer with thermoplastic plastic's ejection formation on substrate.

3, between the image sensor according to claim 1, first plate that it is characterized in that described sheet metal and second plate is that the 3rd plate is connected.

4, image sensor according to claim 1 is characterized in that described photic zone is a transparent glass.

5, image sensor according to claim 1 is characterized in that forming the intermediate plate that image sensing wafer is set and separates with each metallic plate in the middle of each sheet metal of described substrate.