CN2765329Y

CN2765329Y - Image sensor

Info

Publication number: CN2765329Y
Application number: CNU2005200023372U
Authority: CN
Inventors: 辛宗宪
Original assignee: Kingpak Technology Inc
Current assignee: Kingpak Technology Inc
Priority date: 2005-02-04
Filing date: 2005-02-04
Publication date: 2006-03-15
Anticipated expiration: 2015-02-04

Abstract

The utility model relates to an image sensor which is used for providing a light, thin, short and small sensor which has the advantages of use reliability and convenient manufacture. The utility model comprises a base plate, a flange layer, an image sensing chip which forms a plurality of welding pads, a plurality of conducting wires, a plurality of spherical media, a euphotic layer and an adhesive sealing layer, wherein the base plate is provided with an upper surface and a lower surface, a plurality of first electrodes are formed on the lower surface of the base plate, the flange layer is arranged on the upper surface of the base plate, a groove is formed from the flange layer and the base plate, a plurality of second electrodes are formed on the flange layer and are correspondingly and electrically connected to the first electrodes which are arranged on the base plate, and the image sensing chip is arranged on the upper surface of the base plate and is positioned in the groove. The conducting wires are respectively and electrically connected to the welding pads of the image sensing chip and among the second electrodes which are arranged on the flange layer. The spherical media are respectively arranged on the welding pads of the image sensing chip, the euphotic layer is covered above the spherical media to cover the image sensing chip, and the conducting wires are coated by the adhesive sealing layer which is used for fixing the euphotic layer.

Description

Image sensor

Technical field

The utility model belongs to sensor, particularly a kind of image sensor.

Background technology

As shown in Figure 1, existing image sensor comprises substrate 10, flange layer 18, image sensing chip 26, several wires 28 and photic zone 34.

Substrate 10 is provided with first surface 12 that forms first contact 15 and the second surface 14 that forms second contact 16.

Flange layer 18 is provided with upper surface 20 and lower surface 22.The lower surface 22 of flange layer 18 sticks together on the first surface 12 that is fixed in substrate 10, and forms accommodation chamber 24 with substrate 10.

Image sensing chip 26 is located in the accommodation chamber 24 of substrate 10 and flange layer 18 formation, and is fixed on the first surface 12 of substrate 10.

Several wires 28 has first end points 30 that is electrically connected to image sensing chip 26 and is electrically connected to second end points 32 of the signal input end 15 of substrate 10.

The photic zone 34 glutinous upper surfaces 20 of being located at flange layer 18.

Only because the periphery of existing image sensor substrate 10 is provided with flange layer 18, therefore, can't be on the substrate 10 of fixed dimension ccontaining bigger image sensing chip 26, maybe can't make the image sensor volume-diminished.And existing image sensor during bonding, often because of the distance limit of 26 of flange layer 18 and image sensing chips, makes the operation of lead-in wire bonding be difficult for carrying out at lead-in wire, thereby the production yield of reduction product.

Summary of the invention

The purpose of this utility model provides a kind of compact, dependability, makes image sensor easily.

The utility model comprises substrate, flange layer, forms the image sensing chip of several weld pads, several wires, several spherical mediums, photic zone and adhesive layer; Substrate is provided with upper and lower surface, and base lower surface forms several first electrodes; Flange layer is arranged at upper surface of base plate, and forms groove with substrate, forms corresponding on the flange layer and is electrically connected to several second electrodes of several first electrodes on the substrate; Image sensing chip is arranged on the upper surface of substrate, and is positioned at groove; Several wires be electrically connected on several weld pads of image sensing chip respectively and on the flange layer between several second electrodes; Several spherical mediums are arranged at respectively on several weld pads of image sensing chip; Photic zone is covered on several spherical medium tops, to cover image sensing chip; Adhesive layer envelopes several wires, and in order to photic zone is fixed.

Wherein:

Spherical medium is a Metal Ball.

Photic zone is a transparent glass.

Several wires is bonded on the weld pad of image sensing chip by second contact conductor on the flange layer.

A kind of image sensor, it comprises substrate, forms the image sensing chip of several weld pads, several wires, several spherical mediums, photic zone and adhesive layer; Substrate is provided with upper and lower surface, and base lower surface forms several first electrodes, and upper surface of base plate forms correspondence and is electrically connected to several second electrodes of several first electrodes on the lower surface; Image sensing chip is arranged on the upper surface of substrate; Being electrically connected on respectively on several weld pads of image sensing chip and the upper surface of base plate between several second electrodes of several wires; Several spherical mediums are arranged at respectively on several weld pads of image sensing chip; Photic zone is covered on several spherical medium tops, to cover image sensing chip; Adhesive layer envelopes several wires, and in order to photic zone is fixed.

Spherical medium is a Metal Ball.

Photic zone is a transparent glass.

Several wires is bonded on the weld pad of image sensing chip by second contact conductor on the upper surface of base plate.

Because the utility model comprises substrate, flange layer, forms image sensing chip, several wires, several spherical mediums, photic zone and the adhesive layer of several weld pads; Substrate is provided with upper and lower surface, and base lower surface forms several first electrodes; Flange layer is arranged at upper surface of base plate, and forms groove with substrate, forms corresponding on the flange layer and is electrically connected to several second electrodes of several first electrodes on the substrate; Image sensing chip is arranged on the upper surface of substrate, and is positioned at groove; Several wires be electrically connected on several weld pads of image sensing chip respectively and on the flange layer between several second electrodes; Several spherical mediums are arranged at respectively on several weld pads of image sensing chip; Photic zone is covered on several spherical medium tops, to cover image sensing chip; Adhesive layer envelopes several wires, and in order to the photic zone fixed bit.Several wires is electrically connected on the weld pad of image sensing chip and the flange layer between second electrode, makes the lead that is positioned at bond pad locations comparatively smooth, and does not have the phenomenon of losing, and can reduce packaging height; Can be convenient to go between the carrying out of bonding operation; Spherical medium is set on image sensing chip, can avoids photic zone to be pressed onto lead; Utilize spherical medium to support photic zone, can make photic zone more smooth.Not only compact, and dependability, manufacturing facility, thereby reach the purpose of this utility model.

Description of drawings

Fig. 1, be existing image sensor structure schematic sectional view.

Fig. 2, be the utility model embodiment one structural representation cutaway view.

Fig. 3, be the utility model embodiment two structural representation cutaway views.

Embodiment

Embodiment one

As shown in Figure 2, the utility model comprises substrate 40, flange layer 42, image sensing chip 44, several wires 46, several spherical mediums 47, photic zone 48 and adhesive layer 50.

Substrate 40 is provided with upper surface 52 and lower surface 54.Lower surface 54 is formed with several first electrodes 56.

Flange layer 42 is arranged at the upper surface 52 of substrate 40, and forms grooves 58 with substrate 40, forms corresponding on the flange layer 42 and is electrically connected to several second electrodes 60 of several first electrodes 56 on the substrate 40.

Image sensing chip 44 forms several weld pads 62, and image sensing chip 44 is arranged on the upper surface 52 of substrate 40, and is positioned at groove 58.

Several wires 46 is electrically connected on the weld pad 62 of image sensing chip 44 and the flange layer 42 between second electrode 60, and be bonded on the weld pad 62 of image sensing chip 44 by second electrode, 60 lead-in wires on the protruding level layer 42, be with, the lead 46 that is positioned at weld pad 62 positions is comparatively smooth, and does not have the phenomenon of losing.

Several spherical mediums 47 are the Metal Ball on the weld pad 62 that is arranged at image sensing chip 40 respectively.

Photic zone 48 is covered on the transparent glass of several spherical medium 47 tops, so as to image sensing chip 40 is covered.

Adhesive layer 50 envelopes several wires 46, and in order to photic zone 48 is fixed.

Embodiment two

As shown in Figure 3, the utility model comprises substrate 40a, image sensing chip 44, several wires 46, several spherical mediums 47, photic zone 48 and adhesive layer 50.

Substrate 40a is provided with upper surface 52 and lower surface 54.Lower surface 54 forms several first electrodes 56, and upper surface 52 forms correspondence and is electrically connected to several second electrodes 60 of several first electrodes 56 on the lower surface 54.

Image sensing chip 44 forms several weld pads 62, and image sensing chip 44 is arranged at the upper surface 52 of substrate 40a.

Several wires 46 is electrically connected between the weld pad 62 and corresponding several second electrodes 60 on the substrate 40a upper surface 52 of image sensing chip 44, and be bonded on the weld pad 62 of image sensing chip 44 by last second electrode of substrate 40a 60 lead-in wires, be with, the lead 46 that is positioned at weld pad 62 positions is comparatively smooth, and does not have the phenomenon of losing.

Several spherical mediums 47 are the Metal Ball on the weld pad 62 that is not arranged at image sensing chip 40a.

As mentioned above, the utlity model has following advantage:

1, the utility model is bonded on the weld pad 62 of image sensing chip 44 in substrate 40a or flange layer 42 lead-in wires, and therefore, the lead 46 that is positioned on the image sensing chip 44 will be comparatively smooth, can reduce packaging height and make lead 46 be difficult for losing.

2, lead 46 lead-in wire is bonded on substrate 40a or the flange layer, the carrying out of the bonding operation of can being convenient to go between.

3, spherical medium 47 is set on image sensing chip 44, can avoids photic zone 48 to be pressed onto lead 46.

4, utilize spherical medium 47 to support photic zone 48, can make photic zone 48 more smooth.

Claims

1, a kind of image sensor, it comprises substrate, flange layer, forms the image sensing chip of several weld pads, is electrically connected to several wires, photic zone and adhesive layer on several weld pads of image sensing chip respectively; Substrate is provided with upper and lower surface; Flange layer is arranged at upper surface of base plate, and forms groove with substrate; Image sensing chip is arranged on the upper surface of substrate, and is positioned at groove; Photic zone covers image sensing chip; Adhesive layer envelopes several wires, and in order to photic zone is fixed; It is characterized in that described base lower surface forms several first electrodes; Form corresponding on the flange layer and be electrically connected to several second electrodes of several first electrodes on the substrate; The other end of several wires is electrically connected to several second electrodes on the flange layer respectively; Be respectively equipped with several spherical mediums on the weld pad of image sensing chip; Photic zone is covered on several spherical medium tops.

2, image sensor according to claim 1 is characterized in that described spherical medium is a Metal Ball.

3, image sensor according to claim 1 is characterized in that described photic zone is a transparent glass.

4, image sensor according to claim 1 is characterized in that described several wires is bonded on the weld pad of image sensing chip by second contact conductor on the flange layer.

5, a kind of image sensor, it comprises substrate, forms the image sensing chip of several weld pads, is electrically connected to several wires, photic zone and adhesive layer on several weld pads of image sensing chip respectively; Substrate is provided with upper and lower surface; Image sensing chip is arranged on the upper surface of substrate; Photic zone covers image sensing chip; Adhesive layer envelopes several wires, and in order to photic zone is fixed; It is characterized in that described base lower surface forms several first electrodes, upper surface of base plate forms correspondence and is electrically connected to several second electrodes of several first electrodes on the lower surface; The other end of several wires is electrically connected to several second electrodes on the upper surface of base plate respectively; Be respectively equipped with several spherical mediums on the weld pad of image sensing chip; Photic zone is covered on several spherical medium tops.

6, image sensor according to claim 5 is characterized in that described spherical medium is a Metal Ball.

7, image sensor according to claim 5 is characterized in that described photic zone is a transparent glass.

8, image sensor according to claim 5 is characterized in that described several wires is bonded on the weld pad of image sensing chip by second contact conductor on the upper surface of base plate.