CN2862111Y

CN2862111Y - Image sensor module with protective flange

Info

Publication number: CN2862111Y
Application number: CN200520129319.0U
Authority: CN
Inventors: 杜修文; 彭镇滨; 何孟南; 谢尚锋; 辛宗宪
Original assignee: Kingpak Technology Inc
Current assignee: Kingpak Technology Inc
Priority date: 2005-10-31
Filing date: 2005-10-31
Publication date: 2007-01-24
Anticipated expiration: 2015-10-31

Abstract

The utility model relates to an image sensor module having protection flange, including a base board with an upper surface and an undersurface, wherein a first electrode is disposed on the upper surface and a second electrode is disposed on the undersurface and connected to the corresponding first electrode; a chip disposed on the upper surface of the base board and provided with a sensing region and a pad; a plurality of wires for electronically connecting the pad of the chip to the first electrode of the base board; an adhesive coated on the upper surface of the base board; a lens stand provided with a sidewall, a circular protection flange and internal thread, wherein when the sidewall of the lens stand is disposed on the upper surface of the base board via the adhesive, the protection flange just surrounds the sensing region of the chip, so as to avoid the pollution of the adhesive to the sensing region of the chip; and a lens barrel provided with external thread that is screwed with the internal thread of the lens stand.

Description

The image sensor module of tool real protection flange

Technical field

The utility model is a kind of image sensor module of miniaturization, is meant especially a kind ofly can effectively promote yield and product is more compact.

Background technology

See also Fig. 1, be a kind of cut-open view of image sensor module structure, it comprises that it includes; One substrate 10 is provided with a upper surface 12 and a lower surface 14, and upper surface 12 is formed with first electrode 16, and lower surface 14 is formed with second electrode 18 and connects the first corresponding electrode 16; Chip 20 is the upper surfaces 12 that are arranged at substrate 10, is formed with weld pad 22 on it; Plurality of wires 24 is to be electrically connected first electrode 16 of the weld pad 22 of chip 20 to substrate 10; One solid 26 is upper surfaces 12 of coating substrate 10; One microscope base 28 is provided with internal thread 30, is by by the sticking upper surfaces 12 of being located at substrate 10 of solid 26, with chip 20 around living; Reaching a lens barrel 32 and be provided with external thread 34, is that screw lock is on the internal thread 30 of microscope base 28.

But, above-mentioned image sensor module, when coating solid 26, the amount control of solid 26 also causes solid 26 to expose outside microscope base 28 not at that time, makes that making the block size of finishing differs, thereby must scrap larger-size module, and form waste.And solid 26 easily pollutes chip 20, has influence on the quality of product.

In view of this, the present utility model people is in line with the spirit of keeping on improving, innovate breakthrough, is devoted to the encapsulation research and development of image sensor, and invents out the utility model image sensor module, makes it effectively promote yield and product is more compact.

Summary of the invention

Fundamental purpose of the present utility model is to provide a kind of image sensor module of miniaturization, and it has the effect that improves the product yield, to reach the purpose that reduces production costs.

Another purpose of the present utility model is to provide a kind of image sensor module of miniaturization, and it has the effect of dwindling small product size, to reach compact purpose.

The utility model includes a substrate and is provided with a upper surface and a lower surface, and this upper surface is formed with first electrode, and this lower surface is formed with first electrode that second electrode connects this correspondence; One chip is the upper surface that is arranged at this substrate, is formed with sensing area and weld pad on it; Plurality of wires is to be electrically connected first electrode of the weld pad of this chip to this substrate; One solid is a upper surface of coating this substrate; One microscope base is provided with the real protection flange and the internal thread of a sidewall, a ring-type, when the sidewall of this microscope base is located at the upper surface of this substrate by being glued by this solid, this real protection flange just with the sensing area of chip around living, avoid this solid to pollute the sensing area of this chip; One lens barrel is provided with external thread, is that screw lock is on the internal thread of this microscope base.

The utlity model has following advantage:

1. during with the excision of the sidewall of microscope base, can make the module volume-diminished, and can obtain consistent product size.

2. the real protection flange of microscope base around living, can prevent that solid from polluting the sensing area of chip 42 with the sensing area of chip.

Above-mentioned and other purpose, advantage and characteristic of the present utility model are by the detailed description of following preferred embodiment and with reference to graphic so that more understood in depth.

Description of drawings

Fig. 1 is the synoptic diagram of existing image sensor module;

Fig. 2 is the synoptic diagram of the image sensor module of the utility model tool protective layer;

Fig. 3 is the manufacture method synoptic diagram of the image sensor module of the utility model tool protective layer.

Figure number of the present utility model

Substrate 40 chips 42 flange layers 43

Plurality of wires 44 grooves 45 solids 46

Microscope base 48 lens barrels 50 upper surfaces 52

Lower surface 54 first electrodes 56 second electrodes 58

Sensing area 60 weld pads 62 sidewalls 63

Real protection flange 65 internal threads 67

Embodiment

See also Fig. 2, be the synoptic diagram of the image sensor module of the utility model tool real protection flange, it includes a substrate 40, chip 42, plurality of wires 44, solid 46, microscope base 48 and lens barrel 50:

It is provided with a upper surface 52 and a lower surface 54 substrate 40, and upper surface 54 is formed with first electrode 56, and lower surface 54 is formed with second electrode 58 and connects the first corresponding electrode 56.

Chip 42 is the upper surfaces 52 that are arranged at substrate 40, is formed with sensing area 60 and weld pad 62 on it.

Plurality of wires 44 is to be electrically connected first electrode 56 of the weld pad 62 of chip 42 to substrate 40.

Solid 46 is to coat on the upper surface 52 of substrate 40, and is positioned at first electrode, 56 peripheries for adhesion glue.

It is provided with the real protection flange 65 and the internal thread 67 of a sidewall 63, a ring-type microscope base 48, when the sidewall 63 of microscope base 48 is located at the upper surface 52 of substrate 40 by being glued by solid 46, real protection flange 65 just with the sensing area 60 of chip 40 around living, avoid solid 46 to pollute the sensing area 60 of chip 40.

Lens barrel 50 is provided with external thread 66, is that screw lock is on the internal thread 64 of microscope base 48.

See also Fig. 3, be the image sensor module manufacture method of the utility model tool protective layer, it comprises the following steps:

One substrate 40 is provided, and it is provided with a upper surface 52 and a lower surface 54, and upper surface 54 is formed with first electrode 56, and lower surface 54 is formed with second electrode 58 and connects the first corresponding electrode 56.

One flange layer 43 is provided, and it is the upper surface 52 that is arranged at substrate 40, and forms a groove 45 with substrate 40.

It is the upper surface 52 that is arranged at substrate 40 that one chip 42 is provided, and is positioned at groove 45, is formed with sensing area 60 and weld pad 62 on it.

It is to be electrically connected first electrode 56 of the weld pad 62 of chip 42 to substrate 40 that plurality of wires 44 is provided.

One solid 46 is provided, and is to coat on the upper surface 52 of

substrate

40, and 43 of chip 40 and flange layers.

One microscope base 48 is provided, it is provided with the real protection flange 65 and the internal thread 67 of a sidewall 63, a ring-type, when the sidewall 63 of microscope base 48 is located at the upper surface 52 of substrate 40 by being glued by solid 46, real protection flange 65 just with the sensing area 60 of chip 40 around living, avoid solid 46 to pollute the sensing area 60 of chip 40.A part of sidewall 63 of cutting microscope base 48 and and be adhered to the substrate 40 of sidewall 63, and become the module of reduced size.

The specific embodiment that is proposed in the detailed description of preferred embodiment is only in order to be easy to illustrate technology contents of the present utility model, be not with the utility model narrow sense be limited to embodiment, all many variations that situation is done enforcement according to spirit of the present utility model and following claim all belongs to scope of the present utility model.

Claims

1. the image sensor module of a tool real protection flange is characterized in that, includes:

One substrate, it is provided with a upper surface and a lower surface, and this upper surface is formed with first electrode, and this lower surface is formed with first electrode that second electrode connects this correspondence;

One chip is the upper surface that is arranged at this substrate, is formed with sensing area and weld pad on it;

Plurality of wires, it is to be electrically connected first electrode of the weld pad of this chip to this substrate;

One solid is a upper surface of coating this substrate;

One microscope base, it is provided with the real protection flange and the internal thread of a sidewall, a ring-type, when the sidewall of this microscope base when being located at the upper surface of this substrate by this solid is sticking, this real protection flange just with the sensing area of chip around living, avoid this solid to pollute the sensing area of this chip; And

One lens barrel, it is provided with external thread, is that screw lock is on the internal thread of this microscope base.

2. the image sensor module of tool real protection flange as claimed in claim 1 is characterized in that, a part of sidewall of described this microscope base and the substrate that is adhered to this microscope base are the modules that cuts into reduced size.