CN101056355A - Video sensor module with the escape hole and its making method - Google Patents

Video sensor module with the escape hole and its making method Download PDF

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Publication number
CN101056355A
CN101056355A CNA200610072141XA CN200610072141A CN101056355A CN 101056355 A CN101056355 A CN 101056355A CN A200610072141X A CNA200610072141X A CN A200610072141XA CN 200610072141 A CN200610072141 A CN 200610072141A CN 101056355 A CN101056355 A CN 101056355A
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CN
China
Prior art keywords
substrate
escape hole
microscope base
sensor module
image sensor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA200610072141XA
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Chinese (zh)
Inventor
杜修文
何孟南
庄俊华
彭镇滨
辛宗宪
张建伟
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kingpak Technology Inc
Original Assignee
Kingpak Technology Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kingpak Technology Inc filed Critical Kingpak Technology Inc
Priority to CNA200610072141XA priority Critical patent/CN101056355A/en
Publication of CN101056355A publication Critical patent/CN101056355A/en
Pending legal-status Critical Current

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Abstract

Disclosed are an image sensor module having stomatas and a manufacturing method thereof. Said module comprises a baseplate equipped with an upper surface having a first electrode and a lower surface having a second electrode connected to the corresponding first electrode; a chip which is mounted on the upper surface of the baseplate, with a sensing zone and a welding pad forming thereon; a plurality of leads for electrically connecting the welding pad on the chip to the first electrode of the baseplate; an adhesive coating the upper surface of the baseplate; a specular seat having a stomata, a side wall and inner screw thread, wherein the side wall of the specular seat is sticked to the upper surface of the baseplate through the adhesive; a drawtube equipped with an outer screw thread locked to the inner screw thread of the specular seat; a sealing glue which is sued for blocking the stomata to preventing pollution sources such as fine dust entering the specular seat; and a baseplat which is sticked to the specular seat and used for cutting side walls of the specular seat into modules with smaller size.

Description

Image sensor module and manufacture method thereof with escape hole
Technical field
The present invention is a kind of image sensor module and manufacture method thereof of tool escape hole, is meant a kind ofly in the image sensor manufacture process especially, can promote yield, the production efficiency of product.
Background technology
See also Fig. 1, be a kind of image sensor module structure cutaway view, it includes; One substrate 10 is provided with a upper surface 12 and a lower surface 14, and upper surface 12 is formed with first electrode 16, and lower surface 14 is formed with second electrode 18 and connects the first corresponding electrode 16; Chip 20 is the upper surfaces 12 that are arranged at substrate 10, is formed with weld pad 22 on it; Plurality of wires 24 is to be electrically connected first electrode 16 of the weld pad 22 of chip 20 to substrate 10; One solid 26 is upper surfaces 12 of coating substrate 10; One microscope base 28 is provided with internal thread 30, is by the sticking upper surfaces 12 of being located at substrate 10 of solid 26, with chip 20 around living; Reaching a lens barrel 32 and be provided with external screw thread 34, is that screw lock is on the internal thread 30 of microscope base 28.
Only, above-mentioned image sensor module, because of solid 26 can discharge escaping gas in a large number in the baking processing procedure, make confined space in the microscope base 28 because of being heated and bulking effect produces interior pressure, cause the temporarily fixing microscope base 28 of precisely contraposition can be out of position, thereby can't reach the purpose of camera lens 28 and the accurate contraposition in transducer sensing center, and the misalignment that makes the optics focusing, image quality can't reach standard.
In view of this, to be this be devoted to encapsulation research and development of image sensor in the spirit of keeping on improving, innovate breakthrough to the inventor, and invent out image sensor module of the present invention, makes it effectively promote yield and product is more compact.
Summary of the invention
Main purpose of the present invention is to provide a kind of image sensor module and manufacture method thereof of tool escape hole, and it has the effect that improves the product yield, to reach more practical purpose.
Another object of the present invention is to provide a kind of image sensor module and manufacture method thereof of tool escape hole, and it has makes convenient and promote the effect of production efficiency, to reach more practical purpose.
The invention provides a kind of image sensor module, it is characterized in that, include with escape hole:
One substrate, it is provided with a upper surface and a lower surface, and this upper surface is formed with most first electrodes, and this lower surface is formed with first electrode that most second electrodes connect this correspondence;
One chip is the upper surface that is arranged at this substrate, is formed with sensing area and most weld pads on it;
Plurality of wires, it is to be electrically connected first electrode of the weld pad of this chip to this substrate;
One solid is a upper surface of coating this substrate;
One microscope base, it is provided with a shoulder, a sidewall and internal thread, and the sidewall of this microscope base is to be located on the upper surface of this substrate by this solid is sticking, and this shoulder is formed with an escape hole that runs through;
One lens barrel, it is provided with an external screw thread screw lock on the internal thread of this microscope base; And
One fluid sealant is to be used to clog this escape hole.
Wherein sealing glue is to be UV glue or other fluid sealant material.
It is the sidewall of this microscope base of cutting and the substrate that is adhered to this microscope base.
The invention provides a kind of manufacture method, it is characterized in that it comprises the following steps with image sensor module of escape hole;
One substrate is provided, and it is provided with a upper surface and a lower surface, and this upper surface is formed with most first electrodes, and this lower surface is formed with first electrode that most second electrodes connect this correspondence;
One chip is provided, and is the upper surface that is arranged at this substrate, is formed with sensor regions and most weld pads on it
One solid is provided, and is the upper surface of coating this substrate;
One microscope base is provided, and it is provided with an escape hole, a sidewall and internal thread, and the sidewall of this microscope base is to be located on the upper surface of this substrate by this solid is sticking; And
One lens barrel is provided, and it is provided with an external screw thread is that screw lock is on the internal thread of this microscope base;
One fluid sealant is provided, and is to be used to clog this escape hole.
Wherein sealing glue is to be UV glue or other fluid sealant material.
After wherein fluid sealant clogs escape hole, cut the sidewall of this microscope base and be adhered to the substrate of this microscope base.
Description of drawings
Above-mentioned and other purpose, characteristics and characteristic of the present invention are by the detailed description of following preferred embodiments and more understood in depth with reference to the accompanying drawings, wherein:
Fig. 1 is the schematic diagram of known image sensor group.
Fig. 2 has the schematic diagram of the image sensor module of escape hole for the present invention.
Fig. 3 has the manufacture method schematic diagram of the image sensor module of escape hole for the present invention.
Embodiment
See also Fig. 2, be the module diagram of the image sensor of tool escape hole of the present invention, it includes a substrate 40, chip 42, plurality of wires 44, solid 46, microscope base 48, lens barrel 50 and fluid sealant 51:
It is provided with a upper surface 52 and a lower surface 54 substrate 40, and upper surface 54 is formed with first electrode 56, and lower surface is formed with second electrode 58 and connects the first corresponding electrode 56.
Chip 42 is the upper surfaces 52 that are arranged at substrate 40, is formed with sensing area 60 and weld pad 62 on it.
Plurality of wires 44 is to be electrically connected the utmost point 56 of the weld pad 62 of chip 42 to substrate 40.
Solid 46 is to coat on the upper surface 52 of substrate 40, and is positioned at first electrode, 56 peripheries for adhesion glue.
It is provided with a sidewall 63, an escape hole 65, a fluid sealant 51, a shoulder 67 and internal thread 69 microscope base 48, and the sidewall 63 of this microscope base 48 is by solid 46 sticking being located on the upper surface 52 of substrate 40.Escape hole 65 is that a spilehole that runs through shoulder 67 is in order to discharge a large amount of escaping gases that solid 46 is produced in microscope base 48 baking processing procedures, can effectively prevent the optics focusing misalignment that the sensing area 60 in the microscope base 48 causes because of interior pressure is excessive, and then influence image quality, fluid sealant 51 in the escape hole 65 is in order to clog escape hole 65, to avoid entering in the microscope base 48 at pollutant sources such as the baking system end little Zhu in back.
Lens barrel 50 is provided with external screw thread 66, is that screw lock is on the internal thread 69 of microscope base 48.
See also Fig. 3, be the manufacture method schematic diagram of the image sensor module of tool escape hole of the present invention, it includes a substrate 40, chip 42, plurality of wires 44, solid 46, microscope base 48, lens barrel 50 and fluid sealant 51:
One substrate 40 is provided, and it is provided with a upper surface 52 and a lower surface 54, and upper surface 54 is formed with most first electrodes 56, and lower surface is formed with most second electrodes 58 and connects the first corresponding electrode 56.
One chip 42 is provided, and it is the upper surface 52 that is arranged at substrate 40, is formed with sensing area 60 and weld pad 62 on it.
Plurality of wires 44 is provided, and is to be electrically connected the utmost point 56 of the weld pad 62 of chip 42 to substrate 40.
Provide a solid 46 for adhesion glue, be to coat on the upper surface 52 of substrate 40, and be positioned at first electrode, 56 peripheries.
One microscope base 48 is provided, and it is provided with a sidewall 63, an escape hole 65, a fluid sealant 51, a shoulder 67 and internal thread 69, and the sidewall 63 of this microscope base 48 is by solid 46 sticking being located on the upper surface 52 of substrate 40.Escape hole 65 is that a spilehole that runs through shoulder 67 is in order to discharge a large amount of escaping gases that solid 46 is produced in microscope base 48 baking processing procedures, can effectively prevent the optics focusing misalignment that the sensing area 60 in the microscope base 48 causes because of interior pressure is excessive, and then influence image quality.
One lens barrel 50 being provided, being provided with external screw thread 66, is that screw lock is on the internal thread 69 of microscope base 48.
One fluid sealant 51 is provided, and is in order to clog escape hole 65, to avoid entering in the microscope base 48 at pollutant sources such as the baking processing procedure end little Zhu in back.
The sidewall 63 of cutting microscope base 48 and be adhered to the substrate 40 of this microscope base 48 makes it become the module of smaller szie.
Be with, the present invention has following advantage:
1. during with the excision of the sidewall of microscope base 48, can make the module volume-diminished, and can obtain consistent product size.
2. the escape hole 65 that runs through shoulder 67 can effectively discharge the escaping gas that solid 46 is produced in the baking processing procedure, and keep microscope base 40 inside and outside isostasies and can prevent because of the excessive gap tilt effect that causes microscope base 40 of interior pressure, cause optics focusing misalignment, and then influence image quality.
The specific embodiment that is proposed being right in detail of preferred embodiment is only for being easy to illustrate technology contents of the present invention, be not with the narrow meaning of the present invention be limited to embodiment, the many variations that the spirit of Fan Yibenfa and the situation of following claim are done implements all to belong to scope of the present invention.

Claims (6)

1. the image sensor module with escape hole is characterized in that, includes:
One substrate, it is provided with a upper surface and a lower surface, and this upper surface is formed with most first electrodes, and this lower surface is formed with first electrode that most second electrodes connect this correspondence;
One chip is the upper surface that is arranged at this substrate, is formed with sensing area and most weld pads on it;
Plurality of wires, it is to be electrically connected first electrode of the weld pad of this chip to this substrate;
One solid is a upper surface of coating this substrate;
One microscope base, it is provided with a shoulder, a sidewall and internal thread, and the sidewall of this microscope base is to be located on the upper surface of this substrate by this solid is sticking, and this shoulder is formed with an escape hole that runs through;
One lens barrel, it is provided with an external screw thread screw lock on the internal thread of this microscope base; And
One fluid sealant is to be used to clog this escape hole.
2. as claim 1 a described image sensor module, it is characterized in that wherein sealing glue is to be UV glue or other fluid sealant material with escape hole.
3. as claim 1 a described image sensor module, it is characterized in that it is the sidewall of this microscope base of cutting and the substrate that is adhered to this microscope base with escape hole.
4. the manufacture method with image sensor module of escape hole is characterized in that it comprises the following steps;
One substrate is provided, and it is provided with a upper surface and a lower surface, and this upper surface is formed with most first electrodes, and this lower surface is formed with first electrode that most second electrodes connect this correspondence;
One chip is provided, and is the upper surface that is arranged at this substrate, is formed with sensor regions and most weld pads on it
One solid is provided, and is the upper surface of coating this substrate;
One microscope base is provided, and it is provided with an escape hole, a sidewall and internal thread, and the sidewall of this microscope base is to be located on the upper surface of this substrate by this solid is sticking; And
One lens barrel is provided, and it is provided with an external screw thread is that screw lock is on the internal thread of this microscope base;
One fluid sealant is provided, and is to be used to clog this escape hole.
5. as claim 4 a described manufacture method, it is characterized in that wherein sealing glue is to be UV glue or other fluid sealant material with image sensor module of escape hole.
6. as claim 4 a described manufacture method, it is characterized in that, after wherein fluid sealant clogs escape hole, cut the sidewall of this microscope base and be adhered to the substrate of this microscope base with image sensor module of escape hole.
CNA200610072141XA 2006-04-14 2006-04-14 Video sensor module with the escape hole and its making method Pending CN101056355A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CNA200610072141XA CN101056355A (en) 2006-04-14 2006-04-14 Video sensor module with the escape hole and its making method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CNA200610072141XA CN101056355A (en) 2006-04-14 2006-04-14 Video sensor module with the escape hole and its making method

Publications (1)

Publication Number Publication Date
CN101056355A true CN101056355A (en) 2007-10-17

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ID=38795947

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA200610072141XA Pending CN101056355A (en) 2006-04-14 2006-04-14 Video sensor module with the escape hole and its making method

Country Status (1)

Country Link
CN (1) CN101056355A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102681124A (en) * 2011-03-07 2012-09-19 鸿富锦精密工业(深圳)有限公司 Lens module and assembly method thereof
CN107800825A (en) * 2017-10-26 2018-03-13 广东欧珀移动通信有限公司 The housing unit and electronic equipment of electronic equipment
CN107908223A (en) * 2017-10-26 2018-04-13 广东欧珀移动通信有限公司 The housing unit and electronic equipment of electronic equipment
WO2020042788A1 (en) * 2018-08-31 2020-03-05 宁波舜宇光电信息有限公司 Multi-lens assembly, camera module, and methods for manufacturing same
CN114338969A (en) * 2020-10-10 2022-04-12 宁波舜宇光电信息有限公司 Camera module, dust removal system and dust removal method thereof

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102681124A (en) * 2011-03-07 2012-09-19 鸿富锦精密工业(深圳)有限公司 Lens module and assembly method thereof
CN107800825A (en) * 2017-10-26 2018-03-13 广东欧珀移动通信有限公司 The housing unit and electronic equipment of electronic equipment
CN107908223A (en) * 2017-10-26 2018-04-13 广东欧珀移动通信有限公司 The housing unit and electronic equipment of electronic equipment
CN107908223B (en) * 2017-10-26 2020-10-16 Oppo广东移动通信有限公司 Shell assembly of electronic equipment and electronic equipment
WO2020042788A1 (en) * 2018-08-31 2020-03-05 宁波舜宇光电信息有限公司 Multi-lens assembly, camera module, and methods for manufacturing same
CN114338969A (en) * 2020-10-10 2022-04-12 宁波舜宇光电信息有限公司 Camera module, dust removal system and dust removal method thereof

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