CN2711904Y - Water cooling type computer CPU heat sink - Google Patents
Water cooling type computer CPU heat sink Download PDFInfo
- Publication number
- CN2711904Y CN2711904Y CNU2004200397889U CN200420039788U CN2711904Y CN 2711904 Y CN2711904 Y CN 2711904Y CN U2004200397889 U CNU2004200397889 U CN U2004200397889U CN 200420039788 U CN200420039788 U CN 200420039788U CN 2711904 Y CN2711904 Y CN 2711904Y
- Authority
- CN
- China
- Prior art keywords
- water tank
- water
- cpu
- utility
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model discloses a water cooling type computer CPU heat sink comprising a water tank and a heat absorber. A pump installed in the water tank is connected with the heat absorber by a conduit. The heat absorber is connected with the water tank by the conduit, and a through-hole is opened on the water tank. The utility model adopts a way of hydrocooling for heat radiation and cooling down of a computer CPU. The utility model is high in radiation efficiency and good in cooling down effect. The utility model can make the CPU work normally under a higher quantity of heat production such as overfrequency, etc. The utility model with a temperature control device can adjust radiation efficiency according to the actual conditions of heat production of the CPU. The water cooling type computer CPU heat sink achieves the best cooling down effect under the precondition of energy conservation.
Description
Technical field
The utility model relates to a kind of heat abstractor, is a kind of water-cooled computer CPU radiator.
Background technology
The CPU of computer can produce big calorimetric when working; at present; in order to prevent that the too high wind-force that often utilizes fan to produce of cpu temperature from carrying out radiating and cooling to CPU; but CPU is lowered the temperature with fan; have that radiating efficiency is lower, the unfavorable shortcoming of cooling-down effect, the deadlock phenomenon appears in computer regular meeting because of cpu temperature is too high.Especially when people for after improving computer performance CPU being carried out overclocking, CPU work quantity of heat production after the overclocking is bigger, the fan heat radiation often is difficult to reach the required cooling requirement of CPU, the frequent phenomenon that crashes of computer not only can appear this moment, the too high phenomenon of being burnt of cpu temperature also can occur, cause the property loss that to retrieve to people.
Summary of the invention
The purpose of this utility model, provided a kind of water-cooled computer CPU radiator, it is with the medium of liquid such as water as heat transferred, can promptly absorb the heat that CPU produces, reduce the temperature of CPU effectively, can guarantee CPU operate as normal under any circumstance, avoid because of the cpu temperature situation that the computer crash occur or CPU burnt that raises.
The purpose of this utility model is achieved through the following technical solutions: the water-cooled computer CPU radiator, it has water tank and heat dump, and water pump is installed in the water tank, and water pump links to each other with heat dump by conduit, heat dump is connected with water tank by another conduit, offers through hole on the water tank.
For further realizing the purpose of this utility model, can also realize by the following technical solutions: heat dump has housing, and lower part of frame is installed absorber plate.Cooling piece is installed on the water tank, fan is installed on the cooling piece.Temperature-sensing probe is installed in the water tank, and temperature-sensing probe is connected with temperature detect switch (TDS) by lead, and temperature detect switch (TDS) is connected with fan with cooling piece by lead.
Good effect of the present utility model is: it adopts water-cooling pattern is the computer CPU radiating and cooling, and its radiating efficiency height, good cooling effect can make CPU operate as normal under quantity of heat production condition with higher such as overclocking; And it is equipped with attemperating unit, can adjust the efficient of radiating and cooling according to the actual conditions of CPU heat production, is issued to best cooling-down effect in energy-conservation prerequisite.
Description of drawings
Accompanying drawing is a structural representation of the present utility model.
Embodiment
The water-cooled computer CPU radiator, it has water tank 1 and heat dump, and water pump 5 is installed in the water tank 1, and water pump 5 links to each other with heat dump by conduit 9, and heat dump is connected with water tank 1 by conduit 10, offers through hole 11 on the water tank 1.Heat dump has housing 8, and absorber plate 7 is installed in the bottom of housing 8.Cooling piece 2 is installed on the water tank 1, fan 3 is installed on the cooling piece 2.Temperature-sensing probe 12 is installed in the water tank 1, and temperature-sensing probe 12 is connected with temperature detect switch (TDS) 4 by lead, and temperature detect switch (TDS) 4 is connected with fan 3 with cooling piece 2 by lead.Temperature-sensing probe 12 can be thermistor.When the utility model is installed and used, water tank 1 is fixed on the cabinet bottom, temperature detect switch (TDS) 4 is linked to each other with chassis power supply respectively by lead with water pump 5.Cooling piece 2, fan 3, temperature detect switch (TDS) 4 and chassis power supply are connected into the loop successively, and water pump 5 is connected in parallel on the chassis power supply two ends.Absorber plate 7 contacts with computer CPU.Open computer, chassis power supply is water pump 5, temperature detect switch (TDS) 4 and temperature-sensing probe 12 power supplies, water pump 5 operations, and water removes the heat that CPU produces continuously circulating in water tank 1 and in the cavity 6 of housing 8 by conduit 9 and conduit 10 under the effect of water pump 5.When the water temperature in the water tank 1 rises to 35 degree when above, temperature-sensing probe 12 control temperature detect switch (TDS)s 4 closures, the loop of cooling piece 2 and fan 3 is connected, cooling piece 2 and the fan 3 reduction water temperature of working simultaneously; When water temperature is reduced to 5 degree when following, 4 actions of temperature-sensing probe 12 control temperature detect switch (TDS)s make the circuit disconnection of cooling piece 2 and fan 3, and cooling piece 2 and fan 3 quit work.Technical scheme described in the utility model is not restricted in the scope of embodiment described in the utility model.The not detailed description technique of the utility model partly is known technology.
Claims (4)
1, water-cooled computer CPU radiator, it has water tank (1) and heat dump, it is characterized in that: water pump (5) is installed in the water tank (1), and water pump (5) links to each other with heat dump by conduit (9), heat dump is connected with water tank (1) by conduit (10), offers through hole (11) on the water tank (1).
2, according to the described water-cooled computer CPU radiator of root claim 1, it is characterized in that: heat dump has housing (8), and absorber plate (7) is installed in the bottom of housing (8).
3, according to the described water-cooled computer CPU radiator of root claim 2, it is characterized in that: water tank (1) is gone up cooling piece (2) is installed, and cooling piece (2) is gone up fan (3) is installed.
4, according to the described water-cooled computer CPU radiator of root claim 3, it is characterized in that: temperature-sensing probe (12) is installed in the water tank (1), temperature-sensing probe (12) is connected with temperature detect switch (TDS) (4) by lead, and temperature detect switch (TDS) (4) is connected with fan (3) with cooling piece (2) by lead.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNU2004200397889U CN2711904Y (en) | 2004-04-13 | 2004-04-13 | Water cooling type computer CPU heat sink |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNU2004200397889U CN2711904Y (en) | 2004-04-13 | 2004-04-13 | Water cooling type computer CPU heat sink |
Publications (1)
Publication Number | Publication Date |
---|---|
CN2711904Y true CN2711904Y (en) | 2005-07-20 |
Family
ID=36193005
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNU2004200397889U Expired - Fee Related CN2711904Y (en) | 2004-04-13 | 2004-04-13 | Water cooling type computer CPU heat sink |
Country Status (1)
Country | Link |
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CN (1) | CN2711904Y (en) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104898812A (en) * | 2015-06-29 | 2015-09-09 | 邢茹 | Computer heat dissipation device |
CN105068630A (en) * | 2015-09-08 | 2015-11-18 | 唐山天乐智能科技有限公司 | Computer secondary liquid cooling system |
WO2016015388A1 (en) * | 2014-08-01 | 2016-02-04 | 北京市鑫全盛商贸有限公司 | Water cooling head for water cooling type cpu heat radiator |
CN105929915A (en) * | 2016-04-08 | 2016-09-07 | 吉首大学 | CPU temperature monitoring and heat dissipation device |
CN106095034A (en) * | 2015-04-28 | 2016-11-09 | 广达电脑股份有限公司 | Calculating system, computer implemented method and non-momentary embodied on computer readable media thereof |
CN106249827A (en) * | 2016-07-25 | 2016-12-21 | 东莞市真品五金散热科技有限公司 | Cpu water pump radiator |
CN109298766A (en) * | 2018-12-06 | 2019-02-01 | 吉林工程技术师范学院 | A kind of computer CPU heat sink |
-
2004
- 2004-04-13 CN CNU2004200397889U patent/CN2711904Y/en not_active Expired - Fee Related
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2016015388A1 (en) * | 2014-08-01 | 2016-02-04 | 北京市鑫全盛商贸有限公司 | Water cooling head for water cooling type cpu heat radiator |
CN106095034A (en) * | 2015-04-28 | 2016-11-09 | 广达电脑股份有限公司 | Calculating system, computer implemented method and non-momentary embodied on computer readable media thereof |
US10345877B2 (en) | 2015-04-28 | 2019-07-09 | Quanta Computer Inc. | Method and system for boosting power supply |
CN104898812A (en) * | 2015-06-29 | 2015-09-09 | 邢茹 | Computer heat dissipation device |
CN104898812B (en) * | 2015-06-29 | 2018-08-03 | 山东商务职业学院 | A kind of computer heat radiating device |
CN105068630A (en) * | 2015-09-08 | 2015-11-18 | 唐山天乐智能科技有限公司 | Computer secondary liquid cooling system |
CN105929915A (en) * | 2016-04-08 | 2016-09-07 | 吉首大学 | CPU temperature monitoring and heat dissipation device |
CN106249827A (en) * | 2016-07-25 | 2016-12-21 | 东莞市真品五金散热科技有限公司 | Cpu water pump radiator |
CN106249827B (en) * | 2016-07-25 | 2023-04-28 | 东莞市真品科技有限公司 | CPU water pump radiator |
CN109298766A (en) * | 2018-12-06 | 2019-02-01 | 吉林工程技术师范学院 | A kind of computer CPU heat sink |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C19 | Lapse of patent right due to non-payment of the annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |