CN207799598U - A kind of computer heat sink - Google Patents
A kind of computer heat sink Download PDFInfo
- Publication number
- CN207799598U CN207799598U CN201820184634.0U CN201820184634U CN207799598U CN 207799598 U CN207799598 U CN 207799598U CN 201820184634 U CN201820184634 U CN 201820184634U CN 207799598 U CN207799598 U CN 207799598U
- Authority
- CN
- China
- Prior art keywords
- rear panel
- temperature
- partition board
- semiconductor cooler
- bolted
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000005192 partition Methods 0.000 claims abstract description 33
- 239000004065 semiconductor Substances 0.000 claims abstract description 27
- 239000002937 thermal insulation foam Substances 0.000 claims abstract description 10
- 239000000428 dust Substances 0.000 claims description 7
- 238000001914 filtration Methods 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 3
- 239000007769 metal material Substances 0.000 claims description 3
- 239000004033 plastic Substances 0.000 claims description 3
- 229920003023 plastic Polymers 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 10
- 238000009825 accumulation Methods 0.000 abstract description 3
- 238000001816 cooling Methods 0.000 description 10
- 238000010586 diagram Methods 0.000 description 3
- 230000002745 absorbent Effects 0.000 description 2
- 239000002250 absorbent Substances 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 229920002456 HOTAIR Polymers 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 238000004883 computer application Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
Abstract
The utility model discloses a kind of computer heat sinks, including semiconductor cooler, cabinet, rear panel, front panel, partition board, it is provided with the semiconductor cooler in the middle part of the partition board, it is provided with heat exchanger below the semiconductor cooler, the semiconductor cooler surrounding is provided with heat insulating mattress, it is provided with radiator above the semiconductor cooler, the front panel top is provided with air inlet, dirt filtrating screen, it is provided with radiator fan on the inside of the rear panel, fan shroud, it is provided with temperature controller below the air inlet, temperature display, the heat exchanger is provided with temperature sensor close to the rear panel side, power supply, the cabinet inner wall is provided with heat insulation foam, it is provided with air outlet above the rear panel, it is provided with power switch below the air outlet, wire hole.Advantageous effect is：The utility model can effectively reduce computer temperature and prevent computer-internal dirt accumulation, and room temperature or less can be cooled the temperature in hot weather.
Description
Technical field
The utility model is related to field of computer technology, and in particular to a kind of computer heat sink.
Background technology
With information-based rapid development, computer application at present has been popularized, during computer use,
Hardware will produce a large amount of heat, these heats can influence the aging that computer runs and accelerates each component in computer, overheat
It is light then cause the computer speed of service to reduce and even crash, it is heavy then hardware can be caused to burn.Traditional computer cool-down method master
There are air-cooled, two kinds of water cooling, water cooling sphere of action to be only limitted to the individual parts such as CPU, video card, other parts, which still need, uses wind
Cold mode cools down, and the variation of computer bulk temperature is little, air-cooled of low cost most widely used, but air-cooled inevitably causes
Computer-internal dust accumulation makes its heat dissipation performance be greatly lowered, and finally loses heat-sinking capability, and dust will also result in poor contact, leakage
The failures such as electricity.
Utility model content
The purpose of this utility model is that solve the above-mentioned problems and provides a kind of computer heat sink.
The utility model is achieved through the following technical solutions above-mentioned purpose：
A kind of computer heat sink, including semiconductor cooler, cabinet, rear panel, front panel, partition board, the partition board
Middle part is provided with the semiconductor cooler, and heat exchanger, the semiconductor cooler are provided with below the semiconductor cooler
Surrounding is provided with heat insulating mattress, and radiator is provided with above the semiconductor cooler, and the front panel top is provided with air inlet,
The air inlet inner wall is provided with dirt filtrating screen, is provided with radiator fan on the inside of the rear panel, the radiator fan with it is described after
It is provided with fan shroud between panel, temperature controller is provided with below the air inlet, is arranged inside the temperature controller
Have a temperature display, the heat exchanger is provided with temperature sensor close to the rear panel side, the rear panel with it is described every
Plate junction is provided with power supply, and the cabinet inner wall is provided with heat insulation foam below the partition board, is provided with above the rear panel
Air outlet, the air outlet lower section are provided with power switch, wire hole.
In above structure, the cabinet is divided into two parts up and down by the partition board, and top is high-temperature area, and lower part is low temperature
Region, the semiconductor cooler can release heat, eventually by the heat dissipation from lower absorbent heat by the radiator
Heat is drained into outside by fan, and the dust filtration net can effectively prevent dust to enter the cabinet, and the temperature sensor can will be warm
Degree signal is transmitted to the temperature controller, and the temperature controller adjusts the semiconductor cooler power accordingly, to make
Low-temperature region temperature is kept constant, and the heat insulation foam can reduce heat transfer inside and outside affiliated cabinet, is conducive to keep inner cryogenic,
Room temperature can be cooled the temperature in hot weather hereinafter, the temperature display can temperature in chassis described in real-time display.
In order to further increase the effect of cooling, the partition board is bolted with the cabinet, the heat insulation foam with
The cabinet bonding, the partition board material are plastics, and the cabinet is metal material.
In order to further increase the effect of cooling, heat insulating mattress is embedded in the partition board, and the semiconductor cooler is embedded in
The heat insulating mattress.
In order to further increase the effect of cooling, the heat exchanger is bolted with the partition board, the radiator
It is bolted with the partition board, the temperature sensor is bolted with the partition board.
In order to further increase the effect of cooling, the dust filtration net is Nian Jie with the air inlet, and the air inlet takes shape in
The front panel top, the front panel are connect with the cabinet by card slot, and the temperature controller is logical with the front panel
It crosses and is bolted, the temperature display is embedded in the temperature controller.
In order to further increase the effect of cooling, radiator fan is bolted with the rear panel, the fan shield
Cover is bolted with the rear panel, and the power supply is bolted with the rear panel, and the air outlet takes shape in
The rear panel top, the rear panel take shape in behind the cabinet.
In order to further increase the effect of cooling, the power switch is embedded in the rear panel, the electric wire hole forming
In the middle part of the rear panel.
It is the power supply, the temperature controller, the temperature sensor, described in order to further increase the effect of cooling
It is connected by conducting wire between temperature display, the power switch.
Advantageous effect is：The utility model can effectively reduce computer temperature and prevent computer-internal dirt accumulation,
Room temperature or less can be cooled the temperature in hot weather.
Description of the drawings
Fig. 1 is a kind of structural schematic diagram of computer heat sink described in the utility model；
Fig. 2 is the structural schematic diagram of rear panel in a kind of computer heat sink described in the utility model；
Fig. 3 is the structural schematic diagram of front panel in a kind of computer heat sink described in the utility model.
The reference numerals are as follows：
1, semiconductor cooler；2, radiator；3, heat exchanger；4, heat insulating mattress；5, radiator fan；6, partition board；7, power supply；8、
Temperature controller；9, cabinet；10, dirt filtrating screen；11, temperature sensor；12, fan shroud；13, wire hole；14, air outlet；15、
Temperature display；16, air inlet；17, power switch；18, heat insulation foam；19, rear panel；20, front panel.
Specific implementation mode
The utility model is described in further detail below in conjunction with the accompanying drawings：
As shown in Figure 1-Figure 3, a kind of computer heat sink, including it is semiconductor cooler 1, cabinet 9, rear panel 19, preceding
Panel 20, partition board 6,6 middle part of partition board are provided with semiconductor cooler 1, and 1 lower end of semiconductor cooler is provided with heat exchanger 3, partly leads
1 surrounding of chiller is provided with heat insulating mattress 4, and 1 top of semiconductor cooler is provided with radiator 2, and 20 top of front panel is provided with
Air inlet 16,16 inner wall of air inlet are provided with dirt filtrating screen 10, and 19 inside of rear panel is provided with radiator fan 5, and radiator fan 5 is with after
Fan shroud 12 is provided between panel 19,16 lower section of air inlet is provided with temperature controller 8,8 inside setting of temperature controller
There are temperature display 15, heat exchanger 3 that 19 side of rear panel is provided with temperature sensor 11, rear panel 19 is connect with partition board 6
Place is provided with power supply 7, and partition board 6 lower section cabinet (9) inner wall is provided with heat insulation foam 18, and 19 top of rear panel is provided with air outlet 14,
14 lower section of air outlet is provided with power switch 17, wire hole 13.
In above structure, cabinet 9 is divided into two parts up and down by partition board 6, and top is high-temperature area, and lower part is low-temperature region,
Semiconductor cooler 1 can release heat by radiator 2, drain into heat eventually by radiator fan 5 from lower absorbent heat
Outside, dirt filtrating screen 10 can effectively prevent dust to enter cabinet 9, and temperature signal can be transmitted to temperature controller by temperature sensor 11
8, temperature controller 8 adjusts the power of semiconductor cooler 1, to make low-temperature region temperature keep constant, heat insulation foam 18 accordingly
Heat transfer inside and outside cabinet 9 can be reduced, be conducive to keep inner cryogenic, in hot weather can cool the temperature to room temperature hereinafter,
Temperature display 15 can be in real-time display cabinet 9 temperature.
In order to further increase the effect of cooling, partition board 6 is bolted with cabinet 9, and heat insulation foam 18 is viscous with cabinet 9
It connects, 6 material of partition board is plastics, and cabinet 9 is metal material, and heat insulating mattress 4 is embedded in partition board 6, and semiconductor cooler 1 is embedded in heat-insulated
Pad 4, heat exchanger 3 are bolted with partition board 6, and radiator 2 is bolted with partition board 6, temperature sensor 11 and partition board 6
It is bolted, dirt filtrating screen 10 is Nian Jie with air inlet 16, and air inlet 16 takes shape in 20 top of front panel, and front panel 20 takes shape in
9 front of cabinet, temperature controller 8 are bolted with front panel 20, and temperature display 15 is embedded in temperature controller 8, dissipates
Hot-air fan 5 is bolted with rear panel 19, and fan shroud 12 is bolted with rear panel 19, power supply 7 and rear panel
19 are bolted, and air outlet 14 takes shape in 19 top of rear panel, and rear panel 19 takes shape in behind cabinet 9, power switch 17
It is embedded in rear panel 19, wire hole 13 takes shape in 19 middle part of rear panel, power supply 7, temperature controller 8, temperature sensor 11, temperature
It is connected by conducting wire between display screen 15, power switch 17.
The basic principles and main features and advantage of the utility model have been shown and described above.The technical staff of the industry
It should be appreciated that the present utility model is not limited to the above embodiments, the above embodiments and description only describe this
The principle of utility model, on the premise of not departing from the spirit and scope of the utility model, the utility model also has various change
And improvement, these various changes and improvements fall within the scope of the claimed invention.
Claims (8)
1. a kind of computer heat sink, it is characterised in that：Including semiconductor cooler (1), cabinet (9), rear panel (19), preceding
Panel (20), partition board (6), partition board (6) middle part are provided with the semiconductor cooler (1), the semiconductor cooler (1)
Lower section is provided with heat exchanger (3), and semiconductor cooler (1) surrounding is provided with heat insulating mattress (4), the semiconductor cooler
(1) top is provided with radiator (2), and front panel (20) top is provided with air inlet (16), air inlet (16) inner wall
Be provided with dirt filtrating screen (10), be provided with radiator fan (5) on the inside of the rear panel (19), the radiator fan (5) with it is described after
It is provided with fan shroud (12) between panel (19), temperature controller (8), the temperature are provided with below the air inlet (16)
Controller (8) is internally provided with temperature display (15), and the heat exchanger (3) is provided with temperature close to the rear panel (19) side
Sensor (11) is spent, the rear panel (19) is provided with power supply (7), partition board (6) the lower section institute with the partition board (6) junction
It states cabinet (9) inner wall and is provided with heat insulation foam (18), air outlet (14), the air outlet are provided with above the rear panel (19)
(14) lower section is provided with power switch (17), wire hole (13).
2. a kind of computer heat sink according to claim 1, it is characterised in that：The partition board (6) and the cabinet
(9) it is bolted, the heat insulation foam (18) is Nian Jie with the cabinet (9), and partition board (6) material is plastics, the machine
Case (9) is metal material.
3. a kind of computer heat sink according to claim 1, it is characterised in that：The heat insulating mattress (4) is embedded in institute
Partition board (6) is stated, the semiconductor cooler (1) is embedded in the heat insulating mattress (4).
4. a kind of computer heat sink according to claim 1, it is characterised in that：The heat exchanger (3) with it is described every
Plate (6) is bolted, and the radiator (2) is bolted with the partition board (6), the temperature sensor (11) with
The partition board (6) is bolted.
5. a kind of computer heat sink according to claim 1, it is characterised in that：The dust filtration net (10) with it is described into
Gas port (16) is bonded, and the air inlet (16) takes shape in the front panel (20) top, the front panel (20) and the cabinet
(9) it is connected by card slot, the temperature controller (8) is bolted with the front panel (20), the temperature display
(15) it is embedded in the temperature controller (8).
6. a kind of computer heat sink according to claim 1, it is characterised in that：The radiator fan (5) with it is described
Rear panel (19) is bolted, and the fan shroud (12) is bolted with the rear panel (19), the power supply
(7) it is bolted with the rear panel (19), the air outlet (14) takes shape in the rear panel (19) top, after described
Panel (19) takes shape in the cabinet (9) below.
7. a kind of computer heat sink according to claim 1, it is characterised in that：The power switch (17) is embedded in
The rear panel (19), the wire hole (13) take shape in the middle part of the rear panel (19).
8. a kind of computer heat sink according to claim 1, it is characterised in that：The power supply (7), the temperature control
Device (8) processed, the temperature sensor (11), the temperature display (15), the power switch are connected between (17) by conducting wire
It connects.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820184634.0U CN207799598U (en) | 2018-02-02 | 2018-02-02 | A kind of computer heat sink |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820184634.0U CN207799598U (en) | 2018-02-02 | 2018-02-02 | A kind of computer heat sink |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207799598U true CN207799598U (en) | 2018-08-31 |
Family
ID=63267875
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820184634.0U Expired - Fee Related CN207799598U (en) | 2018-02-02 | 2018-02-02 | A kind of computer heat sink |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207799598U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110243284A (en) * | 2019-06-14 | 2019-09-17 | 华中科技大学 | A kind of high temp objects spatial digitizer and its working method |
| CN111735924A (en) * | 2020-07-13 | 2020-10-02 | 上海安杰环保科技股份有限公司 | Measuring instrument for measuring chemical oxygen demand |
-
2018
- 2018-02-02 CN CN201820184634.0U patent/CN207799598U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110243284A (en) * | 2019-06-14 | 2019-09-17 | 华中科技大学 | A kind of high temp objects spatial digitizer and its working method |
| CN111735924A (en) * | 2020-07-13 | 2020-10-02 | 上海安杰环保科技股份有限公司 | Measuring instrument for measuring chemical oxygen demand |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180831 Termination date: 20190202 |