CN2676405Y - 芯片黏着胶材 - Google Patents

芯片黏着胶材 Download PDF

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CN2676405Y
CN2676405Y CNU2003201275117U CN200320127511U CN2676405Y CN 2676405 Y CN2676405 Y CN 2676405Y CN U2003201275117 U CNU2003201275117 U CN U2003201275117U CN 200320127511 U CN200320127511 U CN 200320127511U CN 2676405 Y CN2676405 Y CN 2676405Y
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chip
glue material
chips
adhesion glue
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吴凯强
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Advanced packaging and testing (Hongkong) Co.,Ltd.
Riyueguang Semiconductor Weihai Co ltd
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LIWEI SCIENCE AND TECHNOLOGY C
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Abstract

本实用新型是一种芯片黏着胶材，可黏着于一堆栈封装结构中上下相邻二芯片之间，此黏着胶材内含有复数个填充粒子，可使黏着胶材具有一定的厚度，藉此在不使用挡片芯片的情况下，利用黏着胶材分隔相邻二芯片并确保芯片间的间隔距离。本实用新型兼具黏着与维持芯片间隔高度的作用，除可节省使用挡片芯片的成本外，亦可使堆栈封装结构的各芯片采用芯片向上的形式以进行封装，藉此避免下层芯片采用覆晶式封装或窗口球栅数组封装所花费的成本。

Description

芯片黏着胶材
技术领域
本实用新型涉及一种芯片黏着胶材，特别是一种应用于堆栈封装结构的芯片黏着胶材。
背景技术
堆栈封装技术是指将复数个芯片相堆栈，并分别对各芯片进行适当的电气连接，最后封装为一颗IC的技术。然而如图1所示的堆栈封装结构，当下层芯片10的尺寸等于或小于上层芯片12时，两层芯片10、12需间隔一段距离，藉以让下层导线14能有足够空间进行打线，因此如图1所示，下层芯片10与上层芯片12间尚有一层挡片芯片16(Dummy Die)，其利用黏胶18黏着于上、下二芯片10、12之间，藉以让二芯片10、12间相隔一定高度，并使下层导线14容易进行打线。
参照图2，其是习知技术另一实施方式示意图，如图所示，上层芯片12仍保持正面向上，下层芯片10则采覆晶(Flip Chip)式封装，此时两层芯片10、12间只需利用黏胶18进行黏着，且不会有下层导线打线空间不足的问题，然而，此习知技术的问题在于下层芯片10的覆晶式封装与上层芯片12的打线封装制程不同，故需利用不同封装机台以进行此二种封装制程，因此就成本与制程繁易度而言，此技术的成本较高且制程较繁琐。
而除上述的二种习知封装技术外，还有一种窗口球栅数组封装技术，如图3所示，而利用窗口球栅数组封装技术的上层芯片12仍是采用正面向上的形式，而下层芯片10则利用基板20上所开设的窗口以进行封装打线的动作，此习知技术虽无需采用挡片芯片以增加二芯片10、12间的高度，但仍因二芯片10、12的封装技术不同，故仍需利用不同封装机台以进行封装打线等动作，因此无论是成本或是制程难易度，此技术亦有改进的空间。
发明内容
本实用新型的主要目的是提供一种芯片黏着胶材，其可黏着于堆栈封装结构中相邻二芯片之间，并可维持其间的高度，藉以省略挡片芯片的使用，并节省成本。
本实用新型的另一目的是提供一种应用芯片黏着胶材的堆栈封装结构，其藉由本实用新型的芯片黏着胶材的使用，以维持相邻二芯片间的高度，藉以省略挡片芯片的使用，并可节省成本。
根据本实用新型，一芯片黏着胶材黏着于一堆栈封装结构中相邻二芯片之间，此芯片黏着胶材内含有复数个填充粒子，藉由适当控制填充粒子的种类及数目，可使芯片黏着胶材具有一定的厚度，故相邻二芯片能藉由芯片黏着胶材而黏附在一起，并相隔一定的高度，如此除可省略挡片芯片的使用以节省成本，并可确保芯片间的间隔距离，以提供下层芯片封装打线所需的空间。另外，应用本实用新型芯片黏着胶材的堆栈封装结构建构于一封装基板上，且该堆栈封装结构具有由下而上堆栈形成的复数个芯片，相邻二芯片即系利用本实用新型的芯片黏着胶材以黏合在一起，藉此在不使用挡片芯片状况下，使相邻二该芯片间隔一定距离。
通过下面的结合附图对具体实施例的详细说明，将会更容易了解本实用新型的目的、技术内容、特点及其所达成的功效。
附图说明
图1至图3为习知堆栈封装结构示意图；
图4至图6为本实用新型实施例示意图。
附图标记说明：10下层芯片；12上层芯片；14下层导线；16挡片芯片；18黏胶；20基板；30基板；32下层芯片；34上层芯片；36芯片黏着胶材；38填充粒子；40下层导线；42金手指。
具体实施方式
本实用新型提供了一种芯片黏着胶材及应用此胶材的堆栈封装结构，本实用新型藉由填充粒子的使用，使芯片黏着胶材具有一定的厚度，藉以维持堆栈封装结构中相邻二芯片的间距，且藉由填充不同数量或种类的填充粒子可改变芯片黏着胶材的厚度，进而增加使用上的弹性。
如图4所示的本实用新型的实施例示意图，由图可知，一封装基板30上建构有一堆栈封装结构，其具有二尺寸相同的下层芯片32与上层芯片34，此二层芯片32、34利用一芯片黏着胶材36黏接在一起，此芯片黏着胶材36含有数个填充粒子38，其可使芯片黏着胶材36具有一定的厚度，且藉由适当管控填充粒子38的种类与数量，便可改变芯片黏着胶材36的厚度；因此，藉由使用此芯片黏着胶材36于上层芯片34与下层芯片32间，可使二芯片32、34黏着在一起并相距一定的间隔，进而可使下层导线40具有足够的打线空间，以顺利打线连接于金手指42上。
而如图5所示，当下层芯片32的尺寸小于上层芯片34的尺寸时，二芯片32、34还需相距一间隔以提供下层导线40打线之用，故若需增加二芯片32、34的间距以保证下层导线40能顺利进行打线连接，还可在芯片黏着胶材36黏附于二芯片32 34间前，填充尺寸更大的填充粒子38以增加芯片黏着胶材36的厚度，接着只要使用此芯片黏着胶材36于二芯片32、34间，即可使二芯片32、34黏附在一起，并维持二芯片32、34间的适当高度。
另外，如图6所示，本实用新型亦可应用于具有多层芯片44的堆栈封装结构中，且可因应各层芯片44间所需间隔高度的不同，而选择具有不同填充粒子46的芯片黏着胶材48，以黏设于不同的相邻二芯片44之间，藉此使不同的相邻二芯片44间具有不同的间距。
由上述可知，本实用新型兼具黏着芯片与维持芯片间距的功能，除可省略挡片芯片的使用以节省成本，更可藉由适当选择填充粒子的种类及数目，以改变芯片黏着胶材的厚度，藉此增加使用本实用新型的弹性，另外，本实用新型不限用于下层芯片尺寸等于或小于上层芯片尺寸的情况，只要有维持相邻二芯片的间距的需求，即可使用本实用新型。
以上所述的实施例仅为本实用新型的较佳实施例，并非用以限定本实用新型实施范围。故凡依本实用新型权利要求所述的形状、构造、特征及精神所为的均等变化与修饰，均应包括于本实用新型的保护范围之内。

Claims (2)

1、一种芯片黏着胶材，黏着于一堆栈封装结构中上下相邻二芯片之间，其特征在于芯片黏着胶材内部含有复数个填充粒子，填充粒子的芯片黏着胶材具有一定厚度。
2、如权利要求1所述的芯片黏着胶材，其特征在于所述堆栈封装结构建构于一封装基板上，且具有由下而上堆栈形成的数个芯片，所述芯片黏着胶材黏着于相邻二该芯片间，使相邻二该芯片间隔一段距离。
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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7868462B2 (en) 2006-02-23 2011-01-11 Samsung Electronics Co., Ltd. Semiconductor package including transformer or antenna
CN101604686B (zh) * 2008-06-12 2011-04-06 坤远科技股份有限公司 具填隙组件的集成电路堆叠构造
CN102097342A (zh) * 2010-11-29 2011-06-15 南通富士通微电子股份有限公司 封装系统及装片胶厚度控制方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7868462B2 (en) 2006-02-23 2011-01-11 Samsung Electronics Co., Ltd. Semiconductor package including transformer or antenna
CN101604686B (zh) * 2008-06-12 2011-04-06 坤远科技股份有限公司 具填隙组件的集成电路堆叠构造
CN102097342A (zh) * 2010-11-29 2011-06-15 南通富士通微电子股份有限公司 封装系统及装片胶厚度控制方法
CN102097342B (zh) * 2010-11-29 2013-04-17 南通富士通微电子股份有限公司 封装系统及装片胶厚度控制方法

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