CN2618303Y - Surface adhering LED structure - Google Patents
Surface adhering LED structure Download PDFInfo
- Publication number
- CN2618303Y CN2618303Y CNU032022409U CN03202240U CN2618303Y CN 2618303 Y CN2618303 Y CN 2618303Y CN U032022409 U CNU032022409 U CN U032022409U CN 03202240 U CN03202240 U CN 03202240U CN 2618303 Y CN2618303 Y CN 2618303Y
- Authority
- CN
- China
- Prior art keywords
- circuit board
- printed circuit
- emitting diode
- pcb
- surface mounted
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model relates to a light emitting diode (LED) structure with an adhesive surface, comprising a printed circuit board, a metal reflecting cup arranged in concave on the printed circuit board, at least one LED wafer is adhered on the metal reflecting cup. So a LED crystal face is electrically connected with the printed circuit board. An encapsulation colloid is used to cover the LED wafer and to protrude from the printed circuit board surface to form a necessary shape. The utility model of encapsulation colloid is directly cast on the printed circuit board and molded into any shape, therefore, the encapsulation colloid does not fall under any circumstance and the metal reflecting cup can fully reflect the light.
Description
Technical field
The utility model is relevant with a kind of surface mounted light-emitting diode, particularly can be by dropping on the printed circuit board (PCB) and can making the structure of the surface mounted light-emitting diode that light can fully reflect about a kind of packing colloid.
Background technology
Press, the surface is glutinous can be luminous when accounting for outstanding type light-emitting diode (Surface Mount Device Light EmittingDiode, SMD LED) for energising electronic component, be the light-emitting component that semi-conducting material is made, the life-span reached more than 100,000 hours; Surface mounted light-emitting diode is little because of volume, low power consumption, need not warm up lamp time (idling time), reaction speed very fast, shatter-proof, pollute characteristics such as low and suitable volume production, and the needs on the fit applications are made the element of minimum or array easily, have been widely used in the light source of the information electronic product of miniaturization day by day.
Known surface mounted light-emitting diode, as shown in Figures 1 and 2, it is to form a plastic cement reflector 12 on a substrate (generally being sheet metal) 10, an adhesive LED wafer 14 on plastic cement reflector 12, this LED wafer 14 is to utilize a conductive metal frames 16 to form with substrate 10 to electrically connect, one epoxy resin 18 coats LED crystal particle 14, and coating one deck UV epoxy resin 20 is in order to bind the plastic cement colloid 22 of a dome-type on epoxy resin 18.
Above-mentioned surface mounted light-emitting diode, be to utilize multiple expansion, the different material of constriction coefficient to engage, but different materials can be because the influence of the temperature difference, and make the displacement that engages the back storeroom increase, the tomography or the slight crack that then can cause engaging the back storeroom because of the increase of displacement are easier to take place, particularly when doing surface mounted formula welded encapsulation backflow (SMT solder reflow), the plastic cement colloid 22 of dome-type can come off especially easily; And only include plastic cement reflector 12 at known surface mounted light-emitting diode, make the light reflecting effect not enough.
The utility model content
Main purpose of the present utility model is to provide a kind of structure of surface mounted light-emitting diode, its packing colloid is that directly being moulded into also one-body molded on the printed circuit board (PCB) is required shape, so must be in addition that other packing colloid of required form is extra not adhesive on printed circuit board (PCB), therefore no matter the neither meeting of packing colloid under any circumstance comes off.
Another object of the present invention is to propose a kind of structure of surface mounted light-emitting diode, it forms a metallic reflection cup (metal reflection cup) on printed circuit board (PCB), utilize the metallic reflection cup that light can be reflected away fully and spotlight effect better.
Another purpose of the present utility model is to propose a kind of structure of surface mounted light-emitting diode, and it utilize to expand, the same or analogous material of constriction coefficient engages, make that the temperature difference leads the displacement of storeroom can reduce to situation minimum or that do not have.
For achieving the above object, the structure of the surface mounted light-emitting diode that the utility model provides comprises:
One printed circuit board (PCB), system is concaved with a metallic reflection cup on it;
At least one LED wafer, adhesive formation on this metallic reflection cup and with this printed circuit board (PCB) electrically connects; And
One packing colloid coats this LED wafer and protrudes this printed circuit board surface and form required shape.
The structure of described surface mounted light-emitting diode, wherein, this printed circuit board (PCB) and this packing colloid are made of two kinds of expansions, the same or analogous materials of constriction coefficient.
The structure of described surface mounted light-emitting diode, wherein, this packing colloid is dome-type, ellipse, column type or other shapes.
The structure of described surface mounted light-emitting diode, wherein, this packing colloid is with the moulding of die casting mode, so this packing colloid can form Any shape when mold.
The structure of described surface mounted light-emitting diode, wherein, this packing colloid is the material of epoxy resin or same nature.
The structure of described surface mounted light-emitting diode, wherein, these printed circuit board (PCB) both sides also are provided with the individual or plurality of grooves of odd number.
Description of drawings
Below illustrate in detail by the specific embodiment conjunction with figs., when the effect that is easier to understand the utility model purpose, technology contents, characteristics and is reached.
Fig. 1 is known structure cutaway view.
Fig. 2 is known structure vertical view.
Fig. 3 is a structure cutaway view of the present utility model.
Fig. 4 is a structure vertical view of the present utility model.
Embodiment
As shown in Figure 3, a kind of structure of surface mounted light-emitting diode, comprise a printed circuit board (PCB) 30, be concaved with a metallic reflection cup (metal reflection cup) 32 on it, and have a LED wafer 34 adhesive on metallic reflection cup 32 and with printed circuit board (PCB) 30, formation to electrically connect; Utilize a packing colloid 36 to coat LED wafer 34 and protrude printed circuit board (PCB) 30 surfaces and form hemispheric external form; Wherein, packing colloid 36 is an epoxy resin (Epoxy).
Above-mentioned printed circuit board (PCB) 30 and packing colloid 36 are two kinds of expansions, the same or analogous material of constriction coefficient, therefore when engaging, can make the displacement of the storeroom that the temperature difference causes, can reduce to situation minimum or that do not have, and packing colloid 36 is for directly being moulded on the printed circuit board (PCB) 30 and one-body moldedly being dome-type, shapes such as cylindrical or ellipse, and need not be as known technology that the plastic cement colloid of dome-type is adhesive on printed circuit board (PCB) 30 in addition, when therefore in the future carrying out surface mounted formula solder reflow processing procedure (SMT solder reflow) again, the plastic cement colloid that does not also have dome-type is taken place by the situation that drops on the printed circuit board (PCB) 30; In addition, packing colloid 34 can directly be made into different shape on printed circuit board (PCB) 30; And the metallic reflection cup 32 on printed circuit board (PCB) 30 can reflect away light fully and it is better to get light effect.
Wherein, as shown in Figure 4, also be provided with single or plurality of grooves 38, make it convenient when carrying out the encapsulation of surface mounted formula solder reflow in printed circuit board (PCB) 30 both sides.
The utility model is in the structure that proposes a kind of surface mounted light-emitting diode, its packing colloid is directly to be moulded on the printed circuit board (PCB), and the formation different shape, must be in addition that other packing colloid of required form is not adhesive on printed circuit board (PCB), therefore no matter under any circumstance packing colloid can not come off, and the material of printed circuit board (PCB) and packing colloid is similar, so can not cause the displacement of storeroom to increase because of the influence of the temperature difference; And the metallic reflection cup that designs on printed circuit board (PCB) makes light can reflect away and reach the better effect of spotlight effect fully.
The above is preferred embodiment of the present utility model only, is not to be used for limiting practical range of the present utility model.So be that all equalizations of doing according to the described shape of the utility model claim, structure, feature and spirit change or modification, all should be included in the claim of the present utility model.
Claims (5)
1, a kind of structure of surface mounted light-emitting diode is characterized in that, comprising:
One printed circuit board (PCB) is concaved with a metallic reflection cup on it;
At least one LED wafer, adhesive formation on this metallic reflection cup and with this printed circuit board (PCB) electrically connects; And
One packing colloid coats this LED wafer and protrudes this printed circuit board surface and form required shape.
2, the structure of surface mounted light-emitting diode as claimed in claim 1 is characterized in that, wherein, this printed circuit board (PCB) and this packing colloid are made of two kinds of expansions, the same or analogous materials of constriction coefficient.
3, the structure of surface mounted light-emitting diode as claimed in claim 1 is characterized in that, wherein, this packing colloid is dome-type, ellipse or column type shape.
4, the structure of surface mounted light-emitting diode as claimed in claim 1 is characterized in that, wherein, this packing colloid is the material of epoxy resin or same nature.
5, the structure of surface mounted light-emitting diode as claimed in claim 1 is characterized in that, wherein, these printed circuit board (PCB) both sides are provided with the individual or plurality of grooves of odd number.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU032022409U CN2618303Y (en) | 2003-01-22 | 2003-01-22 | Surface adhering LED structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU032022409U CN2618303Y (en) | 2003-01-22 | 2003-01-22 | Surface adhering LED structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2618303Y true CN2618303Y (en) | 2004-05-26 |
Family
ID=34241163
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU032022409U Expired - Fee Related CN2618303Y (en) | 2003-01-22 | 2003-01-22 | Surface adhering LED structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2618303Y (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102412344A (en) * | 2010-09-23 | 2012-04-11 | 展晶科技(深圳)有限公司 | Light emitting diode (LED) packaging method |
-
2003
- 2003-01-22 CN CNU032022409U patent/CN2618303Y/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102412344A (en) * | 2010-09-23 | 2012-04-11 | 展晶科技(深圳)有限公司 | Light emitting diode (LED) packaging method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20040526 Termination date: 20120122 |