CN1622346A - High thermal conductivity PCB type surface binding light emitting diode - Google Patents
High thermal conductivity PCB type surface binding light emitting diode Download PDFInfo
- Publication number
- CN1622346A CN1622346A CNA2003101183745A CN200310118374A CN1622346A CN 1622346 A CN1622346 A CN 1622346A CN A2003101183745 A CNA2003101183745 A CN A2003101183745A CN 200310118374 A CN200310118374 A CN 200310118374A CN 1622346 A CN1622346 A CN 1622346A
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- China
- Prior art keywords
- conductive metal
- pcb
- emitting diode
- thermal conductive
- metal conductor
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- Led Device Packages (AREA)
Abstract
The present invention is one kind of high heat conductivity PCB surface mounted LED. In the position of the PCB with LED chip mounted, there is through hole filled with high heat conductivity metal conductor, so that the heat the powered LED chip generates may be conducted out to form the high heat conductivity PCB surface mounted LED. The high heat conductivity PCB surface mounted LED may have great current, high light emitting strength and less fault, and is superior to common surface mounted LED.
Description
Technical field
The present invention is about the encapsulating structure of light-emitting diode and the innovation of method for a kind of.The encapsulation of tradition light-emitting diode (LED) is that led chip (Chip) is fixedly arranged on substrate or the metallic support routing again, and use the transparent resin encapsulated moulding, and wherein LED divides two kinds of lamp type (Lamp) and surface adhesion types (SMD).The present invention is installed the SMD LED element of high-thermal conductive metal conductor additional for solid brilliant place on the PCB substrate.
Background technology
Traditional circuit-board (PCB) type surface adhering light-emitting diode (SMD LED) is directly to be installed with light-emitting diode (LED) chip on the PCB substrate, connect the electrode call wire again after sizing shaped, because PCB substrate poor heat radiation, heat can't be discharged when making light-emitting diode (LED) chip light emitting, therefore can only do little electric current (20mA is following) small-sized component, PCB type surface adhering light-emitting diode (SMD LED) full-size was 1608 (long 1.6mm * wide 0.8mm) (as shown in Figure 1) at present.
The encapsulation of LED is considerable to considering of its thermal diffusivity, especially on the White-light LED illumination purposes, to no longer be that 15mA or 20mA in the past is standard, but wish to reach more than the 50mA, even 100mA makes its brightness brighter, certainly its consumed power is bigger, the heat that produces is also big, therefore must strengthen its radiating effect, U.S. Hewlett-Packard Corporation just develops the LED of a special package (being commonly called as Piranha) structure, and (Hewlett-Packard Corporation claims SUPER FLUX LEDS, model HPWA-MHOO etc.) it emphasizes that thermal diffusivity is good, and it is out of question to pass to 70mA, and this type LED mostly is used in the 3rd brake light of automobile now.
The LED encapsulation is with regard to thermal diffusivity, PCB SMD type is the poorest a kind of of all LED package coolings, will differ from manyly than lamp type (Lamp), so it can't pass to big electric current, its poor radiation is main because its potting resin and the thermal diffusivity of substrate own are not good, can't effectively conduct heat.
Summary of the invention
In order to solve above-mentioned puzzlement, my study for a long period of time LED work, multinomial patent and good achievement are arranged for many years, modern because PCB type SMD LED, and not good research of crystal-coated light-emitting diodes (LED Chip OnBoard) its thermal diffusivity found solution, the present invention breaks through traditional production, but mass production has good competitiveness and productive value.
The present invention's " sticking potato light-emitting diode in high heat conduction PCB type surface ", mainly be to put light-emitting diode (LED) chip position in advance at the base material of circuit board＜PCB), do hole and fill up high-thermal conductive metal conductor (as shown in Figure 2), its high-thermal conductive metal conductor material is copper glue, elargol or high temperature bump, the heat conduction that light-emitting diode (LED) chip energising back can be produced is gone out, and makes to form to have high heat conduction PCB type surface adhering light-emitting diode.
The present invention utilizes circuit board (PCB) perforation and fills the high-thermal conductive metal conductor, so can lead to big electric current, can not make the light-emitting diode fault yet, can strengthen the thermal diffusivity of light-emitting diode (LED) effectively and strengthen the luminosity of light-emitting diode (LED), be the general conventional surface adhesioluminescence diode effect that is beyond one's reach.
Utilize the present invention's " high heat conduction PCB type surface adhering light-emitting diode " directly to make crystal-coated light-emitting diodes (LED Chip On Board) and make (as Fig. 5, shown in Figure 3) as LED traffic lights or area source, its effect is assembled than with the Lamp lamp, its processing procedure and material cost are cheap many and thermal diffusivity is good, more can be applied on other LED lamp light source Products Development, as LED billboard or LED lamp string.
Description of drawings
Fig. 1 is a traditional PCB type surface adhering package structure for LED side cutaway view;
Fig. 2 is the present invention's " high heat conduction PCB type surface adhering light-emitting diode " embodiment one encapsulating structure side cutaway view;
Fig. 3 is the present invention's " high heat conduction PCB type surface adhering light-emitting diode " embodiment two crystal covering type encapsulating structure side cutaway views;
Fig. 4 is the present invention's " high heat conduction PCB type surface adhering light-emitting diode " embodiment three front luminous package structure side cutaway views;
Fig. 5 is a pseudosection on the present invention's " high heat conduction PCB type surface adhering light-emitting diode " embodiment four lateral emitting encapsulating structures.
Embodiment
For the present invention's " high heat conduction PCB type surface adhering light-emitting diode " is more clearly demonstrated, cooperate to illustrate and lift an example of making:
Embodiment one
Please consult shown in Figure 2, the present invention's's " high heat conduction PCB type surface adhering light-emitting diode " side cutaway view structure, formed by led chip 1, led chip electrode 2, call wire 3, the PCB substrate 5 that contains the high-thermal conductive metal conductor, electrode of substrate 7, epoxy resin 9 and high-thermal conductive metal conductor 11, wherein high-thermal conductive metal conductor 11 is in the fixed chip position of the PCB substrate 5 that contains the high-thermal conductive metal conductor, led chip 1 is in high-thermal conductive metal conductor 11 tops, call wire 3 connects led chip electrode 2 and electrode of substrate 7 respectively, uses epoxy resin 9 Overmolded.
The heat that is sent when this structure is can be with led chip 1 luminous is directly discharged by high-thermal conductive metal conductor 11, has good heat sinking function.
The manufacture method of high heat conduction PCB substrate is PCB to be put on the chip position in advance bore through hole and utilize the PCB electroplating process to make this through hole point formation one metal heat-conducting point (being a kind of bump) utilize this bump to conduct the heat of chip through the reflow heating mode again in wire mark tin cream or various alloy cream (its fusing point must greater than 220 ℃) mode through hole again through hole inwall electroplated metal layer (being generally the gold layer).
Embodiment two
Please consult shown in Figure 3, side cutaway view for the present invention's " high heat conduction PCB type surface adhering light-emitting diode " crystal covering type encapsulating structure, be by crystal covering type led chip 12, chip electrode 2, tin ball 8, the PCB substrate 6 that contains two high-thermal conductive metal conductors, electrode of substrate 7, epoxy resin 9 and high-thermal conductive metal conductor 11 are formed, two high-thermal conductive metal conductors 11 covering on the brilliant position electrode wherein respectively at the PCB substrate 6 that contains two high-thermal conductive metal conductors, crystal covering type led chip 12 is in high-thermal conductive metal conductor 11 tops, use tin ball 8 connection-core plate electrode 2 and high-thermal conductive metal conductor 11 respectively, Overmolded with epoxy resin 9 at last.
The high-thermal conductive metal conductor 11 of this structure on the PCB substrate 6 that contains two high-thermal conductive metal conductors can be a plurality of, can engage conducting with a plurality of chip electrodes 2 contacts of crystal covering type LED12, and the heat that is sent when can be with crystal covering type led chip 12 luminous can be through chip electrode 2 and tin ball 8, discharge by high-thermal conductive metal conductor 11 at last, be to make illumination white light LEDs best mode now, have good heat sinking function, significantly promote luminous efficiency and stability.
Embodiment three
Please consult shown in Figure 4, the side cutaway view of the present invention's " high heat conduction PCB type surface adhering light-emitting diode " front luminous package structure, be by lED chip 1, chip electrode 2, call wire 3, the PCB substrate 5 that contains the high-thermal conductive metal conductor, electrode of substrate 7, epoxy resin 9, white colloid 10 and high-thermal conductive metal conductor 11 are formed, wherein, high-thermal conductive metal conductor 11 is in the fixed chip position of the PCB substrate 5 that contains the high-thermal conductive metal conductor, led chip 1 is in high-thermal conductive metal conductor 11 tops, call wire 3 difference connection-core plate electrodes 2 and electrode of substrate, use epoxy resin 9 to coat led chip 1, chip electrode 2 and call wire 3 are in PCB substrate 5 surfaces that contain the high-thermal conductive metal conductor, at last with white colloid 10 moulding.
When this structure is can be with led chip 1 luminous, light is sent by the top through white colloid 10 and PCB substrate 5 surface reflections that contain the high-thermal conductive metal conductor, the heat that is sent is directly discharged by high-thermal conductive metal conductor 11, has good heat sinking function, can promote the finished product luminous efficient that makes progress significantly, the utmost point is suitable for using in large-scale indicator light and large-scale panel light source.
Embodiment four
Please consult shown in Figure 5, the last pseudosection of the present invention's " high heat conduction PCB type surface adhering light-emitting diode " lateral emitting encapsulating structure, be by led chip 1, chip electrode 2, call wire 3, the PCB substrate 5 that contains the high-thermal conductive metal conductor, electrode of substrate 7, epoxy resin 9, white colloid 10 and high-thermal conductive metal conductor 11 are formed, wherein high-thermal conductive metal conductor 11 is in the fixed chip position of the PCB substrate 5 that contains the high-thermal conductive metal conductor, led chip 1 is in high-thermal conductive metal conductor 11 tops, call wire 3 is connection-core plate electrode 2 and electrode of substrate 7 respectively, use epoxy resin 9 to coat led chip 1, chip electrode 2 and call wire 3 are in PCB substrate 5 surfaces that contain the high-thermal conductive metal conductor, at last with white colloid 10 moulding.
This structure is identical with embodiment three, difference only is light emission direction and electrode position, two electrode position all is finished product side and homonymy, light is sent by the top through white colloid 10 and PCB substrate 5 surface reflections that contain the high-thermal conductive metal conductor when luminous, and the heat that is sent is directly discharged by high-thermal conductive metal conductor 11, has good heat sinking function, can promote the efficient of lateral emitting significantly, be splendid panel light source,, use with small panel for various mobile phone screen.
In sum, not high in order to solve circuit board (PCB) type surface adhering light-emitting diode (SMD LED) because of bad its life-span and the luminous efficiency of causing of dispelling the heat, can't use on the big electric current of high power (more than the 50mA), the present invention can strengthen the thermal diffusivity of light-emitting diode (LED) effectively and strengthen luminosity, is that general conventional surface adhesioluminescence diode is beyond one's reach.The crystal-coated light-emitting diodes Chip Packaging be can be used in and LED traffic lights or area source made, its effect than assemble its processing procedure with the Lamp lamp and material cost cheaply many, more can be applied on other LED lamp light source Products Development, as LED billboard, indicator light, panel light source or LED lamp string, be to make illumination white light LEDs best mode now, the present invention breaks through traditional production, but mass production has good competitiveness and productive value.
Claims (7)
1. PCB type surface adhering light-emitting diode, its structure is made up of led chip, circuit board, high-thermal conductive metal conductor, it is characterized in that, a hole is arranged on the led chip position and it is filled up the high-thermal conductive metal conductor putting in advance of PCB, so as to heat that led chip the produced high-thermal conductive metal conductor thermal conductance by substrate is gone out.
2. PCB type surface adhering light-emitting diode as claimed in claim 1 is characterized in that, the high-thermal conductive metal conductor can be copper glue, elargol or high temperature scolding tin composition to be formed, and its fusing point is greater than 220 ℃.
3. PCB type surface adhering light-emitting diode as claimed in claim 1 is characterized in that the high-thermal conductive metal conductor on pcb board can be a plurality of.
4. PCB type surface adhering light-emitting diode as claimed in claim 3 is characterized in that, the high-thermal conductive metal conductor on pcb board engages conducting with crystal covering type LED plurality of electrodes contact.
5. the manufacture method of a PCB type surface adhering light-emitting diode, it is characterized in that, be that perforation is done in the position of putting led chip on PCB circuit sheet material in advance, and its hole filled up with high heat conductive metal powder, make this metal-powder in conjunction with forming a heat carrier with heating mode again, again led chip is placed on the heat carrier and the routing connection electrode, again with the epoxy encapsulation moulding.
6. the manufacture method of PCB type surface adhering light-emitting diode as claimed in claim 5 is characterized in that, the high-thermal conductive metal conductor can be copper glue, elargol or high temperature scolding tin composition to be formed, and its fusing point is greater than 220 ℃.
7. the manufacture method of PCB type surface adhering light-emitting diode as claimed in claim 5 is characterized in that the high-thermal conductive metal conductor on PCB pulls can be a plurality of.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2003101183745A CN1622346A (en) | 2003-11-25 | 2003-11-25 | High thermal conductivity PCB type surface binding light emitting diode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2003101183745A CN1622346A (en) | 2003-11-25 | 2003-11-25 | High thermal conductivity PCB type surface binding light emitting diode |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1622346A true CN1622346A (en) | 2005-06-01 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2003101183745A Pending CN1622346A (en) | 2003-11-25 | 2003-11-25 | High thermal conductivity PCB type surface binding light emitting diode |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1622346A (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100388092C (en) * | 2006-04-20 | 2008-05-14 | 友达光电股份有限公司 | Heat radiation structure of backlight module |
| US7505109B2 (en) | 2006-03-31 | 2009-03-17 | Au Optronics Corporation | Heat dissipation structure of backlight module |
| CN101949521A (en) * | 2010-08-24 | 2011-01-19 | 广州南科集成电子有限公司 | LED integrated light source board and manufacturing method thereof |
| CN102214758A (en) * | 2010-04-09 | 2011-10-12 | Lg伊诺特有限公司 | Light emitting device, method for fabricating the light emitting device, and light emitting device package |
| CN101355133B (en) * | 2007-07-26 | 2012-09-05 | 夏普株式会社 | Nitride based compound semiconductor light emitting device and method of manufacturing the same |
| CN102738375A (en) * | 2011-04-12 | 2012-10-17 | 东莞怡和佳电子有限公司 | Led light source module |
| WO2012151762A1 (en) * | 2011-05-09 | 2012-11-15 | 深圳市华星光电技术有限公司 | Led light source module, backlight module, and liquid crystal display |
| CN105355622A (en) * | 2014-08-21 | 2016-02-24 | 上海威廉照明电气有限公司 | Integrated super-quantum LED light-emitting device |
| CN109037174A (en) * | 2018-07-13 | 2018-12-18 | 深圳烯创技术有限公司 | A kind of copper is embedded in the heat structure and preparation method thereof in graphene-based composite substrate |
-
2003
- 2003-11-25 CN CNA2003101183745A patent/CN1622346A/en active Pending
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7505109B2 (en) | 2006-03-31 | 2009-03-17 | Au Optronics Corporation | Heat dissipation structure of backlight module |
| CN100388092C (en) * | 2006-04-20 | 2008-05-14 | 友达光电股份有限公司 | Heat radiation structure of backlight module |
| CN101355133B (en) * | 2007-07-26 | 2012-09-05 | 夏普株式会社 | Nitride based compound semiconductor light emitting device and method of manufacturing the same |
| CN102214758A (en) * | 2010-04-09 | 2011-10-12 | Lg伊诺特有限公司 | Light emitting device, method for fabricating the light emitting device, and light emitting device package |
| CN102214758B (en) * | 2010-04-09 | 2016-01-27 | Lg伊诺特有限公司 | Luminescent device, for the manufacture of the method for luminescent device and light emitting device package |
| CN101949521A (en) * | 2010-08-24 | 2011-01-19 | 广州南科集成电子有限公司 | LED integrated light source board and manufacturing method thereof |
| CN101949521B (en) * | 2010-08-24 | 2012-11-21 | 广州南科集成电子有限公司 | LED integrated light source board and manufacturing method thereof |
| CN102738375A (en) * | 2011-04-12 | 2012-10-17 | 东莞怡和佳电子有限公司 | Led light source module |
| WO2012151762A1 (en) * | 2011-05-09 | 2012-11-15 | 深圳市华星光电技术有限公司 | Led light source module, backlight module, and liquid crystal display |
| CN105355622A (en) * | 2014-08-21 | 2016-02-24 | 上海威廉照明电气有限公司 | Integrated super-quantum LED light-emitting device |
| CN109037174A (en) * | 2018-07-13 | 2018-12-18 | 深圳烯创技术有限公司 | A kind of copper is embedded in the heat structure and preparation method thereof in graphene-based composite substrate |
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