CN2556791Y - Connected surface adhesive luminous diode - Google Patents
Connected surface adhesive luminous diode Download PDFInfo
- Publication number
- CN2556791Y CN2556791Y CN02231267U CN02231267U CN2556791Y CN 2556791 Y CN2556791 Y CN 2556791Y CN 02231267 U CN02231267 U CN 02231267U CN 02231267 U CN02231267 U CN 02231267U CN 2556791 Y CN2556791 Y CN 2556791Y
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- China
- Prior art keywords
- emitting diode
- coupled
- surface adhesion
- electrode
- adhesion type
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/93—Batch processes
- H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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Abstract
The utility model provides a coupled surface adhesive luminescent diode which is the novel structure of a surface adhesive luminescent diode (SMD LED) The processing method is that a metal support is regarded as a base plate, one side of which is provided with a groove, a base plate electrode and the structure of a penetrating hole through a mechanical process or chemical etching method, being an injection molding method, the groove structure of the metal base plate is regarded as an injection molding seat, injection plastic materials are used for being filled in the groove and leading the two sides of the SMD to be attached to electrodes to form a flat surface, at the same time, after the injection molding method, the plastic materials will be formed into coupled bowl-cup structure and can fill the structure of the penetrating hole being arranged on the two lateral sides, and then the LED will be given solid crystal process, binding wire process and glue sealing process, and the coupled metal base plate structure is divided into LED module products of monomer structure or multi-connected monomer structure in different cutting methods.
Description
Technical field
The utility model relates to led technology, particularly the coupled surface adhesion type light-emitting diode.
Background technology
At present its manufacture method of surface adhesion type light-emitting diode (SMD LED) is distinguished two kinds of die casting package method (Molding) and method of radiations (Injection).Die casting package method (Molding) processing procedure has roughly been distinguished circuit board (PCB) type and support (Lead Frame), type, and method of radiation (Injection) processing procedure then has support (Lead Frame) clubfoot type in addition.
The utility model, the coupled surface adhesion type light-emitting diode, mainly be to break through traditional SMD structure, this creator realizes the shortcoming that traditional circuit-board (PCB) type SMD structure is caused through the experience of LED for many years, as poor radiation, sealing is bad, and lighting angle causes brightness low greatly, and procedure for producing is loaded down with trivial details, equipment investment is bigger, and the destabilizing factor in producing as the glue that overflows, skew, or the like this all are shortcomings of traditional SMD.
Method of radiation (Injection) processing procedure support (Lead Frame) clubfoot type surface adhesion type light-emitting diode (SMD LED) shortcoming: the big microminiaturization difficulty of volume, and mostly must just can reach the structure of SMD surface adhering electrode after encapsulating through meander electrode for the monomer mode, its machining meander electrode, easily cause product hermeticity to change, make qualification rate reduce, and processing procedure is more, cost is high, production stability is low, poor radiation, finished product reliability are relatively poor.And it is relatively poor on existing shoot mode production efficiency and the benefit.
Steamed bun casting (Molding) processing procedure circuit board type and support rack type surface adhesion type light-emitting diode (SMD LED) shortcoming: (FR-4 or BT) makes substrate with circuit board, the encapsulation reliability is relatively poor, low heat emission, generally encapsulate with die casting package method (Molding) processing procedure, employed manufacturing equipment cost is higher, and processing procedure is loaded down with trivial details, does not have light reflection recess structure to make that the LED luminous intensity is lower, if with Molding die casting (belong to then formula engage) make its sealing resin and the substrate zygosity relatively poor.
The utility model content
The purpose of this utility model is in order to overcome the deficiency of existing surface adhesion type light-emitting diode, a kind of luminous intensity height, good airproof performance, technological process is simple, production cost is low " coupled surface adhesion type light-emitting diode " are provided, improve SMD type light-emitting diode structure.
For achieving the above object, solution of the present utility model is:
A kind of coupled surface adhesion type light-emitting diode is a substrate with the metal, and substrate wherein one side has the structure of groove and formation metal electrode and metal substrate electrode and tool through hole; Be filled between metal electrode and metal substrate electrode and through hole and groove area with plastics, integrally formed surface adhesion type light-emitting diode mounting structure with coupled bowl cup; Again
With the LED crystal particle metal electrode in the coupled bowl cup of adhering, and cut into surface adhesion type light-emitting diode through bonding wire, sealing Hou.
Comply with the light emitting diode module finished product that different cutting methods can form the monomer structure finished product or link monomer structure more.
Two electrode of substrate adopts extended type, can form a surface adhesion type lateral light-emitting diode.Advantage of the present utility model has:
One, with the metal substrate groove structure, method through ejection formation, formed SMD LED surface adhering base is the plane pattern, virgin metal substrate recess place is filled up through ejection formation, form the insulator between two lateral electrodes, and protruding place, former both sides, as SMD LED surface adhering electrode, this can remove the shortcoming that conventional surface adhesion SMD LED clubfoot support rack type palpus meander electrode could constitute SMD LED surface adhering electrode from.
Two, ejection formation groove skew wall structure engages to improve between two structures with half clad type with the metal substrate structure and engages intensity.
Three, through solid brilliant, bonding wire, sealing, the cutting flow process that promptly fulfils assignment, the manufacturing process of shortening and time, and reduced equipment investment and reduce cost to reach.
Four, utilize cutting method to cut apart operation, be different from tradition and penetrate the support rack type product, it uses the mechanical stamping mode to destroy substrate easily and penetrates glue sealing structure, the cutting method that the utility model uses then can not influence LED light-emitting diode sealing, thereby improves the reliability that the encapsulation adaptation is guaranteed product.
Five, structure of the present utility model adopts the coupled structure, is different from traditional ejaculation type monomer structure, helps improving the production operation production capacity.
Six, wherein have a bowl cup structure, utilize the bowl cup structure that the light reflection is had preferable optical application forward, therefore improve SMD product luminous intensity.
Seven, metal electrode must not use the machining bending can reach SMD surface adhering electrode in the new structure, makes its more complanation/lightening using value that has more.
Eight, adopt the coupled structure can comply with different cutting methods, the surface adhering SMD type LED of manufacture order body member, binary element or concatemer element shows module simultaneously.
Nine, structure of the present utility model, its both sides metal electrode can become a surface adhesion type lateral light-emitting diode if adopt extended type, and welding is used in the side.
Description of drawings
Fig. 1, tradition penetrate support rack type surface adhering three-dimensional LED and dissect schematic diagram.
Fig. 2, conventional die castings package method (Molding) circuit board type SMD surface adhering three-dimensional LED are dissected schematic diagram.
Fig. 3, conventional die castings package method (Molding) support rack type SMD surface sticking work three-dimensional LED is dissected schematic diagram.
Fig. 4, the utility model coupled surface adhesion type light-emitting diode, the three-dimensional internal anatomy of metal substrate after machining or chemical etching (Etching).
Fig. 5, the utility model coupled surface adhesion type light-emitting diode utilize injection forming method that plastics are incorporated into three-dimensional internal anatomy on the metal substrate.
Fig. 6, the utility model coupled surface adhesion type light-emitting diode weld the three-dimensional internal anatomy that the work processing procedure forms through solid crystalline substance and lead.
The three-dimensional internal anatomy that Fig. 7, the utility model coupled surface adhesion type light-emitting diode form through crystal covering type (Flipchip) processing procedure.
The three-dimensional internal anatomy that Fig. 8, the utility model coupled surface adhesion type light-emitting diode form through manufacture procedure of adhesive.
The three-dimensional internal anatomy of monomer product that Fig. 9, the utility model coupled surface adhesion type light-emitting diode form through the cutting processing procedure.
The monomer product schematic perspective view that Figure 10, the utility model coupled surface adhesion type light-emitting diode form through the cutting processing procedure.
Figure 11, the utility model coupled surface adhesion type light-emitting diode monomer structure finished product backplate figure.
Figure 12, the utility model coupled surface adhesion type light-emitting diode electrode extended type monomer structure finished product backplate figure.
Figure 13, the utility model coupled surface adhesion type light-emitting diode link monomer structure LED module finished product stereogram more.
Embodiment
In order to make those skilled in the art understand the utility model, cooperation illustrates as follows:
As the surface adhering three-dimensional LED internal anatomy of the 1st figure tradition ejaculation support rack type, it must be through the traditional electrode after the machining bending 6.After its processing bending, the influence of stress easily causes plastics 84 and traditional electrode 6 sealings to change, so yield reduces, thus make in addition be all that monomer structure production processing procedure is loaded down with trivial details, cost is high, production stability is low, poor radiation, finished product reliability be low.
As the 2nd figure conventional die castings package method (Molding) circuit board type surface adhering three-dimensional LED internal anatomy; This SMD LED element is adopted die casting package method (Molding), unglazed reflection recess structure, and the LED luminous intensity is low, and brightness can't effectively be brought into play.In addition tellite (PCB) 3 is relatively poor and both thermal expansion coefficient differences are big with sealing resin 83 zygosities, easily causes and peels off problem between the two.
Shown in the 3rd figure, this is the embodiment that utilizes metallic support and use die casting package method (Molding), as the narration of the 2nd figure, and the still old identical shortcoming of this example, unglazed reflection recess structure, the LED luminous intensity is low, and brightness can't effectively be brought into play; Support and sealing resin 83 zygosities are also relatively poor, easily cause and peel off problem between the two.
See also shown in the 4th figure, " " mainly with metal substrate 1, one side has the coupled structure of groove 4, metal electrode 21 and metal substrate electrode 22 and through hole 5 to the coupled surface adhesion type light-emitting diode to the utility model to utilize machining or chemical etching (Etching) to make wherein; Through ejection formation (consulting shown in the 5th figure), plastics 84 are filled up metal substrate groove 4 and with both sides metal electrode 21,22 one-tenth one planes of metal substrate electrode, form coupled bowl cup 7 through ejection formation, the bowl cup structure can improve the brightness that LED produces, plastics 84 fill up both sides through hole 5 simultaneously, are beneficial to improve metal electrode 21 and metal substrate electrode 22 and 84 bond strengths of plastics.
Shown in the 6th figure, finish the ejaculation program after, the semi-finished product of LED crystal particle 81 and plain conductor 82 gained after processing procedure is shown in solid brilliant and lead weldering.
Shown in the 7th figure, this is the schematic diagram of crystal covering type (Flip chip) processing procedure, and this processing procedure is directly with the mode combination with the eutectic welding of the electrode on the LED crystal particle 81 and metal electrode 21 and metal substrate electrode 22.
Shown in the 8th figure, sealing resin 83 pours in the coupled ejection formation bowl cup 7 that ejection formation plastics 84 are crossed and promptly finishes manufacture procedure of adhesive.
Shown in the 9th, 10 figure, after cutting, form the monomer diagram; The 9th figure is an internal anatomy, and the 10th figure is a sterogram.
Shown in the 11st figure, when metal electrode 21 and metal substrate electrode 22 bottoms become the scolding tin operation, with the circuit board soldering tin composition surface.
Shown in the 12nd figure, can adopt extended type both sides metal electrode 21 and metal substrate electrode 22 can become a surface adhesion type lateral light-emitting diode to use in side scolding tin operation.
Shown in the 13rd figure, can use different cut mode, the couple structure of formation, or the above many connecting structures of binary.
The utility model, the advantage of coupled surface adhesion type light-emitting diode is the LED element that can cutting mode forms monomer, binary, concatemer, be applied to the light guide plate lateral emitting source and the various light sources of automobile of LCD backlight especially, as devices such as instrument board, indicators, also can on bowl cup crystal grain, add to make light source produce white light or other by phosphor powder each is photochromic.
Structure processing procedure of the present utility model is unexistent method of SMD LED and design in the past, traditional design and structure have been changed, this has the product of essence volume production, except that the brightness that strengthens SMD LED generation, also make simple (must not analyse bent angle), characteristics that reliability is also good or the like are one to have practicality and progressive design in fact.
Claims (3)
1. a coupled surface adhesion type light-emitting diode is characterized in that, is substrate with the metal, and substrate wherein one side has the structure of groove and formation metal electrode and metal substrate electrode and tool through hole; Be filled between metal electrode and metal substrate electrode and through hole and groove area with plastics, integrally formed surface adhesion type light-emitting diode mounting structure with coupled bowl cup; Again
With the LED crystal particle metal electrode in the coupled bowl cup of adhering, and cut into surface adhesion type light-emitting diode through bonding wire, sealing Hou.
2. as the sharp 1 described coupled surface adhesion type light-emitting diode that requires, it is characterized in that, comply with the light emitting diode module finished product that different cutting methods can form the monomer structure finished product or link monomer structure more.
3. coupled surface adhesion type light-emitting diode as claimed in claim 1 is characterized in that, two electrode of substrate adopts extended type, can form a surface adhesion type lateral light-emitting diode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN02231267U CN2556791Y (en) | 2002-04-30 | 2002-04-30 | Connected surface adhesive luminous diode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN02231267U CN2556791Y (en) | 2002-04-30 | 2002-04-30 | Connected surface adhesive luminous diode |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2556791Y true CN2556791Y (en) | 2003-06-18 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN02231267U Expired - Fee Related CN2556791Y (en) | 2002-04-30 | 2002-04-30 | Connected surface adhesive luminous diode |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2556791Y (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100373566C (en) * | 2006-03-22 | 2008-03-05 | 常州久和电子有限公司 | Method for processing patch diode |
| CN101533791B (en) * | 2008-03-12 | 2010-09-29 | 佰鸿工业股份有限公司 | Method for manufacturing luminescence module and luminescence module |
| CN101436631B (en) * | 2007-11-14 | 2010-11-24 | 财团法人工业技术研究院 | Method for packaging LED |
| CN101442088B (en) * | 2007-11-22 | 2012-03-28 | 广州市鸿利光电股份有限公司 | Method for shaping patch type LED optical lens model |
| CN102437151A (en) * | 2011-11-17 | 2012-05-02 | 佛山市蓝箭电子有限公司 | Full-color SMD LED (Surface Mounted Device Light Emitting Diode) bracket structure and packaging product device thereof |
| CN101290962B (en) * | 2007-04-19 | 2012-07-18 | 斯坦雷电气株式会社 | Optical device |
| CN103171080A (en) * | 2011-12-21 | 2013-06-26 | 顺德工业股份有限公司 | Manufacturing method of light-emitting device packaging bracket |
| CN104051592A (en) * | 2013-03-15 | 2014-09-17 | 深圳市斯迈得光电子有限公司 | Highly reliable LED support |
-
2002
- 2002-04-30 CN CN02231267U patent/CN2556791Y/en not_active Expired - Fee Related
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100373566C (en) * | 2006-03-22 | 2008-03-05 | 常州久和电子有限公司 | Method for processing patch diode |
| CN101290962B (en) * | 2007-04-19 | 2012-07-18 | 斯坦雷电气株式会社 | Optical device |
| CN101436631B (en) * | 2007-11-14 | 2010-11-24 | 财团法人工业技术研究院 | Method for packaging LED |
| CN101442088B (en) * | 2007-11-22 | 2012-03-28 | 广州市鸿利光电股份有限公司 | Method for shaping patch type LED optical lens model |
| CN101533791B (en) * | 2008-03-12 | 2010-09-29 | 佰鸿工业股份有限公司 | Method for manufacturing luminescence module and luminescence module |
| CN102437151A (en) * | 2011-11-17 | 2012-05-02 | 佛山市蓝箭电子有限公司 | Full-color SMD LED (Surface Mounted Device Light Emitting Diode) bracket structure and packaging product device thereof |
| CN102437151B (en) * | 2011-11-17 | 2013-10-16 | 佛山市蓝箭电子股份有限公司 | Full-color SMD LED (Surface Mounted Device Light Emitting Diode) bracket structure and packaging product device thereof |
| CN103171080A (en) * | 2011-12-21 | 2013-06-26 | 顺德工业股份有限公司 | Manufacturing method of light-emitting device packaging bracket |
| CN104051592A (en) * | 2013-03-15 | 2014-09-17 | 深圳市斯迈得光电子有限公司 | Highly reliable LED support |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C19 | Lapse of patent right due to non-payment of the annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |