CN101533791B - Method for manufacturing luminescence module and luminescence module - Google Patents
Method for manufacturing luminescence module and luminescence module Download PDFInfo
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- CN101533791B CN101533791B CN 200810085005 CN200810085005A CN101533791B CN 101533791 B CN101533791 B CN 101533791B CN 200810085005 CN200810085005 CN 200810085005 CN 200810085005 A CN200810085005 A CN 200810085005A CN 101533791 B CN101533791 B CN 101533791B
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- illuminating module
- galvanic circle
- emitting diode
- manufacture method
- cooling base
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
The invention discloses a method for luminescence module and a luminescence module; wherein the luminescence module comprises a conductive circuit consisting of metal plates and a plurality of light-emitting diodes (LED) arranged on the conductive circuit. The manufacturing method of the luminescence module applies the wire frames encapsulated by a plurality of LEDs to cut off part connection of the conductive frames so as to form the conductive circuit, thus leading the LEDs to be conductively connected by the conductive circuit directly; therefore, the arrangement of the circuit board is saved and the processing time for blanking single grain of the LED and arranging and welding the LED on the circuit board is saved, and the heat dissipation performance of the luminescence module is also improved.
Description
Technical field
The present invention relates to a kind of manufacture method and this illuminating module of illuminating module, particularly relate to manufacture method and this illuminating module of illuminating module that a kind of application is packaged with the lead frame of light-emitting diode.
Background technology
Consult Fig. 1, be a kind of existing illuminating module 1, it comprises that a surface is laid with the circuit board 12 (or ceramic substrate) of conducting wire 121, and is welded on light-emitting diode 10 on the circuit board 12 in order to the cooling base 13 that is arranged on circuit board 12 belows and most in order to arrangement.In the existing this illuminating module 1, light-emitting diode 10 be earlier one encapsulate on by the stamping forming lead frame of metal tablet and single blanking after, arrange again and be welded on the circuit board 13, by the described light-emitting diode 10 of conducting wire 121 conductings.
Why this illuminating module 1 exists the reason of this circuit board 12 (or ceramic substrate) to be: the blanking that all has been stamped of these light-emitting diodes 10 becomes single structure, and under the situation of the most light-emitting diode of a less important use simultaneously, these light-emitting diodes 10 are conducted, the most frequently used also the most general way is exactly to utilize the conducting wire 121 of laying on the circuit board 12 again, therefore, being arranged on the circuit board 12 light-emitting diode 10 again, the fixing procedure of welding certainly will just can't omit, and this way is when batch volume production, speed of production can't effectively promote, in addition, this circuit board 12 also can form the obstruction of light-emitting diode 10 in heat radiation, makes light-emitting diode 10 owing to the factor of poor heat radiation causes shorten useful life.
Summary of the invention
In view of this, this case inventor satisfies and thinks to reach, if can be provided with on the lead frame of light-emitting diode one, do not take way with single blanking of light-emitting diode, but connect by the part of cutting off on the lead frame, making lead frame constitute one can allow light-emitting diode be connection in series-parallel (series connection, in parallel or series connection simultaneously and parallel connection) galvanic circle that is connected, do not save the setting of circuit board only, and remove from and need be again light-emitting diode being arranged and the procedure of welding, thereby promote the speed of production of volume production, in addition, because the setting of having saved circuit board, whole illuminating module also can promote on heat dissipation to some extent, and then can keep the normal useful life of light-emitting diode.
The manufacture method of illuminating module of the present invention is applied to a lead frame that is provided with many light-emitting diodes, and the part of this lead frame forms the electrode of described light-emitting diode, and all electrodes are connected to each other, and this method may further comprise the steps:
Step (A): the part of cutting off described electrode connects, and make this lead frame constitute a galvanic circle that connects described light-emitting diode, and described light-emitting diode borrows this galvanic circle connection in series-parallel to connect.
Preferable enforcement according to the manufacture method of illuminating module of the present invention, also comprise a step (B): with the below one insulating protective layer is set respectively at top, this galvanic circle, and this insulating protective layer that is positioned at this top, galvanic circle is covered on this galvanic circle and described light-emitting diode is exposed.With a step (C): this galvanic circle is combined with a cooling base.
According to a preferable enforcement of the manufacture method of illuminating module of the present invention, also comprise a step (B '): an insulating protective layer that covers this top, galvanic circle and described light-emitting diode is exposed is set.With a step (C): this galvanic circle is combined with a cooling base.
Illuminating module of the present invention comprises a galvanic circle and many light-emitting diodes.The galvanic circle is that a metal sheet constitutes, and this galvanic circle has several to electrode, and described electrode is connection in series-parallel and connects.Described light-emitting diode be arranged at this galvanic circle respectively each on the electrode, described light-emitting diode is borrowed this galvanic circle to be connection in series-parallel to connect.
According to a preferable enforcement of illuminating module of the present invention, comprise that also one can supply this galvanic circle setting cooling base thereon, and one is covered on this galvanic circle and the insulating protective layer that described light-emitting diode is exposed.
According to a preferable enforcement of illuminating module of the present invention, comprise that also one is arranged at the insulating protective layer between this galvanic circle and this cooling base.
The present invention is by the lead frame that is packaged with light-emitting diode is carried out the part bar stock cutting by punching, the galvanic circle that the part that light-emitting diode is retained by lead frame constitutes forms and is in series and in parallel connecting, not only the member of whole illuminating module composition can be saved circuit board, also can save many once to single blanking of light-emitting diode and arrange again and weld back the required consumed time of circuit board, and then the speed of production of lifting volume production, in addition, owing to there has not been the setting of circuit board, the galvanic circle is that direct position is on cooling base, the heat energy that light-emitting diode produced also can be shed by cooling base more rapidly, promote the heat dissipation of entire heat dissipation module whereby, and keep the normal useful life of light-emitting diode.
Description of drawings
Fig. 1 is a kind of exploded view of existing illuminating module.
Fig. 2 is the end view of illuminating module first preferred embodiment of the present invention.
Fig. 3 is the vertical view of wherein a kind of aspect of the galvanic circle of illuminating module of the present invention.
Fig. 4 is the applied lead frame vertical view of the manufacture method of illuminating module of the present invention.
Fig. 5 is the flow chart of steps of manufacture method first preferred embodiment of illuminating module of the present invention.
Fig. 6 is in illuminating module first preferred embodiment of the present invention, the partial top view of protection insulating barrier.
Fig. 7 is the flow chart of steps of manufacture method second preferred embodiment of illuminating module of the present invention.
Fig. 8 is the end view of illuminating module second preferred embodiment of the present invention.
Embodiment
The present invention is described in detail below in conjunction with accompanying drawing and two embodiment:
Consult Fig. 2, Fig. 3, illuminating module 200 first preferred embodiments of the present invention comprise that a cooling base 5, is arranged on the galvanic circle 2 on the cooling base 5, most two insulating protective layers 4 that are arranged on the light-emitting diode 3 on the galvanic circle 2, the top that is separately positioned on galvanic circle 2 and below, and most the connectors 6 in order to above-mentioned insulating protective layer 4, galvanic circle 2 are combined with cooling base 5.
In advance one carry be, see also Fig. 4, the manufacture method of illuminating module of the present invention is to use a lead frame 201 that is provided with most light-emitting diode 3 to carry out.Thin portion, lead frame 201 is that a metal sheet punching press constitutes, these lead frame 201 punching presses are formed with the carrier strip 21 of most horizontal expansions, the carrier strip 22 of most longitudinal extensions, these carrier strips 21,22 define most gridiron structures 20, in addition, go back punching press on the lead frame 201 and be formed with the transverse electrode 23 and longitudinal electrode 24 of most contrapositions in each gridiron structure 20, majority in each gridiron structure 20 is to transverse electrode 23, longitudinal electrode 24 general alignment are " ten " font, and with the horizontal carrier strip 21 that defines this gridiron structure 20, vertically carrier strip 22 connects.Light-emitting diode 2 is arranged on " ten " font central authorities junction in each gridiron structure 20, and light-emitting diode 3 and this gridiron structure 20 interior majorities that are encapsulated in each gridiron structure 20 are connected transverse electrode 23, longitudinal electrode 24.
Consult Fig. 5, first preferred embodiment of the manufacture method of illuminating module may further comprise the steps:
Step 91: cooperate Fig. 3 and Fig. 4, the part of cutting off lead frame 201 electrodes 23,24 connects, and makes lead frame 201 constitute a galvanic circle 2 that connects described light-emitting diode 3, and described light-emitting diode 32 is connection in series-parallel and connects by the galvanic circle.
In the present embodiment, step 91 be with lead frame 201 all vertical carrier strips 22 and transverse electrode 23 remove, 24 of the longitudinal electrodes of each light-emitting diode 3 vertical both sides stay one longitudinally electrode 24, position in these a horizontal carrier strip 21 reservations of central authorities, make longitudinal electrode 24 between vertical two light-emitting diodes 3 can keep being formed by connecting and be this galvanic circle 2, by this galvanic circle 2, two light-emitting diodes 3 of each longitudinal row are series connection, and 3 of the light-emitting diodes of per two longitudinal rows are the state of being in parallel by horizontal carrier strip 21.
The lead frame 201 that galvanic circle 2 and Fig. 4 that Fig. 3 enumerated herein enumerated is the aspect that present embodiment is enumerated, the emphasis of step 91 of the present invention is to be that the part that is provided with the lead frame of light-emitting diode by cut-out connects, and lead frame can directly be used as the galvanic circle that connects light-emitting diode.
Step 92: cooperate and to consult Fig. 2, Fig. 6, one insulating protective layer 4 is set, and the insulating protective layer 4 that is positioned at 2 tops, galvanic circle is covered on the galvanic circle 2 and described light-emitting diode 3 is exposed respectively at 2 tops, galvanic circle and below.In the present embodiment; each insulating protective layer 4 is a platy structure; and wherein; as shown in Figure 6; the position is provided with the perforation 41 of most corresponding described light-emitting diodes 3 leading pad this insulating protective layer 4 on the loop 2; and each is to all being close to the majority of each perforation 41 individually to lockhole 42; these insulating protective layer 4 usefulness are so that described light-emitting diode 3 open country outside perforation 41 is covered in 2 tops, galvanic circle; protect 2 surfaces, galvanic circle whereby, avoid 2 surfaces, galvanic circle to be polluted or destroy and directly have influence on conducting between the described light-emitting diode 3.And the position is between galvanic circle 2 and cooling base 5 at this insulating protective layer 4 below the galvanic circle 2, and be provided with most equally to lockhole 42, the position of described lockhole 42 is corresponding at the lockhole 42 of leading this insulating protective layer 4 on the pad loop 2 with the position, and the material of insulating protective layer 4 can be any material with insulation effect.
Step 93: cooperate and consult Fig. 2, galvanic circle 2 is combined with a cooling base 5.The cooling base 5 of present embodiment comprises that a substrate 52 and is arranged on the heat-conducting medium 51 on the substrate 52, and heat-conducting medium 51 can be thermal grease or heat radiation film etc., and the material of substrate 52 can be aluminium or copper.Galvanic circle 2 is arranged on the cooling base 5 with insulating protective layer 4, and in step 93, be to utilize most connectors 6 that insulating protective layer 4, galvanic circle 2 are combined with cooling base 5, connector 6 can be screw or bolt, pass the lockhole 42 of two-layer insulating protective layer 4 up and down and galvanic circle 2 and locking at cooling base 5.Supplementary notes be, in the present embodiment, each light-emitting diode 3 has a heating column 31 that is down protruded by the bottom, when galvanic circle 2 by locking on cooling base 5 time, heating column 31 contacts are on the heat-conducting medium 51 of cooling base 5.
As shown in the above, after being 10 single blankings of light-emitting diode that encapsulation is finished, the existing technology of Fig. 1 arranges the way that is welded on the circuit board 12 again, the present invention has broken the notion that existing this single blanking is welded back again, connect described light-emitting diode 3 and directly constitute galvanic circle 2 replacement circuit boards with lead frame 201, just will not have single blanking now and arrange two road procedures of welding again, be merged into together carrier strip unnecessary on the galvanic circle 2 21,22 with electrode 23, the 24 bar stock cutting by punching programs of removing, simultaneously, also can save in the existing way, the material cost of circuit board, in addition, because galvanic circle 2 is to be set directly on the cooling base 5, therefore, the heat energy that light-emitting diode 3 is produced in the process of electrified light emitting also can be directly by heat-conducting medium 51 conduction of cooling base 5 and shed, promote the heat dissipation of entire heat dissipation module 200 whereby.
In addition, by lead the pad loop 2 insulating protective layer 4 is set respectively up and down, except avoiding galvanic circle 2 short circuits, its another the effect also be the structural strength that is to increase galvanic circle 2.Moreover, when galvanic circle 2 locking is on cooling base 5, the heating column 31 of light-emitting diode 3 bottoms can contact on the heat eliminating medium 51 of cooling base 5 and the heat energy that light-emitting diode 3 is produced down transmits, reach preferable heat radiation function whereby.
Consult Fig. 7 and Fig. 8, second preferred embodiment for illuminating module 200 ' of the present invention and manufacture method thereof, the places different with first preferred embodiment are, in first preferred embodiment, galvanic circle 2 all is provided with insulating protective layer 4 up and down, and in manufacture method second preferred embodiment of illuminating module 200 ' of the present invention, step 92 ' insulating protective layer 4 only is set above galvanic circle 2.And this insulating protective layer 4 makes light-emitting diode 3 expose equally, and connector 6 be equally pass insulating protective layer 4, galvanic circle 2 and locking at cooling base 5, and when galvanic circle 2 is locked on cooling base 5, the heating column 31 of its bottom contacts with cooling base 5 equally, so as to transmitting the heat energy that light-emitting diode 3 produces.
In sum, illuminating module 200 of the present invention, 200 ' manufacture method is not taked in the past the way with single blanking of light-emitting diode, but by again the lead frame 201 that is packaged with light-emitting diode 3 being carried out the part bar stock cutting by punching, the galvanic circle 2 that the part that light-emitting diode 3 is retained by lead frame 201 constitutes, 2 ' formation is in series and in parallel connecting, compared to will arrange the way of welding back circuit board after single blanking of light-emitting diode more in the past, not only whole illuminating module 200,200 ' member is formed can save circuit board, also can save many once to single blanking of light-emitting diode and arrange again and weld back the required consumed time of circuit board, and then the speed of production of lifting volume production, in addition, owing to there has not been the setting of circuit board, galvanic circle 2 is that direct position is on cooling base 5, therefore, the heat energy that light-emitting diode 3 is produced also can be shed by cooling base 5 more rapidly, promote entire heat dissipation module 200 whereby, 200 ' heat dissipation, and the normal useful life of keeping light-emitting diode 3.
Claims (15)
1. the manufacture method of an illuminating module, be applied to a lead frame that is provided with many light-emitting diodes, the part of this lead frame forms the electrode of described light-emitting diode, and all electrodes are connected to each other, and it is characterized in that the manufacture method of this illuminating module may further comprise the steps:
Steps A: the part of cutting off described electrode connects, and make this lead frame constitute a galvanic circle that connects described light-emitting diode, and described light-emitting diode borrows this galvanic circle connection in series-parallel to connect.
2. the manufacture method of illuminating module as claimed in claim 1, it is characterized in that: the manufacture method of described illuminating module also comprises a step B who carries out after this steps A: with the below one insulating protective layer is set respectively at top, this galvanic circle, and this insulating protective layer that is positioned at this top, galvanic circle is covered on this galvanic circle and described light-emitting diode is exposed.
3. the manufacture method of illuminating module as claimed in claim 2, it is characterized in that: the manufacture method of described illuminating module also comprises a step C who carries out after this step B: this galvanic circle is combined with a cooling base.
4. the manufacture method of illuminating module as claimed in claim 1, it is characterized in that: the manufacture method of described illuminating module also comprises a step B ' who carries out after this steps A: an insulating protective layer that is covered in this top, galvanic circle and described light-emitting diode is exposed is set.
5. the manufacture method of illuminating module as claimed in claim 4 is characterized in that: the manufacture method of described illuminating module also comprises a step C who carries out afterwards in this step B ': this galvanic circle is combined with a cooling base.
6. as the manufacture method of claim 3 or 5 described illuminating module, it is characterized in that: in this step C, this insulating protective layer, this galvanic circle are to combine by most connectors with this cooling base.
7. the manufacture method of illuminating module as claimed in claim 6, it is characterized in that: in this step C, this insulating protective layer, this galvanic circle are to combine by several screws with this cooling base.
8. the manufacture method of illuminating module as claimed in claim 1, it is characterized in that: this lead frame partly forms described electrode, part forms the carrier strip that connects described electrode, in this steps A, optionally cut-out carrier strip and partial electrode and constitute this galvanic circle.
9. an illuminating module comprises a galvanic circle and many light-emitting diodes that are arranged at this galvanic circle, it is characterized in that:
This galvanic circle is that a metal sheet constitutes, and this galvanic circle has several to electrode, and described electrode is connection in series-parallel and connects; And
Described light-emitting diode be arranged at this galvanic circle respectively each on the electrode, described light-emitting diode is connection in series-parallel by this galvanic circle and connects.
10. illuminating module as claimed in claim 9 is characterized in that: this illuminating module also comprises a cooling base, and this galvanic circle is arranged on this cooling base.
11. illuminating module as claimed in claim 10 is characterized in that: this cooling base comprises that a heat-radiating substrate and is arranged at the heat-conducting medium on this heat-radiating substrate.
12. as claim 10 or 11 described illuminating module, it is characterized in that: this illuminating module comprises that also one is covered on this galvanic circle and the insulating protective layer that described light-emitting diode is exposed.
13. illuminating module as claimed in claim 12 is characterized in that: this illuminating module comprises that also one is arranged at the insulating protective layer between this galvanic circle and this cooling base.
14. illuminating module as claimed in claim 12 is characterized in that: this illuminating module also comprises at least one usefulness so that the connector that this cooling base, this galvanic circle combine with this insulating protective layer.
15. illuminating module as claimed in claim 14 is characterized in that: this connector is a screw, passes this insulating protective layer and this galvanic circle is locked in this cooling base.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200810085005 CN101533791B (en) | 2008-03-12 | 2008-03-12 | Method for manufacturing luminescence module and luminescence module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200810085005 CN101533791B (en) | 2008-03-12 | 2008-03-12 | Method for manufacturing luminescence module and luminescence module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101533791A CN101533791A (en) | 2009-09-16 |
| CN101533791B true CN101533791B (en) | 2010-09-29 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200810085005 Active CN101533791B (en) | 2008-03-12 | 2008-03-12 | Method for manufacturing luminescence module and luminescence module |
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| CN (1) | CN101533791B (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2556791Y (en) * | 2002-04-30 | 2003-06-18 | 诠兴开发科技股份有限公司 | Connected surface adhesive luminous diode |
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2008
- 2008-03-12 CN CN 200810085005 patent/CN101533791B/en active Active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2556791Y (en) * | 2002-04-30 | 2003-06-18 | 诠兴开发科技股份有限公司 | Connected surface adhesive luminous diode |
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| Publication number | Publication date |
|---|---|
| CN101533791A (en) | 2009-09-16 |
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