CN103171080A - Manufacturing method of light-emitting device packaging bracket - Google Patents
Manufacturing method of light-emitting device packaging bracket Download PDFInfo
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- CN103171080A CN103171080A CN2011104387005A CN201110438700A CN103171080A CN 103171080 A CN103171080 A CN 103171080A CN 2011104387005 A CN2011104387005 A CN 2011104387005A CN 201110438700 A CN201110438700 A CN 201110438700A CN 103171080 A CN103171080 A CN 103171080A
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Abstract
The invention discloses a manufacturing method of a light-emitting device packaging bracket. The manufacturing method comprises the following steps that: a metal bracket is provided; the metal bracket is provided with at least one chip region and a plurality of conductive pins are formed on the periphery of each chip region; at least one light cup body which corresponds to at least one chip region on the metal bracket is formed on the metal bracket by matching a thermosetting material with an injection molding machine in an injection and molding manner; each light cup body is provided with a concave space so that each chip region of the metal bracket is exposed out of the concave space of the corresponding light cup body; and each conductive pin of the metal bracket is exposed out of the outer part of the corresponding light cup body. According to the manufacturing method of the light-emitting device packaging bracket, disclosed by the invention, the structural stability of the light cup body of the packaging bracket can be improved and the light cup body of the packaging bracket is not easily softened or cracked due to heating or illumination, so that the structural stability of a light-emitting device can be improved and the whole service life of the light-emitting device is prolonged.
Description
Technical field
The present invention relates to a kind of manufacture method of light emitting device package support, relate in particular to a kind of package support manufacture method that coordinates injection molding method with thermosets.
Background technology
Existing light emitting device package support is mainly thermoplastic material to be formed with the light cup body of plastics on a metallic support in the mode of ejection formation during fabrication, and then carry out the flow processs such as die bond, routing and sealing, can complete the manufacturing of light emitting device package module.
Yet, thermoplastic is met the characteristic that heat can be softened, though be easy to make with ejection formation, but light-emitting device can produce heat in use, light cup body with the thermoplastic manufacturing is heated and after the use of a period of time, easily produce the situation of cracking, therefore existing comparatively not enough on the stability of structure with the made enclosure support structure of thermoplastic.
Separately, for improving the stability of enclosure support structure, someone utilizes thermosetting plastics to form light cup body, so, existing thermosetting plastics is mainly to utilize the mode of metaideophone moulding (transfer molding) to form light cup body, and the required more general Jet forming machine of equipment cost of metaideophone moulding is high, and after the metaideophone moulding, separately need extra processing handling procedure that light cup body is met and use specification and demand, comparatively trouble and inconvenience, so also can improve whole production cost on making.
Summary of the invention
Therefore, the present invention is because the disappearance on the package support manufacture method of existing light-emitting device with not enough, proposes a kind of the present invention who improves existing disappearance.
Main purpose of the present invention is to provide a kind of manufacture method of light emitting device package support, it is to utilize the mode of ejection formation to be formed with at least one light cup body on a metallic support with thermosets, to reach by this structural stability that promotes package support and the purpose of using reliability.
For reaching above-mentioned purpose, the present invention mainly provides a kind of manufacture method of light emitting device package support, and it includes the following step:
One metallic support is provided, and this metallic support is formed with at least one chip region, in respectively being formed with a plurality of conductive connecting pins around this chip region; And
Correspond respectively at least one the light cup body of this chip region on this metallic support in coordinating a Jet forming machine to be formed with at least one with injection molding method with thermosets on this metallic support, and respectively this light cup body has an interior concave space, each chip region that makes this metallic support is exposed by the interior concave space of this relative light cup body, and respectively this conductive connecting pin of this metallic support is to be exposed by this corresponding light cup body exterior.
By above-mentioned technological means, the present invention can improve the structural stability of package support light cup body, allow the light cup body of package support be difficult for because being heated or softened by light or cracking, can improve the structural stability of light-emitting device and extend the service life of light-emitting device integral body.
Describe the present invention below in conjunction with the drawings and specific embodiments, but not as a limitation of the invention.
Description of drawings
Fig. 1 is the manufacturing process schematic diagram by package support manufacture method of the present invention.
Wherein, Reference numeral
10 support 12 light cup bodies
The specific embodiment
Below in conjunction with accompanying drawing, structural principle of the present invention and operation principle are done concrete description:
the present invention is mainly the manufacture method that a kind of light emitting device package support is provided, please coordinate referring to Fig. 1, by seeing in figure, the package support of manufacturing of the present invention consists predominantly of a metallic support 10 and the plastic light cup body 12 of at least one, wherein this metallic support 10 is formed with at least one chip region, and be formed with a plurality of conductive connecting pins on every side in each chip region, respectively this light cup body 12 is corresponding chip region that are compassingly set at this metallic support 10 respectively, respectively this chip region can be electrically connected to gold thread in order to reach with a luminescence chip phase set, respectively this light cup body 12 has an interior concave space, each chip region that makes this metallic support 10 is exposed by the interior concave space of this relative light cup body 12, and respectively this conductive connecting pin of this metallic support 10 is to be exposed by this corresponding light cup body 12 outsides, wherein the structure of metallic support 10 and light cup body 12 can be existing, therefore its detailed construction is not separately given unnecessary details.
manufacture method of the present invention again, it is mainly that a metallic support 10 first is provided, this metallic support 10 is to be formed with at least one chip region, in respectively being formed with a plurality of conductive connecting pins around this chip region, again in coordinating a Jet forming machine to be formed with the light cup body 20 that at least one corresponds respectively at least one this chip region on this metallic support 10 with injection molding method with thermosets on this metallic support 10, the material of light cup body 12 can select the coefficient of expansion (CTE) boundary in the thermosets of 5-30ppm/ ℃, it can be thermosetting resin, preferably, it can select the thermosetting resin that contains inorganic additive, more preferably, it can be selected the silicones (Silicone) that contains aluminium oxide or titanium oxide or contain aluminium oxide or the epoxy of titanium oxide (Epoxy), again when ejection formation, the ejaculation temperature of thermosets be the boundary between 120-200 ℃, wherein again with between 140-180 ℃ for better, and allow thermosets forming temperature compacted under between 160-200 ℃ in mould.
wherein, this Jet forming machine can be bestowed surface treatment in order to the screw rod of feeding, wherein be treated to better to bestow the plating chromium nitride in the surface, can reduce by this adhesion strength between screw rod and thermosets, carrying out in order to the feeding operation of Jet forming machine, in addition, can utilize water or the oil of high temperature to make screw rod keep constant temperature and samming, to avoid the thermosets sclerosis, and affect the carrying out of ejection formation operation, and the screw rod of this Jet forming machine can be arranged to easily detachable, to allow the user be easy to clear up the thermosets that is adhered on screw rod, conveniently to carry out the cleaning maintenance operation of ejection formation.
Many the package supports moulding simultaneously of the package support of applicable single of method of the present invention, or group-wise again, and after a plurality of light cup bodies are arranged in ejection formation on support, can cut again and/or roll over the operations such as pin, to form respectively single package support; Separately, no matter this package support is the folding pin formula that belongs to the relative bending of outer surface of the concordant surface adhesive type of conductive connecting pin end face and the outer surface of light cup body or conductive connecting pin end face and light cup body, also all is suitable for manufacture method of the present invention.
By manufacturing of the present invention light cup body 12 out, its structural stability is high, difficult because being heated or being subjected to the light cracking, can improve the structural stability of light-emitting device and extend whole service life, the result of another the present invention after the reality test, according to manufacturing of the present invention package support out, through 150 ℃ of high-temperature bakings after 3000 hours, the reflectivity light decay of its light cup body 12 is below 20%, is as seen had good structural stability and is used reliability by the inventive method manufacturing package support out.
Certainly; the present invention also can have other various embodiments; in the situation that do not deviate from spirit of the present invention and essence thereof; those of ordinary skill in the art work as can make according to the present invention various corresponding changes and distortion, but these corresponding changes and distortion all should belong to the protection domain of the appended claim of the present invention.
Claims (19)
1. the manufacture method of a light emitting device package support, is characterized in that, includes the following step:
One metallic support is provided, and this metallic support is formed with at least one chip region, in respectively being formed with a plurality of conductive connecting pins around this chip region; And
In coordinating a Jet forming machine to be formed with the light cup body that at least one corresponds respectively at least one this chip region on this metallic support with injection molding method with thermosets on this metallic support, and respectively this light cup body has an interior concave space, each chip region that makes this metallic support is exposed by the interior concave space of this relative light cup body, and respectively this conductive connecting pin of this metallic support is exposed by this corresponding light cup body exterior.
2. the manufacture method of light emitting device package support according to claim 1, is characterized in that, material selection coefficient of expansion circle of light cup body is in the thermosets of 5-30ppm/ ℃.
3. the manufacture method of light emitting device package support according to claim 1 and 2, is characterized in that, ejaculation temperature circle of this thermosets is between 120-200 ℃.
4. the manufacture method of light emitting device package support according to claim 3, is characterized in that, ejaculation temperature circle of this thermosets is between 140-180 ℃.
5. the manufacture method of light emitting device package support according to claim 4, is characterized in that, forming temperature circle of this thermosets is between 160-200 ℃.
6. the manufacture method of light emitting device package support according to claim 5, is characterized in that, this thermosets is thermosetting resin.
7. the manufacture method of light emitting device package support according to claim 6, is characterized in that, this thermosets is the thermosetting resin that contains inorganic additive.
8. the manufacture method of light emitting device package support according to claim 7, is characterized in that, this thermosetting resin that contains inorganic additive select following one of them: salic silicones and contain the silicones of titanium oxide.
9. the manufacture method of light emitting device package support according to claim 8, is characterized in that, this Jet forming machine is the surface treatment of bestowing the plating chromium nitride in order to the screw rod of feeding.
10. the manufacture method of light emitting device package support according to claim 7, is characterized in that, this thermosetting resin that contains inorganic additive for select following one of them: salic epoxy and contain the epoxy of titanium oxide.
11. the manufacture method of light emitting device package support according to claim 10 is characterized in that, this Jet forming machine is the processing of bestowing the plated surface chromium nitride in order to the screw rod of feeding.
12. the manufacture method of light emitting device package support according to claim 1 and 2 is characterized in that, this thermosets is thermosetting resin.
13. the manufacture method of light emitting device package support according to claim 12 is characterized in that, this thermosets is the thermosetting resin that contains inorganic additive.
14. the manufacture method of light emitting device package support according to claim 13 is characterized in that, this thermosetting resin that contains inorganic additive for select following one of them: salic silicones and contain the silicones of titanium oxide.
15. the manufacture method of light emitting device package support according to claim 14 is characterized in that, this Jet forming machine is the processing of bestowing the plated surface chromium nitride in order to the screw rod of feeding.
16. the manufacture method of light emitting device package support according to claim 13 is characterized in that, this thermosetting resin that contains inorganic additive for select following one of them: salic epoxy and contain the epoxy of titanium oxide.
17. the manufacture method of light emitting device package support according to claim 16 is characterized in that, this Jet forming machine is the processing of bestowing the plated surface chromium nitride in order to the screw rod of feeding.
18. the manufacture method of light emitting device package support according to claim 1 and 2 is characterized in that, this Jet forming machine is the processing of bestowing the plated surface chromium nitride in order to the screw rod of feeding.
19. the manufacture method of light emitting device package support according to claim 1 and 2 is characterized in that, forming temperature circle of this thermosets is between 160-200 ℃.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011104387005A CN103171080A (en) | 2011-12-21 | 2011-12-21 | Manufacturing method of light-emitting device packaging bracket |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011104387005A CN103171080A (en) | 2011-12-21 | 2011-12-21 | Manufacturing method of light-emitting device packaging bracket |
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| CN103171080A true CN103171080A (en) | 2013-06-26 |
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| CN2011104387005A Pending CN103171080A (en) | 2011-12-21 | 2011-12-21 | Manufacturing method of light-emitting device packaging bracket |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2556791Y (en) * | 2002-04-30 | 2003-06-18 | 诠兴开发科技股份有限公司 | Connected surface adhesive luminous diode |
| CN101080822A (en) * | 2004-12-16 | 2007-11-28 | 首尔半导体株式会社 | Leadframe having a heat sink supporting ring, fabricating method of a light emitting diodepackage using the same and light emitting diodepackage fabbricated by the method |
| CN101420002A (en) * | 2007-10-26 | 2009-04-29 | 宋文恭 | LED encapsulation construction and manufacturing method thereof |
| CN101442015A (en) * | 2007-11-19 | 2009-05-27 | 日进半导体株式会社 | Light emitting diode device and manufacturing method thereof |
| CN101523621A (en) * | 2006-09-29 | 2009-09-02 | 奥斯兰姆奥普托半导体有限责任公司 | Housing for an optoelectronic component, optoelectronic component and method for producing a housing for an optoelectronic component |
-
2011
- 2011-12-21 CN CN2011104387005A patent/CN103171080A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2556791Y (en) * | 2002-04-30 | 2003-06-18 | 诠兴开发科技股份有限公司 | Connected surface adhesive luminous diode |
| CN101080822A (en) * | 2004-12-16 | 2007-11-28 | 首尔半导体株式会社 | Leadframe having a heat sink supporting ring, fabricating method of a light emitting diodepackage using the same and light emitting diodepackage fabbricated by the method |
| CN101523621A (en) * | 2006-09-29 | 2009-09-02 | 奥斯兰姆奥普托半导体有限责任公司 | Housing for an optoelectronic component, optoelectronic component and method for producing a housing for an optoelectronic component |
| CN101420002A (en) * | 2007-10-26 | 2009-04-29 | 宋文恭 | LED encapsulation construction and manufacturing method thereof |
| CN101442015A (en) * | 2007-11-19 | 2009-05-27 | 日进半导体株式会社 | Light emitting diode device and manufacturing method thereof |
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Application publication date: 20130626 |