CN2394329Y - Crystal coated sealing structure for LED - Google Patents
Crystal coated sealing structure for LED Download PDFInfo
- Publication number
- CN2394329Y CN2394329Y CN99244278U CN99244278U CN2394329Y CN 2394329 Y CN2394329 Y CN 2394329Y CN 99244278 U CN99244278 U CN 99244278U CN 99244278 U CN99244278 U CN 99244278U CN 2394329 Y CN2394329 Y CN 2394329Y
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- CN
- China
- Prior art keywords
- led
- light
- emitting diode
- circuit board
- crystal coated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model relates to a crystal coated sealing structure for LEDs, which comprises an LED and a circuit board installed on the LED. A welded ball formed by a line welder is arranged on an electrode of the LED, and is connected with a corresponding electrode on the circuit board. A connecting line is extended behind of the welded ball; the LED has the crystal coated structure and is installed on the circuit board by a supporting block; the connecting line naturally holds down and is contacted with the corresponding electrode. The utility model can use an existing lining device to carry out the crystal coated installation of the LED for saving cost, and can also use the crystal coated sealing structure of the LED of the utility model to rapidly carry out the crystal coated installation of the LED for enhancing production speed.
Description
The utility model relates to a kind of composite packing structure of light-emitting diode.
Light-emitting diode since have long-life, volume little, power consumption low and the monochromatic characteristics of luminescence, therefore in computer periphery, display, instrument indication, have been widely used so far.Moreover because being widely used of light-emitting diode, so the encapsulating structure of light-emitting diode is even more important.
In recent years, in order to improve the luminous efficiency of light-emitting diode, Flip Chip is used for the encapsulation of light-emitting diode gradually.Referring to Fig. 1,, light-emitting diode commonly used is encapsulated in cutaway view on the circuit board for using Flip Chip.Referring to this figure, on a printed circuit board (PCB) 100, form the weld pad 102 of respective leds chip 200, form projection 104 in going up of weld pad 102 again, light-emitting diode chip for backlight unit 200 turns over to put its electrode 202 is placed on the projection, can finish being electrically connected of light-emitting diode chip for backlight unit 200 and printed circuit board (PCB) 100.Because side is not provided with electrode on the light-emitting diode chip for backlight unit 200, therefore the light that sends in this direction can not be subjected to the electrode obstruction, therefore uses the light-emitting diode of this Flip Chip encapsulation to have higher luminous efficiency.
Yet in above-mentioned encapsulation commonly used, owing to projection 104 must be purchased separately, so processing procedure is comparatively complicated, and can increase material cost.And formation also settles projection 104 need buy more the characteristic equipment separately, and packaging cost also can increase.
The purpose of this utility model is to provide a kind of composite packing structure of light-emitting diode, only need utilize on-the-spot existing packaging equipment, can carry out the chip package of light-emitting diode, reaches the effect that reduces cost.
The purpose of this utility model is achieved in that a kind of light-emitting diode composite packing structure, it comprise light-emitting diode with and the circuit board installed, have by seam welder on the electrode of light-emitting diode and form soldered ball, soldered ball is connected with counter electrode on the circuit board.
Be extended with wiring behind the described soldered ball, and light-emitting diode is flip chip structure and utilizes a back-up block to be installed in a circuit board that described wiring is hung down naturally and contacted with described counter electrode.
In sum, diode composite packing structure of the present utility model, can use promptly has routing device to carry out the brilliant installation of covering of light-emitting diode, to save cost; Also can use diode composite packing structure of the present utility model, can carry out the brilliant installation of covering of light-emitting diode rapidly, can improve speed of production.
Below in conjunction with accompanying drawing and specific embodiments, the utility model is described further.
Fig. 1 is LED package schematic diagram commonly used;
Fig. 2 is a preferred embodiment schematic diagram of the present utility model;
Fig. 3 is that the chip of Fig. 2 is installed on the schematic diagram on the printed circuit board (PCB);
Fig. 4 is another preferred embodiment schematic diagram of the present utility model;
Fig. 5 is that the chip of Fig. 4 is installed on the schematic diagram on the printed circuit board (PCB).
Referring to Fig. 2, be the LED package schematic diagram of a preferred embodiment of the present utility model.On the electrode 202 of a light-emitting diode chip for backlight unit 200, can utilize seam welder to form soldered ball 300.Again referring to Fig. 3, to have light-emitting diode chip for backlight unit 200 upsets of soldered ball 300, soldered ball 300 is placed on the weld pad 102 of printed circuit board (PCB) 100, re-use eutectic bond or alternate manner, with soldered ball 300 and weld pad 102 electrical bond, can finish being electrically connected between light-emitting diode chip for backlight unit 200 and the printed circuit board (PCB) 100.
Because in this encapsulating structure, the seam welder that 300 need of soldered ball are general can form, must not buy more extra means in addition with the formation projection, so packaging cost can be saved.Moreover because general seam welder can form soldered ball under flank speed, therefore the time of encapsulation can shorten.
Referring to Fig. 4, be the LED package schematic diagram of another preferred embodiment of the present utility model.On the electrode 202 of a light-emitting diode chip for backlight unit 200, the wiring 302 that can utilize seam welder to form soldered ball 300 and extend from wiring 302.Again referring to Fig. 5, to have light-emitting diode chip for backlight unit 200 upsets of soldered ball 300 and wiring 302, and utilize a back-up block 304 that light-emitting diode chip for backlight unit 200 is supported on the weld pad 102 of a printed circuit board (PCB) 100, form wiring 302 and weld pad 102 electrical bond, can finish being electrically connected between light-emitting diode chip for backlight unit 200 and the printed circuit board (PCB) 100.
Claims (2)
1, a kind of composite packing structure of light-emitting diode, it comprise light-emitting diode with and the circuit board installed, it is characterized in that: have by seam welder on the electrode of light-emitting diode and form soldered ball, soldered ball is connected with counter electrode on the circuit board.
2, the composite packing structure of light-emitting diode as claimed in claim 1, it is characterized in that: be extended with wiring behind the described soldered ball, and light-emitting diode is flip chip structure and utilizes a back-up block to be installed in a circuit board that described wiring is hung down naturally and contacted with described counter electrode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN99244278U CN2394329Y (en) | 1999-09-10 | 1999-09-10 | Crystal coated sealing structure for LED |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN99244278U CN2394329Y (en) | 1999-09-10 | 1999-09-10 | Crystal coated sealing structure for LED |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2394329Y true CN2394329Y (en) | 2000-08-30 |
Family
ID=34030404
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN99244278U Expired - Fee Related CN2394329Y (en) | 1999-09-10 | 1999-09-10 | Crystal coated sealing structure for LED |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2394329Y (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104602450A (en) * | 2014-12-31 | 2015-05-06 | 京东方科技集团股份有限公司 | Circuit board, circuit board manufacturing method, and display device |
-
1999
- 1999-09-10 CN CN99244278U patent/CN2394329Y/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104602450A (en) * | 2014-12-31 | 2015-05-06 | 京东方科技集团股份有限公司 | Circuit board, circuit board manufacturing method, and display device |
| WO2016107143A1 (en) * | 2014-12-31 | 2016-07-07 | 京东方科技集团股份有限公司 | Circuit board and method for manufacture thereof, and display device |
| US10178771B2 (en) | 2014-12-31 | 2019-01-08 | Boe Technology Group Co., Ltd. | Circuit board, manufacturing method thereof and display apparatus |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C19 | Lapse of patent right due to non-payment of the annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |