CN100477211C - LED module - Google Patents
LED module Download PDFInfo
- Publication number
- CN100477211C CN100477211C CNB2006100763821A CN200610076382A CN100477211C CN 100477211 C CN100477211 C CN 100477211C CN B2006100763821 A CNB2006100763821 A CN B2006100763821A CN 200610076382 A CN200610076382 A CN 200610076382A CN 100477211 C CN100477211 C CN 100477211C
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- CN
- China
- Prior art keywords
- emitting diode
- light
- circuit pattern
- light emitting
- diode module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L24/17—Structure, shape, material or disposition of the bump connectors after the connecting process of a plurality of bump connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/17—Structure, shape, material or disposition of the bump connectors after the connecting process of a plurality of bump connectors
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Led Devices (AREA)
- Led Device Packages (AREA)
Abstract
The disclosed LED module comprises: a circuit board, including a first metal layer with a first/second circuit patterns and an opposite second metal layer with a third circuit pattern, wherein, partial third pattern is arranged on the projective position of the first one; a first LED including a first anode/cathode connected with the first/second pattern; and a second LED including a second anode/cathode connected with the first/second pattern. This invention is fit to design miniature product.
Description
Technical field
The present invention relates to a kind of light emitting diode module, particularly relate to a kind of light emitting diode module with AC driving.
Background technology
Light-emitting diode generally is to utilize P type semiconductor and N type semiconductor to be made, owing to utilize the light-emitting diode of semiconductor element made, has long, advantage such as the speed of lighting a lamp is fast, photoelectric conversion efficiency is high, volume is little and spectrum is narrow of life-span, recently be subjected to suitable attention, also therefore quickened the growth of led technology.
Please refer to shown in Figure 1, for showing the schematic diagram of existing a kind of framework with the DC driven light-emitting diode.Generally speaking, light-emitting diode 11 is to make it luminous by the driving of a direct current power supply 12.In addition, in order to ensure stablizing of circuit, need usually to use a resistor 13 to be series between a light-emitting diode 11 and the earth terminal G, with usefulness as current limliting.Yet,, therefore can cause extra power consumption because resistor 13 can consume the real power (P=VI) in the circuit.
Please refer to shown in Figure 2, for showing the schematic diagram of existing a kind of framework with ac driven light-emitting diodes.Recently, there is the dealer that the N end 232 of the P of one first light-emitting diode 22 end 221 and 1 second light-emitting diode 23 is electrically connected with an end of an AC power 26 by a plain conductor 251; And the P end 231 of the N of first light-emitting diode 22 end 222 and second light-emitting diode 23 is to electrically connect with an end of a capacitor 24 by a plain conductor 252; And the other end of capacitor 24 electrically connects with the other end of AC power 26 by a plain conductor 253 again.Wherein, plain conductor 251,252,253 all is to be arranged on the printed circuit board (PCB) 21.
From the above, because light-emitting diode has the little advantage of volume, therefore its applied electronic product is also all towards miniaturized design, yet the above-mentioned framework that utilizes AC power driven for emitting lights diode, compare down with the framework that utilizes DC power supply driven for emitting lights diode, AC power drives framework will use more element, and the light-emitting diode quantity of wanting when required by electronic product more for a long time, the required size of circuit board will be relative increase, and cause the difficulty of electronic product microminiaturization.
Therefore how to provide a kind of light emitting diode module, make it can not cause difficulty, real one of the current important topic that belongs to the design of electronic product microminiaturization.
This shows that above-mentioned existing light emitting diode module obviously still has inconvenience and defective, and demands urgently further being improved in structure and use.In order to solve the problem of above-mentioned existence, relevant manufacturer there's no one who doesn't or isn't seeks solution painstakingly, but do not see always that for a long time suitable design finished by development, and common product does not have appropriate structure to address the above problem, this obviously is the problem that the anxious desire of relevant dealer solves.So the light emitting diode module of how to found a kind of new structure, just becoming the current industry utmost point needs improved target.
Because the defective that above-mentioned existing light emitting diode module exists, the inventor is based on being engaged in this type of product design manufacturing abundant for many years practical experience and professional knowledge, and the utilization of cooperation scientific principle, actively studied innovation, in the hope of founding a kind of light emitting diode module of new structure, can improve general existing light emitting diode module, make it have more practicality.Through constantly research, design, and, create the present invention who has practical value finally through after studying sample and improvement repeatedly.
Summary of the invention
The objective of the invention is to, overcome the defective that existing light emitting diode module exists, and a kind of light emitting diode module of new structure is provided, technical problem to be solved is to make it can be beneficial to the electronic product miniaturized design, thereby is suitable for practicality more.
The object of the invention to solve the technical problems realizes by the following technical solutions.A kind of light emitting diode module according to the present invention's proposition, it comprises: a circuit board, having a first metal layer reaches relative with this first metal layer and one second metal level that establish, wherein this first metal layer has one first circuit pattern and a second circuit pattern, this second metal level has a tertiary circuit pattern, this first circuit pattern and this tertiary circuit pattern have an overlapping region, and at least partly this tertiary circuit pattern setting in a projected position of this first circuit pattern partly; One first light-emitting diode has a first anode and one first negative electrode, and this first circuit pattern of this first negative electrode and this circuit board electrically connects, and this first anode and this second circuit pattern electrically connect; And one second light-emitting diode, having a second plate and one second negative electrode, this second plate and this first circuit pattern electrically connect, this second negative electrode and the electric connection of this second circuit pattern.
The object of the invention to solve the technical problems also can be applied to the following technical measures to achieve further.
Aforesaid light emitting diode module, it also comprises: an AC power supply loop is to electrically connect with this second circuit pattern of this first metal layer and this tertiary circuit pattern of this second metal level respectively.
Aforesaid light emitting diode module, wherein said circuit board are a two-sided circuit board or a multilayer circuit board.
Aforesaid light emitting diode module, wherein said circuit board more comprises at least one insulating barrier, and it is to be arranged between this first metal layer and this second metal level.
Aforesaid light emitting diode module, the material of wherein said insulating barrier be selected from glass, cyanate ester resin, glass reinforced epoxy or polyimides at least one of them.
Aforesaid light emitting diode module, wherein said first light-emitting diode are a LED wafer or the naked crystalline substance of a light-emitting diode.
Aforesaid light emitting diode module, wherein said second light-emitting diode are a LED wafer or the naked crystalline substance of a light-emitting diode.
Aforesaid light emitting diode module, wherein said first light-emitting diode and this second light-emitting diode are that surface adhering, chip bonding or wire-bonded are on this first metal layer of this circuit board.
Aforesaid light emitting diode module, this of wherein said the first metal layer first circuit pattern and this second circuit pattern are to be open circuit.
By technique scheme, light emitting diode module of the present invention has following advantage at least:
The light emitting diode module of novelty of the present invention, need are series at capacitor between light-emitting diode and the AC power supply loop, when circuit layout, finish in the lump, use the occupied space of capacitor and can save tradition, therefore can be beneficial to the electronic product miniaturized design of using light emitting diode module.
The present invention has above-mentioned advantage and practical value, no matter it all has bigger improvement on product structure or function, obvious improvement is arranged technically, and produced handy and practical effect, and more existing light emitting diode module has has promoted effect, thereby being suitable for practicality more, and having the extensive value of industry, really is a new and innovative, progressive, practical new design.
Above-mentioned explanation only is the general introduction of technical solution of the present invention, for can clearer understanding technological means of the present invention, and can be implemented according to the content of specification, and for above-mentioned and other purposes, feature and advantage of the present invention can be become apparent, below especially exemplified by preferred embodiment, and conjunction with figs., be described in detail as follows.
Description of drawings
Fig. 1 is the schematic diagram of existing a kind of framework with the DC driven light-emitting diode.
Fig. 2 is the schematic diagram of existing a kind of framework with ac driven light-emitting diodes.
Fig. 3 is the schematic diagram according to a kind of light emitting diode module of preferred embodiment of the present invention, and wherein the circuit board of light emitting diode module is a double-sided PCB.
Fig. 4 is another schematic diagram of a kind of light emitting diode module according to preferred embodiment of the present invention, and wherein the circuit board of light emitting diode module is a multilayer circuit board.
Fig. 5 is the another schematic diagram of a kind of light emitting diode module according to preferred embodiment of the present invention, and wherein first light-emitting diode and second light-emitting diode are that chip bonding is in circuit board.
11: light-emitting diode 12: DC power supply
13: resistor G: earth terminal
21: 22: the first light-emitting diodes of printed circuit board (PCB)
The N end of 222: the first light-emitting diodes of the P end of 221: the first light-emitting diodes
The P end of 231: the second light-emitting diodes of 23: the second light-emitting diodes
The N end 24 of 232: the second light-emitting diodes: capacitor
251,252,253: plain conductor 26: AC power
3,4: light emitting diode module
31,31 ', 41: circuit board
311,411: the first metal layer
3111,3111 ', 4111: the first circuit patterns
3112,3112 ', 4112: the second circuit pattern
312,412: the second metal levels
3121,3121 ', 4121: the tertiary circuit pattern
313,314,413: insulating barrier
32,42: the first light-emitting diodes
321,321 ', 421: the first anode
322,322 ', 422: the first negative electrodes
33,43: the second light-emitting diodes
331,331 ', 431: second plate
332,332 ', 432: the second negative electrodes
34,34 ', 44: the AC power supply loop
45: projection
Embodiment
Reach technological means and the effect that predetermined goal of the invention is taked for further setting forth the present invention, below in conjunction with accompanying drawing and preferred embodiment, to its embodiment of light emitting diode module, structure, feature and the effect thereof that foundation the present invention proposes, describe in detail as after.
Please refer to shown in Figure 3ly, is the schematic diagram according to a kind of light emitting diode module of preferred embodiment of the present invention, and wherein the circuit board of light emitting diode module is a double-sided PCB.A kind of light emitting diode module 3 according to preferred embodiment of the present invention is to comprise a circuit board 31, one first light-emitting diode 32, one second light-emitting diode 33 and an AC power supply loop 34.
In present embodiment, circuit board 31 can be an a pair of face circuit board or a multilayer circuit board, wherein the material of insulating barrier 313 is such as but not limited to glass, cyanate (Bismaleimide-triazine, BT) resin, glass reinforced epoxy (Fiberglass reinforced epoxy resin, FR4) or polyimides (Polyimide).In addition, first circuit pattern 3111 is open circuit with second circuit pattern 3112.In other words, between first circuit pattern 3111 and the circuit pattern 3112 not electric property be connected.
As shown in Figure 4, be another schematic diagram according to a kind of light emitting diode module of preferred embodiment of the present invention, wherein the circuit board of light emitting diode module is a multilayer circuit board.When circuit board 31 ' was multilayer circuit board, the tertiary circuit pattern 3121 ' of second metal level 312 ' can be arranged between the insulating barrier 313 ', 314 ', can form capacitor with first circuit pattern 3111 ' of the first metal layer 311 '.
Referring again to shown in Figure 3, first light-emitting diode 32 has a first anode 321 and one first negative electrode 322, wherein the first anode 321 electrically connects with the second circuit pattern 3112 of the first metal layer 311, and first circuit pattern 3111 of first negative electrode 322 and the first metal layer 311 electrically connects.In present embodiment, anode is represented the electrode of an end of the P type semiconductor that is electrically connected at light-emitting diode, and negative electrode is represented the electrode of an end of the N type semiconductor that is electrically connected at light-emitting diode.
Second light-emitting diode 33 has a second plate 331 and one second negative electrode 332, wherein second plate 331 electrically connects with first circuit pattern 3111 of the first metal layer 311, and the second circuit pattern 3112 of second negative electrode 332 and the first metal layer 311 electrically connects.The meaning of anode and negative electrode representative is identical with the anode and the negative electrode of first light-emitting diode 32.In present embodiment, first light-emitting diode 32 and second light-emitting diode 33, (surface mountingtechnology SMT) is arranged on the circuit board 31 can to utilize the surface adhering technology.
AC power supply loop 34 respectively with the second circuit pattern 3112 of the first metal layer 311, and electrically connect, to drive first light-emitting diode 32 and second light-emitting diode 33 with the tertiary circuit pattern 3121 of second metal level 312.In present embodiment, AC power supply loop 34 is can directly be arranged on the circuit board 31, also can electrically connect (not shown) with AC power supply loop 34 again by a splicing ear by light emitting diode module 3 certainly.
In present embodiment, first light-emitting diode 32 and second light-emitting diode 33, removing can be as mentioned above, be to utilize outside the surface adhering technology is arranged on the circuit board 31 for the SMD assembly, first light-emitting diode 32 and second light-emitting diode 33 also can be packaging body (Package), wafer (Chip) or naked crystalline substance (Die), it is to utilize wire-bonded (wire-bonding) or chip bonding modes such as (Flip-chip), and electrically connects with the first metal layer 311 of circuit board 31.
Please refer to shown in Figure 5ly, is the another schematic diagram according to a kind of light emitting diode module of preferred embodiment of the present invention, and wherein first light-emitting diode and second light-emitting diode are that chip bonding is in circuit board.When first light-emitting diode 42 and second light-emitting diode 43 are to be naked crystalline substance, it is to utilize the chip bonding mode, with the first anode 421, first negative electrode 422, the second plate 431 and second negative electrode 432 are respectively by a projection 45, and with electrically connect in first circuit pattern 4111 of circuit board 41 and second circuit pattern 4112, and also be provided with a tertiary circuit pattern 4121 with respect to the projected position of first circuit pattern 4111 in circuit board 41, again AC power supply loop 44 is electrically connected with first circuit pattern 4111 and tertiary circuit pattern 4121 respectively, can form light emitting diode module 4 with chip bonding technology made.
Except that above-mentioned, light-emitting diode also can utilize the wire-bonded mode and be arranged on the first metal layer of circuit board, because the wire-bonded technology is to be prior art, so no longer add to give unnecessary details in this.
In sum, because of being that need are series at capacitor between light-emitting diode and the AC power supply loop according to a kind of light emitting diode module of the present invention, when circuit layout, finish in the lump, use the occupied space of capacitor and can save tradition, therefore can be beneficial to the electronic product miniaturized design of using light emitting diode module.In addition, the material of the insulating barrier in the circuit board of light emitting diode module can be glass, and it helps the use of Fine-pitch technology, and light-emitting diode is except that can be the SMD assembly, also can be encapsulation, wafer or naked crystalline substance, all help the electronic product miniaturized design.
The above, it only is preferred embodiment of the present invention, be not that the present invention is done any pro forma restriction, though the present invention discloses as above with preferred embodiment, yet be not in order to limit the present invention, any those skilled in the art, in not breaking away from the technical solution of the present invention scope, when the technology contents that can utilize above-mentioned announcement is made a little change or is modified to the equivalent embodiment of equivalent variations, in every case be the content that does not break away from technical solution of the present invention, according to technical spirit of the present invention to any simple modification that above embodiment did, equivalent variations and modification all still belong in the scope of technical solution of the present invention.
Claims (10)
1, a kind of light emitting diode module is characterized in that comprising:
One circuit board, it has a first metal layer and reaches relative with this first metal layer and one second metal level that establish, wherein this first metal layer has one first circuit pattern and a second circuit pattern, this second metal level has a tertiary circuit pattern, this first circuit pattern and this tertiary circuit pattern have an overlapping region, and at least partly this tertiary circuit pattern setting in a projected position of this first circuit pattern partly;
One first light-emitting diode has a first anode and one first negative electrode, and this first circuit pattern of this first negative electrode and this circuit board electrically connects, and this first anode and this second circuit pattern electrically connect; And
One second light-emitting diode has a second plate and one second negative electrode, and this second plate and this first circuit pattern electrically connect, and this second negative electrode and this second circuit pattern electrically connect.
2, light emitting diode module according to claim 1 is characterized in that it also comprises:
One AC power supply loop is to electrically connect with this second circuit pattern of this first metal layer and this tertiary circuit pattern of this second metal level respectively.
3, light emitting diode module according to claim 1 is characterized in that wherein said circuit board is a two-sided circuit board or a multilayer circuit board.
4, light emitting diode module according to claim 1 is characterized in that wherein said circuit board more comprises at least one insulating barrier, and it is to be arranged between this first metal layer and this second metal level.
5, light emitting diode module according to claim 4, the material that it is characterized in that wherein said insulating barrier be selected from glass, cyanate ester resin, glass reinforced epoxy or polyimides at least one of them.
6, light emitting diode module according to claim 1 is characterized in that wherein said first light-emitting diode is a LED wafer or the naked crystalline substance of a light-emitting diode.
7, light emitting diode module according to claim 1 is characterized in that wherein said second light-emitting diode is a LED wafer or the naked crystalline substance of a light-emitting diode.
8, light emitting diode module according to claim 1 is characterized in that this first circuit pattern of part of wherein said the first metal layer and this tertiary circuit pattern of part of this second metal level are to form a capacitor.
9, light emitting diode module according to claim 1 is characterized in that wherein said first light-emitting diode and this second light-emitting diode are that surface adhering, chip bonding or wire-bonded are on this first metal layer of this circuit board.
10, light emitting diode module according to claim 1 is characterized in that this first circuit pattern of wherein said the first metal layer and this second circuit pattern are open circuit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2006100763821A CN100477211C (en) | 2006-04-20 | 2006-04-20 | LED module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2006100763821A CN100477211C (en) | 2006-04-20 | 2006-04-20 | LED module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101060118A CN101060118A (en) | 2007-10-24 |
| CN100477211C true CN100477211C (en) | 2009-04-08 |
Family
ID=38866111
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2006100763821A Expired - Fee Related CN100477211C (en) | 2006-04-20 | 2006-04-20 | LED module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100477211C (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108040422A (en) * | 2018-01-05 | 2018-05-15 | 深圳市合利来科技有限公司 | A kind of fine definition PCB circuit board |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI527261B (en) * | 2009-09-11 | 2016-03-21 | 晶元光電股份有限公司 | Light-emitting device |
-
2006
- 2006-04-20 CN CNB2006100763821A patent/CN100477211C/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108040422A (en) * | 2018-01-05 | 2018-05-15 | 深圳市合利来科技有限公司 | A kind of fine definition PCB circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101060118A (en) | 2007-10-24 |
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| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090408 Termination date: 20120420 |