CN107799643A - A kind of COB LED of double-side for automotive lighting - Google Patents
A kind of COB LED of double-side for automotive lighting Download PDFInfo
- Publication number
- CN107799643A CN107799643A CN201710904646.6A CN201710904646A CN107799643A CN 107799643 A CN107799643 A CN 107799643A CN 201710904646 A CN201710904646 A CN 201710904646A CN 107799643 A CN107799643 A CN 107799643A
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- glass substrate
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- box dam
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- 239000000758 substrate Substances 0.000 claims abstract description 62
- 239000011521 glass Substances 0.000 claims abstract description 54
- 239000003292 glue Substances 0.000 claims abstract description 27
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 19
- 229910052709 silver Inorganic materials 0.000 claims abstract description 15
- 239000004332 silver Substances 0.000 claims abstract description 15
- 238000009413 insulation Methods 0.000 claims abstract description 7
- 238000004806 packaging method and process Methods 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 6
- 230000003287 optical effect Effects 0.000 claims description 6
- 239000000843 powder Substances 0.000 claims description 6
- 239000000741 silica gel Substances 0.000 claims description 6
- 229910002027 silica gel Inorganic materials 0.000 claims description 6
- 239000004568 cement Substances 0.000 claims description 4
- 238000010438 heat treatment Methods 0.000 claims description 3
- 229910052710 silicon Inorganic materials 0.000 claims description 3
- 239000010703 silicon Substances 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 238000002834 transmittance Methods 0.000 claims description 3
- 238000005286 illumination Methods 0.000 description 7
- 238000005516 engineering process Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 5
- 239000006071 cream Substances 0.000 description 5
- 238000005538 encapsulation Methods 0.000 description 5
- 239000000919 ceramic Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000012913 prioritisation Methods 0.000 description 4
- 239000004411 aluminium Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000005265 energy consumption Methods 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 239000010937 tungsten Substances 0.000 description 2
- 238000012356 Product development Methods 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000009958 sewing Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Led Device Packages (AREA)
- Arrangements Of Lighting Devices For Vehicle Interiors, Mounting And Supporting Thereof, Circuits Therefore (AREA)
Abstract
The invention discloses a kind of COB LED of the double-side for automotive lighting, including glass substrate and multiple blue chips, multiple blue chips are arranged on the upper surface of glass substrate by the array format of series connection, blue chip is fixed on the glass substrate, glass substrate is provided with filamentary silver, blue chip forms silk-screen silver circuit with filamentary silver by gold wire bonding, thermal conductive insulation glue is filled between every two silver wires, the upper surface of glass substrate, lower surface is equipped with box dam, the box dam of upper surface surrounds all blue chips, fluorescent glue is coated with multiple blue chips, the lower surface of glass substrate is also coated with fluorescent glue, flushed at the top of fluorescent glue at glass substrate upper surface with the top of the box dam at glass substrate upper surface, fluorescent glue at glass substrate lower surface flushes with the box dam at glass substrate lower surface.The invention provides the glass substrate COB of double-side, improve and take that light rate, lighting angle are bigger, color tolerance is smaller and good reliability.
Description
Technical field
The present invention relates to the COB LED of vehicle-mounted lighting technical field, particularly a kind of double-side for automotive lighting.
Background technology
COB area light source is chip on board encapsulation, is one of bare chip mounting technology, and semiconductor chip handing-over is mounted on printing
On wiring board, the electrical connection of chip and substrate is realized with lead sewing method, and is covered with resin to ensure reliability.Although
COB is simplest bare chip mounting technology, but its packaging density can not show a candle to TAB and reviewing welding technique.Therefore, pass through
COB packing forms and come COB area light source be also known as COB light source, COB planar light sources, COB integrated optical sources, ceramic COB light source.
Mainly being used in indoor and outdoor lamp lighting at present has utilization, and indoor main has：Shot-light, Down lamp, Ceiling light,
Ceiling lamp, fluorescent lamp and light bar, outdoor has, street lamp, bulkhead lamp, the wall lamp of floodlight and current urban landscape, luminescent characters
Deng.COB light source is the trend that following LED productions are used.LED light source has the characteristics that low in energy consumption, controllability is strong, long lifespan, extensively
It is general to be applied in modern lighting field, it has also become the direction of countries in the world illuminating product development.It is continuous with semiconductor industry
The field such as improvement, LED forward directions high-power illumination such as automotive lighting of development and technology strides forward.LED is in automotive illumination applications
In in addition to as interior trim ornament lamp, most important application be include steering indicating light, in-car reading lamp, headlight for vehicles and the 3rd stop
Automobile lamp including car light etc..
Light emitting diode (LED) is a kind of most promising cold light source of 2 l centuries, because of its energy-saving and environmental protection, reliably
Property high and flexible design the advantages that in lighting field obtained extensive exploitation and application.Major product is LED pieces and LED
Silk.As many countries start to carry out the plan for prohibitting the use of incandescent lamp, tungsten incandescent lamp is about to disappear, and LED filament lamp progressively takes
For status of the tungsten lamp in the minds of people, LED filament lamp is new the 1 of the characteristics such as no stroboscopic, low-heat, long-life, slow decay
For LED illumination new light sources, because of its upside-down mounting and planar coating process and 360。The characteristics of stereo luminous as market survey weight
Point.In encapsulation process, because chip is to be fixed on by tin cream in white ceramic substrate silver wire, therefore often led because tin cream is adhered
Cause flip LED filament that the phenomenon of short circuit occurs, therefore improve original packaging technology, before die bond, first in flip LED lamp
Appropriate thermal conductive insulation glue is filled between every adjacent two silver wires of silk ceramic substrate to prevent tin cream from being adhered so as to effectively prevent lamp
The generation of silk short circuit phenomenon.
Due to the advantages of low energy consumption, quick response, long-life, environmental protection etc., made possessed by LED its into
For solid-state illumination light source of new generation, in recent years, single-chip great power LED can not meet that general illumination, backlight, automobile shine
Application in terms of bright lamp.Because single-chip LED overall dimension limits the integrated of more high power density, excessive heat-conducting glue, base
Plate, pad etc. have impact on reliability and stability.Therefore, high-power multi-core piece COB LED arise, and have become industry
Design the trend of production.COB encapsulation technologies be by LED chip directly against loaded on metal substrate PCB or ceramic substrate etc., these
Substrate can meet higher packaging density, more preferable heat endurance and bigger lighting angle, but substrate is opaque, such as aluminium base
Plate, chip shelves area and made a floor specular aluminium or argentum reflecting layer takes light rate for increase, and COB LED efficiency of light extraction also compares
It is relatively low.
A kind of the LED automobile wick and LED automobile light source of Application No. 2015101077062, it is straight to disclose LED chips
Connect bonding or be welded on the positive and negative electrode substrate of wick, there is rapid heat dissipation, and positive and negative electrode substrate is in the reflector with reflectorized material
It is interior so that the light of LED lamps can more be reflected the brightness for by each LED lamps optically focused, improving each LED lamps,
But the problem of taking light rate also relatively low simultaneously be present.
The content of the invention
The technical problems to be solved by the invention are overcome the deficiencies in the prior art and provide and a kind of be used for automotive lighting
The COB LED of double-side, the invention provides the glass substrate COB of double-side, improve and take light rate, lighting angle more
Greatly, color tolerance is smaller and good reliability.
The present invention uses following technical scheme to solve above-mentioned technical problem：
According to a kind of COB LED of double-side for automotive lighting proposed by the present invention, including glass substrate and multiple indigo plants
Optical chip, wherein, multiple blue chips are arranged on the upper surface of glass substrate by the array format of series connection, and blue chip is fixed on
On glass substrate, glass substrate is provided with filamentary silver, and blue chip and filamentary silver form silk-screen silver circuit by gold wire bonding, every two
Thermal conductive insulation glue is filled between filamentary silver, upper surface, the lower surface of glass substrate are equipped with box dam, and the box dam of upper surface surrounds institute
Some blue chips, fluorescent glue are coated with multiple blue chips, the lower surface of glass substrate is also coated with fluorescent glue, glass base
Flushed at the top of fluorescent glue at plate upper surface with the top of the box dam at glass substrate upper surface, the fluorescence at glass substrate lower surface
Glue flushes with the box dam at glass substrate lower surface, and fluorescent glue includes green fluorescence powder, red fluorescent material and silica gel.
It is blue as a kind of further prioritization schemes of COB LED of double-side for automotive lighting of the present invention
It is fixed after being heating and curing between optical chip and glass substrate by insulating cement.
As a kind of further prioritization schemes of COB LED of double-side for automotive lighting of the present invention, green fluorescence
The weight ratio of powder, red fluorescent material and silica gel is 1.16:0.23:5.6.
As a kind of further prioritization schemes of COB LED of double-side for automotive lighting of the present invention, thoroughly
Bright substrate is the plane high-boron-silicon glass of light transmittance >=96%.
It is blue as a kind of further prioritization schemes of COB LED of double-side for automotive lighting of the present invention
The positive and negative electrode of optical chip is connected by packaging line with glass substrate, and soldered ball is respectively equipped with the positive and negative electrode of blue chip, if
The upper surface of blue chip is the reference plane of the bank of packaging line, and the height of bank is more than 160um, passes through cutting for solder joint on bank
The angle of line and normal is 20 degree to 50 degree.
The present invention compared with prior art, has following technique effect using above technical scheme：
（1）The invention provides the glass substrate COB of double-side, improve and take that light rate, lighting angle are bigger, color tolerance is smaller
And good reliability；
（2）What the present invention filled that thermal conductive insulation glue adds chip and substrate between filamentary silver pastes power, also largely prevents
Being adhered for tin cream in encapsulation process is stopped, COB LED yields is improved in actual production；
（3）The present invention is used for great power LED package application, and a new technological approaches is provided for LED illumination industry.
Brief description of the drawings
Fig. 1 is the schematic diagram of the present invention.
Reference in figure is construed to：1- glass substrates, 2- blue chips, 3- spun golds, 4- box dams, 5- fluorescent glues.
Embodiment
Technical scheme is described in further detail below in conjunction with the accompanying drawings：
As shown in figure 1, a kind of COB LED of double-side for automotive lighting, including glass substrate 1 and multiple blue chips
2, wherein, multiple blue chips are arranged on the upper surface of glass substrate by the array format of series connection, and blue chip is fixed on glass
On substrate, glass substrate is provided with filamentary silver, and blue chip bonds together to form silk-screen silver circuit, every two bullion with filamentary silver by spun gold 3
Thermal conductive insulation glue is filled between silk, upper surface, the lower surface of glass substrate are equipped with box dam 4, and the box dam of upper surface surrounds institute
Some blue chips, fluorescent glue 5 are coated with multiple blue chips, the lower surface of glass substrate is also coated with fluorescent glue, glass
Flushed at the top of fluorescent glue at upper surface of base plate with the top of the box dam at glass substrate upper surface, it is glimmering at glass substrate lower surface
Optical cement flushes with the box dam at glass substrate lower surface, and fluorescent glue includes green fluorescence powder, red fluorescent material and silica gel.
It is fixed after being heating and curing between blue chip and glass substrate by insulating cement.
The weight ratio of green fluorescence powder, red fluorescent material and silica gel is 1.16:0.23:5.6.
Transparency carrier is the plane high-boron-silicon glass of light transmittance >=96%.
The positive and negative electrode of blue chip is connected by packaging line with glass substrate, is set respectively on the positive and negative electrode of blue chip
There is soldered ball, if the upper surface of blue chip is the reference plane of the bank of packaging line, the height of bank is more than 160um, passed through on bank
The angle of the tangent line and normal of crossing solder joint is 20 degree to 50 degree.The invention provides the glass substrate COB of double-side, improves
Take that light rate, lighting angle are bigger, color tolerance is smaller and good reliability.The present invention fills thermal conductive insulation glue between silver wire and added
Chip and substrate paste power, also largely prevent being adhered for tin cream in encapsulation process, are improved in actual production
COB LED yields；The present invention is used for great power LED package application, and a new technology way is provided for LED illumination industry
Footpath.
Above content is to combine specific preferred embodiment further description made for the present invention, it is impossible to is assert
The specific implementation of the present invention is confined to these explanations.For general technical staff of the technical field of the invention,
On the premise of not departing from present inventive concept, some simple deductions can also be made or substituted, should all be considered as belonging to the present invention's
Protection domain.
Claims (5)
1. the COB LED of a kind of double-side for automotive lighting, it is characterised in that including glass substrate and multiple blue light cores
Piece, wherein, multiple blue chips are arranged on the upper surface of glass substrate by the array format of series connection, and blue chip is fixed on glass
On substrate, glass substrate is provided with filamentary silver, and blue chip forms silk-screen silver circuit, every two filamentary silvers with filamentary silver by gold wire bonding
Between be filled with thermal conductive insulation glue, upper surface, the lower surface of glass substrate are equipped with box dam, and the box dam of upper surface surrounds all
Blue chip, is coated with fluorescent glue on multiple blue chips, and the lower surface of glass substrate is also coated with fluorescent glue, on glass substrate
Flushed at the top of fluorescent glue at surface with the top of the box dam at glass substrate upper surface, the fluorescent glue at glass substrate lower surface and
Box dam at glass substrate lower surface flushes, and fluorescent glue includes green fluorescence powder, red fluorescent material and silica gel.
A kind of 2. COB LED of double-side for automotive lighting according to claim 1, it is characterised in that blue light
It is fixed after being heating and curing between chip and glass substrate by insulating cement.
3. the COB LED of a kind of double-side for automotive lighting according to claim 1, it is characterised in that green glimmering
The weight ratio of light powder, red fluorescent material and silica gel is 1.16:0.23:5.6.
4. the COB LED of a kind of double-side for automotive lighting according to claim 1, it is characterised in that transparent
Substrate is the plane high-boron-silicon glass of light transmittance >=96%.
A kind of 5. COB LED of double-side for automotive lighting according to claim 1, it is characterised in that blue light
The positive and negative electrode of chip is connected by packaging line with glass substrate, and soldered ball is respectively equipped with the positive and negative electrode of blue chip, if blue
The upper surface of optical chip is the reference plane of the bank of packaging line, and the height of bank is more than 160um, the tangent line of solder joint is passed through on bank
Angle with normal is 20 degree to 50 degree.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710904646.6A CN107799643A (en) | 2017-09-29 | 2017-09-29 | A kind of COB LED of double-side for automotive lighting |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710904646.6A CN107799643A (en) | 2017-09-29 | 2017-09-29 | A kind of COB LED of double-side for automotive lighting |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107799643A true CN107799643A (en) | 2018-03-13 |
Family
ID=61532873
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710904646.6A Pending CN107799643A (en) | 2017-09-29 | 2017-09-29 | A kind of COB LED of double-side for automotive lighting |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107799643A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111146324A (en) * | 2019-11-25 | 2020-05-12 | 华中科技大学鄂州工业技术研究院 | White light LED device with ultrahigh color rendering index |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102820074A (en) * | 2012-05-07 | 2012-12-12 | 上海交通大学 | Conductive base plate for photoelectric device and preparation method for conductive base plate |
| CN203812908U (en) * | 2014-03-21 | 2014-09-03 | 深圳市佳捷特陶瓷电路技术有限公司 | LED lamp filament transparent glass substrate |
| CN104134484A (en) * | 2014-07-31 | 2014-11-05 | 中国电子科技集团公司第五十五研究所 | Flexible transparent conductive film based on silver nanowires and preparation method |
| CN206225406U (en) * | 2016-12-07 | 2017-06-06 | 鸿利智汇集团股份有限公司 | A kind of double-side COB |
| CN206490087U (en) * | 2016-12-27 | 2017-09-12 | 江苏稳润光电科技有限公司 | A kind of LED encapsulation structure |
-
2017
- 2017-09-29 CN CN201710904646.6A patent/CN107799643A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102820074A (en) * | 2012-05-07 | 2012-12-12 | 上海交通大学 | Conductive base plate for photoelectric device and preparation method for conductive base plate |
| CN203812908U (en) * | 2014-03-21 | 2014-09-03 | 深圳市佳捷特陶瓷电路技术有限公司 | LED lamp filament transparent glass substrate |
| CN104134484A (en) * | 2014-07-31 | 2014-11-05 | 中国电子科技集团公司第五十五研究所 | Flexible transparent conductive film based on silver nanowires and preparation method |
| CN206225406U (en) * | 2016-12-07 | 2017-06-06 | 鸿利智汇集团股份有限公司 | A kind of double-side COB |
| CN206490087U (en) * | 2016-12-27 | 2017-09-12 | 江苏稳润光电科技有限公司 | A kind of LED encapsulation structure |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111146324A (en) * | 2019-11-25 | 2020-05-12 | 华中科技大学鄂州工业技术研究院 | White light LED device with ultrahigh color rendering index |
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Application publication date: 20180313 |