CN2327012Y - Device for fitting and sticking single-grain-shaped IC card mould block - Google Patents
Device for fitting and sticking single-grain-shaped IC card mould block Download PDFInfo
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- CN2327012Y CN2327012Y CN 97213476 CN97213476U CN2327012Y CN 2327012 Y CN2327012 Y CN 2327012Y CN 97213476 CN97213476 CN 97213476 CN 97213476 U CN97213476 U CN 97213476U CN 2327012 Y CN2327012 Y CN 2327012Y
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Abstract
The utility model relates to a device for fitting and sticking single-grain-shaped IC card module on full automatic IC card production lines, comprising positioning fixtures, vacuum suction heads, light screens, and pallets. The utility model is characterized in that the positioning fixture has a rectangular pattern plate, the middle of the positioning fixture is provided with at least one square hole for placing IC card modules, the inner part has a supporting frame, the bottom has a bearing plate, and the four corners are provided with positioning holes and mounting holes, wherein, the symmetrical center of the square hole are coincident with the symmetrical centers of the IC card modules and the cavities for installing IC cards on card bases. The utility model has the characteristics of simple structure, convenient assembly and disassembly, good quality, high productive efficiency, less labor and equipment investment, higher capability of processing multi-varieties, etc.
Description
The utility model relates to the IC-card production technical field, and the dress adhesion produces the device of single-grain-shaped IC-card module on the particularly full-automatic IC-card production line.
Since China's " Golden Card Program " implements, IC-card is developed rapidly in the production and the application of China, be widely used at present, and obtain first-stage success in fields such as finance, commerce and trade, traffic, telecommunications, health care, social insurance, tourism, population management, labour employment, organization mechanism code, management of bank account, public utilities.IC-card is also referred to as integrated circuit card, it is made up of Ka Ji and IC-card special module, that is to say, there is an integrated circuit (IC) chip to be encapsulated in inside modules, carrier as store information, the special now integrated circuit (IC) chip as IC-card is broadly divided into three kinds, i.e. the integrated circuit of free access integrated circuit, logical encrypt access integrated circuit and band microprocessor.Usually integrated circuit (IC) chip is encapsulated in the module; the inner lead of circuit is drawn by special-purpose bonding apparatus; coating sealing resin glue then protects integrated circuit (IC) chip and internal lead; this has just made a complete IC-card module; again the module dress is attached in the hole of leaving in advance on the card base, has just made IC-card (as shown in Figure 9).In April, 95, we have taken the lead in introducing article one dress at home and have pasted the semi-automatic production line of IC-card module, subsequently, some domestic IC-card manufacturers also begin introducing equipment successively, to at present, full-automatic, the semi-automatic production line that the dress of domestic introduction pastes the IC-card module has reached about 30, and wherein the overwhelming majority is that full-automatic dress pastes the production line of IC-card module.
The IC-card module of domestic present use nearly all is import, from packing forms, the module of import can be divided into two kinds substantially, a kind of is the IC-card module (see figure 10) of the strip-type encapsulation of similar cinefilm pattern, another kind of then (see Figure 11 for the IC-card module of simple grain encapsulation, 12), for full-automatic IC-card production line, only suitable sealing label strip-type IC-card module, and semi-automatic IC-card production line needs in advance the module on the band to be become single-grain-shaped with special-purpose die cutting device punching out when dress joint strip belt IC-card module, and then one one ground dress is attached in the hole of IC-card card base, that is to say, semi-automatic IC-card production line only is fit to the IC-card module that dress pastes single-grain-shaped, it is 200/hour modules that dress pastes fastest, and the dress of the full-automatic IC-card production line speed of pasting then is 1000-3000/hour module.This shows that two kinds of Production Line efficient differ 5-15 doubly.Domestic IC-card manufacturer introduces full-automatic IC-card production line and accounts for more than 80%, introduce semi-automatic IC-card production line then have only the last 10% some, in the IC-card module of import, the large percentage that the single-grain-shaped module is shared can have half share on market with the strip-type module.Why the single-grain-shaped module has big like this market in China, and reason is roughly: the manufacturer of (1) single-grain-shaped module sells product into China earlier; (2) performance and price of this module relatively is fit to China's national situation; (3) domestic IC-card user has been familiar with the application of this module.The single-grain-shaped IC-card module of so big quantity only depends on several semi-automatic IC-cards to produce traditional thread binding subsides to be difficult to finish, and the producer that has only introduced full-automatic IC-card production line feels simply helpless to dress subsides simple grain IC card module, promptly delay production, influenced economic benefit of enterprises again.The FB(flow block) of full-automatic IC-card production line as shown in figure 13.Therefrom as can be seen, empty calorie is moved on the automatic on-line after being input on the production line, behind a last workstation complete operation, passes to the next stop, clamps casket up to making finished product.Among Figure 13 die-cut/pick and place the module workstation and be exactly after strip-type IC-card modular belt upper punch is downcut module, take out automatically and be put in the basic hole of card.This step is very important working link, and it is directly connected to dress and is attached to after card base goes up, and the accuracy of the flatness of card and the subsides of module dress also is related to the bonding strength of module and card base.We can also learn by figure, single-grain-shaped IC-card module just can not with die-cut/pick and place module workstation compatibility, can not on full-automatic IC-card production line, carry out the subsides of module dress.
The problem that the utility model exists at prior art, design one cover both can have been adorned and paste single-grain-shaped IC-card module on existing full-automatic IC-card production line, simultaneously through changing the device that can keep original dress joint strip belt IC-card module again, i.e. design provides a kind of simple in structure, and use or replacing are convenient, save equipment investment, save manpower, enhance productivity, both can adorn joint strip belt IC-card module, can adorn the device that pastes single-grain-shaped IC-card module again.
The utility model is achieved by following manner: a kind of device of adorning subsides single-grain-shaped IC-card module on full-automatic IC-card production line, comprise positioning fixture, vacuum cups, pallet four parts of shadow shield and placement single-grain-shaped IC-card module, it is characterized in that: said positioning fixture partly has a rectangle template 6, template 6 middle parts are provided with the square hole 3 that can place the IC-card module at least, wherein the symcenter 7 of square hole 3 overlaps with the symcenter 19 of IC-card module, be provided with the carriage 5 that overlaps with its symcenter 7 in the square hole 3, bottom surface at template 6 and carriage 5 thereof is provided with supporting plate 4, in the position at 6 four angles of template pilot hole 1 and mounting hole 2 is set respectively in addition.Vacuum cups in the present technique is by operating personnel's manual operations, and the shadow shield pallet places the front portion of the automatic suction nozzle working position on the full-automatic IC-card production line usually, and shadow shield places band to transmit on the photoelectric sensor of guide rail.It can be one (shown in Fig. 1,2,3,4) that above-mentioned said template 6 middle parts are provided with the square hole 3 that can place the IC-card module at least, also can be two (shown in Fig. 5,6,7,8), promptly reprocess a square hole 3 in the symmetric position of a former square hole 3.The pilot hole 1 here can be the form (shown in Fig. 1,2,5,6) of location, full hole, also can be the form (shown in Fig. 3,4,7,8) of location, half hole.The template 6 of said positioning fixture part, the symcenter 7 of the square hole 3 that overlaps with the symcenter 19 of IC-card module that is provided with on it should overlap with the symcenter 28 in the hole at installation IC-card place on the card base 8.So just realized that dress pastes single-grain-shaped IC-card module on full-automatic IC-card production line, and taken off device of the present utility model, can recover the function of dress joint strip belt IC-card module on the former full-automatic IC-card production line, and these device installation and removal have been convenient and swift.
Through the actual production evidence, adopt this device dress on full-automatic IC-card production line to press close to 50,000 single-grain-shaped IC-card modules, dress pastes the outward appearance of module and the qualification rate of bonding strength reaches 100%, the electric parameters testing qualification rate reaches 100%, product quality meets the quality standard of ISO7816 standard and full-automatic IC-card production line fully, actual production efficient is more than five times of semi-automatic IC-card production line, is approximately equal to the work efficiency of full-automatic IC-card production line.We can adorn the every of each companies' production such as subsides atmel corp, SIEMENS company, HITACHI company and can adorn all size of subsides and the single-grain-shaped IC-card module of model on the IC-card production line with this device now.
The utility model is compared with prior art, has following characteristics:
1, saves the equipment investment aspect.Article one, the introduction of semi-automatic IC-card production line needs 100,000 dollars, and output is at most 1/5th of full-automatic IC-card production line, that is to say, on a full-automatic IC-card production line, join this device of cover, just be equivalent to increase at least five semi-automatic IC-card production lines, about 500,000 dollars of disposable saving equipment investment expense is amounted to surplus the Renminbi 400 ten thousand yuan.
2, many variety production of raising equipment working ability.Make the producer that only has full-automatic IC-card production line, not only can adorn joint strip belt IC-card module, can also adorn and paste single-grain-shaped IC-card module, enlarged the production range of product, improved many kinds working ability of equipment.
3, save manpower and increasing work efficiency.To semi-automatic IC-card production line, split run is produced every equipment need be equipped with 2 operating personnel, and five equipment then need be equipped with 10 operating personnel.And use this device just can on original full-automatic IC-card production line staffing basis, increase by two people at most, and can finish 10 people's task, and not need any equipment maintenance cost, saved production expenditure widely.
4, this apparatus structure is simple, and installation or removal are convenient, and product quality meets ISO7816 standard and full-automatic IC-card Production Line quality standard fully.
Fig. 1,2 is master, the vertical view of full hole location structure of a square hole of positioning fixture of the present utility model;
Fig. 3,4 is master, the vertical view of half hole location structure of a square hole of positioning fixture of the present utility model;
Fig. 5,6 is master, the vertical view of full hole location structure of two square holes of positioning fixture of the present utility model;
Fig. 7,8 is master, the vertical view of half hole location structure of two square holes of positioning fixture of the present utility model;
Fig. 9 is the IC-card section of structure;
Figure 10 is the structural representation of strip-type IC-card module;
Figure 11 is the structural front view of single-grain-shaped IC-card module;
Figure 12 is the structure vertical view of single-grain-shaped IC-card module;
Figure 13 is the process flow diagram of original full-automatic IC-card production line;
Figure 14 is the symcenter synoptic diagram of single-grain-shaped IC-card module;
Figure 15,16 is hole 6 symcenter masters, the diagrammatic sketch of bowing on the card base of IC-card.
Among the figure: 1 pilot hole; 2 mounting holes; 3 (placement single-grain-shaped IC-card module) square hole; 4 supporting plates; 5 carriages (having small square hole to be used to place the resin glue protective coating of IC-card bottom in it); 6 templates; the symcenter of 7 square holes; 8 (IC-cards) card base; 9 holes; 10 resin glue protective coatings; 11 insulation module substrates; the external electrode contact of 12 modules; 13 internal leads; the 14IC chip; 15 strip-type IC-card modules; 16 stepping pilot holes; 17 bands; 18 insulation courses; the symcenter of 19IC card module; the input of 20 empty calorie; 21 finished products clamp casket; 22 add the hole of frock module; 23 tests; 24 glue; 25 hot pressing; 26 image detection glue points; the 27 die-cut modules that pick and place; 28 hole symcenter.
Most preferred embodiment of the present utility model is shown in Fig. 1-16.A kind of device of on full-automatic IC-card production line, adorning subsides single-grain-shaped IC-card module, comprise positioning fixture, vacuum cups, pallet four parts of shadow shield and placement single-grain-shaped IC-card module, it is characterized in that: said positioning fixture partly has a rectangle template 6, template 6 middle parts are provided with the square hole 3 that can place the IC-card module at least, wherein the symcenter 7 of square hole 3 overlaps with the symcenter 19 of IC-card module, be provided with the carriage 5 that overlaps with its symcenter 7 in the square hole 3, bottom surface at template 6 and carriage 5 thereof is provided with supporting plate 4, in the position at 6 four angles of template pilot hole 1 and mounting hole 2 is set respectively in addition.It can be that one (shown in Fig. 1,2,3,4) also can be two (shown in Fig. 5,6,7,8) that above-mentioned said template 6 middle parts are provided with the square hole 3 that can place the IC-card module at least, promptly reprocesses a square hole 3 in the symmetric position of a former square hole 3.The pilot hole 1 here can be the form (shown in Fig. 1,2,5,6) of location, full hole, also can be the form (shown in Fig. 3,4,7,8) of location, half hole.The template 6 of said positioning fixture part, the symcenter 7 of the square hole 3 that overlaps with the symcenter 19 of IC-card module that is provided with on it should overlap with the symcenter 28 in the hole at installation IC-card place on the card base 8.So just realized that dress pastes single-grain-shaped IC-card module on full-automatic IC-card production line, and taken off device of the present utility model, can recover the function of dress joint strip belt IC-card module on the former full-automatic IC-card production line, and these device installation and removal have been convenient and swift.
Claims (2)
1, a kind of device of on full-automatic IC-card production line, adorning subsides single-grain-shaped IC-card module, comprise positioning fixture, vacuum cups, pallet four parts of shadow shield and placement single-grain-shaped IC-card module, it is characterized in that: said positioning fixture partly has a rectangle template, the template middle part is provided with the square hole that can place the IC-card module at least, wherein the symcenter of square hole overlaps with the symcenter of IC-card module, be provided with the carriage that overlaps with its symcenter in the square hole, bottom surface at template and carriage thereof is provided with supporting plate, in the position at four angles of template pilot hole and mounting hole is set respectively in addition.
2, a kind of device of on full-automatic IC-card production line, adorning subsides single-grain-shaped IC-card module as claimed in claim 1, it is characterized in that: the template of said positioning fixture part, the symcenter of the square hole that overlaps with IC-card module symcenter that is provided with on it should overlap with the basic symcenter that goes up the hole that the IC-card place is installed of card.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 97213476 CN2327012Y (en) | 1997-04-08 | 1997-04-08 | Device for fitting and sticking single-grain-shaped IC card mould block |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 97213476 CN2327012Y (en) | 1997-04-08 | 1997-04-08 | Device for fitting and sticking single-grain-shaped IC card mould block |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2327012Y true CN2327012Y (en) | 1999-06-30 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 97213476 Expired - Fee Related CN2327012Y (en) | 1997-04-08 | 1997-04-08 | Device for fitting and sticking single-grain-shaped IC card mould block |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2327012Y (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105196050A (en) * | 2015-10-27 | 2015-12-30 | 上海芯玛电子有限公司 | Bank cipher assembling equipment and process thereof |
-
1997
- 1997-04-08 CN CN 97213476 patent/CN2327012Y/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105196050A (en) * | 2015-10-27 | 2015-12-30 | 上海芯玛电子有限公司 | Bank cipher assembling equipment and process thereof |
| CN105196050B (en) * | 2015-10-27 | 2018-04-06 | 上海芯玛电子有限公司 | Bank cipher device assembles equipment and its process |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C19 | Lapse of patent right due to non-payment of the annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |