CN221306164U - 多层基板以及电子设备 - Google Patents

多层基板以及电子设备 Download PDF

Info

Publication number
CN221306164U
CN221306164U CN202290000492.2U CN202290000492U CN221306164U CN 221306164 U CN221306164 U CN 221306164U CN 202290000492 U CN202290000492 U CN 202290000492U CN 221306164 U CN221306164 U CN 221306164U
Authority
CN
China
Prior art keywords
main surface
region
metal foil
folding line
laminate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202290000492.2U
Other languages
English (en)
Chinese (zh)
Inventor
高桥博宣
礒野文哉
松田贤二
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Application granted granted Critical
Publication of CN221306164U publication Critical patent/CN221306164U/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08—Microstrips; Strip lines
    • H01P3/085—Triplate lines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08—Microstrips; Strip lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0707—Shielding
    • H05K2201/0723—Shielding provided by an inner layer of PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09609—Via grid, i.e. two-dimensional array of vias or holes in a single plane

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structure Of Printed Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
CN202290000492.2U 2021-06-28 2022-06-20 多层基板以及电子设备 Active CN221306164U (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021106440 2021-06-28
JP2021-106440 2021-06-28
PCT/JP2022/024462 WO2023276743A1 (ja) 2021-06-28 2022-06-20 多層基板及び電子機器

Publications (1)

Publication Number Publication Date
CN221306164U true CN221306164U (zh) 2024-07-09

Family

ID=84691717

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202290000492.2U Active CN221306164U (zh) 2021-06-28 2022-06-20 多层基板以及电子设备

Country Status (4)

Country Link
US (1) US12424720B2 (https=)
JP (1) JP7380953B2 (https=)
CN (1) CN221306164U (https=)
WO (1) WO2023276743A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022209843A1 (ja) * 2021-03-30 2022-10-06 株式会社オートネットワーク技術研究所 通信器及び通信装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0555746A (ja) * 1991-08-29 1993-03-05 Hitachi Chem Co Ltd 高周波用銅張り積層板及びプリント配線板
US5334800A (en) * 1993-07-21 1994-08-02 Parlex Corporation Flexible shielded circuit board
JP2006005134A (ja) 2004-06-17 2006-01-05 Fujikura Ltd フレキシブルプリント配線板及びその製造方法
JP4972115B2 (ja) 2009-03-27 2012-07-11 Ｊｘ日鉱日石金属株式会社 圧延銅箔
JP5355478B2 (ja) * 2010-04-07 2013-11-27 株式会社フジクラ フレキシブルプリント基板及びその製造方法
WO2014065172A1 (ja) * 2012-10-26 2014-05-01 株式会社村田製作所 フレキシブル基板
JP6149016B2 (ja) 2014-05-09 2017-06-14 Ｊｘ金属株式会社 キャリア付銅箔、銅張積層板の製造方法、電子機器の製造方法、キャリア付銅箔の製造方法、及び、プリント配線板の製造方法
JP6362444B2 (ja) * 2014-06-16 2018-07-25 日本メクトロン株式会社 フレキシブルプリント基板およびフレキシブルプリント基板の製造方法
CN111886938B (zh) * 2018-04-05 2024-05-14 株式会社村田制作所 树脂多层基板的制造方法以及制造装置

Also Published As

Publication number Publication date
JP7380953B2 (ja) 2023-11-15
JPWO2023276743A1 (https=) 2023-01-05
WO2023276743A1 (ja) 2023-01-05
US20240014536A1 (en) 2024-01-11
US12424720B2 (en) 2025-09-23

Similar Documents

Publication Publication Date Title
US9113560B2 (en) Signal line and circuit substrate
US8933340B2 (en) Signal transmission line and circuit board
US8810340B2 (en) Signal line disposed in a flexible insulating main body, where the main body includes a connector portion which is wider than a signal portion
JP5574030B2 (ja) 多層基板
CN102577647B (zh) 电路基板
US9148955B2 (en) Mounting structure of circuit board having multi-layered ceramic capacitor thereon
CN106602193B (zh) 层叠型多芯电缆
CN204559998U (zh) 柔性基板及电子设备
US10225928B2 (en) Flexible board and electronic device
CN103733736B (zh) 高频信号传输线路及电子设备
US9445493B2 (en) Signal line and manufacturing method therefor
CN220021573U (zh) 传输线路以及电子设备
US9847171B2 (en) Flexible cable and electronic device
US9875823B2 (en) Flat cable
CN221306164U (zh) 多层基板以及电子设备
CN204333194U (zh) 高频信号线路
CN103733426A (zh) 高频信号线路及电子设备
US10869395B2 (en) Flexible substrate, flexible substrate-attached component, and manufacturing method of flexible substrate-attached component
CN203968484U (zh) 高频信号线路及电子设备
CN204361241U (zh) 高频信号传输线路及电子设备
US20080013295A1 (en) Capacitor sheet and electronic circuit board
WO2023085177A1 (ja) 多層基板
WO2022080067A1 (ja) 回路基板及び回路基板の製造方法
CN219981140U (zh) 多层基板、多层基板模块以及电子设备
JP2014175829A (ja) 伝送線路、アンテナ装置及び伝送線路製造方法

Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant