JP7380953B2 - 多層基板及び電子機器 - Google Patents

多層基板及び電子機器 Download PDF

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Publication number
JP7380953B2
JP7380953B2 JP2023531811A JP2023531811A JP7380953B2 JP 7380953 B2 JP7380953 B2 JP 7380953B2 JP 2023531811 A JP2023531811 A JP 2023531811A JP 2023531811 A JP2023531811 A JP 2023531811A JP 7380953 B2 JP7380953 B2 JP 7380953B2
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JP
Japan
Prior art keywords
laminate
main surface
metal foil
region
foil layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2023531811A
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English (en)
Japanese (ja)
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JPWO2023276743A1 (https=
JPWO2023276743A5 (https=
Inventor
博宣 高橋
文哉 礒野
賢二 松田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Publication of JPWO2023276743A1 publication Critical patent/JPWO2023276743A1/ja
Publication of JPWO2023276743A5 publication Critical patent/JPWO2023276743A5/ja
Application granted granted Critical
Publication of JP7380953B2 publication Critical patent/JP7380953B2/ja
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08—Microstrips; Strip lines
    • H01P3/085—Triplate lines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08—Microstrips; Strip lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0707—Shielding
    • H05K2201/0723—Shielding provided by an inner layer of PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09609—Via grid, i.e. two-dimensional array of vias or holes in a single plane

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structure Of Printed Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP2023531811A 2021-06-28 2022-06-20 多層基板及び電子機器 Active JP7380953B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021106440 2021-06-28
JP2021106440 2021-06-28
PCT/JP2022/024462 WO2023276743A1 (ja) 2021-06-28 2022-06-20 多層基板及び電子機器

Publications (3)

Publication Number Publication Date
JPWO2023276743A1 JPWO2023276743A1 (https=) 2023-01-05
JPWO2023276743A5 JPWO2023276743A5 (https=) 2023-10-13
JP7380953B2 true JP7380953B2 (ja) 2023-11-15

Family

ID=84691717

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023531811A Active JP7380953B2 (ja) 2021-06-28 2022-06-20 多層基板及び電子機器

Country Status (4)

Country Link
US (1) US12424720B2 (https=)
JP (1) JP7380953B2 (https=)
CN (1) CN221306164U (https=)
WO (1) WO2023276743A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022209843A1 (ja) * 2021-03-30 2022-10-06 株式会社オートネットワーク技術研究所 通信器及び通信装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011222664A (ja) 2010-04-07 2011-11-04 Fujikura Ltd フレキシブルプリント基板及びその製造方法
WO2014065172A1 (ja) 2012-10-26 2014-05-01 株式会社村田製作所 フレキシブル基板
WO2019194142A1 (ja) 2018-04-05 2019-10-10 株式会社村田製作所 樹脂多層基板の製造方法および製造装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0555746A (ja) * 1991-08-29 1993-03-05 Hitachi Chem Co Ltd 高周波用銅張り積層板及びプリント配線板
US5334800A (en) * 1993-07-21 1994-08-02 Parlex Corporation Flexible shielded circuit board
JP2006005134A (ja) 2004-06-17 2006-01-05 Fujikura Ltd フレキシブルプリント配線板及びその製造方法
JP4972115B2 (ja) 2009-03-27 2012-07-11 Ｊｘ日鉱日石金属株式会社 圧延銅箔
JP6149016B2 (ja) 2014-05-09 2017-06-14 Ｊｘ金属株式会社 キャリア付銅箔、銅張積層板の製造方法、電子機器の製造方法、キャリア付銅箔の製造方法、及び、プリント配線板の製造方法
JP6362444B2 (ja) * 2014-06-16 2018-07-25 日本メクトロン株式会社 フレキシブルプリント基板およびフレキシブルプリント基板の製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011222664A (ja) 2010-04-07 2011-11-04 Fujikura Ltd フレキシブルプリント基板及びその製造方法
WO2014065172A1 (ja) 2012-10-26 2014-05-01 株式会社村田製作所 フレキシブル基板
WO2019194142A1 (ja) 2018-04-05 2019-10-10 株式会社村田製作所 樹脂多層基板の製造方法および製造装置

Also Published As

Publication number Publication date
JPWO2023276743A1 (https=) 2023-01-05
WO2023276743A1 (ja) 2023-01-05
US20240014536A1 (en) 2024-01-11
CN221306164U (zh) 2024-07-09
US12424720B2 (en) 2025-09-23

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