CN221303161U - Light receiving detection device on wafer - Google Patents
Light receiving detection device on wafer Download PDFInfo
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- CN221303161U CN221303161U CN202323238960.5U CN202323238960U CN221303161U CN 221303161 U CN221303161 U CN 221303161U CN 202323238960 U CN202323238960 U CN 202323238960U CN 221303161 U CN221303161 U CN 221303161U
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- 235000012431 wafers Nutrition 0.000 claims 12
- 230000006872 improvement Effects 0.000 description 7
- 238000012360 testing method Methods 0.000 description 5
- 230000008878 coupling Effects 0.000 description 3
- 238000010168 coupling process Methods 0.000 description 3
- 238000005859 coupling reaction Methods 0.000 description 3
- 230000003028 elevating effect Effects 0.000 description 3
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- 238000003306 harvesting Methods 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
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- 238000006467 substitution reaction Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
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- 238000003384 imaging method Methods 0.000 description 1
- 230000031700 light absorption Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
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Abstract
The utility model discloses a wafer light receiving detection device, which comprises: the base is provided with a wafer detection position, and a probe detection module is arranged on the wafer detection position; the base is also provided with a base frame, the base frame is provided with an upper light receiving detection module, and the upper light receiving detection module comprises an integrating sphere and a shooting detection mechanism; the upper light receiving detection module is arranged on the base frame through the moving module, and the moving module comprises a horizontal moving module and a lifting moving module; one side of the wafer detection position is provided with a shooting and positioning mechanism, the shooting and positioning mechanism is arranged on a base below the base frame, and the shooting and positioning mechanism is aligned to the wafer detection position. The shooting positioning mechanism and the upper light receiving detection module are arranged separately, so that the shooting positioning mechanism is controlled independently, and errors of focusing or alignment caused by back and forth movement are reduced. Moreover, by taking the shooting positioning mechanism and the shooting detection mechanism as two shooting mechanisms, the focusing can be prevented from being changed from different shooting, and the shooting precision of the shooting positioning mechanism can be ensured.
Description
Technical Field
The utility model relates to the field of wafer detection, in particular to a wafer light receiving detection device.
Background
Wafer light harvesting inspection is an important testing step in semiconductor manufacturing processes for the purpose of evaluating the performance and quality of devices on a wafer. In the process of wafer light receiving detection, probe positioning detection and wafer positioning detection are usually required, the same detection device is used for shooting detection at present, the detection device and the integrating sphere are usually arranged at the same position, the position needs to be constantly changed back and forth, the shooting focal length needs to be changed in different modes, and therefore larger errors are caused, the equipment performance is influenced by back and forth adjustment, and accordingly accuracy is influenced.
Disclosure of utility model
In order to overcome the defects in the prior art, the utility model provides a wafer light receiving detection device, which is characterized in that an upper light receiving detection device and a shooting positioning mechanism are arranged separately, so that shooting devices used by the shooting detection mechanism and the shooting positioning mechanism are divided into two. The focal length of the shooting equipment does not need to be changed by moving back and forth, and the respective function and performance indexes are better met through independent parameter adjustment, calibration and optimization. Errors generated by repeated positioning movement among the detection devices can be reduced, and positioning accuracy is guaranteed.
The technical scheme adopted for solving the technical problems is as follows:
A light harvesting inspection device on a wafer, comprising: the wafer detection device comprises a base, a probe detection module and a probe mechanism, wherein the base is provided with a wafer detection position, the wafer detection position is provided with the probe detection module, and the probe detection module is provided with the probe mechanism in a circle; the base is also provided with a base frame, the base frame is provided with an upper light receiving detection module, and the upper light receiving detection module comprises an integrating sphere and a shooting detection mechanism; the upper light receiving detection module is arranged on the base frame through a moving module, and the moving module comprises a horizontal moving module and a lifting moving module; and one side of the wafer detection position is provided with a shooting positioning mechanism, the shooting positioning mechanism is arranged on the base below the base frame, and the shooting positioning mechanism is aligned to the wafer detection position.
As a further improvement of the technical scheme, the horizontal moving module comprises a horizontal guide rail and a horizontal sliding block, wherein the horizontal sliding block is arranged on the horizontal guide rail in a sliding manner, and the horizontal sliding block is fixed on the base frame.
As a further improvement of the above technical solution, the shooting detection mechanism is fixed at an end of the horizontal guide rail close to the wafer detection position.
As a further improvement of the technical scheme, the lifting and moving module is vertically arranged along the z-axis direction and comprises a lifting guide rail and a lifting sliding block, the lifting sliding block is slidably arranged on the lifting guide rail, the lifting guide rail is fixedly arranged at the end part of the horizontal guide rail, which is close to the wafer detection position, and the integrating sphere is arranged on the lifting guide rail through the lifting sliding block.
As a further improvement of the technical scheme, the movable module further comprises a horizontal screw rod module, the horizontal screw rod module is arranged at the bottom of the base frame and comprises a horizontal screw rod and a horizontal screw rod nut, the horizontal guide rail is connected with the horizontal screw rod nut, and the end part of the horizontal screw rod is connected with a servo motor to drive the horizontal screw rod nut to move.
As a further improvement of the technical scheme, the movable module further comprises a lifting screw rod module, the lifting screw rod module is arranged on the lifting guide rail and comprises a lifting screw rod and a lifting screw rod nut, the lifting sliding block is connected with the lifting screw rod nut, and a servo motor is connected above the lifting screw rod to drive the lifting screw rod nut to move.
As a further improvement of the above technical solution, the probe mechanism surrounds the periphery of the wafer detection position, and a gap is left in the shooting positioning mechanism.
As a further improvement of the technical scheme, the probe mechanism is provided with a probe tip and a probe spring, and the probe tip is aligned with the circle center of the wafer detection position.
The beneficial effects of the utility model are as follows: the shooting positioning mechanism and the upper light receiving detection module are arranged separately, so that the shooting positioning mechanism is controlled independently, and errors of focusing or alignment caused by back and forth movement are reduced. Moreover, by taking the shooting positioning mechanism and the shooting detection mechanism as two shooting mechanisms, the focusing can be prevented from being changed from different shooting, and the shooting precision of the shooting positioning mechanism can be ensured.
Drawings
The utility model will be further described with reference to the drawings and examples.
FIG. 1 is a schematic view of the assembly of the present utility model;
FIG. 2 is a side view of the present utility model;
fig. 3 is a top view of the present utility model.
Reference numerals illustrate: 1-a base; 11-wafer inspection bits; 2-a base frame; 21-a horizontal movement module; 211-horizontal sliding blocks; 212-horizontal guide rails; 213-a horizontal screw module; 214-a servo motor; 22-a lifting moving module; 221-lifting screw rod module; 222-lifting guide rail; 223-lifting slide block; 3-an upper light receiving detection module; 31-a shooting detection mechanism; 32-integrating sphere; 4-shooting positioning mechanism; 5-a probe detection module; 51-probe mechanism.
Detailed Description
The conception, specific structure, and technical effects produced by the present utility model will be clearly and completely described below with reference to the embodiments and the drawings to fully understand the objects, features, and effects of the present utility model. It is apparent that the described embodiments are only some embodiments of the present utility model, but not all embodiments, and that other embodiments obtained by those skilled in the art without inventive effort are within the scope of the present utility model based on the embodiments of the present utility model. In addition, all the coupling/connection relationships referred to in the patent are not direct connection of the single-finger members, but rather, it means that a better coupling structure can be formed by adding or subtracting coupling aids depending on the specific implementation. The technical features in the utility model can be interactively combined on the premise of no contradiction and conflict.
Referring to fig. 1, the present utility model provides a device for detecting light received on a wafer, comprising: a susceptor 1 for placing a wafer and each inspection module. Wherein, a wafer detecting position 11 is provided on the base 1, for placing a wafer, and positioning the wafer for easy detection. The wafer detecting position 11 is provided with a probe detecting module 5 for detecting the working state of the electronic device on the wafer.
Wherein, the probe detection module 5 is provided with a circle of probe mechanism 51 for contacting with the surface of the wafer; and sending the test signal into the tested chip and obtaining a feedback signal to judge the performance and the working state of the chip.
Furthermore, a base frame 2 is further provided on the base 1, for supporting the inspection device at a certain height, so as to facilitate the inspection of the upper surface of the wafer. An upper light receiving detection module 3 is arranged on the base frame 2 and used for detecting upper light receiving of the wafer. The upper light receiving detection module 3 comprises an integrating sphere 32 and a shooting detection mechanism 31, the integrating sphere 32 is used for measuring the light output or light absorption capacity of an optoelectronic device on a wafer, and the shooting detection mechanism 31 is used for shooting and detecting whether a probe head of the probe detection device is in contact with the surface of the wafer.
Wherein, the upper light receiving detection module 3 is arranged on the base frame 2 through a moving module and can move through the moving module. The movable module comprises a horizontal movable module 21 and a lifting movable module 22, wherein the horizontal movable module 21 is horizontally arranged along the x-axis direction, the lifting movable module 22 is vertically arranged along the z-axis direction, and the movable module can move in the horizontal direction and the vertical direction, so that the position of the upper light receiving detection module 3 can be conveniently adjusted.
And a shooting and positioning mechanism 4 is further arranged on one side of the wafer detection position 11, and the shooting and positioning mechanism 4 is downwards aligned to the wafer detection position 11. The photographing and positioning mechanism 4 is disposed on the base 1 below the base frame 2, and is used for detecting the position where the wafer chip is placed.
The upper light receiving detection device and the shooting and positioning mechanism 4 are arranged separately through the base frame 2, so that the shooting and positioning mechanism 31 and shooting equipment used by the shooting and positioning mechanism 4 are divided into two, the shooting and positioning mechanism 4 detects the position of a wafer chip first, and the shooting and positioning mechanism 31 detects the contact condition of a probe according to the position of the shooting and positioning mechanism 4. The focal length of the shooting equipment does not need to be changed by moving back and forth, and the respective function and performance indexes are better met through independent parameter adjustment, calibration and optimization. Errors generated by repeated positioning movement among the detection devices can be reduced, and positioning accuracy is guaranteed.
Referring to fig. 1 and fig. 2 in combination, the upper light receiving detection module 3 moves through a moving module, and the moving module includes a horizontal moving module 21 and a lifting moving module 22. Wherein the horizontal movement includes a horizontal guide rail 212 and a horizontal slider 211, and the horizontal slider 211 is slidably disposed on the horizontal guide rail 212 to perform a movement along the horizontal direction. And, the horizontal slider 211 is fixed on the base frame 2, the horizontal guide rail 212 is inverted, and slidably cooperates with the horizontal slider 211, so that the horizontal movement module 21 is integrally flip-chip mounted on the base frame 2. The horizontal rail 212 is long, and the device is convenient to be arranged on the horizontal rail 212.
Further, the photographing detection mechanism 31 is fixed to the horizontal rail 212 and is provided at an end of the horizontal rail 212 near the wafer detection position 11. And one end of the horizontal rail 212 is exposed on the base frame 2 above the wafer inspection position 11. The imaging detection means 31 is fixed to the horizontal rail 212 and can move in the horizontal direction.
The moving module further comprises a horizontal screw rod module 213 for driving the horizontal moving module 21 to move. The horizontal screw rod module 213 is arranged at the bottom of the base frame 2, and penetrates through the base frame 2 to be connected with the horizontal movement module 21. The horizontal screw rod module 213 comprises a horizontal screw rod and a horizontal screw rod nut, wherein the horizontal screw rod is sleeved with the horizontal screw rod, and the horizontal screw rod module moves along the horizontal screw rod. The horizontal screw is disposed in parallel with the horizontal guide rail 212 along the x-axis direction, wherein one end is disposed toward the wafer inspection position 11.
The horizontal guide rail 212 is connected with the horizontal screw nut, and the horizontal guide rail 212 is driven to move along the x-axis direction by the horizontal screw nut, so as to drive the shooting detection mechanism 31 to move. And a servo motor 214 is connected to the end of the horizontal screw rod far away from the wafer detection position 11 and is used for driving the horizontal screw rod to rotate so as to move a horizontal screw rod nut. High precision position and speed control can be provided by the servo motor 214 so that the movement of the screw is more accurate and stable.
Meanwhile, the lifting moving module 22 also includes a lifting guide rail 222 and a lifting slider 223, where the lifting slider 223 is slidably disposed on the lifting guide rail 222 and can lift along the z-axis direction. The lifting rail 222 is fixedly disposed at an end of the horizontal rail near the wafer detecting position 11, at the same end as the shooting detecting mechanism 31, and behind the shooting detecting mechanism 31.
The moving module further comprises a lifting screw rod module 221, wherein the lifting screw rod module 221 is arranged in the lifting guide rail 222 and is used for driving the lifting slider 223 to perform lifting movement. The lifting screw module 221 comprises a lifting screw and a lifting screw nut, the lifting screw nut is arranged on the lifting screw in a penetrating mode, and the lifting sliding block 223 is connected with the lifting screw nut and moves along with the lifting screw nut. A servo motor 214 is also connected above the lifting screw rod, and drives the lifting screw rod to rotate so as to enable the lifting screw rod nut to move.
Further, the integrating sphere 32 is provided on the elevating slider 223, and is moved on the elevating rail 222 by the elevating slider 223. The lifting and moving module 22 is integrally provided on the horizontal moving module 21, and can move horizontally along the x-axis, thereby driving the integrating sphere 32 to move horizontally, and the two-axis movement of the integrating sphere 32 is realized in cooperation with the movement of the lifting and sliding block 223. The integrating sphere 32 is conveniently lowered to the wafer inspection position 11 for light receiving.
The shooting detection mechanism 31 is fixed on the horizontal movement module 21, and only moves in the horizontal x-axis direction, and the height is fixed, so that the distance between the shooting detection mechanism 31 and the wafer detection position 11 is ensured, and the focus parameter is prevented from being changed by back and forth movement. The integrating sphere 32 moves in a double-shaft manner through the cooperation of the lifting moving module 22 and the horizontal moving module 21, and the integrating sphere 32 can be adjusted according to the position of the wafer, so that uniform illumination of a measured object can be realized. In addition, the dual-axis movement of the integrating sphere 32 can acquire illumination data under different angles and positions in one test, so that the number of repeated tests is reduced.
With continued reference to fig. 1 and 3, a probe mechanism 51 is disposed at the periphery of the wafer detecting position 11, wherein the probe mechanism 51 surrounds the periphery of the wafer detecting position 11, and a large space is reserved in the direction of the position of the photographing positioning mechanism 4, so that the photographing positioning mechanism 4 can conveniently move toward the center of the wafer detecting position 11.
The probe mechanism 51 is provided with probe tips, and the probe tips on each probe mechanism 51 are aligned to the center of the wafer detection position 11. When a wafer is placed on the wafer inspection position 11, the probe tip is brought into contact with the wafer by the lowering or moving of the probe mechanism 51, and test signals and feedback signals obtained from chips on the wafer are collected and recorded to judge the performance and the operating state of the chips.
When the utility model works, a wafer is placed in a wafer detection position 11, and a shooting and positioning mechanism 4 performs positioning detection on the wafer to determine the position information of the wafer; meanwhile, the probe mechanism 51 of the probe detection module 5 is in wafer contact to detect the wafer; the moving module starts to drive the upper light receiving detection module 3 to move, and the shooting detection mechanism 31 firstly shoots and detects the wafer to judge whether the probe is contacted with the wafer or not; after the detection is finished, the moving module continues to drive the integrating sphere 32 to move in a double-shaft mode, and the integrating sphere 32 is driven to align with the wafer according to the position information collected by the shooting and positioning mechanism 4 so as to perform light receiving detection.
According to the light receiving detection device on the wafer, the shooting positioning mechanism 4 and the upper light receiving detection module 3 are arranged separately, so that the shooting positioning mechanism 4 is controlled independently, and errors of focusing or alignment caused by back and forth movement are reduced. Further, by using the photographing positioning mechanism 4 and the photographing detection mechanism 31 as two photographing mechanisms, it is possible to avoid a change in focus from a different photographing, and to ensure the accuracy of photographing by the photographing positioning mechanism 4.
While the preferred embodiment of the present utility model has been described in detail, the present utility model is not limited to the embodiments, and those skilled in the art can make various equivalent modifications or substitutions without departing from the spirit of the present utility model, and the equivalent modifications or substitutions are included in the scope of the present utility model as defined in the appended claims.
Claims (8)
1. The utility model provides a light detection device is received on wafer which characterized in that includes: the wafer detection device comprises a base, a probe detection module and a probe mechanism, wherein the base is provided with a wafer detection position, the wafer detection position is provided with the probe detection module, and the probe detection module is provided with the probe mechanism in a circle; the base is also provided with a base frame, the base frame is provided with an upper light receiving detection module, and the upper light receiving detection module comprises an integrating sphere and a shooting detection mechanism; the upper light receiving detection module is arranged on the base frame through a moving module, and the moving module comprises a horizontal moving module and a lifting moving module; and one side of the wafer detection position is provided with a shooting positioning mechanism, the shooting positioning mechanism is arranged on the base below the base frame, and the shooting positioning mechanism is aligned to the wafer detection position.
2. The light receiving detection device of claim 1, wherein the horizontal movement module is vertically arranged along the x-axis direction, the horizontal movement module comprises a horizontal guide rail and a horizontal slide block, the horizontal slide block is slidably arranged on the horizontal guide rail, and the horizontal slide block is fixed on the base frame.
3. The apparatus according to claim 2, wherein the photographing detection mechanism is fixed to an end of the horizontal rail near the wafer detection position.
4. The light receiving detection device for wafers according to claim 2, wherein the lifting movement module is vertically arranged along the z-axis direction, the lifting movement module comprises a lifting guide rail and a lifting slide block, the lifting slide block is slidably arranged on the lifting guide rail, the lifting guide rail is fixedly arranged at the end part of the horizontal guide rail, which is close to the wafer detection position, and the integrating sphere is arranged on the lifting guide rail through the lifting slide block.
5. The light receiving detection device on a wafer according to claim 2, wherein the moving module further comprises a horizontal screw rod module, the horizontal screw rod module is arranged at the bottom of the base frame and comprises a horizontal screw rod and a horizontal screw rod nut, the horizontal guide rail is connected with the horizontal screw rod nut, and a servo motor is connected to the end part of the horizontal screw rod to drive the horizontal screw rod nut to move.
6. The light receiving inspection device according to claim 4, wherein the moving module further comprises a lifting screw module, the lifting screw module is arranged on the lifting guide rail, the lifting screw module comprises a lifting screw and a lifting screw nut, the lifting slider is connected with the lifting screw nut, and a servo motor is connected above the lifting screw to drive the lifting screw nut to move.
7. The apparatus of claim 1, wherein the probe mechanism surrounds the periphery of the wafer inspection site, leaving a gap between the camera positioning mechanism.
8. The apparatus of claim 7, wherein the probe mechanism is provided with a probe tip and a probe spring, the probe tip being aligned with a center of a circle of the wafer inspection site.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202323238960.5U CN221303161U (en) | 2023-11-28 | 2023-11-28 | Light receiving detection device on wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202323238960.5U CN221303161U (en) | 2023-11-28 | 2023-11-28 | Light receiving detection device on wafer |
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| Publication Number | Publication Date |
|---|---|
| CN221303161U true CN221303161U (en) | 2024-07-09 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202323238960.5U Active CN221303161U (en) | 2023-11-28 | 2023-11-28 | Light receiving detection device on wafer |
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| Country | Link |
|---|---|
| CN (1) | CN221303161U (en) |
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2023
- 2023-11-28 CN CN202323238960.5U patent/CN221303161U/en active Active
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