CN215069899U - Wafer test equipment - Google Patents
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- CN215069899U CN215069899U CN202121522856.7U CN202121522856U CN215069899U CN 215069899 U CN215069899 U CN 215069899U CN 202121522856 U CN202121522856 U CN 202121522856U CN 215069899 U CN215069899 U CN 215069899U
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Abstract
The utility model provides an improve wafer test equipment of wafer test accuracy, including equipment body and the test machine of setting above that, and inlay into the probe card of inversion in the equipment body top, the probe card with the test machine electricity is connected, the equipment body includes: a frame; a first moving platform arranged at the lower part in the frame; the lower microscope vision system and the wafer are arranged on the first moving platform, the lower microscope vision system is used for acquiring an image of the probe card, and the first moving platform can drive the lower microscope vision system and the wafer to linearly move along X, Y, Z directions; and the second moving platform is arranged at the upper part in the frame, the upper microscope vision system is inverted on the second moving platform and is used for acquiring the image of the wafer below the upper microscope vision system, and the second moving platform can drive the upper microscope vision system to move linearly along the Y-axis or X-axis direction.
Description
Technical Field
The utility model belongs to the technical field of semiconductor test equipment, in particular to wafer test equipment.
Background
The whole process of manufacturing semiconductor devices can be divided into wafer manufacturing, wafer probing, and chip packaging. Among them, the Chip Probing (CP) is an important part of the semiconductor chip manufacturing process, and the CP testing aims to detect the electrical characteristics of each die on the wafer, and filter out the wafer with poor electrical function before the semiconductor is packaged, so as to avoid increasing the manufacturing cost.
The wafer probing test is generally performed by using a wafer testing device, an upper microscope vision system, a lower microscope vision system, a Tester (Tester), a probe card and a wafer are all arranged on the wafer testing device, and the method for performing a contact test on a pad testing point of the wafer by using the probe card comprises the following steps: the method comprises the steps of acquiring coordinates (x1, y1, z1) of a pad test point on a wafer below the upper microscope vision system in a coordinate system of a moving platform by using the upper microscope vision system and the lower microscope vision system, carrying out optical calibration by using the upper microscope vision system and the lower microscope vision system to obtain coordinates (x2, y2, z2) of a focusing point of the upper microscope vision system and the lower microscope vision system on the coordinate system of the moving platform when the focusing point of the lower microscope vision system is at the same point, acquiring coordinates (x3, y3, z3) of all probe tips on a probe card in the moving platform by using the lower microscope vision system, controlling the difference between the moving coordinates of the moving platform { (x2-x1) + (x3-x2), (y2-y1) + (y3-y2), (z2-z1) + (z 1-z 1), namely, (x 1-x 1, y 1-y 1, z 1-z 1) is the distance for controlling the moving of the moving platform, and enabling the wafer to be in contact with the probes one by one to one, thereby performing a needling experiment.
However, in the conventional wafer testing device, the wafer is arranged on the lower microscope vision system, and the lower microscope vision system can drive the wafer to move in the horizontal plane and in the vertical direction; the upper microscope vision system is fixedly arranged on one side above the wafer, and the probe is inverted above the wafer. When the upper microscope vision system is required to acquire the coordinates of each pad test point on the wafer below the upper microscope vision system, the wafer needs to be moved to the position below the upper microscope vision system, then the upper microscope vision system and the lower microscope vision system are checked with each other to acquire the conversion relation between the two coordinate systems, then the lower microscope vision system is required to move the wafer to the position below the probe, after the coordinates of the probe are acquired by the lower microscope vision system, the wafer is moved to the position below the probe and the wafer is moved upwards to enable the wafer to be in contact with the probe, and each probe on the probe card is correspondingly inserted into each pad test point of the wafer one by one to perform detection. In this way, the lower microscope vision system needs to be moved back and forth for a certain distance in the horizontal direction during testing. In fact, due to the existence of mounting and manufacturing errors, the longer the motion stroke of the moving platform for driving the wafer, the larger the error will be, and this error will be brought into the wafer test, so that the deviation occurs in the position of one-to-one contact between the probe and the wafer pad test point, which affects the data of the electrical signal of the tested wafer, and the like, which is specifically expressed as:
1. the movement stroke of the lower microscope vision system is larger, and the larger the movement stroke is, the lower the microscope vision system can obtain the wafers and the probes with low coordinate precision under the condition that the stability is difficult to ensure; 2. when the space coordinate system is converted, the self precision error of the lower microscope vision system is added to the corresponding coordinates of the pad test point of the wafer and the probe, so that the precision of the contact between the probe and the pad test point of the wafer is reduced.
SUMMERY OF THE UTILITY MODEL
The utility model discloses to the above-mentioned problem that prior art exists, provide a wafer test equipment, it is high to carry out wafer test accuracy with this equipment.
According to a wafer test equipment, including the equipment body, in the test machine that the higher authority of equipment body set up, and inlay into the probe card of inversion in the top of equipment body, the probe card with the test machine electricity is connected, the equipment body includes:
a frame;
a first moving platform arranged at the lower part in the frame;
the lower microscope vision system and the wafer are arranged on the first moving platform, the lower microscope vision system is used for acquiring an image of the probe card, and the first moving platform can drive the lower microscope vision system and the wafer to linearly move along X, Y, Z directions;
and the second moving platform is arranged at the upper part in the frame, the upper microscope vision system is inverted on the second moving platform and is used for acquiring the image of the wafer below the upper microscope vision system, and the second moving platform can drive the upper microscope vision system to move linearly along the Y-axis or X-axis direction.
In some embodiments of the present invention, the first mobile platform comprises: the X-axis motion module and the Z-axis motion module which are connected are sequentially stacked upwards,
the X-axis motion module comprises an X-axis drive assembly and an X-axis support plate for supporting the X-axis drive assembly, and the X-axis drive assembly is partially or completely embedded into the X-axis support plate;
the Z-axis motion module comprises a Z-axis drive assembly and a Z-axis connecting plate connected with the Z-axis drive assembly, and the X-axis drive assembly is fixedly connected with the Z-axis connecting plate and drives the Z-axis connecting plate to move linearly along the X-axis direction;
the Z-axis driving component is embedded into the X-axis supporting plate, and the embedding depth of the Z-axis driving component is greater than that of the X-axis driving component;
the lower microscope vision system is arranged on the Z-axis motion module.
The utility model discloses a in some embodiments, first moving platform still includes Y axle motion module, sets up the below of X axle motion module, Y axle motion module includes Y axle drive assembly and support Y axle drive assembly's Y axle backup pad, Y axle drive assembly with X axle support plate links firmly, and the drive X axle support plate is along Y axle direction linear motion, Y axle drive assembly part or whole inlay down in the Y axle backup pad.
In some embodiments of the present invention, the first mobile platform further comprises: the rotary motion module is arranged on the Z-axis motion module, the wafer is arranged on the rotary motion module, and the rotary motion module can drive the wafer to rotate around the Z axis or a rotating shaft with a certain included angle with the Z axis.
In some embodiments of the present invention, the X-axis support plate and the Y-axis support plate are slidably connected by a slide rail; or/and
the Z-axis connecting plate is connected with the X-axis supporting plate in a sliding mode through a sliding rail.
In some embodiments of the present invention, the second movable platform includes two slide rails disposed along the X axis or the Y axis, and a sliding plate slidably connected to the slide rails and spanned over the slide rails, and the microscope vision system is disposed on the sliding plate.
Drawings
Fig. 1 is a cross-sectional view of a wafer test apparatus provided by the present invention;
fig. 2 is a schematic view of an internal structure of an apparatus body of a wafer testing apparatus provided in the present invention;
fig. 3 is a top view of a wafer testing method according to step S1 provided by the present invention;
fig. 4 is a top view of a wafer testing method according to step S2 provided by the present invention;
fig. 5 is a cross-sectional view of a wafer testing method according to the present invention corresponding to step S2;
fig. 6 is a cross-sectional view corresponding to step S3 in a wafer testing method according to the present invention;
fig. 7 is a cross-sectional view of a wafer testing method according to the present invention corresponding to step S4;
fig. 8 is a cross-sectional view corresponding to step S5 in a wafer testing method according to the present invention.
Reference numerals
1. An apparatus body; 11. a frame; 12. a first mobile platform; 13. a lower microscope vision system; 131. focusing point of lower microscope vision system; 14. a second mobile platform; 15. an upper second mobile platform; 151. focusing point of upper microscope visual system;
121. a Y-axis motion module; 122. an X-axis motion module; 123. a Z-axis motion module; 124. a rotation module;
2. a testing machine; 3. a probe card; 4. a wafer bearing table; 41. and (5) a wafer.
Detailed Description
The following are specific embodiments of the present invention and the accompanying drawings are used to further describe the technical solution of the present invention, but the present invention is not limited to these embodiments.
The wafer test apparatus shown in fig. 1 includes an apparatus body 1, a tester 2 disposed on an upper surface of the apparatus body 1, and a probe card 3 disposed upside down in a top portion of the apparatus body 1 and electrically connected to the tester 2.
The equipment body 1 comprises a rectangular frame 11, the lower end of the probe card 3 extends into the top of the rectangular frame 11, the upper end of the probe card is electrically connected with the testing machine 2, and the lower end of the probe card 3 is provided with a plurality of probes.
As shown in fig. 1 and fig. 2, the apparatus body 1 further includes a first moving platform 12 disposed in the frame 11, and a lower microscope vision system 13 disposed on the first moving platform 12, and the wafer stage 4 for carrying the wafer 41 is also disposed on the first moving platform 12 and is disposed adjacent to the lower microscope vision system 13.
The first movable platform 12 is disposed on the bottom of the frame 11, but may be disposed on the side wall of the frame 11, and it is within the scope of the present disclosure that the first movable platform is disposed in the frame 11. The lower microscope vision system 13 is used to acquire images of all probes on the probe card 3 located above the lower microscope vision system, and the first moving platform 12 carries the lower microscope vision system 13 and the wafer stage 4 to perform linear movement in 3 directions.
Specifically, the first moving platform 12 includes a linear motion module and a rotation module 124. The linear motion module comprises a Y-axis motion module 121, an X-axis motion module 122 and a Z-axis motion module 123 which are sequentially stacked upwards, the Y-axis motion module 121 drives the X-axis motion module 122 to linearly move along the Y axis, the X-axis motion module 122 drives the Z-axis motion module 123 to linearly move along the X axis, a rotation module 124 is arranged on the Z-axis motion module 123, and the Z-axis motion module 123 drives the rotation module 124 to linearly move along the Z axis. At this time, the wafer 41 is disposed on the rotation module 124 and rotates together with the rotation module 124; the lower microscope vision system 13 is disposed on the Z-axis motion block 123.
It should be noted that the arrangement positions of the Y-axis movement module 121 and the X-axis movement module 122 may be interchanged here.
In addition, the wafer-bearing platform 4 is disposed on the rotating module 124, and since the wafer 41 is placed on the chuck of the wafer-bearing platform 4, if its cutting path is not aligned with the set position, it needs to be correctly positioned by the rotating module 124. If the top surface of the rotation module 124 is horizontal, the rotation module 124 can rotate the wafer around the Z axis in the horizontal plane, and if the top surface of the rotation module 124 is not horizontal, the rotation module 124 can rotate the wafer 41 around a rotation axis forming an angle with the Z axis, so that the first moving platform 12 can perform four-directional movement with the wafer support 4 and the lower microscope vision system 13, i.e. X, Y, Z-axis directional linear movement and rotation movement in the horizontal plane or a plane forming an angle with the horizontal plane can be performed. The lower microscope vision system 13 is now disposed on the Z-axis motion block 123.
In some embodiments, the first movable platform 12 may not include the rotation module 124, and the stage 4 and the lower microscope vision system 13 are directly disposed on the Z-axis motion module 123.
The X-axis motion module 122 and the Y-axis motion module 121 each include a driving assembly and a supporting plate supporting the driving assembly, wherein the X-axis motion module 122 includes an X-axis driving assembly and an X-axis supporting plate, and the Y-axis motion module 121 includes a Y-axis driving assembly and a Y-axis supporting plate supporting the Y-axis driving assembly. The Z-axis motion module 123 includes a Z-axis drive assembly and a Z-axis connection plate connecting the Z-axis drive assembly.
The Y-axis driving component is downwards embedded into a Y-axis supporting plate for supporting the Y-axis driving component, and the Y-axis driving component is fixedly connected with the X-axis supporting plate so as to drive the X-axis supporting plate to linearly move along the Y-axis direction.
The X-axis driving assembly is downwards embedded into an X-axis supporting plate for supporting the X-axis driving assembly, and the X-axis driving assembly is fixedly connected with the Z-axis connecting plate so as to drive the Z-axis connecting plate to linearly move along the X-axis direction.
The Z-axis driving component is also embedded into the X-axis supporting plate downwards, and the depth of the Z-axis driving component embedded into the X-axis supporting plate is greater than that of the X-axis driving component embedded into the X-axis supporting plate.
The upper surface of the X-axis supporting plate is provided with a first groove, the bottom of the first groove is provided with a second groove, the X-axis driving component is arranged in the first groove, and the Z-axis driving component is arranged in the second groove.
In some embodiments, the Y-axis motion module 121 may not be provided, and the second movable platform 14 described later and the Z-axis motion module 123 driven by the X-axis motion module 122 may move in the same direction.
The upper surface of Y axle backup pad is provided with the spout rail or slider rail (collectively referred to as slide rail), is provided with the slider that matches with the spout rail on the bottom surface of X axle backup pad, or the spout that matches with the slider rail, and the spout rail cooperates with the slider or slider rail and spout cooperation, moves along the slide rail of Y axle backup pad when Y axle drive assembly drive X axle backup pad motion, has increased the stationarity that X axle backup pad moved.
Similarly, a sliding groove rail or a sliding block rail (collectively referred to as a sliding rail) is arranged on the upper surface of the X-axis supporting plate, a sliding block matched with the sliding groove rail or a sliding groove matched with the sliding block rail is arranged on the bottom surface of the Z-axis connecting plate, the sliding groove rail is matched with the sliding block or the sliding block rail is matched with the sliding groove, and when the X-axis driving assembly drives the Z-axis connecting plate to move, the sliding groove rail or the sliding block rail is matched with the sliding groove, the sliding groove rail moves along the sliding rail of the X-axis supporting plate, so that the moving stability of the Z-axis connecting plate is improved.
In this embodiment, the X-axis driving assembly, the Y-axis driving assembly, and the Z-axis driving assembly are rodless cylinders.
In some embodiments, the X-axis drive assembly, the Y-axis drive assembly, and the Z-axis drive assembly may also be other linear drives such as a rod cylinder, an electric push rod, and the like.
The lower microscope vision system 13 includes camera components, optical components, and a light spot component for calibrating the coordinate systems of the upper and lower microscope vision systems 13. Acquiring an image of the probe card 3 through the camera part and the optical part, thereby acquiring coordinates of all probe tips of the probe card 3 thereabove on an X, Y, Z axis coordinate system of the lower microscope vision system 13; the alignment of the upper and lower microscope vision systems 15,13 is performed by the spot unit.
As shown in fig. 1 and 2, the apparatus body 1 further includes a second moving platform 14 disposed at an upper portion in the frame 11, and an inverted upper microscope vision system 15 disposed on the second moving platform 14, wherein the second moving platform 14 is disposed at an upper portion of the first moving platform 12, and the upper microscope vision system 15 is disposed higher than the stage 4 and is configured to acquire an image of the wafer 41 of the stage 4 therebelow, that is, to acquire images of pad test points of all chips on the wafer 41.
As shown in fig. 2, the second moving platform 14 includes two symmetrically disposed slide rails and a slide plate straddling the slide rails, the upper microscope vision system 15 is disposed on the slide plate, and the moving direction of the second moving platform 14 is the same as the moving direction of the Y-axis motion module 121, that is, the slide rails of the second moving platform 14 and the Y-axis motion module 121 are disposed in parallel. The slide of the second mobile platform 14 is also driven by the power mechanism to slide horizontally along the slide rail with the upper microscope vision system 15.
In some embodiments, the moving direction of the second moving platform 14 may also be the same as the moving direction of the X-axis motion module 122.
The driving components of the second movable platform 14 are the same as those of the Y-axis motion module 121, the X-axis motion module 122, and the Z-axis motion module 123, and are not described herein again.
The upper microscope vision system 15 includes a camera component and an optical component, and can acquire an image of the wafer 41 on the stage 4 below the camera component, so as to acquire coordinates of the pad testing points of all chips on the stage 4 in the coordinate system of the first moving platform 12.
When a wafer is tested, the upper microscope vision system 15 is driven by the second moving platform 14 to move to the position below the probe, the positions of the wafer in the vertical direction, the front direction, the rear direction and the left direction are adjusted through the first moving platform 12, so that the upper microscope vision system 15 can clearly see images of all pad test points on the wafer bearing table 4, and coordinates of all pad test points of the wafer bearing table 4 in a coordinate system of the first moving platform 12 are obtained through the upper microscope vision system 15; then keeping the position of the upper microscope vision system 15 still, moving the lower microscope vision system 13 to the position below the upper microscope vision system 15, adjusting the height of the lower microscope vision system 13 through the first moving platform 12 to enable the focal points of the upper and lower microscope vision systems 15,13 to be at the same height, adjusting the position of the lower microscope vision system 13 through the first moving platform 12 in the left-right front-back direction to enable the focal points of the upper and lower microscope vision systems 15,13 to be at the same point, realizing the calibration of the upper and lower microscope vision systems 15,13, and obtaining the coordinates of the lower microscope vision system 13 in the coordinate system of the first moving platform 12; then, the upper microscope vision system 15 is moved to an initial position under the action of the second moving platform 14, the lower microscope vision system 13 is moved to the lower part of the probe card 3 through the first moving platform 12, and the position of the lower microscope vision system 13 is adjusted up, down, left, right, front and back through the first moving platform 12, so that the lower microscope vision system 13 can clearly see the images of all probe tips on the probe card 3, and the coordinates of all the probe tips on the probe card 3 in the coordinate system of the first moving platform 12 are obtained; the first moving platform 12 is moved horizontally and vertically to make the wafer 41 on the stage 4 contact with the probes on the probe card 3, and the tester 2 gives the probe card 3 relevant electrical signals, so as to test various electrical parameters and characteristics of all chips on the wafer 41.
In the above test process, when the probe card 3 and the wafer 41 are subjected to contact test and coordinates of all probe tips on the probe card 3 in the coordinate system of the first moving platform 12 are obtained through the lower microscope vision system 13, the lower microscope vision system 13 is performed in the same area (the moving distance of the lower microscope vision system 13 in the horizontal direction is not large), that is, after the lower microscope vision system 13 on the first moving platform 12 and the upper microscope vision system 15 on the second moving platform 14 are checked in the wafer test process, the second moving platform 14 is moved to the initial position, the first moving platform 12 moves in a small range in the horizontal direction to enable the wafer 41 thereon to be directly opposite to the upper probe card 3, the Z-axis motion module 123 of the first moving platform 12 adjusts the height of the wafer 41 upward to contact with the probe card 3 to perform a test experiment, in this process, the first moving platform 12 moves in the horizontal direction slightly, the upper and lower microscope vision systems 15,13 check area and the wafer test area are the same working area. The lower microscope vision system 13 has a small moving range, and the influence on the coordinate of the probe card 3 and the mutual checking error of the upper microscope vision system 15 and the lower microscope vision system 13 is small, so that the coordinate calibration precision of the probe card 3 is high, the contact precision of the wafer bonding pad testing point and the probe is improved, and the stability and the accuracy of the whole test are improved.
The utility model also provides a wafer test method specifically includes following step:
step S1, mounting the wafer 41 on the wafer stage 4 of the first movable platform 12 of the wafer testing apparatus;
specifically, the Z-axis motion module 123 is lowered to the lowest position, as shown in fig. 3, the wafer 41 is placed in the chuck of the wafer bearing table 4, whether the chip dicing channels on the wafer 41 are aligned with the set position is checked, and if not, the position of the wafer 41 is rotated by a small angle through the rotation module 124 and is tiled in the chuck; if the wafer test equipment is not provided with the rotation module 124, the wafer stage 4 is mounted on the upper end surface of the Z-axis movement module 123, and the wafer 41 can be correctly positioned by hand. The wafer 41 is then sucked into the chuck by means of vacuum suction.
Step S2, establishing a coordinate system relationship between all the chip pad testing points on the wafer 41 and the microscope vision system 15, that is, obtaining coordinates of all the chip pad testing points on the wafer 41 in the coordinate system of the first mobile platform 12 through the microscope vision system 15;
step S21, moving the upper microscope vision system 15 to the lower side of the probe card 3 along with the second moving platform 14, and keeping the upper microscope vision system 15 staying at the current position, as shown in fig. 4;
step S22, moving the wafer 41 to a position below the upper microscope vision system 15 through the first moving platform 12 until the upper microscope vision system 15 can clearly see the pad testing points of all chips on the wafer 41;
step S221, the Z-axis motion module 123 moves the wafer support 4 up and down until the wafer 41 moves to the height of the focus point 151 of the upper microscope vision system 15, and the upper microscope vision system 15 can clearly observe the image of the wafer 41, as shown in fig. 5;
step S222, the X-axis motion module 122 and the Y-axis motion module 121 drive the wafer bearing table 4 to horizontally move back and forth, left and right, so that the upper microscope vision system 15 can clearly observe all the pad test points on the wafer 41;
in step S23, the coordinates of all pad testing points on the wafer 41 in the coordinate system of the first movable platform 12 are recorded.
The upper microscope vision system 15 is only used to obtain the image of all the chip pad testing points on the wafer 41, the first movable platform 12 with the wafer is placed under the upper microscope vision system 15, the first movable platform 12 can carry out X, Y, Z three-directional linear motion, if the first movable platform 12 has the coordinate (x) in its own coordinate system0,y0,z0) The coordinates of the wafer in the coordinate system of the first movable platform 12, which are obtained by the upper microscope vision system 15 after X, Y, Z three-directional movements of the first movable platform 12, are (x)1,y1,z1)。
Step S3, the upper and lower microscope vision systems 15,13 perform coordinate calibration to obtain the coordinates of the lower microscope vision system 13 in the coordinate system of the first mobile platform 12 when the focusing points of the upper and lower microscope vision systems 15,13 are the same;
step S31, keeping the position of the upper microscope vision system 15 under the probe card 3 unchanged, moving the lower microscope vision system 13 with the first moving platform 12 to the position under the upper microscope vision system 15 as shown in fig. 5;
step S32, the lower microscope vision system 13 is driven to move up and down through the Z-axis movement module 123 until the focusing point 131 of the lower microscope vision system 13 and the focusing point 151 of the upper microscope vision system 15 are at the same vertical height, and the upper and lower microscope vision systems 15,13 can clearly observe the image of the other side;
step S33, moving the lower microscope vision system 13 through the X-axis motion module 122 or/and the Y-axis motion module 121, so that the focus point 131 of the lower microscope vision system coincides with the focus point 151 of the upper microscope vision system, as shown in fig. 6;
at step S34, the coordinates of the microscope vision system 13 in the first moving platform 12 coordinate system are recorded.
As shown in FIG. 6, since the focus point 131 of the lower microscope vision system coincides with the focus point 151 of the upper microscope vision system, the coordinates of the focus points of the upper and lower microscope vision systems in the coordinate system of the first moving stage 12 are (x)2,y2,z2)。
Step S4, establishing a coordinate system relationship between all probe tips of the probe card 3 and the lower microscope vision system 13, that is, obtaining coordinates (x) of all probe tips of the probe card 3 in the coordinate system of the first movable platform 12 by the lower microscope vision system 133,y3,z3)：
Step S41, the second moving platform 14 drives the upper microscope vision system 15 to return to the initial position;
step S42, driving the lower microscope vision system 13 to move under the probe card 3 through the first moving platform 12 until each probe tip image of the probe card 3 is clearly visible;
step S421, moving the lower microscope vision system 13 up and down to clearly see the tip image of the probe card 3 through the Z-axis movement module 123;
the Z-axis motion module 123 drives the lower microscope vision system 13 to move up and down until the height of the focus point 131 of the lower microscope vision system 13 reaches the height of the tip of the probe card 3, that is, the lower microscope vision system 13 clearly observes the image of the tip of the probe card 3, and records the distance height h2 from the camera lens of the lower microscope vision system 13 to the focus point 131, as shown in fig. 7.
Step S422, moving the lower microscope vision system 13 through the X-axis motion module 122 or/and the Y-axis motion module 121 to clearly observe an image of each probe tip of the probe card 3;
in step S423, the coordinates (x) of all the probe tips of the probe card 3 in the coordinate system of the first moving stage 12 acquired by the microscope vision system 13 are recorded3,y3,z3)。
Step S5, controlling the first movable platform 12 to move with the wafer 41 and to make one-to-one contact between each probe tip of the probe card 3 and all pad test points on the wafer 41, so as to perform an electrical test experiment:
as shown in fig. 8, the position of the wafer 41 is adjusted by the first moving platform 12, so that the wafer 41 is disposed right below the probe card 3, the wafer is driven to rise by the Z-axis movement module 123 to make the pad testing points on the wafer 41 and the probes on the probe card 3 contact accurately in a one-to-one correspondence manner, and the tester 2 gives the probe card 3 a relevant electrical signal, so as to test various electrical parameters and characteristics of the wafer stage 4.
The specific method for controlling the moving distance of the first moving platform 12 is as follows: the coordinate difference between the wafer 41 and the lower microscope vision system 13 is (x)2-x1,y2-y1,z2-z1) The coordinate difference between the probe and the lower microscope vision system 13 is (x)3-x2,y3-y2,z3-z2) Then, the coordinates that need to be moved to control the first moving platform 12 to bring the wafer 41 and the probe into one-to-one correspondence are:
{(x2-x1)+(x3-x2),(y2-y1)+(y3-y2),(z2-z1)+(z3-z2) I.e. (x)3-x1,y3-y1,z3-z1)。
The utility model discloses a set up second moving platform 14 portable, when establishing all pad test points on wafer 41 and the relation between last microscope vision system 15, promptly through last microscope vision system 15 when obtaining the coordinate of all pad test points on wafer 41 in the coordinate system of first moving platform 12, through moving second moving platform 14 under probe card 3, first moving platform 12 moves the position of adjusting wafer 41 and makes last microscope vision system 15 can be clear see the image of all pad test points on wafer 41; then the first mobile platform 12 moves a small distance in the horizontal direction, so that the upper and lower microscope vision systems 15 and 13 check each other to obtain the coordinates of the lower microscope vision system in the coordinate system of the first mobile platform 12; the upper microscope vision system 15 is then moved to the initial position by the second movable stage 14, and the first movable stage 12 is moved horizontally by a small distance so that the lower microscope vision system 13 observes an image of all probe tips. The longer the distance that the X-axis motion module and the Y-axis motion module of the first moving platform 12 move due to the manufacturing error of each driving assembly of the first moving platform 12, the larger the error. In the process of checking the upper and lower microscope vision systems 15 and 13 with each other and obtaining the relationship between the probe and the lower microscope vision system 13, the first moving platform 12 moves slightly in the horizontal direction, so that the influence on the wafer test precision is small, and the data precision of the wafer test is improved.
In the prior art, the second mobile platform is fixed on one side of the probe station, the probe card is approximately arranged in the middle of the probe station, and in the process of mutually checking the upper and lower microscope vision systems and obtaining the relation between the probe and the lower microscope vision system, the first mobile platform needs to move back and forth for a long distance in the horizontal direction, so that the installation and manufacturing errors of the first mobile platform are brought to wafer testing, and the wafer testing accuracy is reduced. The utility model discloses a set up the second moving platform as portable, reduced the displacement of first moving platform horizontal direction to the precision of wafer test has been improved.
The specific embodiments described herein are merely illustrative of the spirit of the invention. Various modifications, additions and substitutions for the specific embodiments described herein may be made by those skilled in the art without departing from the spirit of the invention or exceeding the scope of the invention as defined in the accompanying claims.
Claims (6)
1. A wafer test device comprises a device body, a tester arranged on the device body, and a probe card which is embedded into the top of the device body and is inverted, wherein the probe card is electrically connected with the tester, and the device body comprises:
a frame;
a first moving platform arranged at the lower part in the frame;
the lower microscope vision system and the wafer are arranged on the first moving platform, the lower microscope vision system is used for acquiring an image of the probe card, and the first moving platform can drive the lower microscope vision system and the wafer to linearly move along X, Y, Z directions;
and the second moving platform is arranged at the upper part in the frame, the upper microscope vision system is inverted on the second moving platform and is used for acquiring the image of the wafer below the upper microscope vision system, and the second moving platform can drive the upper microscope vision system to move linearly along the Y-axis or X-axis direction.
2. The wafer test apparatus of claim 1, wherein the first moving stage comprises: the X-axis motion module and the Z-axis motion module which are connected are sequentially stacked upwards,
the X-axis motion module comprises an X-axis drive assembly and an X-axis support plate for supporting the X-axis drive assembly, and the X-axis drive assembly is partially or completely embedded into the X-axis support plate;
the Z-axis motion module comprises a Z-axis drive assembly and a Z-axis connecting plate connected with the Z-axis drive assembly, and the X-axis drive assembly is fixedly connected with the Z-axis connecting plate and drives the Z-axis connecting plate to move linearly along the X-axis direction;
the Z-axis driving component is embedded into the X-axis supporting plate, and the embedding depth of the Z-axis driving component is greater than that of the X-axis driving component;
the lower microscope vision system is arranged on the Z-axis motion module.
3. The wafer test apparatus of claim 2, wherein the first moving platform further comprises a Y-axis motion module disposed below the X-axis motion module, the Y-axis motion module comprises a Y-axis driving assembly and a Y-axis supporting plate supporting the Y-axis driving assembly, the Y-axis driving assembly is fixedly connected to the X-axis supporting plate and drives the X-axis supporting plate to move linearly along a Y-axis direction, and the Y-axis driving assembly is partially or completely embedded in the Y-axis supporting plate.
4. The wafer test apparatus of claim 3, wherein the first motion stage further comprises: the rotary motion module is arranged on the Z-axis motion module, the wafer is arranged on the rotary motion module, and the rotary motion module can drive the wafer to rotate around the Z axis or a rotating shaft with a certain included angle with the Z axis.
5. The wafer test apparatus of claim 3,
the X-axis supporting plate is connected with the Y-axis supporting plate in a sliding manner through a sliding rail; or/and
the Z-axis connecting plate is connected with the X-axis supporting plate in a sliding mode through a sliding rail.
6. The wafer test apparatus as claimed in claim 1, wherein the second movable platform comprises two slide rails disposed along an X-axis or a Y-axis, and a slide plate slidably coupled to the slide rails across the slide rails, the upper microscope vision system being disposed on the slide plate.
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114878877A (en) * | 2022-06-02 | 2022-08-09 | 中国农业大学 | Probe card and wafer testing method |
| CN115069575A (en) * | 2022-05-31 | 2022-09-20 | 珠海市科迪电子科技有限公司 | Automatic test equipment for pressure sensor |
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2021
- 2021-07-06 CN CN202121522856.7U patent/CN215069899U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115069575A (en) * | 2022-05-31 | 2022-09-20 | 珠海市科迪电子科技有限公司 | Automatic test equipment for pressure sensor |
| CN114878877A (en) * | 2022-06-02 | 2022-08-09 | 中国农业大学 | Probe card and wafer testing method |
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