CN215375662U - Automatic needle aligning device for wafer - Google Patents

Abstract

The utility model provides an automatic wafer aligning device, which comprises: the device comprises an image acquisition component, a movement component, a data processing component, a wafer tray and a probe card, wherein the image acquisition component consists of a camera with a cross hair mark on the surface of a lens, the movement component carries out fixed value movement through a grating ruler, the wafer tray is used for bearing a wafer to be aligned, and the probe card is used for aligning the wafer to be aligned; the image acquisition assembly is used for acquiring images of the wafer tray, the probe card and the wafer to be aligned and transmitting the images to the data processing assembly; the data processing component is used for processing the received image data and calculating aiming parameters according to the data; the wafer tray is fixedly connected with the moving assembly, and the moving assembly drives the wafer tray to move. According to the utility model, wafer needle alignment is carried out in an image recognition and grating ruler positioning mode, and needle alignment in three directions of X direction, Y direction and Z direction can be simultaneously completed; the mounting difficulty and the needle alignment operation steps are reduced without the help of a calibration block; the alignment method is simple, the data processing is more accurate, and the alignment precision and efficiency are improved.

Description

Automatic needle aligning device for wafer

Technical Field

The utility model relates to the field of wafer processing, in particular to an automatic wafer aligning device.

Background

The wafer probe station is a device for supporting a tester to test the performance and quality of each chip of a wafer in the previous process of manufacturing a semiconductor chip, and is a necessary link for ensuring the manufacturing quality of the chip and reducing the manufacturing cost and loss. After the wafer is manufactured, a wafer testing stage is required, in which a tester is used to test each die on the chip by a probe station and a probe, the probe is used to make direct contact with a Pad on the die, so that the tester can directly input signals or output signals to the chip, and the testing parameters include a DC parameter and an AC parameter of the chip.

The existing wafer probe station mostly adopts test needle alignment, the probe card is preliminarily adjusted through the acquired wafer image, the test needle alignment is carried out, the needle mark condition of the test needle alignment is adjusted again, the test needle alignment is carried out again, the steps are repeated for many times until the needle mark is positioned at the center position of the pad on the wafer, and the needle alignment is completed. The needle aligning method has the disadvantages of complex operation and poor stability.

The utility model discloses a carry out accurate needle device and method of aiming at with the help of calibration piece has been proposed in utility model patent No. CN105486995B full-automatic probe station image positioning device and vision alignment method, and this method can realize the aiming at of higher accuracy, and it is too much nevertheless to relate to the formula, calculates too much, very easily produces the error because of calibration piece manufacturing accuracy or installation accuracy in the calculation process, influences the accuracy of aiming at the needle, reduces the efficiency of aiming at the needle.

SUMMERY OF THE UTILITY MODEL

The utility model provides a high-precision and high-efficiency automatic wafer needle aligning device without using a calibration block to overcome the defects of the wafer needle aligning method.

In order to achieve the purpose, the utility model adopts the following specific technical scheme:

an automatic wafer aligning device, comprising: the device comprises an image acquisition component, a movement component, a data processing component, a wafer tray and a probe card, wherein the image acquisition component consists of a camera with a cross hair mark on the surface of a lens, the movement component performs fixed-distance movement through a grating ruler, the wafer tray is used for bearing a wafer to be aligned, and the probe card is used for aligning the wafer to be aligned; the image acquisition assembly is used for acquiring images of the wafer tray, the probe card and the wafer to be aligned and transmitting the images to the data processing assembly; the data processing component is used for processing the received image data and calculating aiming parameters according to the data; the wafer tray is fixedly connected with the moving assembly, and the moving assembly drives the wafer tray to move.

Preferably, the image acquisition assembly comprises: a downward-looking camera, an upward-looking camera; the overlooking camera is fixed and does not change, is used as a reference camera, has a downward lens, and collects images of the wafer tray, the upward camera and the wafer to be aligned; the upward-looking camera is fixedly connected with the moving assembly, horizontally moves along with the wafer tray and serves as a calibration camera, a lens faces upwards, and images of the probe card and the upward-looking camera are acquired;

the overlooking camera comprises an overlooking camera low-power lens and an overlooking camera low-power CCD (charge coupled device) for low-power amplification, an overlooking camera high-power lens and an overlooking camera high-power CCD for high-power amplification and an overlooking camera lighting component; a downward looking camera illumination assembly providing downward looking camera work environment illumination;

the upward-looking camera comprises an upward-looking camera low-power lens for low-power amplification, an upward-looking camera high-power lens for high-power amplification, an upward-looking camera CCD, a lens switching separation sheet and an upward-looking camera lighting assembly; the low-power lens of the upward-looking camera and the high-power lens of the upward-looking camera share the CCD of the upward-looking camera, and the imaging lens is switched by the lens switching separation blade; the upward-looking camera lighting assembly provides upward-looking camera work environment lighting;

the lens surfaces of the downward-looking camera and the upward-looking camera are provided with cross-hair marks which are used as reference when the downward-looking camera and the upward-looking camera are aimed at each other and are also used for positioning objects in images acquired by the downward-looking camera and the upward-looking camera.

Preferably, the wafer automatic alignment device further comprises: the device comprises a base, a first bracket, a second bracket and a cover plate; the first bracket and the second bracket are fixed on the upper surface of the base; the first bracket is connected and fixed with the overlook camera; the probe card is fixed on the lower surface of the cover plate, and the second bracket is connected with the cover plate.

Preferably, the motion assembly comprises a horizontal motion device; the horizontal movement device includes: the X-direction sliding plate, the Y-direction sliding plate, the X-direction linear motor for driving the X-direction sliding plate, the Y-direction linear motor for driving the Y-direction sliding plate, the X-direction grating ruler for X-direction positioning and the Y-direction grating ruler for Y-direction positioning are arranged on the X-direction sliding plate;

the Y-direction sliding plate can slide in the Y direction through the matching of the Y-direction sliding rail and the Y-direction sliding block; the upper surface of the Y-direction sliding plate is provided with an X-direction sliding rail, the lower surface of the X-direction sliding plate is provided with an X-direction sliding block matched with the X-direction sliding rail, and the X-direction sliding plate can slide in the X direction through the matching of the X-direction sliding rail and the X-direction sliding block; the X-direction linear motor and the scale of the X-direction grating ruler are fixed on the upper surface of the Y-direction sliding plate, and the sensor of the X-direction grating ruler is fixed on the lower surface of the X-direction sliding plate; the Y-direction linear motor and the scale of the Y-direction grating scale are fixed on the upper surface of the base, and the sensor of the Y-direction grating scale is fixed on the lower surface of the Y-direction sliding plate.

Preferably, the motion assembly further comprises a Z-direction motion device; the Z-direction movement device comprises: a Z-direction base, a rotating element and a Z-direction moving element; the Z-direction base is fixed on the upper surface of the X-direction sliding plate; the rotating element is fixedly connected with the Z-direction base to drive the wafer tray to rotate around the central axis of the wafer tray; the upper surface of the Z-direction moving element is connected with and fixed with the wafer tray, and the lower surface of the Z-direction moving element is connected with and fixed with the upper surface of the Z-direction base to drive the wafer tray to move in the Z direction.

Preferably, the motion assembly further comprises an upward-looking camera stage; the upward-looking camera bearing table is fixed on the upper surface of the X-direction sliding plate, the upward-looking camera and the upward-looking camera bearing table are fixedly connected, and the upward-looking camera bearing table can move in the Z direction to drive the upward-looking camera to move in the Z direction.

Preferably, the Z-direction moving element includes: the device comprises a Z-direction moving plate, a Z-direction driving motor, a ball screw group, a driving toothed belt, a transmission toothed belt, a guide spline shaft group for limiting the moving direction of the Z-direction moving plate and a Z-direction grating ruler for Z-direction positioning; the Z-direction driving motor is fixed on the upper surface of the Z-direction base; the lead screw of each ball screw forming the ball screw group is perpendicular to the Z-direction base and is fixedly connected, and the nut is fixedly connected with the Z-direction moving plate; the shaft of each guide spline shaft forming the guide spline shaft group is vertical to the Z-direction base, is connected and fixed, and is connected with the Z-direction moving plate through a spline; the output end of the Z-direction driving motor is connected with a motor gear, each ball screw is connected with a screw gear, and one ball screw is connected with a driving gear; the motor gear and the driving gear are meshed with the driving toothed belt, and all the lead screw gears are meshed with the transmission toothed belt; the Z-direction driving motor drives the driving toothed belt to drive the driving gear, the ball screw connected with the driving gear drives the other ball screws to synchronously move through the transmission toothed belt, so that the Z-direction moving plate is driven to move in the Z direction, and the guide spline shaft group guides the moving direction of the Z-direction moving plate to ensure that the moving direction of the Z-direction moving plate is perpendicular to the Z-direction base; the scale of the Z-direction grating ruler is perpendicular to the Z-direction base and is fixedly connected, and the sensor is fixedly connected with the Z-direction moving plate.

Preferably, the rotating element comprises: the rotary element comprises a rotary driving motor, a rotary element screw rod, a rotary element base provided with a rotary element slide rail, a rotary element slide block matched with the rotary element slide rail and a rotary element connecting plate fixedly connected with a wafer tray; the rotating element base is fixed on the upper surface of the Z-direction base; the rotary driving motor is fixed on the rotary element base, and the rotary element lead screw is connected with the output end of the rotary driving motor; the upper surface of the rotating element sliding block is provided with two driving rods, and the rotating element connecting plate is arranged between the two driving rods and is abutted against the two driving rods; the rotating element sliding block is provided with a threaded hole which is matched with the rotating element lead screw; the rotary driving motor drives the rotary element screw to rotate, the rotary element sliding block is driven to slide along the rotary element sliding rail path, and the two driving rods on the rotary element sliding block drive the rotary element connecting plate and the wafer tray to rotate together.

Preferably, the upward camera carrier stage comprises: the device comprises an upward-looking camera bearing table base, an upward-looking camera bearing table driving motor, an upward-looking camera bearing table ball screw, an upward-looking camera bearing table sliding plate and an upward-looking camera bearing table grating ruler, wherein the side face of the upward-looking camera bearing table base is provided with an upward-looking camera bearing table sliding rail; the upward camera bearing table base is fixed on the upper surface of the X-direction sliding plate; the upward camera is fixedly connected with the upward camera bearing table sliding plate; the driving motor of the upward-looking camera bearing table is fixed on the upper surface of the upward-looking camera bearing table base; a lead screw of a ball screw of the upward-looking camera bearing table is perpendicular to a base of the upward-looking camera bearing table and is fixedly connected with the base, and a nut is fixedly connected with a sliding plate of the upward-looking camera bearing table; the upward-looking camera bearing table driving motor drives the upward-looking camera bearing table ball screw to rotate, drives the upward-looking camera bearing table sliding plate to slide along the upward-looking camera bearing table sliding rail path, and further drives the upward-looking camera to move in the Z direction; the scale of the upward camera bearing table grating ruler is perpendicular to the upward camera bearing table base and is fixedly connected, and the sensor is fixedly connected with the upward camera bearing table sliding plate.

The utility model can obtain the following technical effects:

(1) wafer needle alignment is carried out in an image recognition and grating ruler positioning mode, and needle alignment in the X direction, the Y direction and the Z direction can be completed simultaneously;

(2) the equipment is simple to use, only two cameras for image acquisition and the motion assembly are used, and a calibration block is not used, so that the installation difficulty and the needle alignment operation steps are reduced;

(3) the alignment method is simple, the data processing is more accurate, the alignment precision and efficiency are improved, and a feasible method is provided for realizing the full-automatic three-dimensional alignment of the wafer probe station.

Drawings

FIG. 1 is a front view of a schematic structural diagram according to an embodiment of the present invention;

FIG. 2 is a top view of a schematic diagram of a structure according to an embodiment of the utility model;

fig. 3 is a schematic structural diagram of a downward-looking camera according to an embodiment of the present invention;

FIG. 4 is a schematic diagram of a detailed structure of an upward-looking camera according to an embodiment of the present invention;

FIG. 5 is a schematic diagram of a detailed structure of a horizontal movement device according to an embodiment of the present invention;

fig. 6 is a schematic structural diagram of a Z-direction movement device and an upward camera carrying table according to an embodiment of the utility model.

Wherein the reference numerals include: an image acquisition assembly 1, a motion assembly 2, a wafer tray 3, a probe card 4, a base 5, a first support 6, a second support 7, a cover plate 8, a downward camera 11, an upward camera 12, a horizontal motion device 21, a Z-direction motion device 22, an upward camera plummer 23, a downward camera macro lens 111, a downward camera macro CCD112, a downward camera macro lens 113, a downward camera macro CCD114, a downward camera illumination assembly 115, an upward camera macro lens 121, an upward camera macro lens 122, an upward camera CCD123, a lens switching barrier 124, an upward camera illumination assembly 125, an X-direction sliding plate 211, a Y-direction sliding plate 212, an X-direction linear motor 213, a Y-direction linear motor 214, an X-direction grating scale 215, a Y-direction grating scale 216, an X-direction sliding rail 217, a Y-direction sliding rail 218, a Z-direction base 221, a Z-direction moving plate 2221, a Z-direction driving motor 2222, a ball screw group 2223, a driving toothed belt 4, 2222222224, a, Drive cog belt 2225, guide spline shaft group 2226, Z-direction grating scale 2227, rotary drive motor 2231, rotary element lead screw 2232, rotary element base 2233, rotary element slide rail 2234, rotary element slider 2235, rotary element connecting plate 2236, drive rod 2237, upward-looking camera plummer base 2241, upward-looking camera plummer drive motor 2242, upward-looking camera plummer ball lead screw 2243, upward-looking camera plummer slide rail 2244, upward-looking camera plummer sliding plate 2245, upward-looking camera plummer grating scale 2246.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be described in further detail below with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the utility model and are not to be construed as limiting the utility model.

As shown in fig. 1, the automatic wafer aligning device provided by the present invention includes an image collecting assembly 1 composed of a camera with a cross-hair mark on the surface of the lens, a moving assembly 2 for performing fixed-value movement through a grating scale, a data processing assembly, a wafer tray 3 for bearing a wafer to be aligned, and a probe card 4 for aligning the wafer to be aligned; the image acquisition assembly 1 acquires images of the wafer tray 3, the probe card 4 and a wafer to be aligned, transmits the acquired images to the data processing assembly, and the data processing assembly judges the positions of the wafer tray 3, the probe card 4 and the wafer to be aligned according to the acquired images through cross wire mark positioning to obtain position coordinates of the wafer tray 3, the probe card 4 and the wafer to be aligned; wafer tray 3 is connected fixedly with motion subassembly 2, drives wafer tray 3 through motion subassembly 2 and moves to each grating chi through motion subassembly 2 carries out accurate distance motion and to the accurate reading of moving distance.

As shown in fig. 2, in one embodiment of the present invention, the image capturing assembly 1 includes: a downward camera 11 and an upward camera 12; the overlooking camera 11 is fixed in position and does not change, is used as a reference camera with a downward lens and is used for acquiring images of the wafer tray 3, the upward camera 12 and a wafer to be aligned; the upward camera 12 is connected and fixed with the motion assembly 2, and moves horizontally along with the wafer tray 3 to serve as a calibration camera, and the lens faces upwards to acquire images of the probe card 4 and the upward camera 12.

As shown in fig. 3, the downward-looking camera 11 includes a downward-looking camera low power lens 111 and a downward-looking camera low power CCD112, and a downward-looking camera high power lens 113 and a downward-looking camera high power CCD114, and further includes a downward-looking camera lighting assembly 115; the low-power lens 111 and the low-power CCD112 of the overlook camera are used for low-power amplification, have a large visual field, are applied to primary positioning, and move an image component to be acquired to an acquisition position; the high-power lens 113 of the overlook camera and the high-power CCD114 of the overlook camera are used for high-power amplification, have small visual fields, are applied to accurate positioning, and carry out position judgment on an image component to be acquired; downward looking camera illumination assembly 115 provides illumination that maintains the downward looking camera 11 environment of operation.

As shown in fig. 4, the upward-view camera 12 includes an upward-view camera low power lens 121, an upward-view camera high power lens 122, an upward-view camera CCD123, a lens switching plate 124, and an upward-view camera illumination assembly 125; the low power lens 121 and the high power lens 122 of the upward-looking camera share the CCD123 of the upward-looking camera, so that the volume of the upward-looking camera 12 can be reduced, and the imaging lens is switched through the lens switching baffle 124; the low power lens 121 of the upward-looking camera is used for low power amplification, has a large visual field, is applied to primary positioning, and moves the upward-looking camera 12 to a collecting position; the high-power lens 122 of the upward-looking camera is used for high-power amplification, has a small visual field, is applied to precise positioning, and judges the position of an image component to be acquired; the upward-looking camera illumination assembly 125 provides illumination that maintains the operational environment of the upward-looking camera 12.

The lens surfaces of the downward-looking camera 11 and the upward-looking camera 12 are both provided with cross hair marks, and the cross hair marks are used as a reference when the downward-looking camera 11 and the upward-looking camera 12 aim at each other, when the cross hair marks of the lenses of the two cameras are overlapped, the main optical axes of the lenses of the two cameras are judged to be overlapped, the lens surfaces are also used for positioning an object in the images collected by the downward-looking camera 11 and the upward-looking camera 12, and the horizontal distance between the object in the images and the main optical axis of the lenses of the downward-looking camera 11 or the upward-looking camera 12 can be directly read according to the marks on the cross hair marks.

As shown in fig. 1, in one embodiment of the present invention, the present invention further includes a base 5, a first bracket 6, a second bracket 7, and a cover plate 8; the base 5 is used as a base for bearing the whole device; the first bracket 6 and the second bracket 7 are fixed on the upper surface of the base 4; the first bracket 6 is connected and fixed with the downward-looking camera 11, and the position of the downward-looking camera 11 is kept fixed; the probe card 4 is fixed on the lower surface of the cover plate 8, and the second bracket 7 is connected with the cover plate 8 to keep the position of the probe card 4 constant.

As shown in fig. 2, in one embodiment of the utility model, the movement assembly 2 comprises a horizontal movement device 21; as shown in fig. 5, the horizontal movement device 21 includes: an X-direction sliding plate 211, a Y-direction sliding plate 212, an X-direction linear motor 213 for driving the X-direction sliding plate 211, a Y-direction linear motor 214 for driving the Y-direction sliding plate 212, an X-direction linear scale 215 for X-direction positioning, and a Y-direction linear scale 216 for Y-direction positioning;

the upper surface of the base 4 is provided with Y-direction slide rails 218, the lower surface of the Y-direction sliding plate 212 is provided with Y-direction sliding blocks matched with the Y-direction slide rails 218, and the Y-direction sliding plate 212 can slide in the Y direction through the matching of the Y-direction slide rails 218 and the Y-direction sliding blocks; an X-direction sliding rail 217 is arranged on the upper surface of the Y-direction sliding plate 212, an X-direction sliding block matched with the X-direction sliding rail 217 is arranged on the lower surface of the X-direction sliding plate 211, and the X-direction sliding plate 211 can slide in the X direction through the matching of the X-direction sliding rail 217 and the X-direction sliding block; the X-direction linear motor 213 and the scale of the X-direction grating scale 215 are both fixed on the upper surface of the Y-direction sliding plate 212, and the sensor of the X-direction grating scale 215 is fixed on the lower surface of the X-direction sliding plate 211; the Y-direction linear motor 214 and the scale of the Y-direction grating 216 are fixed on the upper surface of the base 4, and the sensor of the Y-direction grating 216 is fixed on the lower surface of the Y-direction sliding plate 212; the Y-direction linear motor 214 drives the Y-direction sliding plate 212 to slide along the Y-direction sliding rail 218, and the Y-direction grating ruler 216 is used for performing accurate Y-direction distance-keeping movement and accurate reading of Y-direction moving distance; the X-direction linear motor 213 drives the X-direction sliding plate 211 to slide along the X-direction sliding rail 217, and perform precise X-direction distance-fixing movement and precise reading of the X-direction moving distance through the X-direction grating scale 215.

As shown in fig. 2, in one embodiment of the present invention, the motion assembly 2 further comprises a Z-motion device 22; as shown in fig. 6, the Z-direction movement device 22 includes: a Z-direction base 221, a rotating member, and a Z-direction moving member; the Z-direction base 221 is fixed to the upper surface of the X-direction sliding plate 211; the rotating element is fixedly connected with the Z-direction base 221 to drive the wafer tray 3 to rotate around the central axis of the wafer tray; the upper surface of the Z-direction moving element is connected with and fixed with the wafer tray 3, and the lower surface is connected with and fixed with the upper surface of the Z-direction base 211 to drive the wafer tray 3 to move in the Z direction.

As shown in fig. 6, the Z-direction moving element includes: a Z-direction moving plate 2221, a Z-direction driving motor 2222, a ball screw group 2223, a driving toothed belt 2224, a transmission toothed belt 2225, a guide spline shaft group 2226 for limiting the moving direction of the Z-direction moving plate, and a Z-direction grating scale 2227 for Z-direction positioning; the Z-direction driving motor 2222 is fixed to the upper surface of the Z-direction base 221; the lead screw of each ball screw constituting the ball screw group 2223 is perpendicular to the Z-direction base 221 and is fixedly connected to the Z-direction moving plate 2221; the shaft of each guide spline shaft constituting the guide spline shaft group 2226 is perpendicular to the Z-direction base 221, is fixedly connected, and is connected with the Z-direction moving plate 2221 through a spline; the output end of the Z-direction driving motor 2222 is connected with a motor gear, each ball screw is connected with a screw gear, and one ball screw is connected with a driving gear; the motor gear and the driving gear are both meshed with the driving toothed belt 2224, and all the lead screw gears are meshed with the driving toothed belt 2225; the Z-direction driving motor 2222 drives the driving toothed belt 2224 to drive the driving gear, the ball screw connected to the driving gear drives the remaining ball screws to move synchronously through the driving toothed belt 2225, so as to drive the Z-direction moving plate 2221 to move in the Z direction, and the guide spline shaft set 2226 guides the moving direction of the Z-direction moving plate 2221 to ensure that the moving direction of the Z-direction moving plate 2221 is perpendicular to the Z-direction base 221; the scale of the Z-directional grating 2227 is perpendicular to the Z-directional base 221 and is fixed, the sensor is fixed to the Z-directional moving plate 2221, and the Z-directional distance movement and the accurate reading of the Z-directional moving distance are performed by the Z-directional grating 2227.

As shown in fig. 6, the rotating member includes: a rotary drive motor 2231, a rotary element screw 2232, a rotary element base 2233 provided with a rotary element slide rail 2234, a rotary element slider 2235 fitted to the rotary element slide rail 2234, and a rotary element attachment plate 2236 fixedly connected to the wafer tray 3; a rotary member base 2233 fixed to the upper surface of the Z-base 221; a rotary driving motor 2231 is fixed on the rotary element base 2233, and a rotary element screw 2232 is connected with the output end of the rotary driving motor 2231; two driving rods 2237 are provided on the upper surface of the rotating element slider 2235, and the rotating element connecting plate 2236 is interposed between the two driving rods 2237 and abuts against the two driving rods 2237; the rotating element slide block 2235 is provided with a threaded hole which is matched with the rotating element screw rod 2232; the rotary driving motor 2231 drives the rotary element screw 2232 to rotate, so as to drive the rotary element slider 2235 to slide along the path of the rotary element slide rail 2234, and the two driving rods 2237 on the rotary element slider 2235 drive the rotary element connecting plate 2236 and the wafer tray 3, so that the linear movement of the rotary element slider 2235 is converted into the rotation of the rotary element connecting plate 2236, and the wafer tray 3 is driven to rotate.

As shown in fig. 2, in one embodiment of the utility model, the motion assembly 2 further comprises a bottom camera stage 23; as shown in fig. 6, the upward camera platform 23 is connected to the upward camera 12 and fixed on the upper surface of the X-direction sliding plate 211 to drive the upward camera 12 and the wafer tray 3 to move horizontally together, and the upward camera platform 23 can move in the Z direction to drive the upward camera 12 to move in the Z direction.

As shown in fig. 6, the bottom camera stage 23 includes: an upward-looking camera bearing table base 231 with an upward-looking camera bearing table slide rail 234 arranged on the side surface, an upward-looking camera bearing table driving motor 232, an upward-looking camera bearing table ball screw 233, an upward-looking camera bearing table slide plate 235 matched with the upward-looking camera bearing table slide rail 234, and an upward-looking camera bearing table grating ruler 236 for positioning the upward-looking camera 12 in the Z direction; the upward camera plummer base 231 is fixed on the upper surface of the X-direction sliding plate 211; the upward-looking camera 12 is fixedly connected with an upward-looking camera bearing table sliding plate 235; the upward camera stage driving motor 232 is fixed on the upper surface of the upward camera stage base 231; the lead screw of the upward camera bearing table ball lead screw 233 is perpendicular to the upward camera bearing table base 231 and is fixedly connected, and the nut is fixedly connected with the upward camera bearing table sliding plate 235; the upward camera plummer drive motor 232 drives the upward camera plummer ball screw 233 to rotate, drives the upward camera plummer sliding plate 235 to slide along the upward camera plummer sliding rail 234 path, and further drives the upward camera 12 to move in the Z direction; the scale of the upward camera plummer grating 236 is perpendicular to the upward camera plummer base 231 and is fixedly connected, the sensor is fixedly connected with the upward camera plummer sliding plate 235, and the accurate Z-direction fixed-distance movement of the upward camera 12 and the accurate reading of the Z-direction moving distance of the upward camera 12 are carried out through the upward camera plummer grating 236.

The working flow of the utility model is described in detail below with reference to fig. 1, 2, 5, and 6:

(1) adjusting a horizontal movement device 21, moving the wafer tray 3 to a position right below the overlooking camera 11, adjusting a Z-direction movement device 22 to make an image of a wafer to be aligned on the wafer tray 3 observed by the overlooking camera 11 be clearest, and recording a Z-direction movement distance of the wafer tray 3 at the moment through a Z-direction grating scale 2227, wherein the Z-direction movement distance is recorded as Z1;

(2) adjusting the horizontal movement device 21 to move the upward camera 12 to a position right below the downward camera 11, adjusting the upward camera carrying table 23 to make the image observed by the upward camera 12 through the downward camera 11 clearest, and recording the Z-direction movement distance of the upward camera 12 at the moment through a grating ruler 236 of the upward camera carrying table, which is recorded as Z2;

(3) measuring the height distance between the wafer to be aligned and the upward camera 12 at the moment by the upward camera plummer 236, and marking as Z3, observing the needle on the probe card 4 by the upward camera 12, calculating the Z-direction distance between the upward camera and the needle, and marking as Z4, and calculating the Z-direction distance between the wafer to be aligned and the needle, and marking as Z5, by Z1-Z4;

(4) adjusting the horizontal movement device 21 to enable the wafer tray 3 to enter the visual field of the overlook camera 11, establishing a horizontal coordinate system by taking the intersection point of the main optical axis of the overlook camera 11 and a horizontal plane as an origin, calculating the central position (X1 and Y1) of the wafer tray 3 at the moment, adjusting the horizontal movement device 21 to enable the upward camera 12 to enter the visual field of the overlook camera 11, calculating the main optical axis position (X2 and Y2) of the upward camera 12 at the moment, wherein the horizontal distance between the center of the wafer tray 3 and the main optical axis of the upward camera 12 is a fixed value, the X-direction distance is recorded as X3, the Y-direction distance is recorded as Y3, and calculating the central position (X4 and Y4) of the wafer tray at the moment;

(5) adjusting the horizontal movement device 21 to align the main optical axis of the upward camera 12 with the needles on the probe card 4, recording an X-direction movement distance of X5 through the X-direction grating scale 215, and recording a Y-direction movement distance of Y5 through the Y-direction grating scale 216, and obtaining the horizontal distance between the center of the wafer tray 3 and the needles through calculation, wherein the X-direction distance is recorded as X6, and the Y-direction distance is recorded as Y6;

(6) placing a wafer to be aligned on the upper surface of a wafer tray 3, determining the horizontal distance between the center of the wafer tray 3 and the center of the wafer to be aligned by a top-view camera 11, wherein the X-direction distance is X7, the Y-direction distance is Y7, calculating to obtain the horizontal distance between the center of the wafer to be aligned and a needle, the X-direction distance is X8, the Y-direction distance is Y8, calculating to obtain the horizontal distance between a pad point on the upper surface of the wafer and the needle by the given horizontal distances between the center of the wafer to be aligned and the pad point on the upper surface of the wafer and X9 and Y9, the X-direction distance is X10, and the Y-direction distance is Y10;

(7) the data processing assembly controls the horizontal moving device 21 and the Z-direction moving device 22 to move through the X10, Y10 and Z5 obtained in the steps, so that the pad point on the upper surface of the wafer is contacted with the needle, and needle alignment is completed.

In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the utility model. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.

While embodiments of the present invention have been shown and described above, it should be understood that the above embodiments are exemplary and should not be taken as limiting the utility model. Variations, modifications, substitutions and alterations of the above-described embodiments may be made by those of ordinary skill in the art without departing from the scope of the present invention.

The above embodiments of the present invention should not be construed as limiting the scope of the present invention. Any other corresponding changes and modifications made according to the technical idea of the present invention should be included in the protection scope of the claims of the present invention.

Claims (9)

1. An automatic wafer aligning device, comprising: the probe card comprises an image acquisition component, a movement component, a data processing component, a wafer tray and a probe card, wherein the image acquisition component consists of a camera with a cross hair mark on the surface of a lens, the movement component measures the movement distance through a grating ruler, the wafer tray is used for bearing a wafer to be aligned, and the probe card is aligned with the wafer to be aligned; the image acquisition assembly is used for acquiring images of the wafer tray, the probe card and the wafer to be aligned and transmitting the images to the data processing assembly; the data processing component is used for processing the received image data and calculating aiming parameters according to the data; the wafer tray is fixedly connected with the moving assembly, and the moving assembly drives the wafer tray to move.

2. The wafer automatic pin aligning apparatus of claim 1, wherein the image capturing assembly comprises: a downward-looking camera, an upward-looking camera; the overlooking camera is fixed and does not change, is used as a reference camera, has a downward lens, and collects images of the wafer tray, the upward looking camera and the wafer to be aligned; the upward-looking camera is fixedly connected with the moving assembly, horizontally moves along with the wafer tray and serves as a calibration camera, a lens faces upwards, and images of the probe card and the upward-looking camera are acquired;

the overlooking camera comprises an overlooking camera low-power lens and an overlooking camera low-power CCD (charge coupled device) for low-power amplification, an overlooking camera high-power lens and an overlooking camera high-power CCD for high-power amplification, and an overlooking camera lighting assembly; the overhead camera illumination assembly provides the overhead camera work environment illumination;

the upward-looking camera comprises an upward-looking camera low-power lens for low-power amplification, an upward-looking camera high-power lens for high-power amplification, an upward-looking camera CCD, a lens switching separation sheet and an upward-looking camera lighting assembly; the low-power lens of the upward-looking camera and the high-power lens of the upward-looking camera share the CCD of the upward-looking camera, and the imaging lens is switched by the lens switching separation blade; the upward-looking camera illumination assembly provides the upward-looking camera work environment illumination;

the lens surfaces of the top view camera and the bottom view camera are provided with cross hair marks which are used as reference when the top view camera and the bottom view camera are aimed at each other and are also used for positioning objects in images acquired by the top view camera and the bottom view camera.

3. The wafer automatic pin aligning apparatus of claim 2, further comprising: the device comprises a base, a first bracket, a second bracket and a cover plate; the first bracket and the second bracket are fixed on the upper surface of the base; the first support is connected and fixed with the overlook camera; the probe card is fixed on the lower surface of the cover plate, and the second bracket is connected with the cover plate.

4. The wafer automatic pin aligning apparatus of claim 3, wherein the motion assembly comprises a horizontal motion device; the horizontal movement device includes: the X-direction sliding plate, the Y-direction sliding plate, the X-direction linear motor for driving the X-direction sliding plate, the Y-direction linear motor for driving the Y-direction sliding plate, the X-direction grating ruler for X-direction positioning and the Y-direction grating ruler for Y-direction positioning are arranged on the X-direction sliding plate;

the Y-direction sliding plate can slide in the Y direction through the matching of the Y-direction sliding rail and the Y-direction sliding block; the upper surface of the Y-direction sliding plate is provided with an X-direction sliding rail, the lower surface of the X-direction sliding plate is provided with an X-direction sliding block matched with the X-direction sliding rail, and the X-direction sliding plate can slide in the X direction through the matching of the X-direction sliding rail and the X-direction sliding block; the X-direction linear motor and the scale of the X-direction grating ruler are fixed on the upper surface of the Y-direction sliding plate, and the sensor of the X-direction grating ruler is fixed on the lower surface of the X-direction sliding plate; the Y-direction linear motor and the scale of the Y-direction grating scale are fixed on the upper surface of the base, and the sensor of the Y-direction grating scale is fixed on the lower surface of the Y-direction sliding plate.

5. The wafer automatic targeting device of claim 4 wherein said motion assembly further comprises a Z-motion device; the Z-direction movement device comprises: a Z-direction base, a rotating element and a Z-direction moving element; the Z-direction base is fixed on the upper surface of the X-direction sliding plate; the rotating element is fixedly connected with the Z-direction base and drives the wafer tray to rotate around a self central shaft; the upper surface of the Z-direction moving element is fixedly connected with the wafer tray, and the lower surface of the Z-direction moving element is fixedly connected with the upper surface of the Z-direction base to drive the wafer tray to move in the Z direction.

6. The wafer automatic pin aligning apparatus of claim 4, wherein the motion assembly further comprises a bottom view camera stage; the upward-looking camera bearing table is fixed on the upper surface of the X-direction sliding plate, the upward-looking camera and the upward-looking camera bearing table are fixedly connected, and the upward-looking camera bearing table can move in the Z direction to drive the upward-looking camera to move in the Z direction.

7. The wafer automatic probe aligning apparatus of claim 5, wherein the Z-direction moving element comprises: the device comprises a Z-direction moving plate, a Z-direction driving motor, a ball screw group, a driving toothed belt, a transmission toothed belt, a guide spline shaft group for limiting the moving direction of the Z-direction moving plate and a Z-direction grating ruler for Z-direction positioning; the Z-direction driving motor is fixed on the upper surface of the Z-direction base; the lead screw of each ball screw forming the ball screw group is perpendicular to the Z-direction base and is fixedly connected, and the nut is fixedly connected with the Z-direction moving plate; the shaft of each guide spline shaft forming the guide spline shaft group is perpendicular to the Z-direction base, is fixedly connected with the Z-direction moving plate and is connected with the Z-direction moving plate through a spline; the output end of the Z-direction driving motor is connected with a motor gear, each ball screw is connected with a screw gear, and one ball screw is connected with a driving gear; the motor gear and the driving gear are meshed with the driving toothed belt, and all the lead screw gears are meshed with the transmission toothed belt; the Z-direction driving motor drives the driving toothed belt to drive the driving gear, the ball screw connected with the driving gear drives the rest ball screws to synchronously move through the transmission toothed belt, so that the Z-direction moving plate is driven to move in the Z direction, and the guide spline shaft group guides the moving direction of the Z-direction moving plate to ensure that the moving direction of the Z-direction moving plate is perpendicular to the Z-direction base; and the scale of the Z-direction grating ruler is perpendicular to the Z-direction base and is fixedly connected, and the sensor is fixedly connected with the Z-direction moving plate.

8. The wafer automatic pin aligning apparatus of claim 5, wherein the rotating element comprises: the rotary element comprises a rotary driving motor, a rotary element screw rod, a rotary element base provided with a rotary element slide rail, a rotary element slide block matched with the rotary element slide rail and a rotary element connecting plate fixedly connected with the wafer tray; the rotating element base is fixed on the upper surface of the Z-direction base; the rotary driving motor is fixed on the rotary element base, and the rotary element lead screw is connected with the output end of the rotary driving motor; the upper surface of the rotating element sliding block is provided with two driving rods, and the rotating element connecting plate is arranged between the two driving rods and is abutted against the two driving rods; the rotating element sliding block is provided with a threaded hole which is matched with the rotating element lead screw; the rotary driving motor drives the rotary element lead screw to rotate, the rotary element sliding block is driven to slide along the rotary element sliding rail path, and the two driving rods on the rotary element sliding block drive the rotary element connecting plate and the wafer tray to rotate together.

9. The wafer automatic pin aligning apparatus of claim 6, wherein the upward camera stage comprises: the device comprises an upward-looking camera bearing table base, an upward-looking camera bearing table driving motor, an upward-looking camera bearing table ball screw, an upward-looking camera bearing table sliding plate and an upward-looking camera bearing table grating ruler, wherein the side face of the upward-looking camera bearing table base is provided with an upward-looking camera bearing table sliding rail; the upward camera bearing table base is fixed on the upper surface of the X-direction sliding plate; the upward camera is fixedly connected with the upward camera bearing table sliding plate; the upward camera bearing table driving motor is fixed on the upper surface of the upward camera bearing table base; a lead screw of the upward camera bearing table ball lead screw is perpendicular to the upward camera bearing table base and is fixedly connected, and a nut is fixedly connected with the upward camera bearing table sliding plate; the upward-looking camera bearing table driving motor drives the upward-looking camera bearing table ball screw to rotate, drives the upward-looking camera bearing table sliding plate to slide along the upward-looking camera bearing table sliding rail path, and further drives the upward-looking camera to move in the Z direction; the scale of the upward camera bearing table grating ruler is perpendicular to the upward camera bearing table base and is fixedly connected, and the sensor is fixedly connected with the upward camera bearing table sliding plate.

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