CN220961115U - Particle testing equipment for wafer box - Google Patents
Particle testing equipment for wafer box Download PDFInfo
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- CN220961115U CN220961115U CN202322735709.3U CN202322735709U CN220961115U CN 220961115 U CN220961115 U CN 220961115U CN 202322735709 U CN202322735709 U CN 202322735709U CN 220961115 U CN220961115 U CN 220961115U
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- clamping
- wafer box
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- wafer cassette
- driving
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- 238000012360 testing method Methods 0.000 title claims abstract description 54
- 239000002245 particle Substances 0.000 title claims abstract description 25
- 230000007246 mechanism Effects 0.000 claims abstract description 16
- 239000007788 liquid Substances 0.000 claims abstract description 14
- 230000002093 peripheral effect Effects 0.000 claims description 4
- 239000012535 impurity Substances 0.000 abstract description 2
- 235000012431 wafers Nutrition 0.000 description 108
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 239000012085 test solution Substances 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000003749 cleanliness Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model relates to a particle testing device for a wafer box, wherein a testing liquid is filled in the wafer box, and the testing device comprises: a frame; a reversing mechanism; and a rotating mechanism. According to the utility model, through successive reversing and rotation of the wafer box, the flow path of the test liquid in the wafer box can be ensured to cover the whole inner wall of the wafer box, so that impurity particles on the inner wall of the wafer box are ensured to be fully flushed into the test liquid, and the accuracy of a test result is effectively improved.
Description
Technical Field
The utility model belongs to the field of semiconductor equipment, and particularly relates to particle testing equipment for a wafer box.
Background
As is well known, a wafer refers to a silicon wafer used for manufacturing a silicon semiconductor integrated circuit, and is called a wafer because the wafer has a circular shape; various circuit element structures can be fabricated on a silicon wafer to form an IC product with specific electrical functions.
Currently, wafers are typically stored side-by-side within a wafer cassette to facilitate storage, transfer, and loading and unloading of wafers between processing steps. The existing closed wafer box comprises a base and an upper cover, when the upper cover is opened, wafers can be placed on the base piece by piece through a mechanical arm or manually, and after the wafers on the base are fully stored, the upper cover is covered again and the wafers are closed in the wafer box. Meanwhile, in order to ensure that the cleanliness of the wafer box meets the use requirement, the wafer box needs to be subjected to particle testing at regular intervals, and in the conventional particle testing, the adopted particle testing equipment generally comprises a clamping unit and a shaking device, wherein the clamping unit comprises a placing seat, a plurality of fixing arms and clamping arms, the fixing arms are arranged on the placing seat, the wafer box is placed on the placing seat, the wafer box and the placing seat are relatively fixed by the plurality of fixing arms in the circumferential direction, and the clamping arms are clamped on two opposite sides of the wafer box; the shaking device is connected with the placing seat and used for driving the placing seat to shake left and right so that water in the wafer box flows through each inner wall of the wafer box. During testing, water is injected into the empty wafer box, then the empty wafer box is clamped and fixed through the clamping unit, the wafer box is shaken through the shaking device, particles on the inner wall of the box are fully fused into water, and finally the particle quantity in the water is detected.
However, in the actual working process, by means of shaking the wafer box left and right, it is difficult to ensure that the water flow can cover all the inner walls of the wafer box (especially the inner wall at the top of the wafer box), so that the test result is inaccurate.
Disclosure of Invention
The utility model aims to overcome the defects of the prior art and provide improved particle testing equipment for a wafer box.
In order to solve the technical problems, the utility model adopts the following technical scheme:
Particle test equipment that wafer box was used has annotated the test solution in the wafer box, and test equipment includes: the rack is provided with a gas purifying area, a testing area and an installing area which are sequentially communicated from top to bottom; the reversing mechanism comprises a positioning seat arranged in the test area, a rotary power piece for driving the positioning seat to rotate around a central line in the vertical direction, and a lifting power piece for driving the positioning seat to move up and down, wherein the wafer box is placed on the positioning seat and can synchronously rotate along with the positioning seat to sequentially reverse; the rotating mechanism comprises a clamping unit and a rotating power piece, wherein the clamping unit is used for clamping and loosening the wafer box positioned on the positioning seat, and during clamping, the rotating power piece is used for driving the clamping unit and driving the wafer box to rotate around a horizontal central line, and along with the rotation of the wafer box around the vertical central line and the horizontal central line respectively, a flow path formed by the testing liquid in the wafer box covers the inner wall of the whole wafer box.
Preferably, each time the direction is reversed, the rotary power member drives the wafer cassette to rotate about the vertical centerline by an angle of 90 °, and each time the direction is reversed, the rotary power member drives the wafer cassette to rotate about the horizontal centerline by an angle of 180 °.
Preferably, the positioning seat forms a positioning surface extending horizontally from the top surface, the wafer box is placed on the positioning surface, and in the orthographic projection in the vertical direction, the peripheral edges of the wafer box are exposed out of the positioning seat.
Preferably, the positioning seat is provided with a plurality of positioning modules, and when the wafer box is placed on the positioning surface, the plurality of positioning modules are propped against the periphery of the bottom of the wafer box.
Preferably, the clamping unit comprises a plurality of clamping arms distributed around the periphery of the positioning seat and a driving component synchronously connected with the clamping arms, wherein the clamping arms respectively comprise an upper clamping part, a lower clamping part and a side clamping part, wherein the upper clamping part and the lower clamping part are arranged at intervals up and down, and the side clamping part is connected between the upper clamping part and the lower clamping part; the upper clamping part, the lower clamping part and the side clamping parts are integrally formed. The wafer box is only required to be placed on the positioning seat, and the clamping and the loosening are automatically realized along with the relative movement of the clamping arms, so that the movement of the wafer box has no precision requirement, and the problem of damage caused by collision of the wafer box is avoided.
Preferably, the clamping surfaces formed by each upper clamping part and the lower clamping part are matched with the top surface and the bottom surface of the wafer box respectively, and the driving part drives the clamping arms to horizontally move so as to clamp or unclamp the wafer box. Here, the unification of the positioning reference in the height direction is ensured, so that the clamping arm can clamp or unclamp the wafer cassette conveniently.
Preferably, the clamping arms are four, wherein each two adjacent side walls of the wafer box correspond to one clamping arm, and when clamping, the side clamping part of each clamping arm synchronously abuts against two adjacent side surfaces of the wafer box.
Preferably, each side clamping part comprises a first split body and a second split body which are vertically connected, wherein clamping surfaces formed by the first split body and the second split body are respectively parallel to two adjacent side surfaces of the wafer box. Here, the side clamping portion can be bonded to the side surface of the wafer cassette during clamping, and thus deformation of the wafer cassette during clamping can be reduced.
Preferably, the left-right direction is defined as an X axis, the front-back direction is defined as a Y axis, the up-down direction is defined as a Z axis, the driving part comprises a first driving part and a second driving part which are arranged on two opposite sides of the positioning seat in the X axis direction, wherein the first driving part and the second driving part are respectively connected with the two clamping arms and respectively drive the corresponding clamping arms to reciprocate along the X axis and the Y axis direction.
Preferably, the first driving piece and the second driving piece are symmetrically arranged, wherein the first driving piece comprises a first power frame and a second power frame which is arranged on the first power frame and is connected with two clamping arms, and the first power frame reciprocates along the X-axis direction; the second power frame drives the two corresponding clamping arms to move close to or away from each other along the Y-axis direction; the rotary power piece is connected with the second power frame and is used for driving the second power frame to rotate.
Due to the implementation of the technical scheme, compared with the prior art, the utility model has the following advantages:
In the test equipment in the prior art, by means of shaking the wafer box left and right, it is difficult to ensure that water flows can fully cover all inner walls of the wafer box (especially the inner wall at the top of the wafer box), so that a test result is inaccurate; the utility model skillfully solves the defects of the prior art by integrally designing the structure of the particle testing equipment, adopts the testing equipment, places the wafer box filled with the testing liquid on the positioning seat, and drives the positioning seat to avoid the wafer box downwards after being clamped by the clamping unit, and drives the wafer box to rotate around the horizontal central line by the rotating power piece so as to enable the testing liquid to flow in the wafer box; then the lifting power piece drives the positioning seat to upwards continuously prop the wafer box, the clamping unit loosens the wafer box, the wafer box is driven by the rotating power piece to rotate around the vertical central line to realize the direction change, and the actions are repeated until a flow path formed by the test liquid in the wafer box covers the inner wall of the whole wafer box.
Drawings
FIG. 1 is a schematic perspective view of a particle testing apparatus for a wafer cassette of the present utility model;
FIG. 2 is a schematic perspective view of a rotating mechanism and a reversing mechanism;
FIG. 3 is an exploded view of the structure of FIG. 2;
Wherein: ①, a frame; q 1, a gas purifying area; q2, test area; q3, an installation area;
② . A reversing mechanism; 1. a positioning seat; m, locating surface; 10. a positioning module; d1, rotating a power piece; d2, lifting the power piece;
③ . A rotating mechanism; a1, a clamping unit; 2. a clamp arm; 20. an upper clamping part; 21. a lower clamping part; 22. a side clamping part; 221. a first split; 222. a second split; 3. a driving part; 31. a first driving member; 311. a first power rack; 312. a second power rack; 32. a second driving member; g. a straight line cylinder; a2, rotating the power piece;
H. a wafer cassette.
Detailed Description
In order that the above objects, features and advantages of the application will be readily understood, a more particular description of the application will be rendered by reference to the appended drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application. The present application may be embodied in many other forms than described herein and similarly modified by those skilled in the art without departing from the spirit of the application, whereby the application is not limited to the specific embodiments disclosed below.
In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present application and simplifying the description, and do not indicate or imply that the device or element being referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present application.
Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In the description of the present application, the meaning of "plurality" means at least two, for example, two, three, etc., unless specifically defined otherwise.
In the present application, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art according to the specific circumstances.
In the present application, unless expressly stated or limited otherwise, a first feature "up" or "down" a second feature may be the first and second features in direct contact, or the first and second features in indirect contact via an intervening medium. Moreover, a first feature being "above," "over" and "on" a second feature may be a first feature being directly above or obliquely above the second feature, or simply indicating that the first feature is level higher than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely below the second feature, or simply indicating that the first feature is less level than the second feature. It will be understood that when an element is referred to as being "fixed" or "disposed" on another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like are used herein for illustrative purposes only and are not meant to be the only embodiment.
As shown in fig. 1 to 3, the particle testing apparatus for a wafer cassette of the present embodiment includes a frame ①, a reversing mechanism ②, and a rotating mechanism ③. The wafer cassette H of this embodiment is a closed wafer cassette, and is set to be a cuboid based on the top horizontal plane, the bottom horizontal plane, and the outermost surfaces of the peripheral side walls of the wafer cassette H, and defines the left-right direction as the X-axis, the front-rear direction as the Y-axis, and the up-down direction as the Z-axis, and the test solution is injected into the wafer cassette H during the test.
Specifically, the rack ① is provided with a gas purifying area q1, a testing area q2 and a mounting area q3 which are sequentially communicated from top to bottom, wherein the gas purifying area q1 is provided with a gas purifier for purifying the air in the inner cavity of the whole rack; test area q2 set by reversing mechanism ② and rotating mechanism ③; the mounting region q3 is used for mounting various kinds of electric components.
In this example, the reversing mechanism ② includes a positioning seat 1, a rotating power member D1 for driving the positioning seat 1 to rotate around a center line in a vertical direction, and a lifting power member D2 for driving the positioning seat 1 to move up and down, where the wafer cassette H is placed on the positioning seat 1 and can rotate synchronously with the positioning seat 1 to sequentially reverse.
Specifically, the positioning seat 1 forms a positioning surface m extending horizontally from the top surface, and when the wafer box H is placed on the positioning surface m, in the orthographic projection in the vertical direction, the peripheral edges of the wafer box H are exposed out of the positioning seat 1.
Meanwhile, four positioning modules 10 are arranged on the positioning seat 1, and when the wafer box H is placed on the positioning surface m, the four positioning modules 10 correspondingly lean against the periphery of the narrower part at the bottom of the wafer box H; the rotary power member D1 and the lifting power member D2 are both conventional power members.
In this example, the rotating mechanism ③ includes a clamping unit A1 and a rotating power member A2, where the clamping unit A1 is used to clamp and unclamp the wafer cassette H located on the positioning seat 1, and during clamping, the rotating power member A2 is used to drive the clamping unit A1 and drive the wafer cassette H to rotate around a horizontal center line, and along with the wafer cassette H to rotate around the vertical and horizontal center lines, respectively, a flow path formed by the test solution in the wafer cassette H covers the inner wall of the entire wafer cassette H.
Specifically, the clamping unit A1 includes four clamping arms 2 distributed around the circumference of the positioning seat 1, and a driving part 3 synchronously connected with the four clamping arms 2.
The four clamping arms 2 respectively comprise an upper clamping part 20, a lower clamping part 21 and a side clamping part 22, wherein the upper clamping part 20 and the lower clamping part 21 are arranged at intervals up and down, and the side clamping part 22 is connected between the upper clamping part 20 and the lower clamping part 21.
Specifically, each two adjacent side walls of the wafer box H correspond to one clamping arm 2, and when clamping, the side clamping part 22 of each clamping arm 2 is synchronously abutted against two adjacent side surfaces of the wafer box H; the clamping surfaces formed by each upper clamping part 20 and each lower clamping part 21 are respectively matched with the top surface and the bottom surface of the wafer box H, and the driving part 3 drives the four clamping arms 2 to horizontally move so as to clamp or unclamp the wafer box H; each side clamping part 22 comprises a first split 221 and a second split 222 which are vertically connected, wherein the clamping surfaces formed by the first split 221 and the second split 222 are respectively parallel to the adjacent two side surfaces of the wafer box H; the upper clamping portion 20, the lower clamping portion 21, and the side clamping portion 22 are integrally formed.
In this example, the driving part 3 includes a first driving member 31 and a second driving member 32 disposed on opposite sides of the positioning seat 1 in the X-axis direction, wherein the first driving member 31 and the second driving member 32 are respectively connected to two clamp arms 2 disposed at intervals side by side in the Y-axis direction, and respectively drive the corresponding clamp arms 2 to reciprocate along the X-axis and the Y-axis directions.
Specifically, the first driving member 31 and the second driving member 32 are symmetrically disposed, and the structure of the first driving member 31 will be described below, so that the structure of the second driving member 32 will be apparent.
The first driving member 31 includes a first power frame 311, a second power frame 312 provided on the first power frame 311 and connected to the two clamp arms 2, wherein the first power frame 311 reciprocates along the X-axis direction; the second power frame 312 drives the corresponding two clip arms 2 to move toward or away from each other in the Y-axis direction. In some embodiments, the first power frame 311 and the second power frame 312 are each driven by a linear cylinder g.
Further, the rotary power member A2 is connected to the second power frame 312 and is configured to drive the second power frame 312 to rotate about the center line in the X-axis direction.
In summary, the test equipment is adopted, the wafer box filled with the test liquid is placed on the positioning seat, after the wafer box is clamped by the clamping unit, the lifting power piece drives the positioning seat to avoid the wafer box downwards, and the wafer box is driven to rotate around the horizontal center line by the rotating power piece so that the test liquid flows in the wafer box; then the lifting power piece drives the positioning seat to upwards continuously prop the wafer box, the clamping unit loosens the wafer box, the wafer box is driven by the rotating power piece to rotate around the vertical central line so as to realize the direction change, and the actions are repeated until a flow path formed by the test liquid in the wafer box covers the inner wall of the whole wafer box, so that compared with the prior art, the utility model can ensure that the flow path of the test liquid in the wafer box covers the inner wall of the whole wafer box through the successive direction change and the rotation of the wafer box, thereby ensuring that impurity particles on the inner wall of the wafer box are fully flushed into the test liquid, and effectively improving the accuracy of the test result; on the other hand, the wafer box is only required to be placed on the positioning seat, clamping and loosening are automatically realized along with the relative movement of the clamping arms, no precision requirement is required for the movement of the wafer box, the problem of damage caused by collision of the wafer box is avoided, the structure is simple, the operation is convenient, and the use cost is low; in the third aspect, unification of positioning references in the height direction is ensured, so that clamping arms can clamp or unclamp the wafer box conveniently; in the fourth aspect, the side clamping portion can be bonded to the side surface of the wafer cassette during clamping, and thus deformation of the wafer cassette during clamping can be reduced.
The present utility model has been described in detail with the purpose of enabling those skilled in the art to understand the contents of the present utility model and to implement the same, but not to limit the scope of the present utility model, and all equivalent changes or modifications made according to the spirit of the present utility model should be included in the scope of the present utility model.
Claims (10)
1. Particle test equipment that wafer box was used has annotated test liquid in the wafer box, its characterized in that, test equipment includes:
The rack is provided with a gas purifying area, a testing area and an installing area which are sequentially communicated from top to bottom;
The reversing mechanism comprises a positioning seat arranged in the test area, a rotary power piece for driving the positioning seat to rotate around a central line in the vertical direction, and a lifting power piece for driving the positioning seat to move up and down, wherein the wafer box is placed on the positioning seat and can synchronously rotate along with the positioning seat to sequentially reverse;
The rotating mechanism comprises a clamping unit and a rotating power piece, wherein the clamping unit is used for clamping and loosening the wafer box positioned on the positioning seat, the rotating power piece is used for driving the clamping unit and driving the wafer box to rotate around a horizontal central line during clamping, and along with the rotation of the wafer box around the vertical central line and the horizontal central line respectively, a flow path formed by the testing liquid in the wafer box covers the whole inner wall of the wafer box.
2. The particle testing apparatus of claim 1, wherein the rotational power member urges the wafer cassette to rotate about a vertical centerline by an angle of 90 ° each time a direction is reversed, and wherein the rotational power member urges the wafer cassette to rotate about a horizontal centerline by an angle of 180 ° each time a direction is reversed.
3. The particle testing apparatus of claim 1, wherein the positioning base forms a horizontally extending positioning surface from a top surface, the wafer cassette is placed on the positioning surface, and in a vertical orthographic projection, peripheral edges of the wafer cassette are exposed to the positioning base.
4. The particle testing apparatus of claim 3, wherein the positioning base has a plurality of positioning modules thereon, and the plurality of positioning modules abut against the periphery of the bottom of the wafer cassette when the wafer cassette is placed on the positioning surface.
5. The particle testing apparatus for a wafer cassette of claim 3, wherein the clamping unit comprises a plurality of clamping arms distributed around the circumference of the positioning seat, and a driving member synchronously connected with the plurality of clamping arms, wherein the plurality of clamping arms respectively comprise an upper clamping part and a lower clamping part which are arranged at an upper and a lower intervals, and a side clamping part connected between the upper clamping part and the lower clamping part, and when clamping, the upper clamping part, the lower clamping part and the side clamping part of each clamping arm correspondingly and synchronously collide on the top, the bottom and the side wall of the wafer cassette; the upper clamping part, the lower clamping part and the side clamping parts are integrally formed.
6. The particle testing apparatus according to claim 5, wherein each of the upper clamping portions and the lower clamping portions form clamping surfaces respectively matched with the top and bottom surfaces of the wafer cassette, and the driving member drives the plurality of clamping arms to move horizontally to clamp or unclamp the wafer cassette.
7. The particle testing apparatus of claim 5, wherein there are four clamping arms, wherein each adjacent two side walls of the wafer cassette correspond to one of the clamping arms, and the side clamping portion of each clamping arm simultaneously abuts against the adjacent two side walls of the wafer cassette when clamping.
8. The particle testing apparatus of claim 6, wherein each of the side clamping portions comprises a first split and a second split vertically connected, wherein clamping surfaces formed by the first split and the second split are respectively parallel to adjacent two sides of the wafer cassette.
9. The apparatus according to claim 5, wherein the X-axis is defined as a right-left direction, the Y-axis is defined as a front-rear direction, and the Z-axis is defined as a top-bottom direction, the driving unit includes a first driving member and a second driving member disposed on opposite sides of the positioning base in the X-axis direction, wherein the first driving member and the second driving member are respectively connected to the two chuck arms, and respectively drive the corresponding chuck arms to reciprocate along the X-axis and the Y-axis directions.
10. The particle testing apparatus for a wafer cassette of claim 9, wherein the first driving member and the second driving member are symmetrically disposed, wherein the first driving member comprises a first power frame, a second power frame disposed on the first power frame and connected to two of the clamping arms, wherein the first power frame reciprocates along an X-axis direction; the second power frame drives the corresponding two clamping arms to move close to or away from each other along the Y-axis direction; the rotary power piece is connected with the second power frame and used for driving the second power frame to rotate.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN202322735709.3U CN220961115U (en) | 2023-10-12 | 2023-10-12 | Particle testing equipment for wafer box |
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CN202322735709.3U CN220961115U (en) | 2023-10-12 | 2023-10-12 | Particle testing equipment for wafer box |
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CN220961115U true CN220961115U (en) | 2024-05-14 |
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CN202322735709.3U Active CN220961115U (en) | 2023-10-12 | 2023-10-12 | Particle testing equipment for wafer box |
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2023
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