CN221041071U - Wafer box clamping device - Google Patents

Abstract

The utility model relates to a wafer box clamping device which comprises a positioning seat, a plurality of clamping arms distributed around the periphery of the positioning seat and a driving unit for driving the clamping arms to be relatively close to or far away from the positioning seat, wherein the positioning seat forms a horizontally extending positioning surface from the top surface; the plurality of clamping arms respectively comprise an upper clamping part, a lower clamping part and a side clamping part, wherein the upper clamping part and the lower clamping part are arranged at intervals up and down, and the side clamping part is connected between the upper clamping part and the lower clamping part. On one hand, the wafer box is only required to be placed on the positioning seat, and clamping and loosening are automatically realized along with the relative movement of the clamping arms, so that the movement of the wafer box has no precision requirement, and the problem of damage caused by collision of the wafer box is avoided; on the other hand, the structure is simple, the operation is convenient, and the use cost is low.

Description

Wafer box clamping device

Technical Field

The utility model belongs to the field of semiconductor equipment, and particularly relates to a wafer box clamping device.

Background

As is well known, a wafer refers to a silicon wafer used for manufacturing a silicon semiconductor integrated circuit, and is called a wafer because the wafer has a circular shape; various circuit element structures can be fabricated on a silicon wafer to form an IC product with specific electrical functions.

Currently, wafers are typically stored side-by-side within a wafer cassette to facilitate storage, transfer, and loading and unloading of wafers between processing steps. The existing closed wafer box comprises a base and an upper cover, when the upper cover is opened, wafers can be placed on the base piece by piece through a mechanical arm or manually, and after the wafers on the base are fully stored, the upper cover is covered again and the wafers are closed in the wafer box. Meanwhile, in order to ensure that the cleanliness of the wafer box meets the use requirement, the wafer box needs to be subjected to particle testing regularly, in the traditional particle testing, firstly water is injected into an empty wafer box, then the empty wafer box is clamped and fixed through a clamping device, the wafer box is shaken through a shaking device, particles on the inner wall of the box are fully fused into water, and finally the particle quantity in the water is detected.

The existing wafer clamping device comprises a placing seat, a plurality of fixing arms and clamping arms, wherein the fixing arms are arranged on the placing seat, the wafer box is placed on the placing seat, the wafer box is relatively fixed with the placing seat in the circumferential direction, and the clamping arms are clamped on two opposite sides of the wafer box.

However, in the actual working process, when the wafer box is taken and placed by the clamping device, the moving precision requirement on the wafer box is very high, otherwise, the wafer box is easily damaged due to collision with the circumferential fixing arm in the taking and placing process, and the tightness of the wafer box is affected; and high-precision mechanical arms are needed, so that the cost is high.

Disclosure of Invention

The utility model aims to overcome the defects of the prior art and provide an improved wafer box clamping device.

In order to solve the technical problems, the utility model adopts the following technical scheme:

The wafer box clamping device comprises a positioning seat, a plurality of clamping arms and a driving unit, wherein the clamping arms are distributed around the periphery of the positioning seat, the driving unit drives the clamping arms to relatively approach or separate, the positioning seat forms a horizontally extending positioning surface from the top surface, and when the wafer box is placed on the positioning surface, the peripheral edges of the wafer box are exposed out of the positioning seat in the orthographic projection in the vertical direction; the clamping arms respectively comprise an upper clamping part, a lower clamping part and a side clamping part, wherein the upper clamping part and the lower clamping part are arranged at intervals up and down, the side clamping part is connected between the upper clamping part and the lower clamping part, and when in clamping, the upper clamping part, the lower clamping part and the side clamping part of each clamping arm correspondingly and synchronously collide with the top, the bottom and the side wall of the wafer box.

Preferably, the clamping surfaces formed by each upper clamping part and each lower clamping part are matched with the top surface and the bottom surface of the wafer box respectively, and the driving unit drives the clamping arms to horizontally move so as to clamp or unclamp the wafer box. Here, the unification of the positioning reference in the height direction is ensured, so that the clamping arm can clamp or unclamp the wafer cassette conveniently.

Preferably, the clamping arms are four, wherein each two adjacent side walls of the wafer box correspond to one clamping arm, and when clamping, the side clamping part of each clamping arm synchronously abuts against two adjacent side surfaces of the wafer box. Here, the clamping stability is effectively improved.

Specifically, each side clamping part comprises a first split body and a second split body which are vertically connected, wherein clamping surfaces formed by the first split body and the second split body are respectively parallel to two adjacent side surfaces of the wafer box. Here, the side clamping portion can be bonded to the side surface of the wafer cassette during clamping, and thus deformation of the wafer cassette during clamping can be reduced.

Preferably, the upper clamping portion, the lower clamping portion, and the side clamping portions are integrally formed.

Preferably, the length direction of the wafer box is defined as an X axis, the width direction of the wafer box is defined as a Y axis, the height direction of the wafer box is defined as a Z axis, the driving unit comprises a first driving part and a second driving part which are arranged on two opposite sides of the positioning seat in the X axis direction, wherein the first driving part and the second driving part are respectively connected with the two clamping arms and respectively drive the corresponding clamping arms to reciprocate along the X axis and the Y axis.

Specifically, the first driving component and the second driving component are symmetrically arranged, wherein the first driving component comprises a first power frame and a second power frame which is arranged on the first power frame and is connected with two clamping arms, and the first power frame reciprocates along the X-axis direction; the second power frame drives the corresponding two clamping arms to move close to or away from each other along the Y-axis direction. Simple structure, easy to install and implement.

Preferably, the second power frame is rotatably connected to the first power frame, and the first driving part further includes a rotating member for driving the second power frame to rotate, wherein a rotation center line of the second power frame extends along the X-axis direction. Here, different types of wafer cassettes can be used by rotational adjustment.

Preferably, the positioning seat is provided with a plurality of positioning modules, and when the wafer box is placed on the positioning surface, the plurality of positioning modules are propped against the periphery of the bottom of the wafer box.

In addition, the positioning seat can be adjusted in a lifting mode. After the clamping is completed, the positioning seat can be separated from the wafer box downwards so as to facilitate the wafer box to carry out particle testing.

Due to the implementation of the technical scheme, compared with the prior art, the utility model has the following advantages:

The wafer box clamping device in the prior art has the defect that the wafer box is easy to collide with the circumferential fixed arm to cause damage when the wafer box is taken and placed, the structure of the wafer clamping device is designed integrally, various defects and drawbacks in the prior art are skillfully solved, after the clamping device is adopted, the wafer box is firstly placed on the positioning seat, the plurality of clamping arms are driven by the driving unit to be relatively close to clamp the wafer box, wherein the upper clamping part, the lower clamping part and the side clamping part on each clamping arm are respectively abutted on the top, the bottom and the side wall of the wafer box, so that the clamping in the circumferential direction and the up-down direction of the wafer box is formed; on the other hand, the structure is simple, the operation is convenient, and the use cost is low.

Drawings

FIG. 1 is a schematic perspective view of a wafer cassette clamping device according to the present utility model;

FIG. 2 is an exploded view of the structure of FIG. 1;

wherein: 1. a positioning seat; m, locating surface; 10. a positioning module;

2. A clamp arm; 20. an upper clamping part; 21. a lower clamping part; 22. a side clamping part; 221. a first split; 222. a second split;

3. A driving unit; 31. a first driving part; 311. a first power rack; 312. a second power rack; 313. a rotating member; 32. a second driving part; g. a straight line cylinder;

H. A wafer cassette.

Detailed Description

In order that the above objects, features and advantages of the application will be readily understood, a more particular description of the application will be rendered by reference to the appended drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application. The present application may be embodied in many other forms than described herein and similarly modified by those skilled in the art without departing from the spirit of the application, whereby the application is not limited to the specific embodiments disclosed below.

In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present application and simplifying the description, and do not indicate or imply that the device or element being referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present application.

Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In the description of the present application, the meaning of "plurality" means at least two, for example, two, three, etc., unless specifically defined otherwise.

In the present application, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art according to the specific circumstances.

In the present application, unless expressly stated or limited otherwise, a first feature "up" or "down" a second feature may be the first and second features in direct contact, or the first and second features in indirect contact via an intervening medium. Moreover, a first feature being "above," "over" and "on" a second feature may be a first feature being directly above or obliquely above the second feature, or simply indicating that the first feature is level higher than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely below the second feature, or simply indicating that the first feature is less level than the second feature. It will be understood that when an element is referred to as being "fixed" or "disposed" on another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like are used herein for illustrative purposes only and are not meant to be the only embodiment.

As shown in fig. 1 and 2, the wafer cassette clamping device of the present embodiment includes a positioning seat 1, four clamping arms 2 distributed around the circumference of the positioning seat 1, and a driving unit 3 for driving the four clamping arms 2 to move relatively closer to or further away from each other.

The wafer cassette H of this embodiment is a closed wafer cassette, and is set to be a cuboid based on the top horizontal plane, the bottom horizontal plane, and the outermost surfaces of the peripheral side walls of the wafer cassette H, and defines the length direction of the wafer cassette as the X-axis, the width direction as the Y-axis, and the height direction as the X-axis.

In this example, the positioning seat 1 forms a positioning surface m extending horizontally from the top surface, and when the wafer cassette H is placed on the positioning surface m, in the orthographic projection in the vertical direction, the peripheral edges of the wafer cassette H are exposed to the positioning seat 1.

Meanwhile, four positioning modules 10 are arranged on the positioning seat 1, and when the wafer box H is placed on the positioning surface m, the four positioning modules 10 correspondingly lean against the periphery of the narrower part at the bottom of the wafer box H; the positioning seat 1 can be lifted and adjusted by a lifting air cylinder.

In this example, the four clamping arms 2 respectively include an upper clamping portion 20, a lower clamping portion 21, and a side clamping portion 22 connected between the upper clamping portion 20 and the lower clamping portion 21, which are arranged at an upper-lower interval, and the upper clamping portion 20, the lower clamping portion 21, and the side clamping portion 22 of each clamping arm 2 correspondingly and synchronously abut against the top, the bottom, and the side walls of the wafer cassette H during clamping.

Specifically, each two adjacent side walls of the wafer box H correspond to one clamping arm 2, and when clamping, the side clamping part 22 of each clamping arm 2 is synchronously abutted against two adjacent side surfaces of the wafer box H; the clamping surfaces formed by each upper clamping part 20 and each lower clamping part 21 are respectively matched with the top surface and the bottom surface of the wafer box H, and the driving unit 3 drives the four clamping arms 2 to horizontally move so as to clamp or unclamp the wafer box H; each side clamping part 22 comprises a first split 221 and a second split 222 which are vertically connected, wherein the clamping surfaces formed by the first split 221 and the second split 222 are respectively parallel to the adjacent two side surfaces of the wafer box H; the upper clamping portion 20, the lower clamping portion 21, and the side clamping portion 22 are integrally formed.

In this example, the driving unit 3 includes a first driving part 31 and a second driving part 32 disposed on opposite sides of the positioning seat 1 in the X-axis direction, wherein the first driving part 31 and the second driving part 32 are respectively connected to two clamp arms 2 disposed side by side at intervals in the Y-axis direction, and respectively drive the corresponding clamp arms 2 to reciprocate along the X-axis and the Y-axis directions.

Specifically, the first driving part 31 and the second driving part 32 are symmetrically disposed, and the structure of the second driving part 32 will be apparent from the following description of the structure of the first driving part 31.

The first driving part 31 includes a first power frame 311, a second power frame 312 provided on the first power frame 311 and connected to the two clamp arms 2, wherein the first power frame 311 reciprocates along the X-axis direction; the second power frame 312 drives the corresponding two clip arms 2 to move toward or away from each other in the Y-axis direction. In some embodiments, the first power frame 311 and the second power frame 312 are each driven by a linear cylinder g.

In addition, the second power frame 312 is rotatably connected to the first power frame 311, and the first driving part 31 further includes a rotating member 313 that drives the second power frame 312 to rotate, wherein a rotation center line of the second power frame 312 extends along the X-axis direction.

In summary, after the clamping device is adopted, the wafer box is firstly placed on the positioning seat, the plurality of clamping arms are driven by the driving unit to be relatively close to clamp the wafer box, wherein the upper clamping part, the lower clamping part and the side clamping part on each clamping arm respectively abut against the top, the bottom and the side wall of the wafer box, so that the clamping in the circumferential direction and the up-down direction of the wafer box is formed, and compared with the prior art, the clamping device only needs to place the wafer box on the positioning seat, and the clamping and the loosening are automatically realized along with the relative movement of the plurality of clamping arms, so that the movement of the wafer box has no precision requirement, and the problem of damage caused by collision of the wafer box is avoided; on the other hand, the structure is simple, the operation is convenient, and the use cost is low; in the third aspect, unification of positioning references in the height direction is ensured, so that clamping arms can clamp or unclamp the wafer box conveniently; in the fourth aspect, the side clamping portion can be bonded to the side surface of the wafer cassette during clamping, and thus deformation of the wafer cassette during clamping can be reduced.

The present utility model has been described in detail with the purpose of enabling those skilled in the art to understand the contents of the present utility model and to implement the same, but not to limit the scope of the present utility model, and all equivalent changes or modifications made according to the spirit of the present utility model should be included in the scope of the present utility model.

Claims (10)

1. Wafer box clamping device, its characterized in that: the wafer box comprises a positioning seat, a plurality of clamping arms and a driving unit, wherein the clamping arms are distributed around the periphery of the positioning seat, the driving unit drives the clamping arms to relatively approach or separate from each other, a horizontally extending positioning surface is formed on the top surface of the positioning seat, and when the wafer box is placed on the positioning surface, the peripheral edges of the wafer box are exposed out of the positioning seat in the orthographic projection in the vertical direction; the clamping arms respectively comprise an upper clamping part, a lower clamping part and a side clamping part, wherein the upper clamping part and the lower clamping part are arranged at intervals up and down, the side clamping part is connected between the upper clamping part and the lower clamping part, and when in clamping, the upper clamping part, the lower clamping part and the side clamping part of each clamping arm correspondingly and synchronously collide with the top, the bottom and the side wall of the wafer box.

2. The wafer cassette clamping device of claim 1, wherein: and each clamping surface formed by the upper clamping part and the lower clamping part is matched with the top surface and the bottom surface of the wafer box respectively, and the driving unit drives the clamping arms to horizontally move so as to clamp or unclamp the wafer box.

3. The wafer cassette clamping device of claim 1, wherein: the clamping arms are four, wherein each two adjacent side walls on the wafer box correspond to one clamping arm, and when clamping, the side clamping parts of each clamping arm synchronously abut against the two adjacent side surfaces of the wafer box.

4. A wafer cassette clamping device as defined in claim 3, wherein: each side clamping part comprises a first split body and a second split body which are vertically connected, wherein clamping surfaces formed by the first split body and the second split body are respectively parallel to two adjacent side surfaces of the wafer box.

5. The wafer cassette clamping device of any one of claims 1-4, wherein: the upper clamping part, the lower clamping part and the side clamping parts are integrally formed.

6. A wafer cassette clamping device as defined in claim 3, wherein: the wafer box is defined to be X-axis in the length direction, Y-axis in the width direction and Z-axis in the height direction, and the driving unit comprises a first driving part and a second driving part which are arranged on two opposite sides of the positioning seat in the X-axis direction, wherein the first driving part and the second driving part are respectively connected with two clamping arms and respectively drive the corresponding clamping arms to reciprocate along the X-axis direction and the Y-axis direction.

7. The wafer cassette clamping device of claim 6, wherein: the first driving component and the second driving component are symmetrically arranged, wherein the first driving component comprises a first power frame and a second power frame which is arranged on the first power frame and is connected with two clamping arms, and the first power frame reciprocates along the X-axis direction; the second power frame drives the corresponding two clamping arms to move close to or away from each other along the Y-axis direction.

8. The wafer cassette clamping device of claim 7, wherein: the second power frame is rotatably connected to the first power frame, and the first driving part further comprises a rotating piece for driving the second power frame to rotate, wherein a rotation center line of the second power frame extends along the X-axis direction.

9. The wafer cassette clamping device of claim 1, wherein: the positioning seat is provided with a plurality of positioning modules, and when the wafer box is placed on the positioning surface, the plurality of positioning modules are propped against the periphery of the bottom of the wafer box.

10. The wafer cassette clamping device of claim 1, wherein: the positioning seat can be lifted and adjusted.