CN220914219U - Semiconductor chip packaging structure with double-sided heat dissipation - Google Patents
Semiconductor chip packaging structure with double-sided heat dissipation Download PDFInfo
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- CN220914219U CN220914219U CN202322565013.0U CN202322565013U CN220914219U CN 220914219 U CN220914219 U CN 220914219U CN 202322565013 U CN202322565013 U CN 202322565013U CN 220914219 U CN220914219 U CN 220914219U
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- semiconductor chip
- heat dissipation
- double
- mounting
- packaging structure
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 42
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 39
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 17
- 229910001369 Brass Inorganic materials 0.000 claims abstract description 25
- 239000010951 brass Substances 0.000 claims abstract description 25
- 239000003292 glue Substances 0.000 claims description 21
- 238000002347 injection Methods 0.000 claims description 21
- 239000007924 injection Substances 0.000 claims description 21
- 238000009423 ventilation Methods 0.000 claims description 20
- 238000009434 installation Methods 0.000 claims description 4
- 238000007789 sealing Methods 0.000 abstract description 9
- 238000005452 bending Methods 0.000 abstract description 3
- 239000000463 material Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 239000000428 dust Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 239000012535 impurity Substances 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- -1 polytetrafluoroethylene Polymers 0.000 description 3
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 3
- 239000004810 polytetrafluoroethylene Substances 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- 238000001816 cooling Methods 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000010248 power generation Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model provides a semiconductor chip packaging structure with double-sided heat dissipation, which relates to the field of chip sealing, and comprises a lower mounting plate and an upper mounting plate, wherein a semiconductor chip is arranged between the lower mounting plate and the upper mounting plate, mounting grooves are formed in the lower mounting plate and the upper mounting plate, brass coils are arranged on the inner side walls of the mounting grooves in a mounting manner, and can be arranged in a bending manner.
Description
Technical Field
The utility model relates to the field of chip sealing, in particular to a semiconductor chip packaging structure with double-sided heat dissipation.
Background
The semiconductor refers to a material with conductivity between a conductor and an insulator at normal temperature, is widely applied to the fields of integrated circuits, consumer electronics, communication systems, photovoltaic power generation, illumination, high-power conversion and the like, has huge importance from the aspects of science and technology or economic development, and most of electronic products such as core units in computers, mobile phones or digital recorders are closely related with the semiconductor, so that the production and the processing of the semiconductor have a great specific weight in the market.
Before the semiconductor chip is used, the chip is required to be packaged generally, the conventional chip packaging structure is poor in heat dissipation effect when in use, so that the temperature emitted by the inside of the chip cannot be discharged through the packaging mechanism rapidly when the chip is used in high strength, heat is accumulated continuously along with the increase of the service time, a solder layer between a substrate and a metal layer is cracked finally, the chip is made to be invalid in conductivity, the use is affected, meanwhile, the conventional packaging structure is generally buckled and mounted firstly when being sealed, then glue injection is carried out, and the mounting and sealing mode is troublesome to operate and affects the mounting efficiency.
Disclosure of utility model
In order to make up for the defects, the utility model provides a semiconductor chip packaging structure with double-sided heat dissipation, and aims to solve the problem that the existing packaging structure is difficult to dissipate heat.
The utility model is realized in the following way:
The utility model provides a semiconductor chip packaging structure with double-sided heat dissipation, which comprises a lower mounting plate and an upper mounting plate, wherein a semiconductor chip is arranged between the lower mounting plate and the upper mounting plate, mounting grooves are formed in the lower mounting plate and the upper mounting plate, brass coils are arranged on the inner side walls of the mounting grooves in a mounting mode, the brass coils are arranged in a bending mode, and heat conducting rods are fixedly connected to the front end and the rear end of each brass coil.
Preferably, a plurality of ventilation and heat dissipation films are arranged on the mounting groove, and a plurality of wiring terminals are fixedly connected to two sides of the lower mounting plate.
Preferably, the lower mounting plate is provided with a plurality of closed slots.
By adopting the technical scheme, the brass coil can conduct heat to the semiconductor chip.
Preferably, a plurality of installation inserts are fixedly connected to the outer side wall of the upper installation plate, and sliding bayonets are formed in the installation inserts.
Preferably, the inner side wall of the sliding bayonet is connected with a rubber injection pipe in a sliding manner, and the rubber injection pipe is arranged in an inner space.
Preferably, the end of the rubber injection pipe is provided with a rubber outlet, and one end of the rubber injection pipe far away from the rubber outlet is provided with a rubber receiving port.
By adopting the technical scheme, the sealant can be filled by arranging the rubber injection pipe.
The beneficial effects of the utility model are as follows:
1. Through the setting of the mounting groove in mounting panel and the last mounting panel down, can realize when mounting panel and last mounting panel carry out the closure encapsulation to the semiconductor chip, the brass coil that lies in respectively down mounting panel and last mounting panel can contact with the upper and lower two sides of semiconductor chip, because brass coil is made for brass material, and it own has fine heat conductivity, when brass coil and the semiconductor chip contact of upper and lower both sides, can carry out heat conduction and dissipation through self good heat conductivity to the upper and lower two sides of semiconductor chip.
2. Through the setting of upper and lower both sides ventilation cooling film 106, can carry out the heat transfer to the brass coil of heat conduction and discharge outside, can also be extra ventilate the heat dissipation to the chip surface, through the cooperation heat dissipation of brass coil and ventilation cooling film, can make whole encapsulation mechanism can carry out abundant heat dissipation to the chip, guarantee the result of use of chip.
3. Meanwhile, the ventilation and heat dissipation film is made of porous polytetrafluoroethylene materials, the ventilation aperture is small, when the ventilation and heat dissipation film dissipates heat, air and other gas molecules can only be penetrated, and impurities with larger particles such as external dust are difficult to enter the sealing mechanism through the ventilation and heat dissipation film, so that the ventilation and heat dissipation film dissipates heat and ventilates and also has the dust removal effect.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings that are needed in the embodiments will be briefly described below, it being understood that the following drawings only illustrate some examples of the present utility model and therefore should not be considered as limiting the scope, and other related drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic structural diagram of a semiconductor chip package structure with dual-sided heat dissipation according to an embodiment of the present utility model;
Fig. 2 is a schematic diagram of a lower mounting board in a semiconductor chip package structure with dual-sided heat dissipation according to an embodiment of the present utility model;
Fig. 3 is a schematic diagram of an upper mounting board in a semiconductor chip package structure with dual-sided heat dissipation according to an embodiment of the present utility model;
Fig. 4 is a schematic view of a mounting package structure in a semiconductor chip package structure with dual-sided heat dissipation according to an embodiment of the present utility model;
fig. 5 is a schematic structural diagram of an injection tube in a semiconductor chip package structure with dual-sided heat dissipation according to an embodiment of the present utility model.
In the figure: 1. a lower mounting plate; 2. a semiconductor chip; 3. an upper mounting plate; 101. a terminal; 102. a mounting groove; 103. closing the slot; 104. a brass coil; 105. a heat conduction rod; 106. a ventilation and heat dissipation film; 301. installing an insert; 302. a sliding bayonet; 303. a rubber injection pipe; 304. a glue outlet hole; 305. and (5) a glue receiving port.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present utility model more apparent, the technical solutions of the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model, and it is apparent that the described embodiments are some embodiments of the present utility model, but not all embodiments. All other embodiments, based on the embodiments of the utility model, which are apparent to those of ordinary skill in the art without inventive faculty, are intended to be within the scope of the utility model.
Examples
Referring to fig. 1-5, a semiconductor chip package structure with double-sided heat dissipation comprises a lower mounting plate 1 and an upper mounting plate 3, wherein a plurality of closed slots 103 are formed on the lower mounting plate 1, a semiconductor chip 2 is arranged between the lower mounting plate 1 and the upper mounting plate 3, a plurality of mounting inserts 301 are fixedly connected to the outer side wall of the upper mounting plate 3, sliding bayonets 302 are formed on the mounting inserts 301, glue outlet holes 304 are formed at the end parts of glue injection pipes 303, glue receiving holes 305 are formed at the end parts of the glue injection pipes 303 away from the glue outlet holes 304,
Further, the inner side wall of the sliding bayonet 302 is slidably connected with a rubber injection pipe 303, the rubber injection pipe 303 is arranged in an inner space, the lower mounting plate 1 and the upper mounting plate 3 are provided with mounting grooves 102, a plurality of ventilation and heat dissipation films 106 are arranged on the mounting grooves 102, two sides of the lower mounting plate 1 are fixedly connected with a plurality of terminals 101, the inner side wall of the mounting groove 102 is provided with a brass coil 104, the brass coil 104 is arranged in a bending manner, the front end and the rear end of the brass coil 104 are fixedly connected with heat conducting rods 105,
The ventilation and heat dissipation film 106 is made of porous polytetrafluoroethylene material, the ventilation aperture is small, only air and other gas molecules can be penetrated during heat dissipation, and impurities with larger particles such as external dust are difficult to enter the sealing mechanism through the ventilation and heat dissipation film 106.
The working principle of the semiconductor chip packaging structure with double-sided heat dissipation is as follows:
When the semiconductor chip sealing device is used, an operator can put a semiconductor chip 2 to be sealed into the mounting groove 102 on the lower mounting plate 1, then align and insert a plurality of mounting plug-ins 301 on the upper mounting plate 3 into the closing slot 103, closing the lower mounting plate 1 and the upper mounting plate 3, when the mounting plug-ins 301 are inserted into the closing slot 103, the glue injection pipe 303 at the bottom end of the mounting plug-ins 301 firstly contacts the bottom of the closing slot 103 and pushes the glue injection pipe 303 to move into the mounting plug-ins 301, at the moment, the glue connection port 305 originally positioned outside the mounting plug-ins 301 can enter the mounting plug-ins 301, correspondingly, the sealing glue in the mounting plug-ins 301 can enter the glue injection pipe 303 through the glue outlet port 304 and is discharged into the closing slot 103, and the glue injection sealing is carried out in the closing slot 103, so that the lower mounting plate 1 and the upper mounting plate 3 are fully closed, the subsequent glue injection is avoided, and the closing mounting efficiency of the lower mounting plate 1 and the upper mounting plate 3 is improved;
When the lower mounting board 1 and the upper mounting board 3 are closed, the semiconductor chip 2 is sealed, at this time, the semiconductor chip 2 can be connected to the wire board through the plurality of terminals 101 on the lower mounting board 1 for use, (this is the prior art, do not make too much explanation), after the lower mounting board 1 and the upper mounting board 3 seal the semiconductor chip 2, the brass coil 104 located in the lower mounting board 1 and the upper mounting board 3 can be contacted with the upper and lower sides of the semiconductor chip 2, when the semiconductor chip 2 uses heating, the brass coil 104 made of brass can conduct double-sided heat conduction, and the heat conducted by the brass coil 104 can be discharged out of the packaging structure by the heat conducting rod 105 connected with the brass coil 104, outside the double-sided heat conduction of the semiconductor chip 2 is conducted by the brass coil 104, the ventilation and heat dissipation film 106 located on the lower mounting board 1 and the upper mounting board 3 can also conduct double-sided ventilation and heat dissipation for the semiconductor chip 2, because the ventilation and heat dissipation film 106 is made of porous polytetrafluoroethylene material, when the ventilation and aperture is smaller, only air and other gas molecules, the impurities of external dust and other particles are difficult to enter the sealing mechanism through the brass film 106, the heat dissipation film 106 can be fully matched with the whole ventilation and heat dissipation mechanism 106, and the ventilation and heat dissipation effect can be guaranteed.
The above description is only of the preferred embodiments of the present utility model and is not intended to limit the present utility model, and various modifications and variations may be made to the present utility model by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present utility model should be included in the protection scope of the present utility model.
Claims (6)
1. The utility model provides a double-sided radiating semiconductor chip packaging structure, includes mounting panel (1) and last mounting panel (3), its characterized in that down be provided with semiconductor chip (2) between mounting panel (1) and the last mounting panel (3), mounting groove (102) are all offered in mounting panel (1) and the last mounting panel (3) down, brass coil (104) have been laid in the inside wall installation of mounting groove (102), brass coil (104) are the crooked setting, all fixedly connected with heat-conducting rod (105) in both ends around brass coil (104).
2. The semiconductor chip packaging structure with double-sided heat dissipation according to claim 1, wherein a plurality of ventilation and heat dissipation films (106) are arranged on the mounting groove (102), and a plurality of terminals (101) are fixedly connected to two sides of the lower mounting plate (1).
3. The semiconductor chip package structure with double-sided heat dissipation according to claim 1, wherein the lower mounting board (1) is provided with a plurality of closed slots (103).
4. The semiconductor chip packaging structure with double-sided heat dissipation according to claim 1, wherein a plurality of mounting inserts (301) are fixedly connected to the outer side wall of the upper mounting board (3), and sliding bayonets (302) are formed on the mounting inserts (301).
5. The semiconductor chip packaging structure with double-sided heat dissipation according to claim 4, wherein the inner side wall of the sliding bayonet (302) is slidably connected with a rubber injection tube (303), and the rubber injection tube (303) is arranged in an inner space.
6. The semiconductor chip packaging structure with double-sided heat dissipation according to claim 5, wherein the end of the glue injection pipe (303) is provided with a glue outlet (304), and one end of the glue injection pipe (303) far away from the glue outlet (304) is provided with a glue receiving opening (305).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322565013.0U CN220914219U (en) | 2023-09-21 | 2023-09-21 | Semiconductor chip packaging structure with double-sided heat dissipation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322565013.0U CN220914219U (en) | 2023-09-21 | 2023-09-21 | Semiconductor chip packaging structure with double-sided heat dissipation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220914219U true CN220914219U (en) | 2024-05-07 |
Family
ID=90910562
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322565013.0U Active CN220914219U (en) | 2023-09-21 | 2023-09-21 | Semiconductor chip packaging structure with double-sided heat dissipation |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220914219U (en) |
-
2023
- 2023-09-21 CN CN202322565013.0U patent/CN220914219U/en active Active
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