CN211628165U - Heat conducting plate special for CPU - Google Patents
Heat conducting plate special for CPU Download PDFInfo
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- CN211628165U CN211628165U CN202020749248.9U CN202020749248U CN211628165U CN 211628165 U CN211628165 U CN 211628165U CN 202020749248 U CN202020749248 U CN 202020749248U CN 211628165 U CN211628165 U CN 211628165U
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Abstract
The utility model belongs to the technical field of CPU heat dissipation equipment, in particular to a heat conducting plate special for a CPU, which comprises a heat conducting mechanism and an auxiliary mechanism arranged on the top surface of the heat conducting mechanism, wherein the heat conducting mechanism comprises a heat conducting box and a heat conducting cover plate, the inner wall of the heat conducting box is fixedly connected with a plurality of heat conducting copper pipes, the two ends of each heat conducting copper pipe are hermetically connected with connecting pipes, and the connecting pipes penetrate through the heat conducting box; hug closely the CPU top surface with the bottom surface of heat conduction apron, the CPU top surface is hugged closely to sealed flange, open the inlet pipe, annotate new heat conduction silicone grease to the heat conduction incasement, under the effect of pressure, the heat conduction silicone grease with the clamp plate below extrudees to heat conduction apron one side, the heat conduction silicone grease permeates to the heat conduction apron outside via a plurality of infiltration hole, fill the clearance between heat conduction apron and the CPU, fill the heat conduction silicone grease to the outside via heat conduction apron inside, can make the effectual clearance that is full of between heat conduction apron and the CPU of heat conduction silicone grease, increase the area of heat transfer, the heat transfer efficiency is improved.
Description
Technical Field
The utility model belongs to the technical field of the CPU cooling device, concretely relates to dedicated heat-conducting plate of CPU.
Background
The CPU is one of the main devices of the electronic computer, the core accessory in the computer, its function is mainly to explain the computer instruction and process the data in the computer software, all operations in the computer are responsible for reading the instruction by CPU, decode the instruction and carry out the core part of the instruction, when CPU installs and uses, need to use the heat sink to cool it, and the heat-conducting plate plays the role of heat transfer, is used for conducting the heat of CPU.
When a heat conducting plate of the existing CPU radiator is contacted with a CPU, heat conducting silicone grease is directly coated on the outer side of the CPU, and because the heat conducting plate and the outer side wall of the CPU are provided with fine pits, a cavity formed by the pits can have certain air pressure when the heat conducting plate and the outer side wall of the CPU are attached, the heat conducting silicone grease cannot be completely filled, and certain heat conducting gaps exist.
Accordingly, those skilled in the art have provided a CPU-dedicated heat conductive plate to solve the problems set forth in the background art described above.
SUMMERY OF THE UTILITY MODEL
To solve the problems set forth in the background art described above. The utility model provides a dedicated heat-conducting plate of CPU has the characteristics that heat conduction efficiency is high.
In order to achieve the above object, the utility model provides a following technical scheme: a heat conducting plate special for a CPU comprises a heat conducting mechanism and an auxiliary mechanism arranged on the top surface of the heat conducting mechanism, the heat conducting mechanism comprises a heat conducting box and a heat conducting cover plate, the inner wall of the heat conducting box is fixedly connected with a plurality of heat conducting copper pipes, the two ends of the heat conducting copper pipe are hermetically connected with connecting pipes which penetrate through the heat conducting box, and extends to the outer side of the heat conduction box, the inner wall of the heat conduction box is connected with a pressing plate in a sliding way, the pressing plate is positioned above the heat conduction copper pipe, a feed pipe is fixedly inserted in the middle position of the top surface of the heat conduction box, the bottom end of the feed pipe is positioned in the heat conduction box, the heat conduction box is filled with heat conduction silicone grease, the sealing flange is fixedly bonded on the outer periphery of the bottom surface of the heat conduction cover plate, a plurality of penetration holes are formed in the heat conduction cover plate and are located on the inner side of the sealing flange.
Preferably, the auxiliary mechanism comprises a plurality of radiating fins and semiconductor refrigerating pieces, and the radiating fins and the semiconductor refrigerating pieces are fixed on the top surface of the heat conduction box.
Preferably, a plurality of radiating fins are arranged in parallel and symmetrically arranged on two sides of the feeding pipe.
Preferably, the plurality of semiconductor chilling plates are respectively located between the plurality of radiating fins.
Preferably, the top surface of the pressing plate is fixedly connected with a plurality of elastic sheets which are uniformly arranged, and the top ends of the elastic sheets are in contact with the inner wall of the heat conduction box.
Preferably, the material of the sealing flange is rubber.
Compared with the prior art, the beneficial effects of the utility model are that:
when using, hug closely the CPU top surface with the bottom surface of heat conduction apron, the CPU top surface is hugged closely to sealing flange, open the inlet pipe, fill new heat conduction silicone grease to the heat conduction incasement, under the effect of pressure, the clamp plate extrudees downwards, extrude heat conduction silicone grease to heat conduction apron one side with the clamp plate below, heat conduction silicone grease permeates to the heat conduction apron outside via a plurality of infiltration hole, fill the clearance between heat conduction apron and the CPU, fill heat conduction silicone grease to the outside via the inside outside of heat conduction apron, can make the effectual clearance that is full of between heat conduction apron and the CPU of heat conduction silicone grease, increase the area of heat transfer, the heat transfer efficiency is improved.
Drawings
The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention, and together with the description serve to explain the invention and not to limit the invention. In the drawings:
fig. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic view of the position of the heat conducting copper pipe according to the present invention;
fig. 3 is a schematic structural view of a heat-conducting cover plate of the present invention;
FIG. 4 is an enlarged view of the point A in FIG. 2;
fig. 5 is an enlarged schematic view of B in fig. 2.
In the figure: 1. a heat conducting mechanism; 101. a penetration hole; 11. a heat conducting box; 12. a heat conducting cover plate; 121. a sealing flange; 13. a heat conducting copper pipe; 14. a connecting pipe; 15. pressing a plate; 16. a spring plate; 17. a feed pipe; 18. heat-conducting silicone grease; 2. an auxiliary mechanism; 21. a heat dissipating fin; 22. semiconductor refrigeration piece.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-5, the present invention provides the following technical solutions: the utility model provides a dedicated heat-conducting plate of CPU, including heat conduction mechanism 1 and install the complementary unit 2 at its top surface, heat conduction mechanism 1 includes heat conduction case 11 and heat conduction apron 12, the inner wall fixedly connected with a plurality of heat conduction copper pipe 13 of heat conduction case 11, the equal sealing connection in both ends of heat conduction copper pipe 13 has connecting pipe 14, connecting pipe 14 runs through heat conduction case 11, and extend to the outside of heat conduction case 11, the inner wall sliding connection of heat conduction case 11 has clamp plate 15, clamp plate 15 is located heat conduction copper pipe 13's top, the top surface intermediate position department of heat conduction case 11 pegs graft and is fixed with inlet pipe 17, the bottom of inlet pipe 17 is located the inside of heat conduction case 11, the inside packing of heat conduction case 11 has heat conduction silicone grease 18, the bottom surface of heat conduction apron 12 is outer along a week bonding and is fixed with sealing flange 121, a plurality of infiltration hole 101 has been seted up on the heat conduction apron 12.
In this embodiment: when the heat conduction box is used, the bottom surface of the heat conduction cover plate 12 is tightly attached to the top surface of a CPU, the sealing flange 121 is tightly attached to the top surface of the CPU, the feeding pipe 17 is opened, new heat conduction silicone grease 18 is filled into the heat conduction box 11, the pressing plate 15 is pressed downwards under the action of pressure, the heat conduction silicone grease 18 below the pressing plate 15 is pressed towards one side of the heat conduction cover plate 12, the heat conduction silicone grease 18 permeates to the outer side of the heat conduction cover plate 12 through the plurality of penetration holes 101, a gap between the heat conduction cover plate 12 and the CPU is filled, the heat conduction silicone grease 18 is filled towards the outer side through the inner part of the heat conduction cover plate 12, the gap between the heat conduction cover plate 12 and the CPU can be effectively filled with the heat conduction silicone grease 18, the heat transfer area is increased, the heat transfer efficiency is improved, the air pressure.
In fig. 1, 2 and 3: the heat conduction mechanism comprises a heat conduction mechanism 1 and an auxiliary mechanism 2 arranged on the top surface of the heat conduction mechanism, wherein the heat conduction mechanism 1 comprises a heat conduction box 11 and a heat conduction cover plate 12, the inner wall of the heat conduction box 11 is fixedly connected with a plurality of heat conduction copper pipes 13, both ends of each heat conduction copper pipe 13 are hermetically connected with a connecting pipe 14, each connecting pipe 14 penetrates through the heat conduction box 11 and extends to the outer side of the heat conduction box 11, the inner wall of the heat conduction box 11 is slidably connected with a pressing plate 15, each pressing plate 15 is positioned above the corresponding heat conduction copper pipe 13, the middle position of the top surface of the heat conduction box 11 is fixedly inserted with a feeding pipe 17, the bottom end of each feeding pipe 17 is positioned inside the corresponding heat conduction box 11, the heat conduction box 11 is filled with heat conduction silicone grease 18, a sealing flange 121 is fixedly adhered to the outer periphery of the bottom surface of the heat conduction cover plate 12, a plurality of permeation holes 101 are formed in the, sealing flange 121 hugs closely the CPU top surface, open inlet pipe 17, annotate new heat conduction silicone grease 18 in heat conduction case 11, under the effect of pressure, clamp plate 15 extrudees downwards, heat conduction silicone grease 18 with clamp plate 15 below extrudes to heat conduction apron 12 one side, heat conduction silicone grease 18 permeates to the heat conduction apron 12 outside through a plurality of infiltration hole 101, fill the clearance between heat conduction apron 12 and the CPU, fill heat conduction silicone grease 18 to the outside via heat conduction apron 12 is inside, can make the effectual clearance that is full of between heat conduction apron 12 and the CPU of heat conduction silicone grease 18, increase the area of heat transfer, the heat transfer efficiency is improved, effectively prevent when the installation, atmospheric pressure produces the cavity.
In fig. 5: the sealing flange 121 is fixedly bonded to the outer periphery of the bottom surface of the heat-conducting cover plate 12, the sealing flange 121 can prevent the heat-conducting silicone grease 18 from overflowing to contaminate the circuit board, the sealing flange 121 is made of rubber, the sealing flange 121 made of rubber can be well attached to a CPU, and the sealing performance is good.
In fig. 1 and 2: the auxiliary mechanism 2 comprises a plurality of radiating fins 21 and semiconductor refrigerating pieces 22, the radiating fins 21 and the semiconductor refrigerating pieces 22 are fixed on the top surface of the heat conducting box 11, the radiating fins 21 are arranged in parallel, the radiating fins are symmetrically arranged on two sides of the inlet pipe 17, the radiating areas of the heat conducting box 11 can be increased by the radiating fins 21 arranged in parallel, the radiating efficiency is further improved, the semiconductor refrigerating pieces 22 are respectively located between the radiating fins 21, the semiconductor refrigerating pieces 22 (model TEC1-12703) are electrically connected with an external power supply through a control switch, when needed, the semiconductor refrigerating pieces 22 can be opened, the heat conducting box 11 is refrigerated, and the radiating efficiency is improved.
In fig. 2 and 4: the top surface of the pressing plate 15 is fixedly connected with a plurality of elastic sheets 16 which are uniformly arranged, the top ends of the elastic sheets 16 are in contact with the inner wall of the heat conducting box 11, and under the action of the elastic sheets 16, the down pressure of the pressing plate 15 can be increased, and the overflowing speed of the heat conducting silicone grease 18 through the permeation holes 101 is increased.
The utility model discloses a theory of operation and use flow: when the heat conducting box is used, the bottom surface of the heat conducting cover plate 12 is tightly attached to the top surface of a CPU, the sealing flange 121 is tightly attached to the top surface of the CPU, the feeding pipe 17 is opened, new heat conducting silicone grease 18 is filled into the heat conducting box 11, the pressing plate 15 is pressed downwards under the action of pressure, the heat conducting silicone grease 18 below the pressing plate 15 is pressed towards one side of the heat conducting cover plate 12, the heat conducting silicone grease 18 permeates to the outer side of the heat conducting cover plate 12 through the plurality of penetration holes 101, a gap between the heat conducting cover plate 12 and the CPU is filled, the heat conducting silicone grease 18 is filled to the outer side through the inner part of the heat conducting cover plate 12, the gap between the heat conducting cover plate 12 and the CPU can be effectively filled with the heat conducting silicone grease 18, the heat transfer area is increased, the heat transfer efficiency is improved, a cavity is effectively prevented from being generated by air pressure during installation, the heat of the CPU is conducted to the heat conducting cover plate 12 and the heat conducting copper pipe 13 through the heat conducting cover plate 12 and the heat conducting silicone grease 18, and the heat on the heat conducting copper pipe 13 is cooled through an external heat radiating pipeline.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described in the foregoing embodiments, or equivalents may be substituted for elements thereof. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (6)
1. A heat conducting plate special for a CPU is characterized in that: the heat conduction structure comprises a heat conduction mechanism (1) and an auxiliary mechanism (2) installed on the top surface of the heat conduction mechanism, wherein the heat conduction mechanism (1) comprises a heat conduction box (11) and a heat conduction cover plate (12), the inner wall of the heat conduction box (11) is fixedly connected with a plurality of heat conduction copper pipes (13), the two ends of each heat conduction copper pipe (13) are respectively and hermetically connected with a connecting pipe (14), each connecting pipe (14) penetrates through the heat conduction box (11) and extends to the outer side of the heat conduction box (11), the inner wall of the heat conduction box (11) is slidably connected with a pressing plate (15), each pressing plate (15) is located above the corresponding heat conduction copper pipe (13), an inlet pipe (17) is fixedly inserted into the middle position of the top surface of the heat conduction box (11), the bottom end of each inlet pipe (17) is located inside the corresponding heat conduction box (11), and heat conduction silicone grease (18) is filled, the bottom surface of heat conduction apron (12) is fixed with sealing flange (121) along a week bonding outward, a plurality of infiltration hole (101) have been seted up on heat conduction apron (12), a plurality of infiltration hole (101) all are located sealing flange (121) are inboard.
2. A CPU-specific heat-conducting plate according to claim 1, characterized in that: the auxiliary mechanism (2) comprises a plurality of radiating fins (21) and semiconductor refrigerating pieces (22), and the radiating fins (21) and the semiconductor refrigerating pieces (22) are fixed on the top surface of the heat conduction box (11).
3. A CPU-specific heat-conducting plate according to claim 2, characterized in that: the heat dissipation fins (21) are arranged in parallel and symmetrically arranged on two sides of the feeding pipe (17).
4. A CPU-specific heat-conducting plate according to claim 2, characterized in that: the plurality of semiconductor refrigeration pieces (22) are respectively positioned among the plurality of radiating fins (21).
5. A CPU-specific heat-conducting plate according to claim 1, characterized in that: the top surface of the pressing plate (15) is fixedly connected with a plurality of elastic sheets (16) which are uniformly arranged, and the top ends of the elastic sheets (16) are in contact with the inner wall of the heat conduction box (11).
6. A CPU-specific heat-conducting plate according to claim 1, characterized in that: the sealing flange (121) is made of rubber.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020749248.9U CN211628165U (en) | 2020-05-09 | 2020-05-09 | Heat conducting plate special for CPU |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020749248.9U CN211628165U (en) | 2020-05-09 | 2020-05-09 | Heat conducting plate special for CPU |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211628165U true CN211628165U (en) | 2020-10-02 |
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ID=72623186
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020749248.9U Active CN211628165U (en) | 2020-05-09 | 2020-05-09 | Heat conducting plate special for CPU |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211628165U (en) |
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2020
- 2020-05-09 CN CN202020749248.9U patent/CN211628165U/en active Active
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