CN220254971U - High-frequency switching power supply heat dissipation device - Google Patents
High-frequency switching power supply heat dissipation device Download PDFInfo
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- CN220254971U CN220254971U CN202321690529.1U CN202321690529U CN220254971U CN 220254971 U CN220254971 U CN 220254971U CN 202321690529 U CN202321690529 U CN 202321690529U CN 220254971 U CN220254971 U CN 220254971U
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- power supply
- air
- air guide
- guide pipeline
- heat dissipation
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- 230000017525 heat dissipation Effects 0.000 title abstract description 27
- 230000007246 mechanism Effects 0.000 claims abstract description 23
- 238000001816 cooling Methods 0.000 claims abstract description 19
- 239000007788 liquid Substances 0.000 claims abstract description 6
- 239000000110 cooling liquid Substances 0.000 claims description 18
- 238000007789 sealing Methods 0.000 claims description 11
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 6
- 230000002035 prolonged effect Effects 0.000 abstract description 4
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
Abstract
The utility model discloses a high-frequency switching power supply radiating device which is used for being arranged on a transformer and a rectifying module of a power supply to radiate heat, and comprises radiating fins and a cold air mechanism, wherein the bottom surface of each radiating fin is contacted with the transformer and/or the rectifying module, and a plurality of fins which are arranged at intervals are integrally formed above each radiating fin to increase radiating area; the cold air mechanism comprises a fan, an air guide pipeline and an air outlet, wherein the fan and the air outlet are positioned at two ends of the air guide pipeline, the position of the air outlet is matched with the position of the fins, and the air blown out by the fan is cooled by the outside of the air guide pipeline in a liquid cooling mode. According to the high-frequency switch power supply heat dissipation device, the heat dissipation area is increased through the heat dissipation fins, the cooling heat dissipation air is provided through the cold air mechanism, the heat dissipation effect of the power supply is greatly improved, the service life of the power supply is prolonged, meanwhile, the cold air mechanism utilizes the entangled spiral air guide pipeline to supply air, the space occupation of the cold air mechanism is reduced, and the power supply space cannot be greatly influenced.
Description
Technical Field
The utility model relates to the technical field of switching power supplies, in particular to a high-frequency switching power supply heat dissipation device.
Background
With the development of power electronic technology, the relation between power electronic equipment and people's work and life is also becoming more and more intimate, and the electronic equipment is not separated from a reliable power supply; among them, a high-frequency switching power supply is a power supply operated at a high frequency by a MOSFET or an IGBT, and is widely used because of its advantages such as high efficiency and miniaturization.
In the working process of the high-frequency switching power supply, a large amount of heat can be generated by electric elements such as a rectifying component, a transformer component and the like in an electric system, particularly the high-power high-frequency switching power supply has great influence on the working performance of the whole high-frequency switching power supply, and even the high-frequency switching power supply can be caused to fail due to overhigh temperature; therefore, in the existing high-frequency switch power supply, heat dissipation is the primary problem.
At present, the heat dissipation of the high-frequency switch power supply is generally carried out by adopting a mode of installing a heat dissipation plate outside the transformer and the rectifying module, but under the conditions of long-time work and large power, heat accumulation is serious, the heat dissipation effect of the common heat dissipation plate is poor, equipment is easy to overheat, and even short circuit is caused and the service life is influenced when serious. In order to solve the heat dissipation problem, an air cooling or liquid cooling heat dissipation mode is generally adopted to cool the heat dissipation plate, the common air cooling mode is greatly influenced by the ambient temperature, the liquid cooling mode is easy to generate leakage of cooling liquid to directly damage the power supply, and the power supply has great potential safety hazard.
Therefore, in combination with the above-mentioned technical problems, it is necessary to provide a new technical solution.
Disclosure of Invention
The utility model aims to provide the high-frequency switch power supply radiating device which has better radiating effect, can effectively prolong the service life of a power supply and has higher safety.
In order to solve the technical problems, the utility model provides a high-frequency switching power supply heat dissipation device, which comprises the following specific technical scheme:
the high-frequency switch power supply radiating device is used for being arranged on a transformer and a rectifying module of a power supply to radiate heat and comprises radiating fins and a cold air mechanism, wherein the bottom surface of the radiating fins are contacted with the transformer and/or the rectifying module, and a plurality of fins which are arranged at intervals are integrally formed above the radiating fins so as to increase radiating area; the cold air mechanism comprises a fan, an air guide pipeline and an air outlet, wherein the fan and the air outlet are positioned at two ends of the air guide pipeline, the position of the air outlet is matched with the position of the fins, and the air blown out by the fan is cooled by the outside of the air guide pipeline in a liquid cooling mode.
Preferably, the cold air mechanism further comprises a sealed bin, the sealed bin is filled with cooling liquid, the air guide pipeline main body is located in the sealed bin, the air guide pipeline is soaked in the cooling liquid, and the inner cavity of the air guide pipeline is isolated from the cooling liquid.
Preferably, the air guide pipeline extends from one end of the sealing bin to the other end of the sealing bin in a spiral shape so as to enlarge the contact area with the cooling liquid.
Preferably, the fans and the air guide pipelines are all multiple, the fans are uniformly arranged at one end of the sealing bin, and the spiral air guide pipelines are arranged in an entangled manner.
Preferably, the sealing bin is also provided with an openable or closable water inlet and water outlet so as to facilitate filling and replacing the cooling liquid.
Preferably, the air guide pipeline is made of a heat conduction material made of metal, and is specifically a galvanized copper pipe or a galvanized aluminum pipe.
The high-frequency switching power supply heat dissipation device has the following beneficial effects:
according to the high-frequency switch power supply heat dissipation device, the heat dissipation area is increased through the heat dissipation fins, and the cooling heat dissipation air is provided through the cold air mechanism, so that the heat dissipation effect of the power supply is greatly improved, the service life of the power supply is prolonged, meanwhile, the cold air mechanism utilizes the entangled spiral air guide pipeline to supply air, the space occupation of the cold air mechanism is reduced, and the power supply space is not greatly influenced;
additional aspects and advantages of the utility model will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the utility model.
Drawings
In order to more clearly illustrate the technical solutions of the present utility model, the following description will briefly explain the drawings used in the embodiments or the description of the prior art, and it is obvious that the drawings in the following description are only some embodiments of the present utility model, and that other drawings can be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of a heat sink of a high frequency switching power supply;
fig. 2 is a schematic structural diagram of the cold air mechanism in fig. 1.
Wherein, 1-radiating fin; 11-fins; 2-a cold air mechanism; 21-a fan; 22-an air outlet; 23-an air guide pipeline; 24-sealing the bin; 25-water inlet; 26-water outlet.
Detailed Description
Embodiments of the present utility model are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the drawings are illustrative and intended to explain the present utility model and should not be construed as limiting the utility model.
Examples
Referring to fig. 1 to 2, a high-frequency switching power supply heat dissipating device is used for being installed on a transformer and a rectifying module of a power supply to dissipate heat, and comprises a heat dissipating fin 1 and a cold air mechanism 2, wherein the bottom surface of the heat dissipating fin is contacted with the transformer and/or the rectifying module, and a plurality of fins 11 are integrally formed above the heat dissipating fin at intervals to increase heat dissipating area; the cold air mechanism 2 comprises a fan 21, an air guide pipeline 23 and an air outlet 22, wherein the fan and the air outlet are positioned at two ends of the air guide pipeline, the position of the air outlet is matched with the position of the fins, and the outside of the air guide pipeline cools the air blown out by the fan in a liquid cooling mode.
The cold air mechanism 2 further comprises a sealed bin 24, cooling liquid is filled in the sealed bin, the main body of the air guide pipeline 23 is positioned in the sealed bin, the air guide pipeline is soaked in the cooling liquid, and the inner cavity of the air guide pipeline is isolated from the cooling liquid.
The air guide pipeline 2 extends from one end of the seal bin 24 to the other end of the seal bin in a spiral shape so as to enlarge the contact area with the cooling liquid.
The fans 21 and the air guide pipelines 23 are all multiple, the fans are uniformly arranged at one end of the sealing bin, and the spiral air guide pipelines are arranged in an entangled manner.
The sealing bin 24 is also provided with an openable or closable water inlet 25 and water outlet 26 so as to facilitate filling and replacing of the cooling liquid.
The air guide pipeline 23 is made of a heat conducting material made of metal, and is specifically a galvanized copper pipe or a galvanized aluminum pipe.
In the high-frequency switching power supply heat dissipation device of the embodiment, the copper pipe cold air mechanism 2 provides cooling air for the heat dissipation fins 1, the air supply path is prolonged by the spiral air guide pipeline 23, the air blown out by the fan 21 is sufficiently cooled by cooling liquid, and then is blown to the fins 11 by the air outlet, so that the heat dissipation effect is further improved on the basis of a common heat dissipation plate.
The beneficial effects of the utility model are as follows: the cooling area is increased through the radiating fin, and the cooling radiating air is provided through the cold air mechanism, so that the cooling effect of the power supply is greatly improved, the service life of the power supply is prolonged, meanwhile, the cold air mechanism supplies air through the entangled spiral air guide pipeline, the space occupation of the cold air mechanism is reduced, the power supply space cannot be greatly influenced, and in addition, the cooling liquid only exists in the sealed cabin and is isolated from the electronic device, and the safety is higher.
While embodiments of the present utility model have been shown and described above, it will be understood that the above embodiments are illustrative and not to be construed as limiting the utility model, and that variations, modifications and alternatives to the above embodiments may be made by those skilled in the art within the scope of the utility model.
Claims (6)
1. The utility model provides a high frequency switching power supply heat abstractor for install on the transformer and the rectifier module of power and dispel the heat, its characterized in that: the cooling device comprises cooling fins (1) and a cold air mechanism (2), wherein the bottom surfaces of the cooling fins are in contact with a transformer and/or a rectifying module, and a plurality of fins (11) which are arranged at intervals are integrally formed above the cooling fins so as to increase the cooling area; the cold air mechanism (2) comprises a fan (21), an air guide pipeline (23) and an air outlet (22), wherein the fan and the air outlet are positioned at two ends of the air guide pipeline, the position of the air outlet is matched with the position of the fins, and the outside of the air guide pipeline cools the air blown out by the fan in a liquid cooling mode.
2. The high frequency switching power supply heat sink according to claim 1, wherein: the cold air mechanism (2) further comprises a sealed bin (24), cooling liquid is filled in the sealed bin, the main body of the air guide pipeline (23) is positioned in the sealed bin, the air guide pipeline is soaked in the cooling liquid, and the inner cavity of the air guide pipeline is isolated from the cooling liquid.
3. The high frequency switching power supply heat sink according to claim 2, wherein: the air guide pipeline (23) extends from one end of the sealing bin (24) to the other end of the sealing bin in a spiral shape so as to enlarge the contact area with the cooling liquid.
4. A high frequency switching power supply heat sink according to claim 3, wherein: the air guide device is characterized in that a plurality of fans (21) and air guide pipelines (23) are arranged, the fans are uniformly arranged at one end of the sealing bin, and the spiral air guide pipelines are arranged in an entangled manner.
5. The high frequency switching power supply heat sink according to claim 2, wherein: the sealing bin (24) is also provided with an openable or closable water inlet (25) and water outlet (26) so as to facilitate filling and replacing of the cooling liquid.
6. The high frequency switching power supply heat sink according to claim 1, wherein: the air guide pipeline (23) is made of a heat conduction material made of metal, and is specifically a galvanized copper pipe or a galvanized aluminum pipe.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321690529.1U CN220254971U (en) | 2023-06-30 | 2023-06-30 | High-frequency switching power supply heat dissipation device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321690529.1U CN220254971U (en) | 2023-06-30 | 2023-06-30 | High-frequency switching power supply heat dissipation device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220254971U true CN220254971U (en) | 2023-12-26 |
Family
ID=89268135
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321690529.1U Active CN220254971U (en) | 2023-06-30 | 2023-06-30 | High-frequency switching power supply heat dissipation device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220254971U (en) |
-
2023
- 2023-06-30 CN CN202321690529.1U patent/CN220254971U/en active Active
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