CN220254972U - Liquid cooling heat radiation structure of high-frequency switching power supply - Google Patents
Liquid cooling heat radiation structure of high-frequency switching power supply Download PDFInfo
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- CN220254972U CN220254972U CN202321690802.0U CN202321690802U CN220254972U CN 220254972 U CN220254972 U CN 220254972U CN 202321690802 U CN202321690802 U CN 202321690802U CN 220254972 U CN220254972 U CN 220254972U
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- heat dissipation
- cooling
- power supply
- switching power
- frequency switching
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- 238000001816 cooling Methods 0.000 title claims abstract description 98
- 239000007788 liquid Substances 0.000 title claims abstract description 55
- 230000005855 radiation Effects 0.000 title claims description 3
- 230000017525 heat dissipation Effects 0.000 claims abstract description 56
- 230000007246 mechanism Effects 0.000 claims abstract description 39
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 8
- 230000000149 penetrating effect Effects 0.000 claims abstract description 4
- 238000009413 insulation Methods 0.000 claims description 3
- 238000007789 sealing Methods 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 6
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 1
- 239000000110 cooling liquid Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a liquid cooling heat dissipation structure of a high-frequency switching power supply, which is used for being arranged between a transformer and a rectifying component in the high-frequency switching power supply and comprises a heat dissipation mechanism and a liquid cooling mechanism, wherein the transformer and the rectifying component are connected through a conductive connecting sheet, and the heat dissipation mechanism is arranged and fixed on the conductive connecting sheet; the heat dissipation mechanism comprises a main body connected and fixed with the conductive connecting sheet, a cooling cavity penetrating through the main body is formed in the main body, the liquid cooling mechanism comprises a cooling pipe, and the cooling pipe penetrates through the cooling cavity and is attached to the cooling cavity so as to take away heat for heat dissipation. According to the liquid cooling heat dissipation structure of the high-frequency switch power supply, the liquid cooling mechanism is matched with the heat dissipation mechanism, the conventional air cooling is replaced by liquid cooling to dissipate heat of the power supply, the heat dissipation effect is greatly improved, meanwhile, the liquid cooling mechanism with a reasonable structure and effective waterproof measures are adopted, potential safety hazards caused by water drops falling into the power supply are avoided, and the safety performance is greatly improved compared with that of a conventional liquid cooling mode.
Description
Technical Field
The utility model relates to the technical field of high-frequency switching power supplies, in particular to a liquid cooling heat dissipation structure of a high-frequency switching power supply.
Background
With the development of power electronic technology, the relation between power electronic equipment and people's work and life is also becoming more and more intimate, and the electronic equipment is not separated from a reliable power supply; among them, a high-frequency switching power supply is a power supply operated at a high frequency by a MOSFET or an IGBT, and is widely used because of its advantages such as high efficiency and miniaturization.
In the working process of the high-frequency switching power supply, a large amount of heat can be generated by electric elements such as a rectifying component, a transformer component and the like in an electric system, particularly the high-power high-frequency switching power supply has great influence on the working performance of the whole high-frequency switching power supply, and even the high-frequency switching power supply can be caused to fail due to overhigh temperature; therefore, in the existing high-frequency switch power supply, heat dissipation is the primary problem.
At present, the heat dissipation of the high-frequency switch power supply is generally carried out by adopting a mode of installing a heat dissipation plate at a transformer, but firstly, heat of the transformer is accumulated and transferred to an adjacent rectifying component, and then additional heat dissipation plates are required to be installed for cooling, meanwhile, under the conditions of long-time work and large power, the heat accumulation is serious, the heat dissipation effect of the common heat dissipation plates is poor, equipment is easy to overheat, even short circuit and service life influence can be caused, in order to solve the heat dissipation problem, the heat dissipation plates are cooled by adopting an air cooling or liquid cooling heat dissipation mode, the common air cooling mode is greatly influenced by the environmental temperature, the liquid cooling mode is easy to generate cooling liquid leakage to directly damage a power supply, and great potential safety hazards are provided.
Therefore, in combination with the above-mentioned technical problems, it is necessary to provide a new technical solution.
Disclosure of Invention
The utility model aims to provide a liquid cooling heat dissipation structure of a high-frequency switching power supply, which has better heat dissipation effect and higher safety.
In order to solve the technical problems, the utility model provides a liquid cooling heat dissipation structure of a high-frequency switching power supply, which comprises the following specific technical scheme:
the liquid cooling heat dissipation structure of the high-frequency switching power supply is used for being arranged between a transformer and a rectifying component in the high-frequency switching power supply and comprises a heat dissipation mechanism and a liquid cooling mechanism, wherein the transformer and the rectifying module are connected through a conductive connecting sheet, and the heat dissipation mechanism is fixedly arranged on the conductive connecting sheet;
the heat dissipation mechanism comprises a main body connected and fixed with the conductive connecting sheet, a cooling cavity penetrating through the main body is formed in the main body, the liquid cooling mechanism comprises a cooling pipe, and the cooling pipe penetrates through the cooling cavity and is attached to the cooling cavity so as to take away heat for heat dissipation.
Preferably, the cooling cavity is a plurality of evenly distributed, the cooling pipe comprises a plurality of branch pipes, the shapes and the positions of the branch pipes are in one-to-one correspondence with the cooling cavity, the branch pipes penetrate through the cooling cavity, and the pipe walls of the branch pipes are attached to the inner wall of the cooling cavity.
Preferably, the liquid cooling mechanism further comprises a liquid inlet and a liquid outlet, and two ends of the branch pipe extend out of the cooling cavity and then are converged to form a single main pipe and are respectively connected with the liquid inlet and the liquid outlet.
Preferably, the conductive connecting piece comprises a first connecting part and a second connecting part, wherein the first connecting part and the second connecting part are respectively positioned at two ends of the conductive connecting piece and connected with the transformer, the second connecting part is connected with the rectifying component, a bearing part for bearing the heat dissipation mechanism is arranged between the first connecting part and the second connecting part, and the first connecting part, the second connecting part and the bearing part are integrally formed.
Preferably, the first connecting portion and the second connecting portion are provided with mounting holes so as to be fixed with the transformer or the rectifying component.
Preferably, the end of the cooling cavity is provided with a sealing ring to prevent the branch pipe in the cooling cavity from leaking.
Preferably, the part of the branch pipe outside the cooling cavity and the whole outer side of the main pipe are sleeved with waterproof heat insulation sleeves so as to prevent water in the air from condensing and dripping in the high-frequency switching power supply.
The liquid cooling heat dissipation structure of the high-frequency switching power supply has the following beneficial effects:
according to the liquid cooling heat dissipation structure of the high-frequency switch power supply, the liquid cooling mechanism is matched with the heat dissipation mechanism, the conventional air cooling is replaced by liquid cooling to dissipate heat of the power supply, the heat dissipation effect is greatly improved, meanwhile, the liquid cooling mechanism with a reasonable structure and effective waterproof measures are adopted, potential safety hazards caused by water drops falling into the power supply are avoided, and the safety performance is greatly improved compared with that of the conventional liquid cooling mode;
additional aspects and advantages of the utility model will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the utility model.
Drawings
In order to more clearly illustrate the technical solutions of the present utility model, the following description will briefly explain the drawings used in the embodiments or the description of the prior art, and it is obvious that the drawings in the following description are only some embodiments of the present utility model, and that other drawings can be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a top view of a liquid-cooled heat sink structure for a high frequency switching power supply;
fig. 2 is a schematic cross-sectional view of the liquid-cooled heat dissipation structure of the high-frequency switching power supply of fig. 1.
Wherein, 1-the heat dissipation mechanism; 11-a body; 12-a cooling chamber; 2-a liquid cooling mechanism; 21-a liquid inlet; 22-a liquid outlet; 23-branch pipes; 3-a conductive connecting sheet; 31-a first connection; 32-a second connection; 33-carrier.
Detailed Description
Embodiments of the present utility model are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the drawings are illustrative and intended to explain the present utility model and should not be construed as limiting the utility model.
Examples
Referring to fig. 1 to 2, a liquid cooling heat dissipation structure of a high-frequency switching power supply is used for being installed between a transformer and a rectifying component in the high-frequency switching power supply, and comprises a heat dissipation mechanism 1 and a liquid cooling mechanism 2, wherein the transformer and the rectifying component are connected through a conductive connecting sheet 3, and the heat dissipation mechanism 1 is installed and fixed on the conductive connecting sheet;
the heat dissipation mechanism 1 comprises a main body 11 fixedly connected with the conductive connecting sheet, a cooling cavity 12 penetrating through the main body is formed in the main body, the liquid cooling mechanism 2 comprises a cooling pipe, and the cooling pipe penetrates through the cooling cavity and is attached to the cooling cavity so as to take away heat for heat dissipation.
The cooling cavity 12 is a plurality of evenly distributed, the cooling pipe includes many branch pipes 23, the shape and the position of branch pipe and cooling cavity one-to-one, the branch pipe passes the cooling cavity and the pipe wall and the cooling cavity inner wall laminating of branch pipe.
The liquid cooling mechanism 2 further comprises a liquid inlet 21 and a liquid outlet 22, and two ends of the branch pipe 23 extend out of the cooling cavity 12 and are converged to form a single main pipe and are respectively connected with the liquid inlet and the liquid outlet.
The conductive connecting piece 3 comprises a first connecting part 31 and a second connecting part 32, wherein the first connecting part 31 and the second connecting part 32 are respectively positioned at two ends of the conductive connecting piece and are connected with the transformer, a bearing part 33 for bearing the heat dissipation mechanism 1 is arranged between the first connecting part and the second connecting part, and the first connecting part, the second connecting part and the bearing part are integrally formed.
The first connecting portion 31 and the second connecting portion 32 are provided with mounting holes so as to be fixed with the transformer or the rectifying component.
The cooling chamber 12 is provided with a sealing ring at the end to prevent water leakage from the branch pipes located in the cooling chamber.
The part of the branch pipe 23 outside the cooling cavity 12 and the whole outer side of the main pipe are sleeved with waterproof heat insulation sleeves so as to prevent water in the air from condensing and dripping in the high-frequency switching power supply.
In the liquid cooling heat dissipation structure of the high-frequency switching power supply of the embodiment, when the power supply works, heat in the transformer and the rectifying component is transferred to the heat dissipation mechanism through the conductive connecting sheet 3, heat is dissipated by utilizing the branch pipe of the liquid cooling mechanism in the cooling cavity 12, and the traditional air heat dissipation and air cooling heat dissipation are replaced by liquid cooling heat dissipation, so that the heat dissipation effect is greatly improved.
The beneficial effects of the utility model are as follows: through liquid cooling mechanism and cooling mechanism cooperation to the liquid cooling replaces conventional forced air cooling to dispel the heat to the power, and the radiating effect greatly improves, adopts liquid cooling mechanism and effectual waterproof measure rational in infrastructure simultaneously, has avoided the water droplet to fall into the potential safety hazard that produces in the power, and the security performance also obtains great improvement relative conventional liquid cooling mode.
While embodiments of the present utility model have been shown and described above, it will be understood that the above embodiments are illustrative and not to be construed as limiting the utility model, and that variations, modifications and alternatives to the above embodiments may be made by those skilled in the art within the scope of the utility model.
Claims (7)
1. A high frequency switching power supply liquid cooling heat radiation structure for install between transformer and the rectifier module in high frequency switching power supply, its characterized in that: the transformer comprises a heat dissipation mechanism (1) and a liquid cooling mechanism (2), wherein the transformer is connected with a rectifying module through a conductive connecting sheet (3), and the heat dissipation mechanism (1) is fixedly arranged on the conductive connecting sheet;
the heat dissipation mechanism (1) comprises a main body (11) fixedly connected with the conductive connecting sheet, a cooling cavity (12) penetrating through the main body is formed in the main body, the liquid cooling mechanism (2) comprises a cooling pipe, and the cooling pipe penetrates through the cooling cavity and is attached to the cooling cavity so as to take away heat for heat dissipation.
2. The high-frequency switching power supply liquid-cooled heat dissipation structure according to claim 1, wherein: the cooling cavities (12) are uniformly distributed, the cooling pipes comprise a plurality of branch pipes (23), the shapes and the positions of the branch pipes are in one-to-one correspondence with the cooling cavities, the branch pipes penetrate through the cooling cavities, and the pipe walls of the branch pipes are attached to the inner walls of the cooling cavities.
3. The high-frequency switching power supply liquid-cooled heat dissipation structure according to claim 2, wherein: the liquid cooling mechanism (2) further comprises a liquid inlet (21) and a liquid outlet (22), and two ends of the branch pipe (23) extend out of the cooling cavity (12) and are converged to form a single main pipe and are respectively connected with the liquid inlet and the liquid outlet.
4. The high-frequency switching power supply liquid-cooled heat dissipation structure according to claim 1, wherein: the conductive connecting sheet (3) comprises a first connecting part (31) and a second connecting part (32), wherein the first connecting part (31) is respectively arranged at two ends of the conductive connecting sheet and is connected with the transformer, the second connecting part (32) is connected with the rectifying component, a bearing part (33) for bearing the heat dissipation mechanism (1) is arranged between the first connecting part and the second connecting part, and the first connecting part, the second connecting part and the bearing part are integrally formed.
5. The high-frequency switching power supply liquid-cooled heat dissipation structure as defined in claim 4, wherein: and the first connecting part (31) and the second connecting part (32) are respectively provided with a mounting hole so as to be conveniently fixed with the transformer or the rectifying component.
6. The high-frequency switching power supply liquid-cooled heat dissipation structure according to claim 2, wherein: a sealing ring is arranged at the end part of the cooling cavity (12) to prevent the branch pipes in the cooling cavity from leaking water.
7. The high-frequency switching power supply liquid-cooled heat dissipation structure according to claim 2, wherein: the part of the branch pipe (23) outside the cooling cavity (12) and the outer side of the whole main pipe are sleeved with waterproof heat insulation sleeves so as to prevent water in the air from condensing and dripping in the high-frequency switching power supply.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321690802.0U CN220254972U (en) | 2023-06-30 | 2023-06-30 | Liquid cooling heat radiation structure of high-frequency switching power supply |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321690802.0U CN220254972U (en) | 2023-06-30 | 2023-06-30 | Liquid cooling heat radiation structure of high-frequency switching power supply |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220254972U true CN220254972U (en) | 2023-12-26 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321690802.0U Active CN220254972U (en) | 2023-06-30 | 2023-06-30 | Liquid cooling heat radiation structure of high-frequency switching power supply |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220254972U (en) |
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2023
- 2023-06-30 CN CN202321690802.0U patent/CN220254972U/en active Active
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